CN105988071B - Semiconductor test equipment and method - Google Patents
Semiconductor test equipment and method Download PDFInfo
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- CN105988071B CN105988071B CN201510058550.3A CN201510058550A CN105988071B CN 105988071 B CN105988071 B CN 105988071B CN 201510058550 A CN201510058550 A CN 201510058550A CN 105988071 B CN105988071 B CN 105988071B
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor testing device and a method, in the probing process of a testing wafer, an induction device is arranged between a clamping device for clamping the testing wafer to perform the probing process and a chuck for placing the testing wafer, so that when a probe card on a probing machine table needs to be replaced, the induction device is utilized to scan the region between a probe of the probe card and the testing wafer so as to eliminate any foreign matters between the probe and the testing wafer, thereby effectively avoiding the occurrence of the phenomena of damage to the probe and the like caused by forgetting to remove a protective cover of the probe, and effectively reducing the cost and instability of the probing process on the premise of improving the safety of the probing process.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor testing device and a semiconductor testing method.
Background
At present, when a wafer (wafer) probing process is performed, a probe on a probe card (probe card) directly contacts a test Pad (Pad) on a chip to extract a chip signal, and then a peripheral test instrument and software control are matched to achieve the purpose of automatic measurement. .
The probe card is mainly used to connect a test Pad (Pad) on a wafer (wafer) with a circuit on a prober in the testing process, i.e., a plurality of extremely thin probes are arranged below a probe card, and the probes are pricked on the test Pad, so that the wafer and the test Pad are electrically connected.
Because the probe card is the most expensive consumable in a test factory, although about 100 ten thousand needle tests (touch down) can be performed under the theoretical condition, before a test process is not performed, in order to protect the probe, a protective cover needs to be sleeved on the probe to avoid the damage of the probe caused by misoperation, and when the test process needs to be performed, the protective cover needs to be removed when the probe card on a probe tester is replaced; however, at present, the probe card and the subsequent protective cover are manually replaced, so that the operation of removing the protective cover is easily omitted when the probe card is replaced, the probe is damaged due to the protective cover in the subsequent testing process (such as a probe alignment), the frequency of the probe card capable of performing the probe testing process is greatly reduced, and even the probe card is directly scrapped, and the cost of the wafer probe testing process is increased.
Disclosure of Invention
In order to solve the technical problems, the application provides a semiconductor test device and a semiconductor test method, which can be applied to a probing process of a wafer, when a probe card on a probing machine is replaced, whether foreign matters exist between a probe of the probe card and a test wafer is scanned by using an induction device, so that damages to the probe caused by subsequent probing and probing processes due to forgetting to remove a protective cover when the probe card is replaced manually can be effectively avoided, and the process cost can be effectively reduced on the premise of improving the quality of the probing process.
The application describes a semiconductor test apparatus, the test apparatus comprising:
the chuck is arranged on the probe testing machine table and used for placing a test wafer;
the clamping device is positioned right above the chuck and is used for clamping a probe card and the test wafer to carry out a probe aligning process;
and the sensing device is arranged between the chuck and the clamping device so as to detect whether foreign matters exist between the probes of the probe card and the test wafer.
In the semiconductor test apparatus, the sensing device moves in the region between the probe and the test wafer, and the moving direction of the sensing device is perpendicular to the surface of the probe card on which the probe is arranged.
In the semiconductor test equipment, the sensing device comprises an optical signal transmitting device and an optical signal receiving device;
the optical signal transmitting device is arranged on one side of the probe card, and the optical signal receiving device is arranged on the other side of the probe card corresponding to the position of the optical signal transmitting device;
the optical signal transmitting device transmits an optical signal to the optical signal receiving device, and the optical signal receiving device judges whether foreign matters exist between the probe and the test wafer by judging whether the optical signal is received or not.
In the semiconductor test equipment, the test equipment further comprises a guide rail, the guide rail is fixedly arranged on the probe test machine platform, and the optical signal sending device and the optical signal receiving device are movably arranged on the guide rail so as to scan the region between the probe and the test wafer along the guide rail.
