CN106048566A - 一种led用铝基板的制备方法及制备该铝基板时所使用的浆料 - Google Patents
一种led用铝基板的制备方法及制备该铝基板时所使用的浆料 Download PDFInfo
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 77
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 71
- 239000002002 slurry Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 title abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000005245 sintering Methods 0.000 claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 15
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- 238000000576 coating method Methods 0.000 claims abstract description 13
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000004411 aluminium Substances 0.000 claims description 64
- 239000000428 dust Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 15
- 239000001856 Ethyl cellulose Substances 0.000 claims description 14
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 14
- 230000000996 additive effect Effects 0.000 claims description 14
- 229920001249 ethyl cellulose Polymers 0.000 claims description 14
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003960 organic solvent Substances 0.000 claims description 5
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000001117 sulphuric acid Substances 0.000 claims description 3
- 235000011149 sulphuric acid Nutrition 0.000 claims description 3
- -1 wherein Substances 0.000 claims description 3
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 claims 1
- 125000005587 carbonate group Chemical group 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract 2
- 239000000969 carrier Substances 0.000 abstract 1
- 239000002585 base Substances 0.000 description 32
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 150000001398 aluminium Chemical class 0.000 description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
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- 239000012528 membrane Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007581 slurry coating method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000006255 coating slurry Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- AJWAFMQIGMFAJX-UHFFFAOYSA-N copper nickel sulfuric acid Chemical compound S(O)(O)(=O)=O.[Cu].[Ni] AJWAFMQIGMFAJX-UHFFFAOYSA-N 0.000 description 1
