CN105988071A - Semiconductor test equipment and method - Google Patents
Semiconductor test equipment and method Download PDFInfo
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- CN105988071A CN105988071A CN201510058550.3A CN201510058550A CN105988071A CN 105988071 A CN105988071 A CN 105988071A CN 201510058550 A CN201510058550 A CN 201510058550A CN 105988071 A CN105988071 A CN 105988071A
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Abstract
The invention relates to the technical field of semiconductor manufacturing, and specifically relates to semiconductor test equipment and method. The semiconductor test equipment and method are characterized in that for a prober testing technology of testing a wafer, an induction device is arranged between a clamping device which is used for clamping a test wafer to perform prober alignment technology and a clamping disk which is used for putting the test wafer, so that when a prober card on a prober testing machine table is required to exchange, the induction device can be used to scan the area between a prober of the prober card and the test wafer to exclude any foreign matters between the prober and the test wafer so as to effectively avoid forgetting to remove a protective cover of the prober to cause damaging of the prober and occurrence of other phenomena, so that on the premise of improvement of the safety of the prober testing technology, the cost and the instability of the prober testing technology can be effectively reduced.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly relate to a kind of semiconductor testing apparatus
And method.
Background technology
At present, when carrying out the pin survey technique of wafer (wafer), by by probe card (prober
Card) probe on directly directly contacts with the testing cushion (Pad) on chip, draws chip
Signal, then coordinate peripheral test instrument and software to control to reach the purpose of automatic measurement, i.e. pin
Survey technique mainly to apply before IC not yet encapsulates, do functional test for nude film by probe,
After filtering out defective products, then carry out follow-up packaging technology..
Probe card is primarily used to connect on wafer (wafer) in above-mentioned test technology
Testing cushion (Pad) is connected with the circuit on pin survey machine, if i.e. can arrange in the lower section of probe card
The probe that dry root is the thinnest, and by above-mentioned probe is pricked in testing cushion, and then realize crystalline substance
Electrical connection between circle and testing cushion.
Owing to probe card is consumable goods the most valuable in testing factory, although can under its theoretical case
The pin carrying out about 1,000,000 times surveys (touch down), but before not carrying out test technology,
In order to protect above-mentioned probe, need a sheathed protective cover on probe, to avoid because of maloperation
Cause the damage of probe, and when needs carry out test technology, survey on machine detector in more needle exchange
Probe card time it is necessary to win above-mentioned protective cover；But because it is all manually to visit at present
The replacing of pin card and follow-up protective cover win operation, it is easy to omit when changing probe card and pluck
Take down the operation of above-mentioned protective cover, cause when follow-up test technology (as to pin) owing to protecting
The existence of guard shield and cause probe to cause damage, greatly reduce probe card and can carry out pin and survey work
The number of times of skill, even can directly result in probe card and scrap, and then add wafer probing technique
Cost.
Summary of the invention
For above-mentioned technical problem, this application provides a kind of semiconductor testing apparatus and method,
The pin that can be applicable to wafer is surveyed in technique, when more needle exchange surveys the probe card on board, by profit
Whether foreign body is had, with effectively between probe and test wafer by induction installation scanning probe card
Avoid such as because of artificial change probe card time forget to remove protective cover etc. to probe follow-up to pin
And the damage that pin causes when surveying technique, on the premise of improving pin survey processing quality, effectively reduce
Process costs.
The application describes a kind of semiconductor testing apparatus, and described test equipment includes:
One chuck, described chuck is arranged on pin and surveys on board, to place test wafer；
One clamping device, described clamping device is positioned at the surface of described chuck, to clamp probe
Card and described test wafer are carried out pin technique；
One induction installation, described induction installation be arranged on described chuck and described clamping device it
Between, to detect whether have foreign body between the probe of described probe card and described test wafer.
Above-mentioned semiconductor testing apparatus, described induction installation is at described probe and described test crystalline substance
Region between circle is moved, and its direction moved is perpendicular in described probe card be provided with spy
The surface of pin.