In the semiconductor test apparatus, the optical signal transmitting device and the optical signal receiving device move synchronously in the same direction.
In the semiconductor test equipment, the test equipment further comprises an alarm device, and the alarm device is connected with the induction device; and when the sensing device senses that foreign matters exist between the probe and the test wafer, the alarm device sends out alarm information.
In the semiconductor test equipment, the probe card is electrically connected with the probing machine to perform a probing process on the test wafer.
In the semiconductor test equipment described above, the foreign matter includes a protective cover;
the protective cover covers the probe card to prevent the probe from being damaged in the transportation process.
In the semiconductor test equipment, the protective cover is provided with the conducting ring;
when the protective cover covers the probe card, the conductive ring is contacted with the contact points at the bottom of the probe card.
The present application also describes a semiconductor test method, the method comprising:
step S1: placing a test wafer on a chuck of a needle test machine;
step S2: judging whether a probe card on the probe testing machine platform needs to be replaced or not; if the wafer is not required to be replaced, performing a probing process on the test wafer by using the probe card; if the probe card needs to be replaced, taking out the probe card, and placing a new probe card on the clamping device of the probe testing machine;
step S3: detecting whether foreign matters exist between the probes on the new probe card and the test wafer by using a sensing device; if foreign matter is present, the process proceeds to step S4; if no foreign matter exists, the new probe card is utilized to carry out the probing process on the test wafer;
step S4: after the foreign materials between the probes of the new probe card and the test wafer are checked and removed, the process proceeds to step S3.
In the above semiconductor test method, the foreign object includes a protective cover, and the method further includes:
after the operation of step S2, continuing to determine whether the contacts of the new probe card contacting the conductive ring on the protective cover can be conducted; if the conduction is possible, the process proceeds to step S4; if the conduction is not possible, the process proceeds to step S3;
the protective cover covers the new probe card to prevent the probes on the probe card from being damaged in the transportation process.
In the above semiconductor testing method, the clamping device is disposed right above the chuck, and the method further includes:
after the new probe card and the test wafer are clamped by the clamping device to carry out the probe aligning process, the probe of the new probe card is pricked on the welding pad of the test wafer so as to carry out the probe testing process.
In the semiconductor test method, the probe card is electrically connected with the probe test circuit on the probe test machine.
In the above semiconductor test method, the sensing device includes an optical signal transmitting device and an optical signal receiving device;
the optical signal transmitting device is arranged on one side of the probe card, and the optical signal receiving device is arranged on the other side of the probe card corresponding to the position of the optical signal transmitting device;
when the sensing device is used for detecting whether foreign matters exist between the probes on the new probe card and the test wafer, the optical signal sending device sends optical signals to the optical signal receiving device, and the optical signal receiving device judges whether the foreign matters exist between the probes and the test wafer by judging whether the optical signals are received.
In the semiconductor testing method, the probe testing machine is also provided with the guide rail;
the guide rail is fixedly arranged on the probe testing machine table, and the optical signal sending device and the optical signal receiving device are movably arranged on the guide rail so as to scan the area between the probe and the test wafer along the guide rail.
In the semiconductor test method, the optical signal transmitting device and the optical signal receiving device move synchronously in the same direction.
In the semiconductor testing method, the probe testing machine is also provided with an alarm device, and the alarm device is connected with the sensing device; and when the sensing device senses that foreign matters exist between the probe and the test wafer, the alarm device sends out alarm information.
In the semiconductor test method, the sensing device moves in the region between the probe and the test wafer, and the moving direction of the sensing device is perpendicular to the surface of the new probe card on which the probe is arranged.
