CN105987781A - Dynamic stress sensor and manufacturing method thereof, and dynamic stress measurement system - Google Patents
Dynamic stress sensor and manufacturing method thereof, and dynamic stress measurement system Download PDFInfo
- Publication number
- CN105987781A CN105987781A CN201510069734.XA CN201510069734A CN105987781A CN 105987781 A CN105987781 A CN 105987781A CN 201510069734 A CN201510069734 A CN 201510069734A CN 105987781 A CN105987781 A CN 105987781A
- Authority
- CN
- China
- Prior art keywords
- layer
- dynamic stress
- dynamic
- stress
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention relates to the stress luminescent material technology field and discloses a dynamic stress sensor and a manufacturing method thereof, and a dynamic stress measurement system. The dynamic stress sensor comprises a protective layer (1), a luminescent layer (2) and a transparent substrate (3), wherein the protective layer (1) is used to generate elastic deformation corresponding to a signature when a writer carries out handwritten signature on the protective layer (1); the luminescent layer (2) is arranged on a lower surface of the protective layer (1) and is used for generating a visible light signal at a stressed position corresponding to the protective layer (1) in the luminescent layer (2) after the protective layer generates the elastic deformation; and the luminescent layer (2) is arranged on an upper surface of the transparent substrate (3) and outputs the visible light signal through the transparent substrate (3). The dynamic stress sensor can output a dynamic image formed by the corresponding visible light signal when the writer carries out handwritten signature so as to display a dynamic process of the handwritten signature. The process is displayed timely and accurately and credibility is high.
Description
Technical field
The present invention relates to stress light emitting material technical field, in particular it relates to a kind of dynamic stress sensor,
Preparation method and dynamic stress measurement system.
Background technology
Sign electronically owing to authentication and system record can be provided the most easily by network, breach
Time and limitation spatially, be therefore widely used in communication, ecommerce, E-Government and letter
The fields such as breath safety.At present, the electronic signature reliably being protected by law in daily life is by greatly
The use of amount, such as handwritten signature, secret code name, personal identification number, and there is individual's identification feature
Fingerprint, sound, retinal structure etc..Wherein, handwritten signature is more easy to use because of it, by users
Being made earnest efforts, there is irreplaceable effect in the field unique in digitized, informationization and networking etc..
But, the personal information security faced along with people threatens increasingly severe, to existing simply record
The final graphics pattern processing techniques of the hand-written generation of user proposes huge challenge, and handwritten signature exists
Various unsafe factor.
Summary of the invention
It is an object of the invention to provide a kind of dynamic stress sensor, can show that writer is when handwritten signature
Dynamic process.
To achieve these goals, the present invention provides a kind of dynamic stress sensor, and described dynamic stress passes
Sensor includes: protective layer, for when writer's handwritten signature on this protective layer, occurs and this signature
Corresponding elastic deformation；Luminescent layer, is arranged on the lower surface of described protective layer, in described protection
After layer occurs elastic deformation, described luminescent layer generates at the forced position of corresponding described protective layer visible ray
Signal；And transparent substrates, described luminescent layer is arranged on the upper surface of described transparent substrates, through described
Transparent substrates exports described visible light signal.
Preferably, described luminescent layer is bonded in described by stress light emitting material powder by the first binding agent
Formed on bright substrate.
Preferably, described first binding agent is ethylene-vinyl acetate copolymer EVA glue or photoresist.
Preferably, the luminescent layer described transparent substrates formed has lattice point.
Preferably, particle diameter < 5 μm of described stress light emitting material powder.
Preferably, described stress light emitting material is Zn1-xS:Mnx, 0.001≤x≤0.04；Or it is described
Stress light emitting material is to mix the ZnS of Cu or rare-earth metal doped aluminates system.
Preferably, described dynamic stress sensor also includes: photoresist layer, is arranged under described protective layer
Surface.
Preferably, described photoresist layer includes having reflecting effect metal film or pitch-dark.
Preferably, described protective layer is flexible material.
Dynamic stress sensor of the present invention can export correspondence when writer's handwritten signature on the protection layer
The dynamic image that visible light signal is formed, to show the dynamic process of handwritten signature, promptly and accurately, credible
Degree height.