Above-mentioned semiconductor testing apparatus, described induction installation includes optical signal transmitter and light
Signal receiving device；
Described optical signal transmitter is arranged at the side of described probe card, and described optical signal receives
The corresponding described optical signal transmitter position of device is arranged at the opposite side of described probe card；
Wherein, described optical signal transmitter sends optical signal to described light signal receiving,
Described light signal receiving by whether receive described optical signal to judge described probe with
Whether foreign body is had between described test wafer.
Above-mentioned semiconductor testing apparatus, described test equipment also includes guide rail, and described guide rail is solid
Surely being arranged on described pin and survey on board, described optical signal transmitter and described optical signal receive dress
Put and be all movably disposed on described guide rail, with along described guide rail to described probe and described survey
Region between examination wafer is scanned.
Above-mentioned semiconductor testing apparatus, described optical signal transmitter and described optical signal receive
Device is synchronized with the movement in the same direction.
Above-mentioned semiconductor testing apparatus, described test equipment also includes an alarm device, described
Alarm device is connected with described induction installation；When described induction installation senses described probe and institute
Stating when having foreign body between test wafer, described alarm device sends warning message.
Above-mentioned semiconductor testing apparatus, described probe card electrically connects with described pin survey board, with
Described test wafer is carried out pin and surveys technique.
Above-mentioned semiconductor testing apparatus, described foreign body includes protection cap；
Described protection cap is located in described probe card, to avoid described probe to be subject in transportation
To damage.
Above-mentioned semiconductor testing apparatus, described protection cap is provided with conducting ring；
When described protection cap is located in described probe card, described conducting ring and described probe card
The contact of bottom.
The application has also stated that a kind of semiconductor test method, described method include:
Step S1 a: test wafer is positioned over a pin and surveys on the chuck of board；
Step S2: judge that described pin surveys the probe card on board the need of replacing；If being not required to
Change, then utilize this probe card that described test wafer carries out pin and survey technique；If desired change,
Then take out described probe card, and the probe card that is new is placed in the clamping device of described pin survey board
On；
Step S3: utilize induction installation to detect the probe in described new probe card and described survey
Foreign body is the most also had between examination wafer；If there being foreign body, then proceed step S4；If nothing
Foreign body, then utilize described new probe card that described test wafer carries out described pin and survey technique；
Step S4: check and remove the probe and described test being positioned in described new probe card
After foreign body between wafer, continue step S3.
Above-mentioned semiconductor test method, described foreign body includes that protection cap, described method also include:
After the operation carrying out step S2, continue judge in described new probe card with protection cap
On conducting ring contact contact whether can turn on；If can turn on, proceed step S4；
If can not turn on, then proceed step S3；
Wherein, described protection cap is located in described new probe card, to avoid described probe card
On probe sustain damage in transportation.
Above-mentioned semiconductor test method, described clamping device is arranged at just going up of described chuck
Side, described method also includes:
Probe card new described in described gripping apparatus grips and described test wafer are carried out pin work
After skill, the probe of described new probe card is pricked on the weld pad of described test wafer, to carry out
Technique surveyed by described pin.
Above-mentioned semiconductor test method, described probe card and described pin are surveyed the pin on board and are surveyed electricity
Road electrically connects.
Above-mentioned semiconductor test method, described induction installation includes optical signal transmitter and light
Signal receiving device；
Described optical signal transmitter is arranged at the side of described probe card, and described optical signal receives
The corresponding described optical signal transmitter position of device is arranged at the opposite side of described probe card；
When the probe using described induction installation to detect in described new probe card and described test
When the most also having foreign body between wafer, described optical signal transmitter receives to described optical signal
Device sends optical signal, and described light signal receiving is by whether receive described optical signal
Judge whether have foreign body between described probe and described test wafer.
Above-mentioned semiconductor test method, described pin is surveyed and is additionally provided with guide rail on board；
Described guide rail is fixedly installed on described pin and surveys on board, described optical signal transmitter and institute
State light signal receiving to be all movably disposed on described guide rail, with along described guide rail to institute
The region stated between probe and described test wafer is scanned.
Above-mentioned semiconductor test method, described optical signal transmitter and described optical signal receive
Device is synchronized with the movement in the same direction.