In summary, according to the above technical solution, in the probing process of the test wafer, the sensing device is disposed between the clamping device for clamping the test wafer to perform the probing process and the chuck for placing the test wafer, so that when the probe card on the probing machine needs to be replaced, the sensing device is utilized to scan the region between the probe of the probe card and the test wafer to remove any foreign matter between the probe and the test wafer, thereby effectively avoiding the occurrence of the phenomena that the probe is damaged due to forgetting to remove the protective cover of the probe, and effectively reducing the cost and instability of the probing process on the premise of improving the safety of the probing process.
Drawings
FIG. 1 is a schematic diagram of a semiconductor test apparatus according to the present application;
fig. 2 is a flow chart illustrating a semiconductor testing method according to the present application.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings:
the first embodiment is as follows:
the semiconductor test equipment can be applied to a wafer probing process, for example, after a chip is prepared on a wafer (wafer) and before an IC (integrated circuit) is packaged, a probe on a probe card (probe card) is directly contacted with a test Pad (Pad) on the chip, a chip signal is led out after the probe is electrified, and then a peripheral test instrument and software are matched for control so as to achieve the purpose of automatic measurement; as shown in fig. 1, a semiconductor test apparatus in the present application is based on a prober (not shown), on which a chuck (chuck)1 is disposed, and when performing a probing process, the chuck 1 is used to fixedly place a test wafer 2 (preferably, a plurality of chips are disposed on the test wafer 2, and each chip includes a semiconductor device structure, and the performance and quality of the semiconductor device structure can be tested by the probing process).
Further, a clamping device 5 is disposed above the chuck 1, and the clamping device 5 is used for clamping a probe card 6 and the test wafer 2 for alignment so as to facilitate a subsequent probing process.
Preferably, the probe card 6 is electrically connected to corresponding test structures, such as test pads (Pad), on the test wafer 2 through the probes 61 during the probing process, and is also electrically connected to the probing circuit on the probing machine to transmit the electrical signals in the test wafer 2 to the corresponding probing apparatus.
Further, a sensing device is disposed between the probe card 6 and the test wafer 2, and the sensing device can detect whether there is a foreign object between the probe 61 and the test wafer 2, such as the protective cover 7 of the probe 61, so as to prevent the probe 61 from being damaged due to the blocking of the foreign object during the probing process.
Preferably, the sensing device may include an optical signal transmitting device 41 and an optical signal receiving device 42 as shown in fig. 1, and the sensing device may move back and forth in a region between the probe 61 and the test wafer 2 along a direction perpendicular to the lower surface of the probe card 6 (i.e., perpendicular to the surface of the probe card 6 on which the probe 61 is disposed) to scan whether there is a foreign object in the region.
Furthermore, guide rails 3 are further disposed on both sides of the probe card 6 and the test wafer 2, and the sensing devices perform scanning actions along the guide rails 3, that is, the optical signal transmitting device 41 is movably disposed on the guide rail 3 on one side of the probe card 6, and the optical signal receiving device 42 is correspondingly movably disposed on the guide rail 3 on the other side of the probe card 6; before the probe card 6 and the test wafer 2 are subjected to the probe alignment process, the optical signal transmitting device 41 transmits an optical signal to the optical signal receiving device 42, and the optical signal transmitting device 41 and the optical signal receiving device 42 synchronously move along the guide rail, so as to complete the scanning of the area between the probes 61 and the test wafer 2, and when the optical signal receiving device 42 cannot receive the optical signal, it can be determined that a foreign object, such as the protective cover 7, exists between the probes 61 and the test wafer 2.
Preferably, the distance L of the one-way movement of the sensing device is greater than the thickness h of the protective cover 7, and the sensing device is located below the probe 61 and at the same time located on the upper surface of the test wafer 2 for scanning, for example, the distance between the uppermost end (the position closest to the probe 61) D and the position D where the probe 61 projects onto the guide rail 3 is greater than 1mm and less than h (the value of L, h is greater than 0).
Preferably, the scanning area of the sensing device includes the whole area formed between the probe 61 and the test wafer 2, so as to ensure that the probe 61 is not obstructed when being stuck to the test pad of the test wafer 2, thereby preventing the probe from being damaged.