It is a further object of the present invention to provide the preparation method of a kind of dynamic stress sensor, making can be simplified
Step, easy to operate.
To achieve these goals, the present invention provides the preparation method of a kind of dynamic stress sensor, described
Preparation method includes: provide a transparent substrates；Stress light emitting material powder is bonded by the first binding agent
Upper surface in described transparent substrates forms luminescent layer；Bonded on the light-emitting layer by the second binding agent
Layer protective layer.
Preferably, described first binding agent is EVA glue or photoresist.
Preferably, stress light emitting material powder is bonded shape on the transparent substrate by the first binding agent
The method becoming luminescent layer includes: be dispersed in ethanol solution by stress light emitting material powder；Described
The upper surface of transparent substrates is coated with one layer of EVA glue, and ethanol solution is coated in EVA glue transparent
The upper surface of substrate；At a set temperature, described stress light emitting material powder particle homogeneous precipitation and ethanol
Solution evaporation, described transparent substrates is formed luminescent layer.
Preferably, stress light emitting material powder is bonded shape on the transparent substrate by the first binding agent
The method becoming luminescent layer includes: under the irradiation of corresponding visible ray, by stress light emitting material powder and photoetching
Glue is uniformly mixed by the part by weight set；Apply the mixture to the upper surface of described transparent substrates, warp
Formed the luminescent layer with lattice point by exposure after crossing baking the affected part after applying some drugs.
Preferably, also include before bonding protective layer on the light-emitting layer by the second binding agent: in institute
The lower surface stating protective layer arranges one layer of photoresist layer.
The preparation method of dynamic stress sensor of the present invention can be by viscous between transparent substrates and protective layer
Closing described stress light emitting material powder and form luminescent layer, preparation method is simple, easy to operate, obtained
Dynamic stress sensor simple in construction, accuracy of detection is high.
It is yet another object of the invention to provide a kind of dynamic stress measurement system, can show that writer is hand-written
Dynamic process during signature.
To achieve these goals, the present invention provides a kind of dynamic stress measurement system, described dynamic stress
Measurement system includes: above-mentioned dynamic stress sensor；Image acquisition units, corresponding described dynamic stress passes
Sensor is arranged, for gathering the Dynamic Graph that the visible light signal of described dynamic stress sensor output is formed
Picture；And signal processing unit, it is connected with described image acquisition units, is used for according to described dynamic image,
Obtain following one or more: writing track, stress distribution and the writing speed of writer.
Preferably, described signal processing unit by described dynamic image according to room and time superposition, it is thus achieved that
Complete writing track, stress distribution and/or writing speed information.
Preferably, described dynamic stress sensor is packaged together with image acquisition units.
Described dynamic stress measurement system is had relative to prior art with above-mentioned dynamic stress sensor
Dominant Facies with, do not repeat them here.
Other features and advantages of the present invention will be described in detail in detailed description of the invention part subsequently.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and constitutes the part of description, with
Detailed description below is used for explaining the present invention together, but is not intended that limitation of the present invention.?
In accompanying drawing:
Fig. 1 is the structural representation of dynamic stress sensor of the present invention；
Fig. 2 is the flow chart of the preparation method of dynamic stress sensor of the present invention；
Fig. 3 is the structural representation of dynamic stress measurement system of the present invention；
Fig. 4 is the example images of dynamic stress measurement system record of the present invention；
Fig. 5 is the light intensity distributions figure of image shown in Fig. 4；
Fig. 6 is the variation diagram of the light intensity of AB bar-shaped zone in Fig. 5；
Fig. 7 is the image obtained the most in the same time.
Description of reference numerals
1 protective layer 2 luminescent layer
3 transparent substrates 4 photoresist layers.
Detailed description of the invention
Below in conjunction with accompanying drawing, the detailed description of the invention of the present invention is described in detail.It should be appreciated that
Detailed description of the invention described herein is merely to illustrate and explains the present invention, is not limited to this
Bright.
In the present invention, in the case of illustrating on the contrary, the direction term mentioned, such as " on ",
D score, "front", "rear", "left", "right" etc., be only the direction with reference to accompanying drawing.Therefore, use
Direction term is used to illustrate not for limiting the scope of the invention.
