CN106025470A - Sealing glue used for filling full-band double-frequency combiner resonant chamber - Google Patents
Sealing glue used for filling full-band double-frequency combiner resonant chamber Download PDFInfo
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- CN106025470A CN106025470A CN201610473731.7A CN201610473731A CN106025470A CN 106025470 A CN106025470 A CN 106025470A CN 201610473731 A CN201610473731 A CN 201610473731A CN 106025470 A CN106025470 A CN 106025470A
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- parts
- resonator cavity
- glue
- silver
- paraffin
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
Abstract
The invention provides a sealing glue used for filling a full-band double-frequency combiner resonant chamber. The sealing glue is prepared by raw materials of rosin 12 parts, silver and copper loaded paraffin 13 parts, bamboo charcoal 7 parts, gypsum powder 1.2 parts, kaolinite 0.8 parts, epoxy resin glue 9 parts and silica gel 10 parts by weight. The sealing glue is used for filling and sealing the resonant chamber of a double-frequency combiner, influence among electrical components in an adjacent resonant chamber can be prevented, rapid sealing can be realized, the electrical component can be fixed, and the sealing glue has advantages of relatively good anti-corrosion performance and good anti-aging performance.
Description
Technical field
The present invention relates to the network optimization product in electronic information and mobile communication technology field, particularly relate to a kind of solid seal glue for filling full frequency band dual-frequency channel merger resonator cavity.
Background technology
0422 represents 400-2200MHZ frequency, including Digital Clustering, SCDMA, CDMA, GSM, DCS1400, PHS, WCDMA, TD-SCDMA and CDMA2000 system.
WLAN is WLAN (Wireless Local Area Network), refer to make the LAN of transmission medium with wireless channel, it is important supplement and the extension of wired networking mode, and it is increasingly becoming a vital ingredient in computer network, it is widely used in needing removable data to process or cannot be carried out the field of physical transmission medium wiring.Its frequency is 2400-2500MHz.
Existing mass communication network optimization project, when doing signal and covering, for cost-effective minimizing space, unlike signal system transfers often uses combiner to make multiple signals merge into a road signal.Therefore wlan system is linked in the covering of existing signal network, it is necessary to use 400-2200MHZ and WLAN dual-frequency channel merger.
This common combiner currently on the market, is made up of three band filters, and wherein 0422 end is two band filter synthesis, although this version meets basic index, but volume is big, assembling complexity, debugging difficulty, and price is high.If simple reduction volume, the electric appliance component within different cavity can be caused to influence each other, assembly difficulty is big.
Summary of the invention
It is an object of the invention to provide a kind of solid seal glue for filling full frequency band dual-frequency channel merger resonator cavity, to solve above-mentioned technical problem.
The technical problem to be solved realizes by the following technical solutions:
A kind of full frequency band dual-frequency channel merger, it is characterized in that: main body includes cavity, cover plate on cavity, and it is arranged on three joints of containment portion, described three joints are 0422 port respectively, WLAN port and public port, described cavity is by the first resonator cavity, second resonator cavity, 3rd resonator cavity, 4th resonator cavity, 5th resonator cavity, 6th resonator cavity, 8th resonator cavity, 9th resonator cavity, tenth resonator cavity, 11st resonator cavity, 12nd resonator cavity and the 13rd resonator cavity are constituted, solid seal glue all it is filled with in each resonator cavity, electrical equipment original paper is packaged；Solid seal glue filling rate in resonator cavity is 45%, i.e. volume after solid seal glue solidification accounts for the 45% of each volume of resonant cavity.
A kind of solid seal glue for filling full frequency band dual-frequency channel merger resonator cavity, it is characterised in that: it is made up of the raw material of following weight portion:
Colophonium 12 parts, load 13 parts of silver-bearing copper paraffin, bamboo charcoal 7 parts, Gypsum Fibrosum powder 1.2 parts, 0.8 part of kaolinite, epoxide-resin glue 9 parts, 10 parts of silica gel.
As preferably, the preparation method of described load silver-bearing copper paraffin is:
In the paraffin of 10 volumes that temperature is 65 DEG C, agitation and dropping concentration is the copper nitrate that mol ratio is 2: 5 of 0.2mol/l and silver nitrate solution amounts to 5 volumes, it is stirred for 1.5h under the conditions of temperature is 68 DEG C, above-mentioned mixed liquor is placed in supersound process 15min under supersonic frequency 40kHz, power 50W, taking-up is cooled to room temperature, to obtain final product.
