CN106207343A - A kind of full frequency band dual-frequency channel merger - Google Patents
A kind of full frequency band dual-frequency channel merger Download PDFInfo
- Publication number
- CN106207343A CN106207343A CN201610473772.6A CN201610473772A CN106207343A CN 106207343 A CN106207343 A CN 106207343A CN 201610473772 A CN201610473772 A CN 201610473772A CN 106207343 A CN106207343 A CN 106207343A
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- China
- Prior art keywords
- resonator cavity
- cavity
- parts
- resonator
- frequency channel
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
- H01P1/2138—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using hollow waveguide filters
Abstract
The present invention provides a kind of full frequency band dual-frequency channel merger, main body includes the cover plate on cavity, cavity and is arranged on three joints of containment portion, described three joints are 0422 port, WLAN port and public port respectively, described cavity is made up of the first resonator cavity, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity, the 6th resonator cavity, the 8th resonator cavity, the 9th resonator cavity, the tenth resonator cavity, the 11st resonator cavity, the 12nd resonator cavity and the 13rd resonator cavity, all it is filled with solid seal glue in each resonator cavity, electrical equipment original paper is packaged.The solid seal glue that the present invention provides, for filling and the resonator cavity of sealing dual-frequency channel merger, can cut off the impact between electrical equipment original paper in adjacent resonators, can quickly realize sealing, and can be fixed electrical equipment original paper；This solid seal glue has preferable antiseptic property, and ageing resistace is good.
Description
Technical field
The present invention relates to the network optimization product in electronic information and mobile communication technology field, particularly relate to a kind of full range
Section dual-frequency channel merger.
Background technology
0422 represents 400-2200MHZ frequency, including Digital Clustering, SCDMA, CDMA, GSM, DCS1400, PHS,
WCDMA, TD-SCDMA and CDMA2000 system.
WLAN is WLAN (Wireless Local Area Network), refers to make transmission matchmaker with wireless channel
The LAN being situated between, is important supplement and the extension of wired networking mode, and is increasingly becoming in computer network one extremely
Close important ingredient, be widely used in needing removable data to process or cannot be carried out the neck of physical transmission medium wiring
Territory.Its frequency is 2400-2500MHz.
Existing mass communication network optimization project, when doing signal and covering, for cost-effective minimizing space, different letters
Number system transfers often uses combiner to make multiple signals merge into a road signal.Therefore wlan system is linked into existing
Signal network cover in, it is necessary to use 400-2200MHZ and WLAN dual-frequency channel merger.
This common combiner currently on the market, is made up of three band filters, and wherein 0422 end is that two bands are logical
Wave filter synthesizes, although this version meets basic index, but volume is big, assembling complexity, debugging difficulty, and price is high.If
Simple reduction volume, can cause the electric appliance component within different cavity to influence each other, and assembly difficulty is big.
Summary of the invention
It is an object of the invention to provide a kind of full frequency band dual-frequency channel merger, to solve above-mentioned technical problem.
The technical problem to be solved realizes by the following technical solutions:
A kind of full frequency band dual-frequency channel merger, it is characterised in that: main body includes the cover plate on cavity, cavity and is arranged on
Three joints of containment portion, described three joints are 0422 port, WLAN port and public port respectively, described cavity by
First resonator cavity, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity, the 6th resonator cavity, the 8th resonator cavity,
9th resonator cavity, the tenth resonator cavity, the 11st resonator cavity, the 12nd resonator cavity and the 13rd resonator cavity are constituted, each resonator cavity
The most all it is filled with solid seal glue, electrical equipment original paper is packaged；
Solid seal glue is made up of the raw material of following weight portion:
Colophonium 12 parts, load 13 parts of silver-bearing copper paraffin, bamboo charcoal 7 parts, Gypsum Fibrosum powder 1.2 parts, 0.8 part of kaolinite, epoxide-resin glue 9
Part, 10 parts of silica gel.
As preferably, described solid seal glue filling rate in resonator cavity is 45%, i.e. volume after solid seal glue solidification accounts for respectively
The 45% of volume of resonant cavity.
As preferably, the preparation method of described load silver-bearing copper paraffin is:
In the paraffin of 10 volumes that temperature is 65 DEG C, agitation and dropping concentration is the nitre that mol ratio is 2: 5 of 0.2mol/l
Acid copper and silver nitrate solution amount to 5 volumes, be stirred for 1.5h, above-mentioned mixed liquor is placed in supersonic frequency under the conditions of temperature is 68 DEG C
Supersound process 15min under rate 40kHz, power 50W, takes out and is cooled to room temperature, to obtain final product.
The preparation method of solid seal glue, it is characterised in that: comprise the steps:
(1) bamboo charcoal 7 parts, 0.8 part of kaolinite, bamboo charcoal 7 parts are mixed in proportion, are ground, to granularity 0.2～2 millimeters,
Obtain material A；
(2) by Colophonium 12 parts, epoxide-resin glue 9 parts mixing, it is heated to 135 DEG C～185 DEG C, is uniformly mixed；Then
It is cooled to 120 DEG C of addition 13 parts of silver-bearing copper paraffin of load, 10 parts of silica gel be sufficiently mixed, obtains material B；
(3) material A is added in material B, under the conditions of 120 DEG C more than ultrasonic Treatment 25min, supersonic frequency 35kHz, merit
Rate 45W, continuously stirred during ultrasonic Treatment, ultrasonic Treatment is taken out after terminating and is cooled to room temperature, to obtain final product.