As it is shown in figure 1, dynamic stress sensor of the present invention includes protective layer 1, it is used for writer at this
On protective layer 1 during handwritten signature, there is the elastic deformation corresponding with this signature；Luminescent layer 2, is arranged
At the lower surface of described protective layer 1, it is used for after described protective layer 1 occurs elastic deformation, described luminescence
Layer 2 generates at the forced position of corresponding described protective layer 1 visible light signal；And transparent substrates 3,
Described luminescent layer 2 is arranged on the upper surface of described transparent substrates 3, exports institute through described transparent substrates 3
State visible light signal.
Described luminescent layer 2 is bonded in described transparent substrates by stress light emitting material powder by the first binding agent
Formed on 3.Described first binding agent can be ethylene ethyl acetate copolymer EVA glue or photoresist.
Wherein, when forming luminescent layer by EVA glue: can be by dispersed for stress light emitting material powder
In ethanol solution；Upper surface in described transparent substrates is coated with one layer of EVA glue, and is coated with by ethanol solution
Overlay on the upper surface of transparent substrates with EVA glue；At a set temperature, described stress light emitting material
Powder particle homogeneous precipitation and ethanol solution evaporation, described transparent substrates is formed luminescent layer.Or, logical
Cross photoresist and form described luminescent layer: under the irradiation of corresponding visible ray, by stress light emitting material powder with
Photoresist is uniformly mixed by the part by weight set；Apply the mixture in described transparent substrates, pass through
By exposure formation, there is lattice point luminescent layer after baking the affected part after applying some drugs.The luminescent layer with lattice point can accurately represent stress
Positional information, improves resolution.
For the selection of stress light emitting material, can select correspondence according to the actual requirements has different luminous face
The stress light emitting material in color, relaxation time etc., in the present embodiment, described stress light emitting material is can
Send the Zn of crocus visible ray1-xS:Mnx, 0.001≤x≤0.04, but be not limited thereto, also may be used
To select to mix ZnS or the stress light emitting material of rare-earth metal doped aluminates system etc. of Cu.Its
In, particle diameter < 5 μm of described stress light emitting material powder.
The material of described protective layer 1 is flexible material, it is simple to writer is hand-written label on described protective layer 1
During name, described protective layer 1 can occur the elastic deformation corresponding with this signature, and is applied to described sending out
On photosphere 2, make to produce at the forced position of the corresponding described protective layer 1 of described luminescent layer 2 visible light signal,
Promptly and accurately, with a high credibility.In the present embodiment, described protective layer 1 is polyethylene terephthalate
(PET) film, but be not limited thereto, it is also possible to for other macromolecular materials, such as: poly-methyl-prop
E pioic acid methyl ester, polydimethylsiloxane, epoxy resin etc..
In order to enable dynamic stress sensor of the present invention normally to use in bright environment, and have
Higher signal noise ratio, dynamic stress sensor of the present invention also includes photoresist layer 4, described photoresist layer
4 lower surfaces being arranged at described protective layer 1.Wherein, described photoresist layer 4 includes having reflecting effect
Metal film or pitch-dark.Can be sputtered by film plating process such as magnetron sputterings at the lower surface of described protective layer 1
Layer of metal film；Or coat one layer pitch-dark, or other have the material of light effect.At the present embodiment
In, described metal film is silver (Ag) film, but is not limited thereto.
Dynamic stress sensor of the present invention can export correspondence when writer's handwritten signature on the protection layer
Visible light signal forms dynamic image, to show the dynamic process of handwritten signature, promptly and accurately, thus carries
The credibility of high electronic signature.
As in figure 2 it is shown, the preparation method of dynamic stress sensor of the present invention includes: step 200: provide
One transparent substrates；Step 201: stress light emitting material powder is bonded in described by the first binding agent
The upper surface of bright substrate forms luminescent layer；Step 202: glued on the light-emitting layer by the second binding agent
Close layer protective layer.
Wherein, described transparent substrates can be PET, polymethyl methacrylate, polydimethylsiloxane,
The macromolecular materials such as epoxy resin.
Described first binding agent is EVA glue or photoresist.
