CN106009525A - Silica gel gasket - Google Patents
Silica gel gasket Download PDFInfo
- Publication number
- CN106009525A CN106009525A CN201610552222.3A CN201610552222A CN106009525A CN 106009525 A CN106009525 A CN 106009525A CN 201610552222 A CN201610552222 A CN 201610552222A CN 106009525 A CN106009525 A CN 106009525A
- Authority
- CN
- China
- Prior art keywords
- parts
- silica gel
- gel pad
- boron nitride
- zinc oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a silica gel gasket. The silica gel gasket comprises the following components in parts by mass: 100 parts of epoxy resin, 45-55 parts of zinc oxide, 35-50 parts of boron nitride, 10-20 parts of modified aluminium oxide, 0.2-0.4 part of a silane coupling agent, 1-5 parts of a thixotropic agent and 1-5 parts of a flexibilizer. According to the silica gel gasket, high-heat-conductivity rubber epoxy resin is adopted as a heat conducting substrate, modified aluminium oxide, zinc oxide and boron nitride are adopted as main heat conduction agents, a special-ingredient stabilizer is designed, zinc oxide serves as an insulating and heat conducting filler, and boron nitride (a fire retardant) is added, so that the silica gel gasket has high performance and is resistant to corrosion and abrasion, flame-retardant and high in bearing capacity.
Description
Technical field
The present invention relates to a kind of silica gel pad, belong to LED silica gel technical field.
Background technology
Today at the continuous development & production of high-tech, the industry of Heat Conduction Material is also in sprouting, silica gel pad plays a part the biggest core and does use. and owing to general Heat Conduction Material is difficult to play electronics significant points not only heat conduction but also having fine viscosity, silica gel pad completely solves this problem；Particularly serve great effect in electronics, LED illumination industry in LED television field.
Silica gel pad is to be filled thermal conductive ceramic powder by acrylic polymers, is composited with organic silicon adhesive.There is the characteristic of high heat conduction and insulation, and there is flexibility, compressibility, docile property, strong viscosity.Adaptive temperature scope is big, can fill up irregular surface, can fit to close and firm thermal source device and fin, is quickly conducted by heat.
Summary of the invention
Purpose: for solving the deficiencies in the prior art, the present invention provides a kind of silica gel pad.
Technical scheme: for solving above-mentioned technical problem, the technical solution used in the present invention is:
A kind of silica gel pad, it is characterised in that: include following component: epoxy resin 100 parts, zinc oxide 45-55 part, boron nitride 35-50 part, modified aluminas 10-20 part, silane coupler 0.2-0.4 part, thixotropic agent 1-5 part, toughener 1-5 part, number is mass fraction.
Preferably, described silica gel pad, it is characterised in that raw material consists of: epoxy resin 100 parts, zinc oxide 50 parts, boron nitride 42 parts, modified aluminas 15 parts, silane coupler 0.3 part, thixotropic agent 3 parts, toughener 3 parts, number is mass fraction.
Preferably, described silica gel pad, it is characterised in that: described zinc oxide, the diameter of boron nitride are respectively less than 30um.
Preferably, described silica gel pad, it is characterised in that: polyethylene selected by described thixotropic agent.
Preferably, described silica gel pad, it is characterised in that: also include stabilizer 1-3 part.Described stabilizer is hydroquinone.
Beneficial effect: the silica gel pad that the present invention provides, silica gel pad band, with high heat conductive rubber epoxy resin as heat conducting base material, uses zinc oxide, modified aluminas, boron nitride etc. as thermal conducting agent, and the single or double back of the body has pressure-sensitive silica gel pad, bonding reliable, intensity height.Silica gel pad tape thickness is thin, and pliability is good, is highly susceptible to fit device and spreader surface.Silica gel pad band also adapts to the change of cold/hot temperature, it is ensured that the one of performance makes peace stable.
Detailed description of the invention
Below in conjunction with example, the present invention is illustrated:
Embodiment 1: a kind of silica gel pad, forms as follows:
Epoxy resin 100 parts, zinc oxide 50 parts, boron nitride 42 parts, modified aluminas 15 parts, silane coupler 0.3 part, thixotropic agent 3 parts, toughener 3 parts, number is mass fraction.
Embodiment 2: a kind of silica gel pad, forms as follows:
Epoxy resin 100 parts, zinc oxide 45 parts, boron nitride 35 parts, modified aluminas 10 parts, silane coupler 0.2 part, thixotropic agent 1 part, toughener 1 part, number is mass fraction.
Embodiment 3: a kind of silica gel pad, forms as follows:
Epoxy resin 100 parts, zinc oxide 55 parts, boron nitride 50 parts, modified aluminas 20 parts, silane coupler 0.4 part, thixotropic agent 5 parts, toughener 5 parts, number is mass fraction.