As preferably, ultrasonic Treatment process is carried out under condition of negative pressure, and condition of negative pressure is 0.35 normal atmosphere.
The invention has the beneficial effects as follows:
The solid seal glue that the present invention provides, for filling and the resonator cavity of sealing dual-frequency channel merger, can cut off adjacent resonators
Impact between interior electrical equipment original paper, can quickly realize sealing, and can be fixed electrical equipment original paper；This solid seal glue has preferably
Antiseptic property, ageing resistace is good.
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect, below knot
Close specific embodiment, the present invention is expanded on further, but following embodiment is only the preferred embodiments of the present invention, and not all.
Based on the embodiment in embodiment, it is real that those skilled in the art are obtained other on the premise of not making creative work
Execute example, broadly fall into protection scope of the present invention.
A kind of full frequency band high-performance dual-frequency channel merger, main body includes the cover plate on cavity, cavity and is arranged on outside cavity
Three joints in portion, described three joints are 0422 port, WLAN port and public port respectively, and described cavity includes that first is humorous
Shake chamber, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity, the 6th resonator cavity, the 8th resonator cavity, the 9th humorous
Shake chamber, the tenth resonator cavity, the 11st resonator cavity, the 12nd resonator cavity and the 13rd resonator cavity, and described 0422 port is by main biography
Defeated line is through the first resonator cavity, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity and the 6th resonator cavity, with public affairs
Altogether port is connected, described WLAN port by coupling wire through the 8th resonator cavity, the 9th resonator cavity, the tenth resonator cavity, the 11st
Resonator cavity, the 12nd resonator cavity and the 13rd resonator cavity, then be connected with the coupling of public port coupling body.
Two wave filter, respectively 400-2200MHZ band elimination filter and WLAN wave filter is included in described cavity.
The first resonator cavity that described WLAN wave filter mainly includes being sequentially connected, the second resonator cavity, the 3rd resonator cavity, the 4th
Resonator cavity, the 5th resonator cavity and the 6th resonator cavity, also include a main transmission being connected between 0422 port and public port
Line, described first resonator cavity, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity and the 6th resonator cavity, often
The center side position of individual resonator cavity is provided with one and adjusts spiral shell.
Described WLAN wave filter i.e. 2400-2500MHz band filter, including the 8th resonator cavity being sequentially connected, the 9th
Resonator cavity, the tenth resonator cavity, the 11st resonator cavity, the 12nd resonator cavity and the 13rd resonator cavity, the centre bit of each resonator cavity
Putting one resonant rod of installation, the resonant rod in the 8th resonator cavity is connected with WLAN port by coupling wire, the 13rd resonator cavity
In resonant rod be of coupled connections with public port by coupling body, the 9th resonator cavity, the tenth resonator cavity, the 11st resonator cavity and the
The equal rheo-die-casting of resonant rod in 12 resonator cavitys is on cavity.
Described coupling wire is to be fixed on resonant rod and joint by silver-jacketed wire scolding tin.
According to optimizing Principles of Network, the index of the present invention is:
A kind of solid seal glue for above-mentioned full frequency band dual-frequency channel merger, is made up of the raw material of following weight portion:
Colophonium 12 parts, load 13 parts of silver-bearing copper paraffin, bamboo charcoal 7 parts, Gypsum Fibrosum powder 1.2 parts, 0.8 part of kaolinite, epoxide-resin glue 9
Part, 10 parts of silica gel.
The preparation method of described load silver-bearing copper paraffin is:
In the paraffin of 10 volumes that temperature is 65 DEG C, agitation and dropping concentration is the nitre that mol ratio is 2: 5 of 0.2mol/l
Acid copper and silver nitrate solution amount to 5 volumes, be stirred for 1.5h, above-mentioned mixed liquor is placed in supersonic frequency under the conditions of temperature is 68 DEG C
Supersound process 15min under rate 40kHz, power 50W, takes out and is cooled to room temperature, to obtain final product.
The preparation method of solid seal glue, comprises the steps:
(1) bamboo charcoal 7 parts, 0.8 part of kaolinite, bamboo charcoal 7 parts are mixed in proportion, are ground, to granularity 0.2～2 millimeters,
Obtain material A；
(2) by Colophonium 12 parts, epoxide-resin glue 9 parts mixing, it is heated to 135 DEG C～185 DEG C, is uniformly mixed；Then
It is cooled to 120 DEG C of addition 13 parts of silver-bearing copper paraffin of load, 10 parts of silica gel be sufficiently mixed, obtains material B；
(3) material A is added in material B, under the conditions of 120 DEG C more than ultrasonic Treatment 25min, supersonic frequency 35kHz,
Power 45W, continuously stirred during ultrasonic Treatment, ultrasonic Treatment is taken out after terminating and is cooled to room temperature, to obtain final product.
