CN117590197A - Needle testing system - Google Patents

Needle testing system Download PDF

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Publication number
CN117590197A
CN117590197A CN202311561279.6A CN202311561279A CN117590197A CN 117590197 A CN117590197 A CN 117590197A CN 202311561279 A CN202311561279 A CN 202311561279A CN 117590197 A CN117590197 A CN 117590197A
Authority
CN
China
Prior art keywords
probe card
probe
object detection
detection sensor
cover plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311561279.6A
Other languages
Chinese (zh)
Inventor
庞云康
邓攀
季鸣
曾上游
王欢
周勤军
李振峰
曹辉
邢小柳
提静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GTA Semiconductor Co Ltd
Original Assignee
GTA Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GTA Semiconductor Co Ltd filed Critical GTA Semiconductor Co Ltd
Priority to CN202311561279.6A priority Critical patent/CN117590197A/en
Publication of CN117590197A publication Critical patent/CN117590197A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Abstract

The invention provides a needle detection system, which comprises a probe station, a probe card and an object detection sensor; the probe station comprises a cover plate, and an opening is formed in the cover plate; a probe card disposed within the opening; the object detection sensor is arranged on the cover plate; the object detection sensor is configured to emit and receive optical signals in a first direction to detect whether the probe card includes a structure extending in a second direction. According to the invention, the object detection sensor is arranged to detect the type of the replaced probe, so that the collision between the high-voltage probe head and the low-voltage probe card in the tester is prevented, the replacement frequency of the high-voltage probe head is reduced, the maintenance frequency of the high-voltage probe head is reduced, and the maintenance cost of the high-voltage probe head is reduced.