Then stress light emitting material powder is formed on the transparent substrate by the first binding agent bonding and send out
The method of photosphere includes: be dispersed in ethanol solution by stress light emitting material powder；Described transparent
Coat EVA glue on substrate, and ethanol solution is coated in the one side of transparent substrates with EVA glue；
At a set temperature, described stress light emitting material powder particle all evaporates with precipitation and ethanol solution, described
Luminescent layer is formed in transparent substrates.
Additionally, stress light emitting material powder is formed on the transparent substrate by the first binding agent bonding
Luminescent layer can also include: under the irradiation of corresponding visible ray, by stress light emitting material powder and photoresist
Uniformly mix by the part by weight set；Apply the mixture in described transparent substrates, after baking the affected part after applying some drugs
By exposure formation, there is lattice point luminescent layer.The luminescent layer obtained by said method has lattice point, can be accurate
Really represent the positional information of stress, improve resolution.
Preparation method of the present invention the most also includes: the lower surface at described protective layer arranges one
Layer photoresist layer.Wherein, described photoresist layer includes having reflecting effect metal film or pitch-dark；Then in institute
State the lower surface of protective layer to arrange the method for one layer of photoresist layer and include: the lower surface at described protective layer passes through
Film plating process sputtering layer of metal film；Or, pitch-dark in the lower surface coating one layer of described protective layer.
Wherein, the material of described protective layer is flexible material, it is simple to writer is hand-written on described protective layer
During signature, described protective layer can occur and the corresponding elastic deformation that renames, and is applied to described luminescence
On layer, make to produce at the forced position of the corresponding described protective layer of described luminescent layer visible light signal, accurate in time
Really, response speed and credibility are improved.In the present embodiment, described protective layer is poly terephthalic acid second
Ester (PET) film, but be not limited thereto, it is also possible to for other macromolecular materials, such as: poly-methyl
Acrylic acid methyl ester., polydimethylsiloxane, epoxy resin etc..
For the selection of stress light emitting material, can select correspondence according to the actual requirements has different luminous face
The stress light emitting material in color, relaxation time etc., in the present embodiment, described stress light emitting material is can
Send the ZnS:Mn of crocus visible ray, but be not limited thereto, it is also possible to select mix Cu ZnS,
The stress light emitting material of rare-earth metal doped aluminates system etc..Wherein, described stress light emitting material powder
Particle diameter < 5 μm at end.
The preparation method of dynamic pressure transducer of the present invention is by bonding between transparent substrates and protective layer
Described stress light emitting material powder forms luminescent layer, and preparation method is simple, easy to operate, and obtained is dynamic
State strain gauge simple in construction, accuracy of detection is high.
Stress light emitting material is discussed in detail as a example by ZnS:Mn below.
The stress light emitting material that the present invention uses is ZnS:Mn, can pass through high-temperature vacuum curing reaction system
?.Its preparation method is: (1) stoichiometrically weighs high-purity manganese carbonate and zinc sulfide, its formula of
For Zn1-xS:MnxMiddle x span be 0.001≤x≤0.04.(2) by the raw material that weighs with
Ethanol is that disperse medium is fully ground.(3) high-purity corundum crucible is inserted after to be dried, under vacuum,
Put into tubular quartz pipe roasting, obtain stress light emitting material powder.Wherein, sintering temperature is 1000 DEG C
～1150 DEG C, roasting time is 1～4 hour, and grinds further after sintering and screening, it is thus achieved that granule
Uniform crocus stress light emitting material ZnS:Mn powder, described stress light emitting material powder particle is straight
Footpath < 5 μm.
Dynamic stress sensor is prepared further below according to described stress light emitting material ZnS:Mn powder.
Embodiment one:
The stress light emitting material ZnS:Mn powder of synthesis is scattered in ethanol solution, with ultrasound wave,
Stirring rod etc. carry out fully dispersed separation, make ZnS:Mn powder be uniformly distributed in ethanol solution；With
After be quickly transferred to scribble EVA glue and edge is pasted with in rectangular frame mould PET film.Setting
At a temperature of, form luminescent layer after ZnS:Mn powder particle homogeneous precipitation and ethanol solution volatilization, remove
Another block is also scribbled the PET film of EVA glue and covers at the upper surface of luminescent layer, subsequently by frame-type mould
It is packaged fixing through hot press by upper and lower both sides PET film.