Preferably, the protective cover 7 is further provided with a conductive ring (not shown), when the protective cover 7 covers the probe card 6, the conductive ring on the protective cover is contacted with the contacts on the bottom of the probe card 6 while protecting the probes 61 from being damaged during transportation, so that whether the protective cover 7 is removed or not can be determined by conducting the contacts during the probing process.
Further, the probing machine is further provided with an alarm device (not shown in the figure), the alarm device is connected to the sensing device, for example, the alarm device can be electrically connected to the optical signal receiving device 42, when the optical signal receiving device 42 cannot receive the optical signal sent by the optical signal sending device 41 in a designated area, the optical signal receiving device 42 starts the alarm device to send an alarm message (such as a sound signal, a mail, a short message, etc.), so as to remind a corresponding engineer to check and troubleshoot the probing machine.
Preferably, the sensing device and the guide rail 3 are both configured to be movable, when the probe card is required to be replaced by the probing machine, before the probing process is performed (or before the probing process is performed each time when the probe card is not required to be replaced), the sensing device and the guide rail are moved to a position between the probe card and the test wafer to perform foreign matter investigation, and after the condition that no foreign matter exists is determined, the sensing device and the guide rail are moved to other positions to avoid the influence of the sensing device on the probing process; when the guide rail is fixedly arranged on the probe testing machine, the guide rail is ensured not to have adverse effects on the probe testing process.
Example two:
FIG. 2 is a flow chart illustrating a semiconductor testing method according to the present application; as shown in fig. 2, a semiconductor testing method, which can be based on the following steps when a probe process is required to be performed on a chip on a wafer after a semiconductor device structure is prepared on the wafer and before a packaging process is performed, specifically includes:
step S1: providing a test wafer, wherein a semiconductor device structure (a plurality of chips) is prepared on the test wafer, fixedly placing the test wafer on a chuck of a probe testing machine, and enabling the surface of the test wafer, which is provided with the semiconductor device structure, to face a probe card.
Step S2: judging whether the original probe card on the probing machine needs to be replaced by a judging module (or by the experience of an engineer) (for example, judging whether the probe card needs to be replaced according to how many times of probing processes (touch down) are performed, and if the preset times are exceeded or the probe card is damaged, the probe card needs to be replaced); the judging module can be arranged according to the conventional technical means, so long as the judging module can accurately judge whether the probe card on the probe testing machine platform needs to be replaced or not, and output the judging result to the corresponding control terminal.
Furthermore, when the original probe card on the probe testing machine table does not need to be replaced, the probe card can be utilized to carry out subsequent probe testing processes, such as probe alignment operation and the like; when the original probe card on the probing machine needs to be replaced, the original probe card is taken out first, and a new probe card is placed in a clamping device (preferably, the clamping device can be set by adopting a conventional technology, so that the description is omitted), and meanwhile, the probe card is also connected with a probing circuit used for performing a probing process on the probing machine, so that signals on a test wafer are transmitted to corresponding instrument equipment when a subsequent probing process is performed.
Preferably, the new probe card is clamped by the clamping device and placed above the test wafer, and a surface of the new probe card on which the probes are arranged is opposite to a surface of the test wafer on which the semiconductor device structure is arranged, so that a subsequent probe aligning process is facilitated.
Preferably, when the new probe card is placed on the clamping device, an engineer may immediately remove the protective cover covering the probe card to protect the probe from being damaged during transportation, but the engineer often forgets the step due to negligence; in the technical solution of the present embodiment, one of the main purposes is to prevent the engineer from forgetting to remove the protective cover due to negligence, so as to effectively avoid the probe from being damaged due to the existence of the protective cover during the operation of the needle.