- OHDIUDQGCWNCFH-UHFFFAOYSA-J copper nickel(2+) disulfate Chemical compound [Ni+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OHDIUDQGCWNCFH-UHFFFAOYSA-J 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract
本发明属于LED用铝基板制备技术领域，特别涉及一种LED用铝基板的制备方法及制备该铝基板时所使用的浆料。铝基板的制作方法是将浆料涂刷于铝板上，经高温烧结后在铝基板上形成绝缘导热涂层，在该涂层上进行化学镀铜或化学镀镍，即可形成导热性良好的LED用铝基板；而该浆料由玻璃粉、有机载体和无机添加剂构成。
Description
技术领域
本发明属于LED用铝基板制备技术领域，特别涉及一种LED用铝基板的制备方法及制备该铝基板时所使用的浆料。
背景技术
LED(light emitting diode，发光二极管的简称)运用领域涉及到手机、台灯等日常家电和机械方面。相对于传统照明灯，LED照明产品具有环保、节能、寿命长等优点。可用于安全照明、特种照明、景观照明和普通照明领域，市场应用潜力巨大。
为了解决LED光源散热问题，目前多采用铝基板，铝基板的制备方法为氧化后的铝板通过粘结剂与铜箔压合而成，为了得到良好的散热基板，通常在粘结剂中添加氧化铝、氮化铝等导热材料，随着LED光源的功率不断增大，对铝基板散热的要求不断地提高，开发高散热性铝基板迫在眉睫。
目前，LED用铝基板的制备方法是，经阳极氧化的铝板通过掺有氧化铝粉体的环氧树脂粘合剂与铜箔压合而制成，虽然环氧树脂中掺有氧化铝粉体，导热性能得到了一定的改善，但是粘合剂层中由于环氧树脂胶的存在会导致导热性明显下降。随着使用LED光源功率的不断提升，对铝基板的散热提出了更高的要求。
发明内容
本发明所要解决的技术问题在于：提高铝基板的散热能力，为解决这一技术问题，本发明采用的技术方案为：
提供一种LED用铝基板的制备方法，将浆料印刷或涂覆于铝板上，经高温烧结后形成绝缘散热涂层，在该涂层上进行化学镀铜或化学镀镍，形成LED用铝基板，
其中，制备绝缘散热涂层的浆料按重量份数计算包括，玻璃粉50～75份，有机载体25～50份，无机添加剂0.01～10份，
玻璃粉粒径小于100μm，制备浆料时，对所用玻璃粉的成分无特殊要求，所使用的玻璃粉粒径大小对铝基板的品质有着重要影响，玻璃粉的粒径是越小越好，当粒径大于100μm时，经印刷烧结后制得的涂层表面不平整，对后续的化学镀铜或镍带来不良影响，
有机载体由有机溶剂和乙基纤维素组成，其中，有机溶剂选择可溶解乙基纤维素的即可，如乙醇、异丙醇、丁醚、正丁酸乙酯等醇、醚、醛、酮或脂类溶剂，乙基纤维素在其中的浓度为10～200g/L，添加乙基纤维素可以相应地增加浆料的粘度，防止浆料涂敷在铝基板上后产生流动从而导致浆料在铝基板上不能形成理想的厚度，
乙基纤维素的量过小，少于10g/L时，所制得的浆料粘度过低，浆料涂覆时会发生塌陷或流浆；乙基纤维素的量过大，大于200g/L时，所制得的浆料粘度过大，导致浆料涂覆困难，乙基纤维素的最佳浓度为50～100g/L，
无机添加剂为碳酸盐，主要是碱金属或碱土金属的碳酸盐，如碳酸钙、碳酸镁等，添加碳酸盐无机添加剂可以有效防止浆料在高温烧结过程中产生龟裂，确保浆料在铝基板上高温烧结后形成均匀地导热层，以重量份数计，无机添加剂的使用量为0.01～10份，无机添加剂的量过少，烧结后的膜会塌陷；无机添加剂的量过多，烧结后的膜中多孔，无机添加剂的最佳使用量为0.1～1份，
在配制上述浆料时，首先制备有机载体，将无机添加剂加入到有机载体混合均匀后，再加入玻璃粉进行搅拌，为了防止团聚物的出现，也可将调好的浆料进一步过滤；
涂覆浆料的铝板为具有或不具有氧化膜的铝板；
将上述浆料涂覆于铝板上后，经80～120℃，5～15分钟烘干后，再经过300～600℃，10～30分钟的烧结处理，烧结处理过程中，玻璃粉与基板的铝之间形成了化合物，从而实现了玻璃粉导热层与铝基板之间良好的结合强度，即可得到附着无机导热膜的铝板；该铝板进行化学镀铜或化学镀镍即可得到LED用铝基板，为了得到较厚的导电层，在化学镀之后也可进行电镀铜或电镀镍，
对于化学镀铜(镍)而言，可以采用通常的化学镀铜(镍)处理，如镀液中含有硫酸铜(镍)10～20g/L、EDTA·4Na30～40g/L、甲醛2～4ml/L，用氢氧化钠调pH为12，化学镀时间可设定为30分钟，温度为40℃；对于化学镀铜(镍)后的电镀铜(镍)，可以采用通常的电镀铜(镍)处理，如镀液中含有硫酸铜(镍)50～80g/L、硫酸150～200g/L、氯离子浓度为30～70ppm及少量添加剂，电流密度可设置为0.5～3A/dm2，温度10～35℃，时间1小时。
本发明的有益效果在于：本发明通过玻璃粉在高温烧结过程中熔融而紧密结合形成了致密的涂层，避免了胶粘剂材料(如环氧树脂胶)的使用；高温烧结后，固定于铝基板上的主要是氧化硅成分，无高分子存在，因此大大提高的导热性能。同时在本发明所制备的导热涂层上成功实现了化学镀铜(镀镍)，节约了后续成本和工序。
具体实施方式
实施例1
