CN106024739A - Metallic pad device and test system and method using same - Google Patents
Metallic pad device and test system and method using same Download PDFInfo
- Publication number
- CN106024739A CN106024739A CN201610320974.7A CN201610320974A CN106024739A CN 106024739 A CN106024739 A CN 106024739A CN 201610320974 A CN201610320974 A CN 201610320974A CN 106024739 A CN106024739 A CN 106024739A
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- CN
- China
- Prior art keywords
- metal
- layer structure
- aluminum
- test
- metal gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides a metallic pad device and a test system and method using the same. The metallic pad device comprises a copper metallic layer structure and an aluminum metallic layer structure thereon. The aluminum metallic layer structure comprises an aluminum plate. The copper metallic layer structure is connected with a test structure to be tested or a lower circuit. The aluminum metallic layer structure also comprises aluminum lines around the aluminum plate.
Description
Technical field
The present invention relates to semiconductor applications, particularly relate to a kind of metal gasket device and use the test System and method for of metal gasket.
Background technology
In current field of semiconductor manufacture, design metal gasket is all had by circuit and test structure, its effect is that circuit or the test structure of lower floor are connected to the superiors, operates for follow-up encapsulation and probe contact etc., as shown in Figure 1 (long and width is respectively 60um).
Along with the use frequency of probe card increases, it was observed that probe card can be shifted in conventionally test, the phenomenon even deformed, especially prominent under hot environment.Needle point still can little by little offset outside metal gasket, until skidding off metal gasket, and the most sliding pin of this phenomenon, the shifting process of probe as shown in Figure 1.
After there is sliding pin, owing to board will not identify automatically, still may proceed to measure, and sample also will continue the maximum time surveyed to setting, the most do not only result in data invalid, the resource of waste tester table, increase rate of resurveying and the workload of tester of test, probe is chronically at outside metal gasket simultaneously, also subject to damage.
Summary of the invention
The technical problem to be solved in the present invention is the sliding pin phenomenon how solving probe.
In order to solve this technical problem, the invention provides a kind of metal gasket device, including copper metal layer structure and the aluminum metal layer structure being provided thereon, described aluminum metal layer structure includes aluminium sheet, described copper metal layer structure connects test structure to be measured or lower circuit, described aluminum metal layer structure also includes that aluminum metal lines, described aluminum metal lines are arranged around described aluminium sheet.
Optionally, the quantity of described aluminium sheet is at least two, and described copper metal layer structure also includes copper metal line, is surrounded between the aluminum metal lines of the described aluminium sheet of adjacent two and is connected by described copper metal line.
Optionally, described copper metal layer structure also includes copper metal master, described copper metal master connecting test structure or lower circuit.
Optionally, the resistance value of single described copper metal line is 100 ohm.
Optionally, described aluminum metal lines and aluminium sheet be spaced apart 6-30 micron.
Present invention also offers a kind of test system using metal gasket, at least include the metal gasket device that probe card, board main frame and alternative of the present invention provide, probe card described in described board response of host contacts conducting with described aluminum metal lines, then judge that this test occurs abnormal, carry out the subsequent operation preset.
Optionally, described default subsequent operation includes that controlling described probe card stops testing.
Present invention also offers a kind of method of testing using metal gasket, have employed the metal gasket device that alternative of the present invention provides, including:
Start test；Then monitor described probe card, if described probe card contacts conducting with aluminum metal lines, then judge that this test occurs abnormal, carry out the subsequent operation preset.
Optionally, described default subsequent operation includes that controlling described probe card stops testing.
In the present invention, aluminum metal lines cincture is had around the aluminium sheet of metal gasket, outside probe skids off metal gasket, when touching the metal wire of outer ring, probe can feed back to board exchange by modes such as short circuits, and the effect of this design is whether exploratory probe slides pin, and continue test after stoping the sliding pin of probe, prevent needle point from damaging, reduce board resource and waste of time, it is ensured that the data of tester table are effective.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the sliding pin situation of prior art middle probe；
Fig. 2 is the schematic diagram of metal pad structure in prior art；
Fig. 3 is the schematic diagram of metal pad structure in one embodiment of the invention；
Fig. 4 is the schematic top plan view of metal pad structure in one embodiment of the invention；
In figure, 1-aluminum metal layer structure；2-copper metal layer structure；10-aluminium sheet；11-aluminum metal lines；20-copper metal master；21-copper metal line.