The preparation method of solid seal glue, it is characterised in that: comprise the steps:
(1) bamboo charcoal 7 parts, 0.8 part of kaolinite, bamboo charcoal 7 parts are mixed in proportion, are ground, to granularity 0.2～2 millimeters, obtain material A；
(2) by Colophonium 12 parts, epoxide-resin glue 9 parts mixing, it is heated to 135 DEG C～185 DEG C, is uniformly mixed；Then it is cooled to 120 DEG C of addition 13 parts of silver-bearing copper paraffin of load, 10 parts of silica gel be sufficiently mixed, obtains material B；
(3) material A being added in material B, under the conditions of 120 DEG C more than ultrasonic Treatment 25min, supersonic frequency 35kHz, power 45W, continuously stirred during ultrasonic Treatment, ultrasonic Treatment is taken out after terminating and is cooled to room temperature, to obtain final product.
As preferably, ultrasonic Treatment process is carried out under condition of negative pressure, and condition of negative pressure is 0.35 normal atmosphere.
The invention has the beneficial effects as follows:
The solid seal glue that the present invention provides, for filling and the resonator cavity of sealing dual-frequency channel merger, can cut off the impact between electrical equipment original paper in adjacent resonators, can quickly realize sealing, and can be fixed electrical equipment original paper；This solid seal glue has preferable antiseptic property, and ageing resistace is good.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect, below in conjunction with specific embodiment, the present invention is expanded on further, but following embodiment is only the preferred embodiments of the present invention, and not all.Based on the embodiment in embodiment, those skilled in the art are obtained other embodiments on the premise of not making creative work, broadly falls into protection scope of the present invention.
nullA kind of full frequency band high-performance dual-frequency channel merger，Main body includes cavity、Cover plate on cavity、And it is arranged on three joints of containment portion，Described three joints are 0422 port respectively、WLAN port and public port,Described cavity includes the first resonator cavity、Second resonator cavity、3rd resonator cavity、4th resonator cavity、5th resonator cavity、6th resonator cavity、8th resonator cavity、9th resonator cavity、Tenth resonator cavity、11st resonator cavity、12nd resonator cavity and the 13rd resonator cavity，Described 0422 port passes through main transmission line through the first resonator cavity、Second resonator cavity、3rd resonator cavity、4th resonator cavity、5th resonator cavity and the 6th resonator cavity，It is connected with public port，Described WLAN port is by coupling wire through the 8th resonator cavity、9th resonator cavity、Tenth resonator cavity、11st resonator cavity、12nd resonator cavity and the 13rd resonator cavity，It is connected with the coupling of public port coupling body again.
Two wave filter, respectively 400-2200MHZ band elimination filter and WLAN wave filter is included in described cavity.
Described WLAN wave filter mainly includes the first resonator cavity, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity and the 6th resonator cavity being sequentially connected, also include a main transmission line being connected between 0422 port and public port, described first resonator cavity, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity and the 6th resonator cavity, the center side position of each resonator cavity is provided with one and adjusts spiral shell.
Described WLAN wave filter i.e. 2400-2500MHz band filter, including the 8th resonator cavity, the 9th resonator cavity, the tenth resonator cavity, the 11st resonator cavity, the 12nd resonator cavity and the 13rd resonator cavity that are sequentially connected, a resonant rod is installed in the center of each resonator cavity, resonant rod in 8th resonator cavity is connected with WLAN port by coupling wire, resonant rod in 13rd resonator cavity is of coupled connections by coupling body and public port, and the equal rheo-die-casting of resonant rod in the 9th resonator cavity, the tenth resonator cavity, the 11st resonator cavity and the 12nd resonator cavity is on cavity.
Described coupling wire is to be fixed on resonant rod and joint by silver-jacketed wire scolding tin.
According to optimizing Principles of Network, the index of the present invention is:
A kind of solid seal glue for filling above-mentioned full frequency band dual-frequency channel merger resonator cavity, is made up of the raw material of following weight portion:
Colophonium 12 parts, load 13 parts of silver-bearing copper paraffin, bamboo charcoal 7 parts, Gypsum Fibrosum powder 1.2 parts, 0.8 part of kaolinite, epoxide-resin glue 9 parts, 10 parts of silica gel.
The preparation method of described load silver-bearing copper paraffin is:
In the paraffin of 10 volumes that temperature is 65 DEG C, agitation and dropping concentration is the copper nitrate that mol ratio is 2: 5 of 0.2mol/l and silver nitrate solution amounts to 5 volumes, it is stirred for 1.5h under the conditions of temperature is 68 DEG C, above-mentioned mixed liquor is placed in supersound process 15min under supersonic frequency 40kHz, power 50W, taking-up is cooled to room temperature, to obtain final product.
The preparation method of solid seal glue, comprises the steps:
(1) bamboo charcoal 7 parts, 0.8 part of kaolinite, bamboo charcoal 7 parts are mixed in proportion, are ground, to granularity 0.2～2 millimeters, obtain material A；
(2) by Colophonium 12 parts, epoxide-resin glue 9 parts mixing, it is heated to 135 DEG C～185 DEG C, is uniformly mixed；Then it is cooled to 120 DEG C of addition 13 parts of silver-bearing copper paraffin of load, 10 parts of silica gel be sufficiently mixed, obtains material B；
(3) material A being added in material B, under the conditions of 120 DEG C more than ultrasonic Treatment 25min, supersonic frequency 35kHz, power 45W, continuously stirred during ultrasonic Treatment, ultrasonic Treatment is taken out after terminating and is cooled to room temperature, to obtain final product.