Step S3: in order to avoid the potential damage to the probe caused by the existence of the protective cover on the new probe card during the needle operation due to the negligence, an induction device can be used for scanning the area between the clamping device and the chuck; preferably, the sensing device scans the region between the probe and the upper surface of the test wafer to confirm that no foreign object, such as a barrier like a protective cover, exists between the probe and the upper surface of the test wafer; when the sensing device does not sense the existence of the foreign matters, the new probe card can be used for carrying out probe alignment operation on the test wafer, and then the probe testing process is continued; otherwise, the subsequent step S4 is continued.
Preferably, the sensing device does not have any adverse effect on the needle aligning process and the needle measuring process during and after scanning operation; for example, the scanning operation can be performed by using a movable sensing device, and after the scanning operation is completed, the scanning device is moved to other areas to avoid the influence on the subsequent probing process; of course, the sensing device may also be fixedly disposed on the probing platform and located at two sides of the three-dimensional space formed by projecting the new probe card onto the test wafer, as long as the three-dimensional space region can be fully scanned.
Furthermore, the sensing device may be an optical signal sensing device, and includes an optical signal transmitting device and an optical signal receiving device, the optical signal transmitting device is disposed on one side of the new probe card, and the optical signal receiving device is disposed on the other side of the new probe card corresponding to the position of the optical signal transmitting device; when the scanning operation is performed, the optical signal transmitting device transmits an optical signal to the optical signal receiving device, and when the optical signal receiving device scans the area between the probe and the test wafer, if the optical signal is not received at one position, the existence of the foreign matter between the probe and the test wafer can be judged.
Preferably, when the sensing device scans the area between the probe and the test wafer, the moving direction of the sensing device is perpendicular to the surface of the new probe card on which the probe is arranged, and the scanning signal emitted by the sensing device can cover the whole side area of the probe card projected to the test wafer.
Furthermore, in order to facilitate the optical signal sensing device to perform scanning, a plurality of guide rails may be disposed on the probing machine, so that the optical signal transmitting device and the optical signal receiving device move synchronously along the guide rails in the same direction, thereby completing scanning of the region between the probe and the test wafer.
Furthermore, in order to timely inform corresponding projects when the sensing device scans that foreign matters exist, an alarm device connected with the optical signal receiving device can be arranged, and when the optical signal receiving device judges that the foreign matters exist, the alarm device can send alarm sound, trigger an alarm signal lamp or send alarm information of one or more modes such as mails and short messages so as to transmit foreign matter information to corresponding engineers, so that the engineers can timely and accurately process the foreign matters.
Step S4: when the sensing device detects a foreign object, the engineer may check and remove the foreign object between the new probe card and the test wafer according to the alarm signal, such as the engineer forgets to remove the protective cover when replacing the probe card, and then the protective cover may be removed (if scanning is performed on the old probe card, some obstacles between the probe card and the test wafer are removed, and the rest steps are similar to the above steps, and those skilled in the art can know specific operation steps according to the above process steps, which is not described herein), and continue to step S3.
Furthermore, since the protection cover is generally provided with a conductive ring, and when the protection cover is covered on a new probe card, the conductive ring is in contact with the contact point at the bottom of the new probe card, it is possible to determine whether the contact point is in conduction with the conductive ring before performing step S3; if not, continuing to step S3; otherwise, the above step S4 is performed.
Furthermore, when it is determined that there is no foreign object between the probe and the test wafer, the clamping device clamps the new probe card and the test wafer to perform probing operation, and then the probe is pricked on the corresponding pad of the test wafer to perform the subsequent probing process.
Preferably, a semiconductor test method in this embodiment may further perform the above-mentioned operations based on a semiconductor test apparatus in the above-mentioned embodiment.
In summary, due to the adoption of the above technical solution, the semiconductor test apparatus and method in the above embodiments can be applied to the probing process of the test wafer, and the sensing device is arranged between the clamping device for clamping the test wafer to perform the probing process and the chuck for placing the test wafer, so that when the probe card on the probing machine needs to be replaced, the sensing device is used to scan the region between the probe and the test wafer, so as to remove any foreign matter between the probe and the test wafer, thereby effectively avoiding the occurrence of phenomena such as damage to the probe due to forgetting to remove the protective cover of the probe, and effectively reducing the cost and instability of the probing process on the premise of improving the safety of the probing process.