Detailed description of the invention
The metal pad structure provided the present invention below with reference to Fig. 3 to Fig. 4 and the test System and method for using metal gasket are described in detail, it is optional embodiment of the present invention, it is believed that, those skilled in the art are not changing in the range of present invention spirit and content, modify it and polish.
Refer to Fig. 3 and Fig. 4, the invention provides a kind of metal gasket device, including copper metal layer structure 2 and the aluminum metal layer structure 1 being provided thereon, described aluminum metal layer structure 1 includes aluminium sheet 10, described copper metal layer structure 2 connects test structure to be measured or lower circuit, described aluminum metal layer structure 1 also includes that aluminum metal lines 11, described aluminum metal lines 11 are arranged around described aluminium sheet 10.
Certainly, in the illustrated embodiment, the quantity of described aluminium sheet 10 is at least two, and described copper metal layer structure 2 also includes copper metal line 21, it is surrounded between the aluminum metal lines 11 of the described aluminium sheet of adjacent two 10 and is connected by described copper metal line 21, it is possible to achieve series connection.In further alternative embodiment, the logical metal wire 11 in copper metal layer is connected to aluminum metal lines 11 by the through hole in copper metal layer.
Visible, except each parts having described that, also include other material that skilled person will appreciate that, structures, as long as meeting above description, just without departing from protection scope of the present invention.For example, in the embodiment of Fig. 3 and Fig. 4 signal, described copper metal layer structure 2 also includes copper metal master 20, described copper metal master 20 connecting test structure or lower circuit.
The present invention is to have aluminum metal lines cincture around metal gasket, and with copper metal line do wire connect (add wire another purpose be to ensure that resistance is the most too small, in order to avoid after probe skids off short circuit, electric current is excessive, scaling loss probe card.It is thus desirable to copper metal line has enough length, it is proposed that ensure that copper metal line has the resistance of 100 ohm, the resistance value of the most single described copper metal line to be 100 ohm), by adjacent aluminum metal lines series connection.The contrast of this change such as Fig. 2 and Fig. 3 understands.
In optional embodiment of the present invention, described aluminum metal lines 11 is spaced apart 6-30 micron with aluminium sheet 10.Should there is sufficiently large gap between aluminum metal lines 11 and aluminium sheet 10, it is ensured that the insulation of aluminum metal lines and aluminium block, and prevent from probe from having slightly skidding off, when not affecting actually used, be just stopped test.So, alternative of the present invention suggestion aluminum metal lines 11 is set to 5-30um with the spacing of aluminium sheet 10.
Based on above-mentioned metal gasket device, present invention also offers a kind of test system using metal gasket, at least include the metal gasket device that probe card, board main frame and alternative of the present invention provide, probe card described in described board response of host contacts conducting with described aluminum metal lines, then judge that this test occurs abnormal, carry out the subsequent operation preset.Furthermore, it is understood that described default subsequent operation includes that controlling described probe card stops testing.
Visible, outside probe skids off metal gasket, when touching the metal wire of outer ring, probe short circuit, now board measuring program, by collecting the data of this sample, it is judged that sample is abnormal, automatically abandon this sample, skip to next sample and continue test, until all samples end of test.
Corresponding with above-mentioned test system, present invention also offers a kind of method of testing using metal gasket, have employed the metal gasket device that alternative of the present invention provides, including:
Start test；Then monitor described probe card, if described probe card contacts conducting with aluminum metal lines, then judge that this test occurs abnormal, carry out the subsequent operation preset.Furthermore, it is understood that described default subsequent operation includes that controlling described probe card stops testing.