Above-mentioned semiconductor test method, described pin survey board is additionally provided with an alarm device,
Described alarm device is connected with described induction installation；When described induction installation senses described probe
And when having foreign body between described test wafer, described alarm device sends warning message.
Above-mentioned semiconductor test method, described induction installation is at described probe and described test crystalline substance
Region between circle is moved, and its direction moved is perpendicular in described new probe card arrange
There is the surface of probe.
In sum, owing to have employed technique scheme, a kind of quasiconductor that the application proposes
Test Apparatus and method for, the pin at test wafer is surveyed in technique, by entering at clamping test wafer
Row arranges induction installation between clamping device and the chuck placing test wafer of pin technique, with
When needing more needle exchange to survey the probe card on board, utilize above-mentioned induction installation that probe card is visited
Region between pin and test wafer is scanned, with get rid of any probe and test wafer it
Between foreign body, and then be prevented effectively from and such as forget to remove the protective cover of probe and cause probe to be subject to
The generation of the phenomenons such as damage so that on the premise of improving pin survey process safety, effectively reduce
Cost and the unstability thereof of technique surveyed by pin.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of semiconductor testing apparatus of the application；
Fig. 2 is the schematic flow sheet of a kind of semiconductor test method of the application.
Detailed description of the invention
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is further described:
Embodiment one:
A kind of semiconductor testing apparatus in the application, the pin that can be applicable to wafer is surveyed in technique,
After preparing chip on wafer (wafer), and before IC encapsulates, can be by by probe card
Probe on (prober card) directly directly contacts with the testing cushion (Pad) on chip, logical
Draw chip signal after electricity, then coordinate peripheral test instrument and software to control to reach automatization's amount
The purpose surveyed；As it is shown in figure 1, a kind of semiconductor testing apparatus in the application, survey based on pin
Board (not shown), surveys at this pin and is provided with chuck (chuck) 1 on board, and
When carrying out pin survey technique, this chuck 1 is for fixed placement test wafer 2 (preferably, this survey
Arrange on examination wafer 2 and some chips, and each chip all include semiconductor device structure,
Survey technique by above-mentioned pin and can test out performance and the quality of this semiconductor device structure).
Further, be positioned at above-mentioned chuck 1 is arranged above clamping device 5, this folder
Hold device 5 and carry out pin with above-mentioned test wafer 2 for clamping probe card 6, in order to after
Technique surveyed by the continuous pin carried out.
Preferably, above-mentioned probe card 6 when carrying out pin and surveying technique, its by probe 61 with
On test wafer 2, corresponding test structure such as testing cushion (Pad) electrically connects, simultaneously its also with
The pin slowdown monitoring circuit electrical connection on board surveyed by pin, so that the electric signal in test wafer 2 is transferred to phase
The pin answered is surveyed on instrument.
Further, between probe card 6 and test wafer 2, it is being additionally provided with induction installation,
Whether foreign body is had, such as probe 61 between this induction installation detectable probe 61 and test wafer 2
Protection cap 7 etc., with avoid carry out pin survey technique time, owing to the stop of foreign body makes probe
61 sustain damage.
Preferably, above-mentioned induction installation can include optical signal transmitter as shown in Figure 1
41 and light signal receiving 42, and this induction installation can be along being perpendicular to above-mentioned probe card 6
The direction (being i.e. perpendicular to be provided with in probe card 6 surface of probe 61) of lower surface, at probe
Region between 61 and test wafer 2 moves back and forth, with scan whether this region has different
Thing.
Further, it is additionally provided with guide rail 3 in the both sides being positioned at probe card 6 and test wafer 2,
Above-mentioned induction installation is scanned action each along this guide rail 3, and the most above-mentioned optical signal sends
Device 41 is movably arranged on the guide rail 3 being positioned at probe card 6 side, and optical signal receives
On the guide rail 3 being movably arranged at this probe card 6 opposite side that device 42 is then corresponding；?
Carrying out above-mentioned probe card 6 and test wafer 2 before carrying out pin processing step, optical signal is sent out
Device 41 is sent to send optical signal, and this optical signal transmitter to light signal receiving 42
41 and light signal receiving 42 be synchronized with the movement along above-mentioned guide rail, and then complete to visit
Sector scanning between pin 61 and test wafer 2, when above-mentioned light signal receiving 42 receives not
During to optical signal, just can determine that and there are foreign body between probe 61 and test wafer 2,
Such as protection cap 7 etc..
