CN106041316A - Laser etching machine - Google Patents
Laser etching machine Download PDFInfo
- Publication number
- CN106041316A CN106041316A CN201610625796.9A CN201610625796A CN106041316A CN 106041316 A CN106041316 A CN 106041316A CN 201610625796 A CN201610625796 A CN 201610625796A CN 106041316 A CN106041316 A CN 106041316A
- Authority
- CN
- China
- Prior art keywords
- needle plate
- laser
- positioning
- main material
- lower location
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/007—Marks, e.g. trade marks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a laser etching machine. The laser etching machine comprises a laser platform. A laser head is arranged over the laser platform. The laser platform is provided with a lower positioning needle plate, an upper positioning needle plate and positioning shafts. The upper positioning needle plate is located over the lower positioning needle plate. The lower positioning needle plate is covered with a main material. Each of the two sides of the lower positioning needle plate is provided with a pair of positioning shafts symmetrically placed on the two faces of the main material and extending in the width direction of the main material. The positioning shafts are controlled by a servo motor. Positioning needles are arranged at the lower portion of the upper positioning needle plate. Positioning needle holes corresponding to the positioning needles are formed in the lower positioning needle plate. According to the laser etching machine, a servo system and traditional needle plate positioning are combined, automatic and precise marking control is achieved, the precision and the fineness degree of products are improved to a great degree, meanwhile, the equipment manufacturing cost is low, and maintaining is convenient.
Description
Technical field
The invention belongs to die cutting technique field, especially relates to a kind of Laser marker.
Background technology
Growing along with electronic product, electronic product pad pasting is more and more universal, and people are to the precision of pad pasting and thin
The requirement of greasy degree is more and more higher, and existing equipment can not meet requirement, only a few devices mostly can produce satisfied wanting
The product asked, but generally cost is higher, keeps in repair cumbersome.
Summary of the invention
In view of this, it is relatively low that the invention is directed to a kind of cost, and the precision of product and fine and smooth degree meet the requirements
Laser marker.
For reaching above-mentioned purpose, the technical scheme of the invention is achieved in that
A kind of Laser marker, including laser platform, the surface of described laser platform is provided with laser head, and described laser is put down
Being provided with lower location needle plate, upper location needle plate and locating shaft on platform, described upper location needle plate is just being positioned at described lower location needle plate
Top, described lower location needle plate overlying is stamped main material, the both sides of described lower location needle plate be respectively provided with a pair be symmetrically disposed at described
Main material two sides and the locating shaft extended along described main material width, described locating shaft is by Serve Motor Control, described fixed
The bottom of position needle plate is provided with positioning needle, and described lower location needle plate is provided with the positioning pinholes corresponding with described positioning needle.
Further, the vac sorb dress that can make the absorption of main material on the needle plate of lower location it is provided with below the needle plate of described lower location
Putting, described lower location needle plate is provided with the wind inlet corresponding with described vacuum absorption device.
Further, described upper location needle plate is taper, and described lower location needle plate is taper.
Further, described Laser marker front end is provided with feeding compounding machine, and described Laser marker rear end is provided with receipts
Material compounding machine.
Relative to prior art, the Laser marker described in the invention has the advantage that servosystem and biography
System needle plate location combines, it is achieved that automatic precision controls mark, the precision of product and fine and smooth degree and obtained largely
Raising, and equipment manufacturing cost is relatively low, keeps in repair more convenient.
Accompanying drawing explanation
The accompanying drawing of the part constituting the invention is used for providing being further appreciated by the invention, and the present invention creates
The schematic description and description made, for explaining the invention, is not intended that the improper restriction to the invention.?
In accompanying drawing:
Fig. 1 is the structural representation of the invention；
Schematic diagram when Fig. 2 is the invention use.
Description of reference numerals:
1-Laser marker, 11-laser head, 12-positions needle plate, 121-positioning needle, under 13-, positions needle plate, 131-is fixed
Position pin hole, the main material of 14-, 15-locating shaft, 2-feeding compounding machine, 3-rewinding compounding machine.
Detailed description of the invention
It should be noted that in the case of not conflicting, the embodiment in the invention and the feature in embodiment can
To be mutually combined.