Description

Needle testing system
Technical Field
The invention relates to the technical field of semiconductor testing, in particular to a needle testing system.
Background
The wafer test is the first procedure of distinguishing good products from defective products in the rear section of the semiconductor, and mainly aims to test independent grains in the wafer. The wafer test is to perform an electrical characteristic test on each die on the wafer to detect and eliminate the failed die on the wafer. The unqualified die is marked with a mark, and then when the chip is cut into independent dies according to the die unit, the unqualified die marked with the mark is eliminated, and the next process is not performed, so that the manufacturing cost is not increased.
The wafer test is mainly placed through the cooperation of a probe station and a tester, in the test process, the tester cannot directly measure the wafer to be tested, but contacts probes in a probe card with bonding pads (pads) or bumps (bumps) on the wafer to form electrical contact, and test signals measured by the probes are sent to automatic test equipment for analysis and judgment, so that an electrical characteristic test result of each crystal grain on the wafer is obtained, and electric and functional crystal grains on the wafer are screened out.
The testing machine comprises a testing machine head, a high-voltage probe head is arranged in the testing machine head, and when a wafer is subjected to high-voltage testing, the high-voltage probe head is lowered to be in contact with a contact point of the high-voltage probe card by pressing a knob, so that high-voltage testing signal transmission is realized. Before the wafer is subjected to low-voltage test, the knob is pressed to enable the high-voltage probe head to ascend, so that the high-voltage probe head is prevented from being contacted with the low-voltage probe card. Fig. 1 and 2 show schematic diagrams of a low voltage probe card 21 and a high voltage probe card 22, respectively. As shown in fig. 1 and 2, the low voltage probe card 21 is different from the high voltage probe card 22 in that the low voltage probe card 21 is provided with metal posts 211 extending upward. When the low voltage test is performed, if the high voltage probe head is still in the lowered state, the high voltage probe head collides with the metal column 211 of the low voltage probe card 21, which may cause damage to the high voltage probe head. Once damaged, the high-voltage probe head has long maintenance time, high maintenance cost and larger influence on the productivity of the production line.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a probe testing system which can detect the type of a replaced probe card, prevent a high-voltage probe head from colliding with a low-voltage probe card, reduce the replacement frequency of the high-voltage probe head, reduce the maintenance frequency of the high-voltage probe head and reduce the maintenance cost of the high-voltage probe head.
An embodiment of the present invention provides a needle measurement system including:
the probe station comprises a cover plate, wherein an opening is formed in the cover plate;
a probe card disposed within the opening;
an object detection sensor disposed on the cover plate; the object detection sensor is configured to emit and receive optical signals along a first direction to detect whether the probe card includes a structure extending along a second direction; the first direction is perpendicular to the second direction.
In some embodiments, the probe card includes a first probe card including metal posts extending along a second direction.
In some embodiments, the object detection sensor is a photosensor.
In some embodiments, the photoelectric sensor comprises an emitter and a receiver, the emitter and the receiver are oppositely arranged, and the emitted light of the emitter and the connecting line of the metal column and the receiver are on the same straight line.
In some embodiments, the wafer test device further comprises a carrier, wherein the carrier is arranged inside the probe station and is used for carrying the wafer to be tested.
In some embodiments, the object detection sensor is disposed on a side of the cover plate that is adjacent to the stage.
In some embodiments, the wafer test system further comprises a tester disposed on a side of the probe card remote from the stage, the tester passing through the probe card to provide test signals to the wafer to be tested.
In some embodiments, the probe card includes a probe head, a metal layer, and a circuit carrier, the probe head and the metal layer being secured to the circuit carrier.
In some embodiments, a tray is also included for holding the probe card.
In some embodiments, the device further comprises a moving device connected with the carrier for controlling the carrier to move up and down.
The needle detection system provided by the invention has the following advantages:
the invention provides a needle detection system, which comprises a probe station, a probe card and an object detection sensor; the probe station comprises a cover plate, and an opening is formed in the cover plate; a probe card disposed within the opening; the object detection sensor is arranged on the cover plate; the object detection sensor is configured to emit and receive optical signals in a first direction to detect whether the probe card includes a structure extending in a second direction. According to the invention, the object detection sensor is arranged to detect the type of the replaced probe, so that the collision between the high-voltage probe head and the low-voltage probe card is prevented, the replacement frequency of the high-voltage probe head is reduced, the maintenance frequency of the high-voltage probe head is reduced, and the maintenance cost of the high-voltage probe head is reduced.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings.
FIG. 1 shows a schematic diagram of a low voltage probe card;
FIG. 2 shows a schematic diagram of the structure of a high voltage probe card;
FIG. 3 shows a schematic diagram of a needle detection system provided by an embodiment of the present invention.
Reference numerals:
1. probe station
11. Cover plate
111. An opening
12. Carrier table
2. Probe card
21. Low-voltage probe card
211. Metal column
2a probe
2b Metal layer
2c circuit board
22. High-voltage probe card
3. Photoelectric sensor
31. Transmitter
32. Receiver with a receiver body
4. Test machine
41. High-voltage probe head
5. Wafer to be tested
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a repetitive description thereof will be omitted. "or", "or" in the specification may each mean "and" or ".
In the description of the present application, reference to the terms "one embodiment," "some embodiments," "examples," "particular examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the various embodiments or examples, and features of the various embodiments or examples, presented herein may be combined and combined by those skilled in the art without conflict.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the context of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
It will be further understood that the terms "comprises," "comprising," "includes," and/or "including" specify the presence of stated features, steps, operations, elements, components, items, categories, and/or groups, but do not preclude the presence, presence or addition of one or more other features, steps, operations, elements, components, items, categories, and/or groups. The terms "or" and/or "as used herein are to be construed as inclusive, or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a, A is as follows; b, a step of preparing a composite material; c, performing operation; a and B; a and C; b and C; A. b and C). An exception to this definition will occur only when a combination of elements, functions, steps or operations are in some way inherently mutually exclusive.
In order to solve the problems in the prior art, the embodiment of the invention provides a needle detection system. Fig. 3 is a schematic structural diagram of a needle measurement system according to an embodiment of the present invention. As shown in fig. 3, the probing system includes a probe station 1, a probe card 2, and an object detection sensor. The probe station 1 comprises a cover plate 11, and an opening 111 is formed in the cover plate 11; the probe card 2 is placed in the opening 111; the object detection sensor is placed on the cover plate 11; the object detection sensor is configured to emit and receive optical signals in a first direction to detect whether the probe card 2 includes structural members extending in a second direction.