It addition, for making dynamic stress sensor have more preferable signal to noise ratio, make described dynamic stress sensor
Also can work well under bright light environments, photoresist layer can be added, i.e. covering table on described luminescent layer
Before face, first pass through the film plating process such as magnetron sputtering the upper sputtering of upper strata PET film (i.e. protective layer) a layer
Ag film (other have the metal of reflecting effect also can) or scribble one layer pitch-dark (other have absorption
The material of light effect also can), after process, lower surface at PTE film is coated with and spreads EVA glue and cover described sending out
Photosphere, is packaged the device being obtained with having high s/n ratio.
Embodiment two
Preparing Nano type dynamic stress sensor, its preparation process is as follows: (1) is at orange photochromic visible ray
Irradiation under, by the ZnS:Mn powder of micro-nano size and positive photoresist (according to technique figure demand,
Also may select the photoresist used in negative photoresist, this example is AZ P4620) uniform by weight 1:3
Mixing, it is possible to according to the height of actual array, other weight ratios of size Selection.(2) subsequently by mixture
Uniformly being spun in cleaning, transparent PET film, utilize UV to expose after baking the affected part after applying some drugs, develop after bake
Rear acquisition required component graphics pattern.
Being prepared for the length of side in the present embodiment is 50 microns, and height is 15 microns, and spacing is 50
The rectangular array of micron.In order to protect photoengraving pattern, in order to avoid in use array structure damages, at device
Surface can spin coating one strata methyl methacrylate (PMMA), the most also can cover one layer again and scribble EVA
The PET of glue carries out packaging by hot pressing again.
The Nano type dynamic stress sensor resolution prepared by said method is high；There is absolute coordinate,
The positional information of stress can be specified；Size is less, and range is wide.
As it is shown on figure 3, dynamic stress measurement system of the present invention includes dynamic stress sensor；Image acquisition
Unit, corresponding described dynamic stress sensor is arranged, for gathering the output of described dynamic stress sensor
The dynamic image that visible light signal is formed；And signal processing unit, it is connected with described image acquisition units,
For according to described dynamic image, obtain following one or more: the writing track of writer, stress divide
Cloth and writing speed.
Wherein, described signal processing unit by described dynamic image according to room and time superposition, it is thus achieved that complete
Whole writing track, stress distribution and/or writing speed information.Described image acquisition units can be electric charge
Coupled device imageing sensor (Charge Coupled Device, CCD), the acquisition zone of described CCD
The transparent substrates of the corresponding described dynamic stress sensor in territory.Adopt additionally, image can be improved according to the actual requirements
Collection unit, is such as directly packaged together dynamic stress sensor with CCD.For example, it is possible to will
Dynamic stress sensor is encapsulated in camera bellows together with image acquisition units, to completely cut off the dry of extraneous light
Disturb.
Described signal processing unit is the key component effectively presenting image parameter, typically can be by from compiling
Software realizes corresponding function.The present invention utilizes Matlab program language, according to described dynamic image,
Obtain CCD video image frame data, and carry out different matrix calculus, obtain writer's writing simultaneously
Image information and the relevant statistics such as track, stress distribution, writing speed, and then guarantee handwritten signature
Safety.
Fig. 4 show an embodiment of writer's handwritten signature figure, and Fig. 5 is handwritten signature in Fig. 4
Light intensity distributions figure, Fig. 6 is expressed as the intensity variation in Fig. 5 in AB bar-shaped zone, Fig. 7 table
Show graphical information the most in the same time.The recordable image letter the most in the same time of dynamic stress measurement system of the present invention
Breath, and by all of image information according to room and time superposition, it is thus achieved that complete stress distribution, write
The personal characteristic information such as speed, thus improve the safety of handwritten signature.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, but, the present invention does not limit
Detail in above-mentioned embodiment, in the technology concept of the present invention, can be to the present invention
Technical scheme carry out multiple simple variant, these simple variant belong to protection scope of the present invention.
It is further to note that each the concrete technology described in above-mentioned detailed description of the invention is special
Levy, in the case of reconcilable, can be combined by any suitable means, in order to avoid need not
The repetition wanted, various possible compound modes are illustrated by the present invention the most separately.