Ultrasonic Treatment process is carried out under condition of negative pressure, and condition of negative pressure is 0.35 normal atmosphere.
When using the resonator cavity that solid seal glue fills sealing dual-frequency channel merger, first solid seal glue is heated to 110～120 DEG C, solid seal glue is injected in each resonator cavity of dual-frequency channel merger by the form then using pressure injection, dual-frequency channel merger is in the environment of 55～65 DEG C, the solid seal glue making injection can stick in the port of dual-frequency channel merger cavity, and there is inside solid seal glue certain mobility, after injecting glue completes, utilize ultrasonic wave concussion, same frequency supersonic wave synchronism more than two is used to shake, often group supersonic frequency 35kHz, power 45W, ultrasonic wave concussion 15 minutes, within the most first 5 minutes, temperature controls at 55 DEG C, in latter 10 minutes, constant temperature drops to room temperature, volume after solid seal glue solidification accounts for the 45% of each volume of resonant cavity.
The ultimate principle of the present invention, principal character and advantages of the present invention have more than been shown and described.Skilled person will appreciate that of the industry; the present invention is not restricted to the described embodiments; the preference being only the present invention described in above-described embodiment and description; it is not intended to limit the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements both fall within scope of the claimed invention.Claimed scope is defined by appending claims and equivalent thereof.
Claims (2)
1. the solid seal glue being used for filling full frequency band dual-frequency channel merger resonator cavity, it is characterised in that: by such as
The raw material of lower weight portion is made:
Colophonium 12 parts, load 13 parts of silver-bearing copper paraffin, bamboo charcoal 7 parts, Gypsum Fibrosum powder 1.2 parts, 0.8 part of kaolinite, ring
9 parts of epoxy resins glue, 10 parts of silica gel.
Solid seal glue for filling full frequency band dual-frequency channel merger resonator cavity the most according to claim 1, its
It is characterised by: the preparation method of described load silver-bearing copper paraffin is:
In the paraffin of 10 volumes that temperature is 65 DEG C, agitation and dropping concentration is the mol ratio of 0.2mo l/l and is
The copper nitrate of 2: 5 and silver nitrate solution amount to 5 volumes, are stirred for 1.5h under the conditions of temperature is 68 DEG C, will
Above-mentioned mixed liquor is placed in supersound process 15mi n under supersonic frequency 40kHz, power 50W, takes out and is cooled to room
Temperature, to obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473731.7A CN106025470A (en) | 2016-06-24 | 2016-06-24 | Sealing glue used for filling full-band double-frequency combiner resonant chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473731.7A CN106025470A (en) | 2016-06-24 | 2016-06-24 | Sealing glue used for filling full-band double-frequency combiner resonant chamber |
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| Publication Number | Publication Date |
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| CN106025470A true CN106025470A (en) | 2016-10-12 |
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| CN201610473731.7A Pending CN106025470A (en) | 2016-06-24 | 2016-06-24 | Sealing glue used for filling full-band double-frequency combiner resonant chamber |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103087655A (en) * | 2012-11-22 | 2013-05-08 | 芜湖众力部件有限公司 | Special epoxy-cotton-oil-containing binding agent for automobile interior ornament surface composite leather |
| CN104046307A (en) * | 2014-05-30 | 2014-09-17 | 青岛辰青信息技术有限公司 | High-temperature-resistant sealant |
| CN104194657A (en) * | 2014-07-31 | 2014-12-10 | 吕明肇 | Temperature-resistant and oil-resistant hot melt adhesive for perfect binding of notebook |
| CN104293264A (en) * | 2014-09-17 | 2015-01-21 | 明光市锐创电气有限公司 | High-strength metal glue |
-
2016
- 2016-06-24 CN CN201610473731.7A patent/CN106025470A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103087655A (en) * | 2012-11-22 | 2013-05-08 | 芜湖众力部件有限公司 | Special epoxy-cotton-oil-containing binding agent for automobile interior ornament surface composite leather |
| CN104046307A (en) * | 2014-05-30 | 2014-09-17 | 青岛辰青信息技术有限公司 | High-temperature-resistant sealant |
| CN104194657A (en) * | 2014-07-31 | 2014-12-10 | 吕明肇 | Temperature-resistant and oil-resistant hot melt adhesive for perfect binding of notebook |
| CN104293264A (en) * | 2014-09-17 | 2015-01-21 | 明光市锐创电气有限公司 | High-strength metal glue |
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Application publication date: 20161012 |