首先制备有机载体，以丁醚为溶剂，加入的乙基纤维素浓度为10g/L；取该有机载体25g，加入无机添加剂碳酸钙0.01g，搅拌均匀后，再加入玻璃粉74.99g进一步充分搅拌，即得到玻璃粉浆料；将该浆料涂刷在10cm×10cm(厚1.5mm)的铝板上，经80℃、3分钟烘干后，再经过600℃、30分钟的烧结处理，即可得到附着有无机膜的铝板；将该铝板进行化学镀铜，化学镀铜的操作为，采用含有硫酸铜15g/L、EDTA·4Na35g/L、甲醛2ml/L的镀液，并用氢氧化钠调pH为12，化学镀铜时间为30分钟，温度为40℃；
为了评价镀层的附着强度，在化学镀铜后进行电镀铜，电镀铜采用含有硫酸铜65g/L、硫酸150g/L、氯离子40ppm及少量添加剂的镀液，电流密度为2.5A/dm2，温度25℃，时间1小时。所得镀铜层总厚度为20μm。
采用划痕实验确定镀铜层的附着强度，在镀铜层表面用刀划刻边长为3mm的正方形格子25个，用胶带充分粘贴在这些正方形的格子上，快速撕下胶带时，以正方形的格子上的铜层掉落的多少来评价铜镀层的附着强度，正方形格子无脱落的表述为“良好”，即便有一个格子脱落的表述为“差”(下同)。
本实施例中通过划痕实验确定镀铜层的附着强度为“良好”。将本实施例中制备完成的LED用铝基板在500℃的电炉加热板上放置5分钟(铝基板与电炉加热板相接触)，玻璃粉导热层和镀铜层均无脱落现象。
作为对比，将现有技术中通过“经阳极氧化的铝板(铝板材质、厚度同实施例1)通过掺有氧化铝粉体的环氧树脂粘合剂与铜箔压合”的工艺制备而成的LED用铝基板也在500℃的电炉加热板上放置(铝基板与电炉加热板相接触)，放置4分30秒时，掺有氧化铝粉体的环氧树脂导热层与铝基板之间产生了脱落。
实施例2
首先制备有机载体，以异丙醇为溶剂，加入的乙基纤维素浓度为50g/L；取该有机载体35g，加入无机添加剂碳酸钙0.1g，搅拌均匀后，再加入玻璃粉64.9g进一步充分搅拌，即得到玻璃粉浆料；将该浆料涂刷在10cm×10cm(厚1.5mm)的铝板上，经80℃、3分钟烘干后，再经过600℃、30分钟的烧结处理，即可得到附着有无机膜的铝板；将该铝板进行化学镀铜，并进行电镀铜，工艺如实施例1。
本实施例中通过划痕实验确定镀铜层的附着强度为“良好”。将本实施例中制备完成的LED用铝基板在500℃的电炉加热板上放置5分钟(铝基板与电炉加热板相接触)，玻璃粉导热层和镀铜层均无脱落现象。
实施例3
首先制备有机载体，以异丙醇为溶剂，加入的乙基纤维素浓度为100g/L；取该有机载体45g，加入无机添加剂碳酸钙1g，搅拌均匀后，再加入玻璃粉54g进一步充分搅拌，即得到玻璃粉浆料；将该浆料涂刷在10cm×10cm(厚1.5mm)的铝板上，经80℃、3分钟烘干后，再经过600℃、30分钟的烧结处理，即可得到附着有无机膜的铝板；将该铝板进行化学镀铜，并进行电镀铜，工艺如实施例1。
本实施例中通过划痕实验确定镀铜层的附着强度为“良好”。将本实施例中制备完成的LED用铝基板在500℃的电炉加热板上放置5分钟(铝基板与电炉加热板相接触)，玻璃粉导热层和镀铜层均无脱落现象。
实施例4
首先制备有机载体，以异丙醇为溶剂，加入的乙基纤维素浓度为200g/L；取该有机载体50g，加入无机添加剂碳酸钙10g，搅拌均匀后，再加入玻璃粉40g进一步充分搅拌，即得到玻璃粉浆料；将该浆料涂刷在10cm×10cm(厚1.5mm)的铝板上，经80℃、3分钟烘干后，再经过600℃、30分钟的烧结处理，即可得到附着有无机膜的铝板；将该铝板进行化学镀铜，并进行电镀铜，工艺如实施例1。
本实施例中通过划痕实验确定镀铜层的附着强度为“良好”。将本实施例中制备完成的LED用铝基板在500℃的电炉加热板上放置5分钟(铝基板与电炉加热板相接触)，玻璃粉导热层和镀铜层均无脱落现象。
Claims (9)
1.一种LED用铝基板的制备方法，其特征在于：所述的制备方法为，将浆料印刷或涂覆于铝板上，经高温烧结后形成绝缘散热涂层，在所述涂层上进行化学镀铜或化学镀镍，形成LED用铝基板。
2.如权利要求1所述的LED用铝基板的制备方法，其特征在于：浆料涂覆于铝板上后，经80～120℃，5～15分钟烘干后，再经过300～600℃，10～30分钟的烧结处理即形成绝缘散热涂层。
3.如权利要求1所述的LED用铝基板的制备方法，其特征在于：化学镀铜的操作为，采用含有硫酸铜10～20g/L、EDTA·4Na30～40g/L、甲醛2～4ml/L的镀液，并用氢氧化钠调pH为12，化学镀铜时间为30分钟，温度为40℃。
4.如权利要求1所述的LED用铝基板的制备方法，其特征在于：化学镀铜后再进行电镀铜处理，电镀铜采用含有硫酸铜50～80g/L、硫酸150～200g/L、氯离子30～70ppm及少量添加剂的镀液，电流密度为0.5～3A/dm2，温度10～35℃，时间1小时。
5.一种制备LED用铝基板所使用的浆料，其特征在于：所述的浆料按重量份数计算包括，玻璃粉50～75份，有机载体25～50份，无机添加剂0.01～10份。
6.如权利要求5所述的制备LED用铝基板所使用的浆料，其特征在于：所述的玻璃粉粒径小于100μm。
7.如权利要求5所述的制备LED用铝基板所使用的浆料，其特征在于：所述的有机载体由有机溶剂和乙基纤维素组成，其中，有机溶剂为可溶解乙基纤维素的即可，乙基纤维素在其中的浓度为10～200g/L。
8.如权利要求7所述的制备LED用铝基板所使用的浆料，其特征在于：所述的有机溶剂为乙醇、异丙醇、丁醚或正丁酸乙酯。
9.如权利要求5所述的制备LED用铝基板所使用的浆料，其特征在于：所述的无机添加剂为碳酸盐。
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