Additionally, combination in any can also be carried out between the various different embodiment of the present invention, as long as its
Without prejudice to the thought of the present invention, it should be considered as content disclosed in this invention equally.
Claims (17)
1. a dynamic stress sensor, it is characterised in that described dynamic stress sensor includes:
Protective layer (1), for when writer's handwritten signature on this protective layer (1), occurs and is somebody's turn to do
Sign corresponding elastic deformation；
Luminescent layer (2), is arranged on the lower surface of described protective layer (1), in described protective layer (1)
After there is elastic deformation, raw at the forced position of corresponding described protective layer (1) in described luminescent layer (2)
Become visible light signal；And
Transparent substrates (3), described luminescent layer (2) is arranged on the upper surface of described transparent substrates (3),
Described visible light signal is exported through described transparent substrates (3).
Dynamic stress sensor the most according to claim 1, it is characterised in that described luminescent layer
(2) it is bonded in described transparent substrates (3) by stress light emitting material powder by the first binding agent above to be formed.
Dynamic stress sensor the most according to claim 2, it is characterised in that described first glues
Mixture is ethylene-vinyl acetate copolymer EVA glue or photoresist.
4. according to the dynamic stress sensor according to any one of claim 1-3, it is characterised in that
The upper luminescent layer (2) formed of described transparent substrates (3) has lattice point.
Dynamic stress sensor the most according to claim 2, it is characterised in that described stress is sent out
Particle diameter < 5 μm of luminescent material powder.
6. according to the dynamic stress sensor according to any one of claim 2-5, it is characterised in that
Described stress light emitting material is Zn1-xS:Mnx, 0.001≤x≤0.04；Or
Described stress light emitting material is to mix the ZnS of Cu or rare-earth metal doped aluminates system.
7. according to the dynamic stress sensor according to any one of claim 1-6, it is characterised in that
Described dynamic stress sensor also includes:
Photoresist layer (4), is arranged at the lower surface of described protective layer (1).
Dynamic stress sensor the most according to claim 7, it is characterised in that described photoresist layer
(4) include having the metal film of reflecting effect or pitch-dark.
9. according to the dynamic stress sensor according to any one of claim 1-8, it is characterised in that
Described protective layer (1) is flexible material.
10. the preparation method of a dynamic stress sensor, it is characterised in that described preparation method includes:
One transparent substrates is provided；
Stress light emitting material powder is bonded in by the first binding agent the upper surface shape of described transparent substrates
Become luminescent layer；
Layer protective layer is bonded on the light-emitting layer by the second binding agent.
The preparation method of 11. dynamic stress sensors according to claim 10, it is characterised in that
Described first binding agent is EVA glue or photoresist.
The preparation method of 12. dynamic stress sensors according to claim 10, it is characterised in that
Stress light emitting material powder is formed luminescent layer on the transparent substrate by the first binding agent bonding
Method includes:
Stress light emitting material powder is dispersed in ethanol solution；
Upper surface in described transparent substrates is coated with one layer of EVA glue, and is coated in ethanol solution with EVA
The upper surface of the transparent substrates of glue；
At a set temperature, described stress light emitting material powder particle homogeneous precipitation and ethanol solution evaporation,
Luminescent layer is formed in described transparent substrates.
The preparation method of 13. dynamic stress sensors according to claim 10, it is characterised in that
Stress light emitting material powder is formed luminescent layer on the transparent substrate by the first binding agent bonding
Method includes:
Under the irradiation of corresponding visible ray, by stress light emitting material powder with photoresist by the weight ratio set
Example uniformly mixes；
Apply the mixture to the upper surface of described transparent substrates, had by exposure formation after baking the affected part after applying some drugs
The luminescent layer of lattice point.
14. according to the preparation method of the dynamic stress sensor according to any one of claim 10-13,
It is characterized in that, also include before bonding protective layer on the light-emitting layer by the second binding agent:
Lower surface at described protective layer arranges one layer of photoresist layer.