While the specification concludes with claims defining exemplary embodiments of particular structures for practicing the invention, it is believed that other modifications will be made in the spirit of the invention. While the above invention sets forth presently preferred embodiments, these are not intended as limitations.
Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.
Claims (16)
1. A method for semiconductor testing, the method comprising:
step S1: placing a test wafer on a chuck of a needle test machine;
step S2: judging whether a probe card on the probe testing machine platform needs to be replaced or not; if the wafer is not required to be replaced, performing a probing process on the test wafer by using the probe card; if the probe card needs to be replaced, taking out the probe card, and placing a new probe card on the clamping device of the probe testing machine;
step S3: detecting whether foreign matters exist between the probes on the new probe card and the test wafer by using a sensing device; if foreign matter is present, the process proceeds to step S4; if no foreign matter exists, the new probe card is utilized to carry out the probing process on the test wafer;
step S4: after the foreign matter between the probe on the new probe card and the test wafer is checked and removed, the process continues to step S3;
the sensing device comprises an optical signal transmitting device and an optical signal receiving device,
when the sensing device is used for detecting whether foreign matters exist between the probes on the new probe card and the test wafer, the optical signal sending device sends optical signals to the optical signal receiving device, and the optical signal receiving device judges whether the foreign matters exist between the probes and the test wafer by judging whether the optical signals are received.
2. The semiconductor test method of claim 1, wherein the foreign object comprises a protective cover, the method further comprising:
after the operation of step S2, continuing to determine whether the contacts of the new probe card contacting the conductive ring on the protective cover can be conducted; if the conduction is possible, the process proceeds to step S4; if the conduction is not possible, the process proceeds to step S3;
the protective cover covers the new probe card to prevent the probes on the probe card from being damaged in the transportation process.
3. The semiconductor test method of claim 1, wherein the clamping device is disposed directly above the chuck, the method further comprising:
after the new probe card and the test wafer are clamped by the clamping device to carry out the probe aligning process, the probe of the new probe card is pricked on the welding pad of the test wafer so as to carry out the probe testing process.
4. The semiconductor test method of claim 1, wherein the probe card is electrically connected to a probing circuit on the probing station.
5. The semiconductor test method according to claim 1,
the optical signal transmitting device is arranged on one side of the probe card, and the optical signal receiving device is arranged on the other side of the probe card corresponding to the position of the optical signal transmitting device.
6. The semiconductor test method of claim 5, wherein the probing station is further provided with a guide rail;
the guide rail is fixedly arranged on the probe testing machine table, and the optical signal sending device and the optical signal receiving device are movably arranged on the guide rail so as to scan the area between the probe and the test wafer along the guide rail.
7. The semiconductor test method according to claim 5, wherein the optical signal transmitting device and the optical signal receiving device are moved synchronously in the same direction.
8. The semiconductor test method of claim 1, wherein the probing station is further provided with an alarm device, and the alarm device is connected to the sensing device; and when the sensing device senses that foreign matters exist between the probe and the test wafer, the alarm device sends out alarm information.
9. The semiconductor test method of claim 1, wherein the sensing device moves in a region between the probe and the test wafer in a direction perpendicular to a surface of the new probe card on which the probe is disposed.
10. A semiconductor test apparatus applied to the semiconductor test method according to any one of claims 1 to 9, the test apparatus comprising:
the chuck is arranged on the probe testing machine table and used for placing a test wafer;
the clamping device is positioned right above the chuck and is used for clamping a probe card and the test wafer to carry out a probe aligning process;
the induction device is arranged between the chuck and the clamping device so as to detect whether foreign matters exist between the probe of the probe card and the test wafer or not;
the foreign body comprises a protective cover;
the sensing device comprises an optical signal sending device and an optical signal receiving device, wherein the optical signal sending device sends an optical signal to the optical signal receiving device, and the optical signal receiving device judges whether foreign matters exist between the probe and the test wafer by judging whether the optical signal is received or not;
the protective cover covers the probe card to prevent the probe from being damaged in the transportation process;
the protective cover is provided with a conducting ring;
when the protective cover covers the probe card, the conductive ring is contacted with a contact at the bottom of the probe card, and whether the protective cover is removed or not is judged through the conduction of the contact.