Describe the invention below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
As it is shown in figure 1, a kind of Laser marker 1, including laser platform, the surface of described laser platform is provided with laser head
11, described laser platform is provided with the upper location needle plate 12 of taper, the lower location needle plate 13 of taper and locating shaft 15, described on
Location needle plate 12 is positioned at the surface of described lower location needle plate 13, and described lower location needle plate 13 is coated with main material 14, described under
The both sides of location needle plate 13 are respectively provided with a pair and are symmetricly set on main material 14 two sides, namely place the most side by side, and along main material
The locating shaft 15 that 14 widths extend, can be fixed clamping to main material, and described locating shaft 15 is by Serve Motor Control, described
The bottom of upper location needle plate 12 is provided with positioning needle 121, and described lower location needle plate 13 is provided with corresponding with described positioning needle 121
Positioning pinholes 131, below the needle plate of described lower location, 13 are provided with the vac sorb that main material 15 can be made to adsorb on lower location needle plate 13
Device (is not marked in figure), and described lower location needle plate 13 is provided with several wind inlets corresponding with described vacuum absorption device.
As in figure 2 it is shown, Laser marker 1 front end is provided with feeding compounding machine 2, Laser marker 1 rear end is provided with rewinding and uses
Compounding machine 3.
The work process of Laser marker: laser incising sent into by the main material 14 after feeding compounding machine 2 will get rid of protection epiphragma
Print machine 1, main material 14 is transferred on lower location needle plate 13 by Laser marker 1 accurately, and at this moment vacuum absorption device can be by main material
14 absorption gently are on lower location needle plate 13, and the input of main material 14 and outfan are respectively by being located at needle plate 13 both sides, lower location
Locating shaft 15 fix, transmission put in place after, a pair locating shaft 15 of outfan is opened under the driving of servomotor, no longer presss from both sides
Tight main material 14, the most main material 14 is in without restrained condition, and main material 14 is provided with hole, location, and then upper location needle plate 12 moves down, fixed
Position pin 121 enters in the hole, location of main material 14, positions main material, and behind location, main material 14 is compressed by locating shaft 15 again, pressure
After tight, laser head 11 starts mark, after mark completes, is transmitted main material 14 by the rolling of two ends locating shaft 15, finally adopts
With compounding machine 3 by product overlay film rolling.
The foregoing is only the preferred embodiment of the invention, not in order to limit the invention, all at this
Within the spirit of innovation and creation and principle, any modification, equivalent substitution and improvement etc. made, should be included in the invention
Protection domain within.
Claims (4)
1. a Laser marker, it is characterised in that: include that laser platform, the surface of described laser platform are provided with laser head,
Being provided with lower location needle plate, upper location needle plate and locating shaft on described laser platform, it is described lower fixed that described upper location needle plate is positioned at
The surface of position needle plate, described lower location needle plate overlying is stamped main material, and the both sides of described lower location needle plate are respectively provided with a pair symmetry
Being placed on described main material two sides and the locating shaft extended along described main material width, described locating shaft is by servomotor control
System, the bottom of described upper location needle plate is provided with positioning needle, and described lower location needle plate is provided with determine corresponding with described positioning needle
Position pin hole.
Laser marker the most according to claim 1, it is characterised in that: it is provided with below the needle plate of described lower location and can make main material
Absorption vacuum absorption device on the needle plate of lower location, described lower location needle plate is provided with several and described vacuum absorption device
Corresponding wind inlet.
Laser marker the most according to claim 1, it is characterised in that: described upper location needle plate is taper, described lower fixed
Position needle plate is taper.
Laser marker the most according to claim 1, it is characterised in that: described Laser marker front end is provided with feeding with multiple
Conjunction machine, described Laser marker rear end is provided with rewinding compounding machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610625796.9A CN106041316A (en) | 2016-07-29 | 2016-07-29 | Laser etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610625796.9A CN106041316A (en) | 2016-07-29 | 2016-07-29 | Laser etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106041316A true CN106041316A (en) | 2016-10-26 |
Family
ID=57197231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610625796.9A Pending CN106041316A (en) | 2016-07-29 | 2016-07-29 | Laser etching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106041316A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113021960A (en) * | 2021-01-29 | 2021-06-25 | 郑州领胜科技有限公司 | Laser flat plate composite die cutting system and die cutting method thereof |
-
2016
- 2016-07-29 CN CN201610625796.9A patent/CN106041316A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113021960A (en) * | 2021-01-29 | 2021-06-25 | 郑州领胜科技有限公司 | Laser flat plate composite die cutting system and die cutting method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161026 |
|
| WD01 | Invention patent application deemed withdrawn after publication |