Preferably, distance L that above-mentioned induction installation one direction moves is greater than protection cap 7
Thickness h, and be simultaneously positioned at again the upper of above-mentioned test wafer 2 in the lower section being positioned at probe 61
Surface is scanned, and such as this induction installation moves to topmost (distance probes 61 is nearest
Position) distance that projects between the position d to guide rail 3 with probe 61 at D is more than
1mm and less than h (value of L, h herein is all higher than 0).
Preferably, the region of above-mentioned induction installation scanning include probe 61 and test wafer 2 it
Between formed whole region, to guarantee when probe 61 is pricked in the testing cushion of test wafer 2
By any obstruction, and then it will be avoided to sustain damage.
Preferably, above-mentioned protection cap 7 is additionally provided with conducting ring (not shown), when
When above-mentioned protection cap 7 is located in probe card 6, at protection probe 61 in transportation
From damage while, conducting ring thereon also with probe card 6 bottom contact, with
Carry out to judge that above-mentioned protection cap 7 is either with or without excision by contact conductive when technique surveyed by pin.
Further, above-mentioned pin is surveyed and is additionally provided with alarm device on board, this alarm device (figure
Not shown in) be connected with above-mentioned induction installation, as this alarm device can be with above-mentioned optical signal
Receive device 42 to electrically connect, when this light signal receiving 42 receives not in a specified area
To above-mentioned optical signal transmitter 41 send optical signal time, this light signal receiving 42 opens
Dynamic above-mentioned alarm device sends warning message (such as sound signal, mail, note etc.), with
Remind corresponding engineer that this pin is surveyed board check and fix a breakdown.
Preferably, above-mentioned induction installation and guide rail 3 all may be configured as movably, working as needs
When the replacing that board carries out probe card surveyed by pin, (also apply be applicable to be not required to before carrying out pin technique
During probe card to be replaced every time to pin technique before), above-mentioned induction installation and guide rail are moved
Move to carrying out foreign body investigation between probe card and test wafer, and after determining foreign, mobile
To other places, produce impact to avoid it that pin is surveyed technique；And when above-mentioned guide rail is fixedly installed on
When pin is surveyed on board, then to guarantee that pin will not be surveyed technique and exert an adverse impact by it.
Embodiment two:
Fig. 2 is the schematic flow sheet of a kind of semiconductor test method of the application；As in figure 2 it is shown,
A kind of semiconductor test method, the method can be based on preparing semiconductor device structure on wafer
After, and before being packaged technique, when needing the chip on this wafer is carried out pin survey technique,
It specifically includes following steps:
Step S1: provide a test wafer, this test wafer has been prepared and has had semiconductor device
Structure (several chips), by this test wafer fixed placement on the chuck that board surveyed by pin,
And this test wafer is provided with the surface of semiconductor device structure towards probe card.
Step S2: utilize a judge module (or the experience by engineer) to judge above-mentioned
On pin survey board, original probe card is the need of changing (as having been carried out how many according to it
Secondary pin is surveyed technique (touch down) and is judged whether to need to change, if secondary beyond preset
Number or probe card damage etc. are required to change probe card)；This judge module can be according to existing
Routine techniques means are configured, as long as it can judge that above-mentioned pin is surveyed on board accurately
Probe card is the need of changing, and exports its judged result to controlling terminal accordingly
On.
Further, when the original probe card on pin survey board need not change, then can profit
Carry out follow-up pin by this probe card and survey technique, as to pin operation etc.；And when this pin is surveyed on board
When original probe card needs to change, then first to take out above-mentioned original probe card, and new by one
Probe card be positioned in a clamping device that (preferably, this clamping device can use the skill of routine
Art is configured, and just not tires out at this and states), this probe card also surveys board wound with above-mentioned pin simultaneously
The upper pin slowdown monitoring circuit surveying technique for carrying out pin connects, with when carrying out follow-up pin and surveying technique,
Signal on test wafer is sent in corresponding instrument and equipment.