The first direction refers to the left-right direction as viewed along the paper surface, and the second direction refers to the up-down direction as viewed from the paper surface. When the probe card 2 is provided with a structural member extending along the second direction, the object detection sensor can shield the transmission of light along the first direction when transmitting light signals to the first direction, and when the sensor does not detect the light signals, it can be determined that no structural member is arranged along the second direction on the probe card 2 currently. The high voltage probe card 22 has no structural member arranged along the second direction, and the low voltage probe card 21 is provided with structural members extending along the second direction, so that when the object detection sensor detects the transmitted optical signal, the probe card 2 is determined to be the high voltage probe card 22 at present; when the object detection sensor fails to detect the transferred optical signal, it can be determined that the probe card 2 is currently the low voltage probe card 21. The type of the probe card is determined based on whether the object detection sensor receives the optical signal.
With continued reference to fig. 3, the probing system further includes a carrier 12 disposed inside the probe station 1, where the carrier 12 is used for carrying the wafer 5 to be tested. The carrier 12 has a wafer placement surface. The carrier 12 may fix the wafer 5 to be tested on the wafer placing surface by electrostatic adsorption or vacuum adsorption. In another embodiment, the carrier 12 may also have a limit structure or a fixing slot matched with the wafer 4 to be tested, so as to fix the wafer 5 to be tested. In yet another embodiment, the carrier 12 is connected to a moving device, and the carrier 12 is controlled to perform a lifting motion, so as to adjust the distance between the carrier 12 and the probe card 2, so as to ensure good contact between the wafer 5 to be tested and the probe card 2. In some embodiments, the probing system further comprises a tray (not shown) for holding the probe card 2.
As shown in fig. 3, the low voltage probe card 21 includes metal pillars 211 arranged in a second direction. In some embodiments, the probe card 2 includes probes 2a, a metal layer 2b, and a wiring board 2c. The material of the metal layer 2b may be an alloy. The wiring board 2c may be, for example, a printed circuit board. One end of the probe 2a faces the wafer 5 to be tested, and the other end of the probe 2a is connected with the metal layer 2b, for example. The probes 2a and the metal layer 2b are fixed on the circuit board 2c by soldering, for example, and each of the probes 2a is electrically connected to a corresponding circuit on the circuit board 2c.
In some embodiments, the object detection sensor is a photosensor 3. In some embodiments, the photosensor 3 may be an active infrared sensor, generating an infrared light signal, but is not limited thereto.
As shown in fig. 3, the photoelectric sensor 3 provided in the embodiment of the present invention includes an emitter 31 and a receiver 32, where the emitter 31 and the receiver 32 are disposed opposite to each other, and an emission light of the emitter 31 and a connection line of the metal column 211 and the receiver 32 are on the same straight line. The arrangement of the transmitter 31 and the receiver 32 is only exemplary and not limited thereto. In the embodiment of the present invention, the photoelectric sensor 3 is disposed on a surface of the cover plate 11 close to the carrier 12, but is not limited thereto.
The probing system further comprises a testing machine 4 disposed on a side of the probe card 2 away from the carrier 12, wherein the testing machine 4 is configured to provide test signals to the wafer 5 to be tested and receive test data through the probe card 2. When the tester 4 provides the relevant electrical signals to the probe card 2, various electrical parameters and characteristics of all chips on the wafer 5 to be tested can be tested.
The testing machine 4 comprises a testing machine head, a high-pressure probe head 41 is arranged in the testing machine head, and one end of the high-pressure probe head 41 is movably connected with the top of the testing machine 4 through a telescopic device. The telescopic device may be a pneumatic telescopic device, but is not limited thereto. When the high voltage probe card is used for high voltage test, the high voltage probe head 41 moves to a direction approaching to the high voltage probe card through the control switch so as to provide a high voltage test signal to the high voltage probe card.
Replacement of the probe card may be accomplished by manual or automatic control. The following explains the probe procedure of the probe card type after manual replacement of the probe card and automatic replacement of the probe card with reference to fig. 3.
When the probe card 2 is manually replaced, it is first controlled to lift the test head of the tester 4 upward and then manually replace a new probe card at the opening 111 above the probe station 1. When the new probe card is replaced, the photoelectric sensor 3 is in a continuously opened state, and if the new probe card is the low-voltage probe card 21, the photoelectric sensor 3 cannot detect the optical signal under the shielding of the metal column 211; if the new probe card is the high voltage probe card 22, the high voltage probe card 22 has no structural member extending along the second direction, and the photoelectric sensor 3 can continuously receive the optical signal.
Therefore, when the optical signal is not received by the photoelectric sensor 3 after the manual replacement of the new probe card is completed, the current new probe card is determined to be the low-voltage probe card 21, accordingly, an alarm prompt can be sent out, the replacement personnel can observe and control the on-off control condition of the control buttons for the ascending and descending of the high-voltage probe head 41, and after the high-voltage probe head 41 is confirmed to be in the ascending state, the test head can be lowered for the next operation. When the optical signal is continuously received by the photoelectric sensor 3 within the preset time after the new probe card is manually replaced, the current new probe card is judged to be the high-voltage probe card 22, an alarm is not required to be sent, and an operator can directly lower the testing machine head to perform the next operation.
When the new probe card is automatically replaced, the tray containing the probe card can firstly move downwards and then pop up, when the new probe card is placed on the tray, the new probe card enters the cavity of the probe station 1 again, the tray can then move upwards slowly, and the new probe card moves upwards simultaneously under the drive of the tray. When the new probe card is the low voltage probe card 21, the photoelectric sensor 3 detects the metal column 211 on the low voltage probe card 21 along with the upward movement of the tray, and the photoelectric sensor 3 controls the tray to stop moving upward at the same moment when the photoelectric sensor 3 does not receive the optical signal, and sends out an alarm prompt, and after receiving the alarm prompt, the replacement personnel confirms the state of the high voltage probe head 41 again, and after confirming that the state is correct, the next action can be performed. When the new probe card is the high-voltage probe card 22, no alarm prompt exists in the whole lifting process of the tray, and the next operation can be directly performed.
Through setting up photoelectric sensor, no matter manual change probe card or automatic change probe card all can effectively detect the type of probe card before the accident takes place, prevent when the probe card is low pressure probe card, high pressure probe head and low pressure probe card collide and cause the damage, reduce the damage frequency of high pressure probe head.
The invention has the following advantages:
the invention provides a needle detection system, which comprises a probe station, a probe card and an object detection sensor; the probe station comprises a cover plate, and an opening is formed in the cover plate; a probe card disposed within the opening; the object detection sensor is arranged on the cover plate; the object detection sensor is configured to emit and receive optical signals in a first direction to detect whether the probe card includes a structure extending in a second direction. According to the invention, the object detection sensor is arranged to detect the type of the replaced probe, so that the collision between the high-voltage probe head and the low-voltage probe card is prevented, the replacement frequency of the high-voltage probe head is reduced, the maintenance frequency of the high-voltage probe head is reduced, and the maintenance cost of the high-voltage probe head is reduced.
The foregoing is a further detailed description of the invention in connection with the preferred embodiments, and it is not intended that the invention be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.