In sum, in the present invention, aluminum metal lines cincture is had, outside probe skids off metal gasket, when touching the metal wire of outer ring around the aluminium sheet of metal gasket, probe can feed back to board exchange by modes such as short circuits, the effect of this design is whether exploratory probe slides pin, and stops continuation test after the sliding pin of probe, prevents needle point from damaging, reduce board resource and waste of time, it is ensured that the data of tester table are effective.
Claims (9)
1. a metal gasket device, including copper metal layer structure and the aluminum metal layer structure being provided thereon, described aluminum
Metal-layer structure includes aluminium sheet, and described copper metal layer structure connects test structure to be measured or lower circuit, its
Being characterised by: described aluminum metal layer structure also includes aluminum metal lines, described aluminum metal lines is around described aluminium sheet cloth
Put.
2. metal gasket device as claimed in claim 1, it is characterised in that: the quantity of described aluminium sheet is at least two
Individual, described copper metal layer structure also includes copper metal line, is surrounded on the aluminum metal of the described aluminium sheet of adjacent two
Connected by described copper metal line between line.
3. metal gasket device as claimed in claim 2, it is characterised in that: described copper metal layer structure also includes
Copper metal master, described copper metal master connecting test structure or lower circuit.
4. metal gasket device as claimed in claim 2, it is characterised in that: the resistance of single described copper metal line
Value is 100 ohm.
5. metal gasket device as claimed in claim 1, it is characterised in that: between described aluminum metal lines and aluminium sheet
It is divided into 6-30 micron.
6. the test system using metal gasket, it is characterised in that: at least include probe card, board main frame with
And such as claim 1 to 5 one of arbitrarily described metal gasket device, spy described in described board response of host
The conducting that contacts of pin card and described aluminum metal lines, then judge that this test occurs abnormal, and carry out presetting is follow-up
Operation.
7. use as claimed in claim 6 metal gasket test system, it is characterised in that: described default after
Continuous operation includes that controlling described probe card stops testing.
8. the method for testing using metal gasket, it is characterised in that: have employed as claim 1 to 5 is any
Metal gasket device described in one of, including:
Start test；Then described probe card is monitored, if described probe card contacts conducting with aluminum metal lines, then
Judge that this test occurs abnormal, carry out the subsequent operation preset.
9. use as claimed in claim 8 metal gasket test system, it is characterised in that: described default after
Continuous operation includes that controlling described probe card stops testing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610320974.7A CN106024739A (en) | 2016-05-13 | 2016-05-13 | Metallic pad device and test system and method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610320974.7A CN106024739A (en) | 2016-05-13 | 2016-05-13 | Metallic pad device and test system and method using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106024739A true CN106024739A (en) | 2016-10-12 |
Family
ID=57098015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610320974.7A Pending CN106024739A (en) | 2016-05-13 | 2016-05-13 | Metallic pad device and test system and method using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106024739A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449462A (en) * | 2016-11-17 | 2017-02-22 | 上海华力微电子有限公司 | Electromigration test structure |
| CN113284815A (en) * | 2020-02-19 | 2021-08-20 | 华邦电子股份有限公司 | Semiconductor device and method for detecting pin mark offset |
| CN113391181A (en) * | 2021-05-24 | 2021-09-14 | 长江存储科技有限责任公司 | Equipment, wafer structure and method for detecting state of wafer test probe card |
-
2016
- 2016-05-13 CN CN201610320974.7A patent/CN106024739A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449462A (en) * | 2016-11-17 | 2017-02-22 | 上海华力微电子有限公司 | Electromigration test structure |
| CN106449462B (en) * | 2016-11-17 | 2019-11-26 | 上海华力微电子有限公司 | Electro-migration testing structure |
| CN113284815A (en) * | 2020-02-19 | 2021-08-20 | 华邦电子股份有限公司 | Semiconductor device and method for detecting pin mark offset |
| CN113391181A (en) * | 2021-05-24 | 2021-09-14 | 长江存储科技有限责任公司 | Equipment, wafer structure and method for detecting state of wafer test probe card |
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Application publication date: 20161012 |
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