Preferably, the above-mentioned new probe card of above-mentioned gripping apparatus grips is placed in above-mentioned test wafer
Top, and be provided with the one side of probe in this new probe card this test wafer be provided with half
The one side of conductor device structure is relative, in order to follow-up to pin technique.
Preferably, when above-mentioned new probe card is positioned on clamping device, common engineering
Shi Junhui gets rid of immediately and is located in above-mentioned probe card to protect its probe in transportation
The protective cover being not damaged, but also the carelessness of Chang Huiyin engineer and forget this step；?
In the technical scheme of the present embodiment, one of its main purpose will prevent due to above-mentioned engineer
Carelessness and forget to remove protective cover, and then can be prevented effectively to pin operate in, due to protection
Cover existence and cause probe to sustain damage.
Step S3: in order to avoid above-mentioned carelessness causes when operating pin, in new probe card
Due to the existence of protective cover, probe is caused potential damage, can use in induction installation scanning
State the region between clamping device and chuck；Preferably, above-mentioned induction installation scans at probe
And the region between the upper surface of test wafer, with confirm not have between the rwo have different
Thing, such as the obstacle of protective cover etc；When above-mentioned induction installation sensing is less than the existence of foreign body
Time, then may utilize above-mentioned new probe card test wafer is carried out to pin operate after, continue into
The hand-manipulating of needle surveys technique；Otherwise, then follow-up step S4 is continued.
Preferably, above-mentioned induction installation be scanned operation time and afterwards, all will not be to upper
That states surveys the technique any harmful effect of generation to pin technique and pin；Such as can use movably sense
Device is answered to carry out above-mentioned scan operation, after scan operation completes, mobile to other regions,
Impact is produced to avoid it that follow-up pin is surveyed technique；Certainly, this induction installation also can be fixed and set
Put and survey on board at pin, and it is positioned at the three-dimensional sky that new probe card projection to test wafer is formed
Between both sides, as long as this solid space region can be completed full scan.
Further, above-mentioned induction installation can be optical signal induction installation, sends including optical signal
Device and light signal receiving, described optical signal transmitter arranges above-mentioned new probe card
Side, light signal receiving then corresponding optical signal transmitter position is arranged at this new spy
The opposite side of pin card；When carrying out above-mentioned scan operation, optical signal transmitter connects to optical signal
Receiving apparatus sends optical signal, this light signal receiving to above-mentioned probe and test wafer it
Between region in when being scanned, not receiving above-mentioned optical signal as long as having at one, can sentence
Determine to have between probe and test wafer foreign body.
Preferably, the region between probe and test wafer is scanned by above-mentioned induction installation
Time, its direction moved is perpendicular to above-mentioned new probe card and is provided with the surface of probe, and its
The scanning signal gone out can cover whole probe card and project the whole lateral side regions to test wafer.
Further, it is scanned action for the ease of above-mentioned optical signal induction installation, can be upper
The pin stated is surveyed and is arranged some guide rails on board, so that above-mentioned optical signal transmitter and light letter
Number receive device be synchronized with the movement in the same direction along guide rail, and then complete to above-mentioned probe with
The scanning in region between test wafer.
Further, in the presence of in order to scan foreign body when above-mentioned induction installation, it is possible in time
Notice to corresponding engineering, the warning being connected with above-mentioned light signal receiving also can be set
Device, in the presence of this light signal receiving is determined with foreign body, this alarm device can be by sending out
Go out alarm sound, trigger warning light or one or more modes such as mail, note of transmission
Warning message, foreign substance information to be transferred to corresponding engineer, and then make engineer's energy
Enough process accordingly in time, accurately to foreign body.
Step S4: when above-mentioned induction installation has detected foreign body, engineer can be according to report
Alert signal check also removes the foreign body between new probe card and test wafer, such as engineering
Teacher forgets to remove protective cover when changing probe card, after now this protective cover can being removed (and if
When being to be scanned for old probe card, then it is to remove some to be blocked in probe card and test crystalline substance
Obstacle between circle, remaining step all with above-mentioned approximation, those skilled in the art can be according to upper
State processing step and know concrete operating procedure, just not tire out at this and state), continue above-mentioned step
Rapid S3.