Claims (10)

1. A needle testing system, comprising:
the probe station comprises a cover plate, wherein an opening is formed in the cover plate;
a probe card disposed within the opening;
an object detection sensor disposed on the cover plate; the object detection sensor is configured to emit and receive optical signals in a first direction to detect whether the probe card includes structural members extending in a second direction, the first direction being perpendicular to the second direction.
2. The probing system as recited in claim 1 wherein the probe card comprises a first probe card comprising metal posts extending along a second direction.
3. The needle detection system of claim 2, wherein the object detection sensor is a photoelectric sensor.
4. A needle detection system according to claim 3, wherein said photoelectric sensor comprises an emitter and a receiver, said emitter and said receiver are disposed opposite each other, and the emitted light of said emitter is on the same straight line with the connecting line of said metal column and said receiver.
5. The probing system as recited in claim 4 further comprising a stage disposed within the probe station, the stage for carrying a wafer to be tested.
6. The needle detection system of claim 5, wherein the object detection sensor is disposed on a side of the cover plate adjacent to the carrier.
7. The prober system of claim 6, further comprising a tester disposed on a side of the probe card remote from the carrier, the tester passing through the probe card to provide test signals to the wafer under test.
8. The probing system as recited in claim 1 wherein the probe card comprises a probe head, a metal layer and a circuit carrier, the probe head and the metal layer being secured to the circuit carrier.
9. The probing system as recited in claim 1 further comprising a tray for holding the probe card.
10. The needle detection system of claim 5, further comprising a movement device coupled to the carrier for controlling the lifting movement of the carrier.
CN202311561279.6A 2023-11-21 2023-11-21 Needle testing system Pending CN117590197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311561279.6A CN117590197A (en) 2023-11-21 2023-11-21 Needle testing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311561279.6A CN117590197A (en) 2023-11-21 2023-11-21 Needle testing system

Publications (1)

Publication Number Publication Date
CN117590197A true CN117590197A (en) 2024-02-23

Family

ID=89909456

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311561279.6A Pending CN117590197A (en) 2023-11-21 2023-11-21 Needle testing system

Country Status (1)

Country Link
CN (1) CN117590197A (en)

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