Embodiment 4: a kind of silica gel pad, forms as follows:
Epoxy resin 100 parts, zinc oxide 50 parts, boron nitride 42 parts, modified aluminas 15 parts, silane coupler 0.3 part, thixotropic agent 3 parts, toughener 3 parts, stabilizer 3 parts, number is mass fraction.
The product that above example obtains, through experiment test: in the silica gel pad that the present invention provides, use silica gel pad with high heat conductive rubber epoxy resin as heat conducting base material, use modified aluminas, zinc oxide, boron nitride as main thermal conducting agent, be zinc oxide by design special composition stabilizer and insulating heat-conductive filler, add boron nitride fire retardant, product is made to have the performance of high-quality, anticorrosion antiwear, resistance combustion, bearing capacity is the strongest.
Below disclosing the present invention with preferred embodiment, so it is not intended to limiting the invention, and the technical scheme that all employing equivalents or equivalent transformation mode are obtained, within all falling within protection scope of the present invention.
Claims (6)
1. a silica gel pad, it is characterised in that: include following component: epoxy resin 100 parts, zinc oxide 45-55 part, boron nitride 35-50 part, modified aluminas 10-20 part, silane coupler 0.2-0.4 part, thixotropic agent 1-5 part, toughener 1-5 part, number is mass fraction.
Silica gel pad the most according to claim 1, it is characterised in that raw material consists of: epoxy resin 100 parts, zinc oxide 50 parts, boron nitride 42 parts, modified aluminas 15 parts, silane coupler 0.3 part, thixotropic agent 3 parts, toughener 3 parts, number is mass fraction.
Silica gel pad the most according to claim 1, it is characterised in that: described zinc oxide, the diameter of boron nitride are respectively less than 30um.
Silica gel pad the most according to claim 1, it is characterised in that: polyethylene selected by described thixotropic agent.
Silica gel pad the most according to claim 1 and 2, it is characterised in that: also include stabilizer 1-3 part.
Silica gel pad the most according to claim 5, it is characterised in that: described stabilizer is hydroquinone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610552222.3A CN106009525A (en) | 2016-07-14 | 2016-07-14 | Silica gel gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610552222.3A CN106009525A (en) | 2016-07-14 | 2016-07-14 | Silica gel gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106009525A true CN106009525A (en) | 2016-10-12 |
Family
ID=57118058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610552222.3A Pending CN106009525A (en) | 2016-07-14 | 2016-07-14 | Silica gel gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106009525A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286660A (en) * | 2017-06-20 | 2017-10-24 | 安徽燕青科技集团有限公司 | A kind of waterproof sealing silica gel ring of LED illumination lamp |
| CN108314778A (en) * | 2018-02-28 | 2018-07-24 | 南方科技大学 | A kind of modified epoxy resin composite and preparation method thereof |
| CN109111697A (en) * | 2018-08-24 | 2019-01-01 | 东莞市昌圣硅胶制品有限公司 | A kind of silica gel pad based on Communication Equipment application |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676109A (en) * | 2012-06-04 | 2012-09-19 | 华烁科技股份有限公司 | Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate |
| CN104371274A (en) * | 2014-11-18 | 2015-02-25 | 中国科学院深圳先进技术研究院 | Modified alumina composite material, copper-coated substrate and preparation method of copper-coated substrate |
-
2016
- 2016-07-14 CN CN201610552222.3A patent/CN106009525A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676109A (en) * | 2012-06-04 | 2012-09-19 | 华烁科技股份有限公司 | Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate |
| CN104371274A (en) * | 2014-11-18 | 2015-02-25 | 中国科学院深圳先进技术研究院 | Modified alumina composite material, copper-coated substrate and preparation method of copper-coated substrate |
Non-Patent Citations (2)
| Title |
|---|
| 温辉梁: "《化工助剂》", 31 December 2009 * |
| 许健南: "《高等学校轻工专业教材 塑料材料》", 31 January 1999 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286660A (en) * | 2017-06-20 | 2017-10-24 | 安徽燕青科技集团有限公司 | A kind of waterproof sealing silica gel ring of LED illumination lamp |
| CN108314778A (en) * | 2018-02-28 | 2018-07-24 | 南方科技大学 | A kind of modified epoxy resin composite and preparation method thereof |
| CN108314778B (en) * | 2018-02-28 | 2021-01-05 | 南方科技大学 | Modified epoxy resin composite material and preparation method thereof |
| CN109111697A (en) * | 2018-08-24 | 2019-01-01 | 东莞市昌圣硅胶制品有限公司 | A kind of silica gel pad based on Communication Equipment application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |
|
| RJ01 | Rejection of invention patent application after publication |