Further, owing to being generally individually provided with conducting ring on protective cover, and when this protective cover cover
When being located in new probe card, this conducting ring connects with the contact being positioned at bottom this new probe card
Touch, therefore can be before carrying out above-mentioned steps S3, also by judging that this contact with conducting ring is
No conducting；If being not turned on, proceed step S3；Otherwise, then above-mentioned step S4 is carried out.
Further, when judging foreign between probe and test wafer, above-mentioned clamping dress
Put, hold after this new probe card and this test wafer carry out operating pin, probe is pricked and exists
On the corresponding weld pad of test wafer, to carry out follow-up pin survey technique.
Preferably, a kind of semiconductor test method in the present embodiment is also based on above-described embodiment
In a kind of semiconductor testing apparatus carry out the operation of above-mentioned processing step.
In sum, owing to have employed technique scheme, a kind of quasiconductor in above-described embodiment
Test Apparatus and method for, the pin that all can be applicable to test wafer is surveyed in technique, by surveying in clamping
Examination wafer carries out arranging sense between the clamping device to pin technique and the chuck placing test wafer
Answer device, when needing more needle exchange to survey the probe card on board, to utilize above-mentioned induction installation
Region between probe card probe and test wafer is scanned, with get rid of any probe with
Foreign body between test wafer, and then be prevented effectively from and such as forget to remove the protective cover of probe and cause
Make the generation of the phenomenons such as probe sustains damage so that in the premise improving pin survey process safety
Under, effectively reduce pin and survey cost and the unstability thereof of technique.
By explanation and accompanying drawing, give typical case's enforcement of the ad hoc structure of detailed description of the invention
Example, based on present invention spirit, also can make other conversion.Although foregoing invention proposes existing
Preferred embodiment, but, these contents be not intended as limitation.
For a person skilled in the art, after reading described above, each middle variations and modifications
Will be apparent to undoubtedly.Therefore, appending claims should be regarded as and contains the true of the present invention
Sincere figure and whole variations and modifications of scope.In Claims scope any and all etc.
The scope of valency and content, be all considered as still belonging to the intent and scope of the invention.
Claims (18)
1. a semiconductor testing apparatus, it is characterised in that described test equipment includes:
One chuck, described chuck is arranged on pin and surveys on board, to place test wafer；
One clamping device, described clamping device is positioned at the surface of described chuck, to clamp probe
Card and described test wafer are carried out pin technique；
One induction installation, described induction installation be arranged on described chuck and described clamping device it
Between, to detect whether have foreign body between the probe of described probe card and described test wafer.
Semiconductor testing apparatus the most according to claim 1, it is characterised in that described sensing
Device moves in the region between described probe and described test wafer, and its direction moved
It is perpendicular to be provided with in described probe card the surface of probe.
Semiconductor testing apparatus the most according to claim 2, it is characterised in that described sensing
Device includes optical signal transmitter and light signal receiving；
Described optical signal transmitter is arranged at the side of described probe card, and described optical signal receives
The corresponding described optical signal transmitter position of device is arranged at the opposite side of described probe card；
Wherein, described optical signal transmitter sends optical signal to described light signal receiving,
Described light signal receiving by whether receive described optical signal to judge described probe with
Whether foreign body is had between described test wafer.
Semiconductor testing apparatus the most according to claim 3, it is characterised in that described test
Equipment also includes that guide rail, described guide rail are fixedly installed on described pin and survey on board, described optical signal
Dispensing device and described light signal receiving are all movably disposed on described guide rail, with edge
Region between described probe and described test wafer is scanned by described guide rail.
Semiconductor testing apparatus the most according to claim 2, it is characterised in that described light is believed
Number dispensing device and described light signal receiving are synchronized with the movement in the same direction.
Semiconductor testing apparatus the most according to claim 1, it is characterised in that described test
Equipment also includes that an alarm device, described alarm device are connected with described induction installation；When described
Induction installation senses when having foreign body between described probe and described test wafer, and described warning fills
Put and send warning message.