Ultrasonic Treatment process is carried out under condition of negative pressure, and condition of negative pressure is 0.35 normal atmosphere.
When using the resonator cavity that solid seal glue fills sealing dual-frequency channel merger, first solid seal glue is heated to 110～120 DEG C, so
Solid seal glue is injected in each resonator cavity of dual-frequency channel merger by the form of rear employing pressure injection, and dual-frequency channel merger is in the ring of 55～65 DEG C
In border, make the solid seal glue of injection can stick in the port of dual-frequency channel merger cavity, and have certain inside solid seal glue
Mobility, after injecting glue completes, utilizes ultrasonic wave concussion, uses same frequency supersonic wave synchronism more than two to shake, often organizes supersonic frequency
Rate 35kHz, power 45W, ultrasonic wave concussion 15 minutes, within the most first 5 minutes, temperature controls at 55 DEG C, constant temperature in latter 10 minutes
Dropping to room temperature, the volume after solid seal glue solidification accounts for the 45% of each volume of resonant cavity.
The ultimate principle of the present invention, principal character and advantages of the present invention have more than been shown and described.The technology of the industry
The personnel only present invention it should be appreciated that the present invention is not restricted to the described embodiments, described in above-described embodiment and description
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also has various
Changes and improvements, these changes and improvements both fall within scope of the claimed invention.Claimed scope is by institute
Attached claims and equivalent thereof define.
Claims (3)
1. a full frequency band dual-frequency channel merger, it is characterised in that: main body includes the cover plate on cavity, cavity and is arranged on chamber
Three joints of external body, described three joints are 0422 port, WLAN port and public port respectively, and described cavity is by first
Resonator cavity, the second resonator cavity, the 3rd resonator cavity, the 4th resonator cavity, the 5th resonator cavity, the 6th resonator cavity, the 8th resonator cavity, the 9th
Resonator cavity, the tenth resonator cavity, the 11st resonator cavity, the 12nd resonator cavity and the 13rd resonator cavity are constituted, in each resonator cavity all
It is filled with solid seal glue, electrical equipment original paper is packaged；
Solid seal glue is made up of the raw material of following weight portion:
Colophonium 12 parts, load 13 parts of silver-bearing copper paraffin, bamboo charcoal 7 parts, Gypsum Fibrosum powder 1.2 parts, 0.8 part of kaolinite, epoxide-resin glue 9 parts, silicon
10 parts of glue.
Full frequency band dual-frequency channel merger the most according to claim 1, it is characterised in that: described solid seal glue filling out in resonator cavity
The rate of filling is 45%.
Full frequency band dual-frequency channel merger the most according to claim 1, it is characterised in that: the preparation method of described load silver-bearing copper paraffin
For:
In the paraffin of 10 volumes that temperature is 65 DEG C, agitation and dropping concentration is the copper nitrate that mol ratio is 2: 5 of 0.2mol/l
And silver nitrate solution amounts to 5 volumes, under the conditions of temperature is 68 DEG C, it is stirred for 1.5h, above-mentioned mixed liquor is placed in supersonic frequency
Supersound process 15min under 40kHz, power 50W, takes out and is cooled to room temperature, to obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473772.6A CN106207343A (en) | 2016-06-24 | 2016-06-24 | A kind of full frequency band dual-frequency channel merger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610473772.6A CN106207343A (en) | 2016-06-24 | 2016-06-24 | A kind of full frequency band dual-frequency channel merger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106207343A true CN106207343A (en) | 2016-12-07 |
Family
ID=57461826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610473772.6A Pending CN106207343A (en) | 2016-06-24 | 2016-06-24 | A kind of full frequency band dual-frequency channel merger |
Country Status (1)
| Country | Link |
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| CN (1) | CN106207343A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1605120A (en) * | 1978-04-11 | 1981-12-16 | Marconi Co Ltd | Electrical networks for use at high frequencies |
| CN101752276A (en) * | 2008-12-16 | 2010-06-23 | 蒂萨公司 | Method for encapsulating electronic device |
| CN202737070U (en) * | 2012-06-28 | 2013-02-13 | 安徽省瑞洋通讯设备有限公司 | Full-band high-performance dual-band combiner |
| CN103335567A (en) * | 2013-06-26 | 2013-10-02 | 北京理工大学 | Integrally gummed electronic circuit module for electronic detonator and process method thereof |
-
2016
- 2016-06-24 CN CN201610473772.6A patent/CN106207343A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1605120A (en) * | 1978-04-11 | 1981-12-16 | Marconi Co Ltd | Electrical networks for use at high frequencies |
| CN101752276A (en) * | 2008-12-16 | 2010-06-23 | 蒂萨公司 | Method for encapsulating electronic device |
| CN202737070U (en) * | 2012-06-28 | 2013-02-13 | 安徽省瑞洋通讯设备有限公司 | Full-band high-performance dual-band combiner |
| CN103335567A (en) * | 2013-06-26 | 2013-10-02 | 北京理工大学 | Integrally gummed electronic circuit module for electronic detonator and process method thereof |
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Application publication date: 20161207 |
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| RJ01 | Rejection of invention patent application after publication |