11. The semiconductor test apparatus of claim 10, wherein the sensing device moves in a region between the probe and the test wafer in a direction perpendicular to a surface of the probe card on which the probe is disposed.
12. The semiconductor test apparatus of claim 11,
the optical signal transmitting device is arranged on one side of the probe card, and the optical signal receiving device is arranged on the other side of the probe card corresponding to the position of the optical signal transmitting device.
13. The semiconductor test apparatus of claim 12, further comprising a guide rail fixedly disposed on the prober, wherein the optical signal transmitter and the optical signal receiver are movably disposed on the guide rail to scan an area between the probe and the test wafer along the guide rail.
14. The semiconductor test apparatus of claim 11, wherein the optical signal transmitting device and the optical signal receiving device move synchronously in the same direction.
15. The semiconductor test apparatus of claim 10, further comprising an alarm device, the alarm device being coupled to the sensing device; and when the sensing device senses that foreign matters exist between the probe and the test wafer, the alarm device sends out alarm information.
16. The semiconductor test apparatus of claim 10, wherein the probe card is electrically connected to the probing machine for performing a probing process on the test wafer.
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| JP6562896B2 (en) * | 2016-12-22 | 2019-08-21 | 三菱電機株式会社 | Semiconductor device evaluation apparatus and semiconductor device evaluation method using the same |
| CN116755171B (en) * | 2023-08-21 | 2023-11-03 | 矽佳半导体(嘉兴)有限公司 | Safety protection system for CP test |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200976009Y (en) * | 2006-10-23 | 2007-11-14 | 比亚迪股份有限公司 | Electric performance testing clamp for circuit board |
| CN101246832A (en) * | 2007-02-16 | 2008-08-20 | 株式会社瑞萨科技 | Method of manufacturing a semiconductor integrated circuit device |
| JP2010048789A (en) * | 2008-08-25 | 2010-03-04 | Tokyo Electron Ltd | Probe polishing method, program for probe polishing, and probe apparatus |
| CN201673239U (en) * | 2010-02-11 | 2010-12-15 | 中芯国际集成电路制造(上海)有限公司 | Test equipment of semiconductor |
| CN102313750A (en) * | 2010-06-30 | 2012-01-11 | 第一实业视检系统股份有限公司 | Chip LED detection device |
| CN103035552A (en) * | 2011-10-06 | 2013-04-10 | 株式会社东芝 | Foreign matter detecting device and semiconductor manufacturing device |
-
2015
- 2015-02-04 CN CN201510058550.3A patent/CN105988071B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200976009Y (en) * | 2006-10-23 | 2007-11-14 | 比亚迪股份有限公司 | Electric performance testing clamp for circuit board |
| CN101246832A (en) * | 2007-02-16 | 2008-08-20 | 株式会社瑞萨科技 | Method of manufacturing a semiconductor integrated circuit device |
| JP2010048789A (en) * | 2008-08-25 | 2010-03-04 | Tokyo Electron Ltd | Probe polishing method, program for probe polishing, and probe apparatus |
| CN201673239U (en) * | 2010-02-11 | 2010-12-15 | 中芯国际集成电路制造(上海)有限公司 | Test equipment of semiconductor |
| CN102313750A (en) * | 2010-06-30 | 2012-01-11 | 第一实业视检系统股份有限公司 | Chip LED detection device |
| CN103035552A (en) * | 2011-10-06 | 2013-04-10 | 株式会社东芝 | Foreign matter detecting device and semiconductor manufacturing device |
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