Semiconductor testing apparatus the most according to claim 1, it is characterised in that described probe
Block and electrically connect with described pin survey board, described test wafer to be carried out pin survey technique.
Semiconductor testing apparatus the most according to claim 1, it is characterised in that described foreign body
Including protection cap；
Described protection cap is located in described probe card, to avoid described probe to be subject in transportation
To damage.
Semiconductor testing apparatus the most according to claim 8, it is characterised in that described protection
Cover and be provided with conducting ring；
When described protection cap is located in described probe card, described conducting ring and described probe card
The contact of bottom.
10. a semiconductor test method, it is characterised in that described method includes:
Step S1 a: test wafer is positioned over a pin and surveys on the chuck of board；
Step S2: judge that described pin surveys the probe card on board the need of replacing；If being not required to
Change, then utilize this probe card that described test wafer carries out pin and survey technique；If desired change,
Then take out described probe card, and the probe card that is new is placed in the clamping device of described pin survey board
On；
Step S3: utilize induction installation to detect the probe in described new probe card and described survey
Foreign body is the most also had between examination wafer；If there being foreign body, then proceed step S4；If nothing
Foreign body, then utilize described new probe card that described test wafer carries out described pin and survey technique；
Step S4: check and remove the probe and described test being positioned in described new probe card
After foreign body between wafer, continue step S3.
11. semiconductor test methods according to claim 10, it is characterised in that described different
Thing includes that protection cap, described method also include:
After the operation carrying out step S2, continue judge in described new probe card with protection cap
On conducting ring contact contact whether can turn on；If can turn on, proceed step S4；
If can not turn on, then proceed step S3；
Wherein, described protection cap is located in described new probe card, to avoid described probe card
On probe sustain damage in transportation.
12. semiconductor test methods according to claim 10, it is characterised in that described folder
Holding device and be arranged at the surface of described chuck, described method also includes:
Probe card new described in described gripping apparatus grips and described test wafer are carried out pin work
After skill, the probe of described new probe card is pricked on the weld pad of described test wafer, to carry out
Technique surveyed by described pin.
13. semiconductor test methods according to claim 10, it is characterised in that described spy
The pin slowdown monitoring circuit that pin card is surveyed on board with described pin electrically connects.
14. semiconductor test methods according to claim 10, it is characterised in that described sense
Device is answered to include optical signal transmitter and light signal receiving；
Described optical signal transmitter is arranged at the side of described probe card, and described optical signal receives
The corresponding described optical signal transmitter position of device is arranged at the opposite side of described probe card；
When the probe using described induction installation to detect in described new probe card and described test
When the most also having foreign body between wafer, described optical signal transmitter receives to described optical signal
Device sends optical signal, and described light signal receiving is by whether receive described optical signal
Judge whether have foreign body between described probe and described test wafer.
15. semiconductor test methods according to claim 14, it is characterised in that described pin
Survey and be additionally provided with guide rail on board；
Described guide rail is fixedly installed on described pin and surveys on board, described optical signal transmitter and institute
State light signal receiving to be all movably disposed on described guide rail, with along described guide rail to institute
The region stated between probe and described test wafer is scanned.
16. semiconductor test methods according to claim 14, it is characterised in that described light
Sender unit and described light signal receiving are synchronized with the movement in the same direction.
17. semiconductor test methods according to claim 10, it is characterised in that described pin
Surveying and be additionally provided with an alarm device on board, described alarm device is connected with described induction installation；
When described induction installation senses and has foreign body between described probe and described test wafer, described
Alarm device sends warning message.
18. semiconductor test methods according to claim 10, it is characterised in that described sense
Answer in device region between described probe and described test wafer and move, and its side moved
To being perpendicular to be provided with in described new probe card the surface of probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510058550.3A CN105988071B (en) | 2015-02-04 | 2015-02-04 | Semiconductor test equipment and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510058550.3A CN105988071B (en) | 2015-02-04 | 2015-02-04 | Semiconductor test equipment and method |
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| CN105988071A true CN105988071A (en) | 2016-10-05 |
| CN105988071B CN105988071B (en) | 2020-04-21 |
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Cited By (2)
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