15. 1 kinds of dynamic stress measurement systems, it is characterised in that described dynamic stress measurement system includes:
According to the dynamic stress sensor according to any one of claim 1-9；
Image acquisition units, corresponding described dynamic stress sensor arranges, is used for gathering described dynamic stress
The dynamic image that the visible light signal of sensor output is formed；And
Signal processing unit, is connected with described image acquisition units, for according to described dynamic image, obtains
Take following one or more: writing track, stress distribution and the writing speed of writer.
16. measurement systems according to claim 15, it is characterised in that described signal processing list
Unit by described dynamic image according to room and time superposition, it is thus achieved that complete writing track, stress distribution and
/ or writing speed information.
17. according to the measurement system described in claim 15 or 16, it is characterised in that described dynamically should
Force transducer is packaged together with image acquisition units.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510069734.XA CN105987781B (en) | 2015-02-10 | 2015-02-10 | Dynamic stress sensor, preparation method and dynamic stress measurement system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510069734.XA CN105987781B (en) | 2015-02-10 | 2015-02-10 | Dynamic stress sensor, preparation method and dynamic stress measurement system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105987781A true CN105987781A (en) | 2016-10-05 |
| CN105987781B CN105987781B (en) | 2021-01-05 |
Family
ID=57041086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510069734.XA Active CN105987781B (en) | 2015-02-10 | 2015-02-10 | Dynamic stress sensor, preparation method and dynamic stress measurement system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105987781B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106590634A (en) * | 2016-11-30 | 2017-04-26 | 北京中科卓研科技有限公司 | Preparation of doped zinc sulfide with micro-nano composite structure and application thereof in augmented reality |
| CN107290084A (en) * | 2017-06-28 | 2017-10-24 | 京东方科技集团股份有限公司 | A kind of pressure sensor and preparation method thereof, electronic device |
| CN108240877A (en) * | 2016-12-23 | 2018-07-03 | 北京纳米能源与系统研究所 | The manufacturing method of pressure sensor, pressure-measuring system and pressure sensor |
| CN108680290A (en) * | 2018-06-22 | 2018-10-19 | 西安交通大学 | A kind of hyperpressure field measurement device |
| CN108693985A (en) * | 2018-07-10 | 2018-10-23 | 深圳大学 | A kind of novel electron signature sense of touch pen based on stress irradiance |
| CN109443630A (en) * | 2018-10-31 | 2019-03-08 | 福州大学 | A kind of pressure sensor based on QLED luminescent device |
| CN110032913A (en) * | 2018-01-11 | 2019-07-19 | 南昌欧菲生物识别技术有限公司 | Protective film, fingerprint recognition mould group and the terminal of fingerprint recognition mould group |
| CN110134292A (en) * | 2019-05-24 | 2019-08-16 | 京东方科技集团股份有限公司 | Hand input device and preparation method thereof, handwriting input device |
| CN110954671A (en) * | 2018-09-27 | 2020-04-03 | 中国矿业大学(北京) | Fully mechanized caving mining simulation experiment device and method based on stress luminescent material |
| CN114910199A (en) * | 2022-05-09 | 2022-08-16 | 北京纳米能源与系统研究所 | Touch sensor, preparation method and information acquisition method |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1727858A (en) * | 2002-08-26 | 2006-02-01 | 佳能株式会社 | Complex function device, producing method thereof , touch information system and information inputting device |
| CN1853094A (en) * | 2003-09-16 | 2006-10-25 | 株式会社东京大学Tlo | Force vector reconstruction method using optical tactile sensor |
| CN101142598A (en) * | 2005-01-19 | 2008-03-12 | 新加坡科技研究局 | Identification tag, object adapted to be identified, and related methods, devices and systems |
| CN101715589A (en) * | 2007-04-24 | 2010-05-26 | 锡克拜控股有限公司 | Method of marking a document or item |
| CN102364413A (en) * | 2010-03-17 | 2012-02-29 | 罗技欧洲公司 | System and method for capturing hand annotations |
| CN102936498A (en) * | 2012-11-11 | 2013-02-20 | 青岛大学 | Zirconium phosphate-based elastic stress luminescent material and preparation method thereof |
| CN103020085A (en) * | 2011-09-26 | 2013-04-03 | 兰州海防信息科技有限公司 | Implementation method and application of dynamic personalized calligraphy character library |
| CN103048070A (en) * | 2013-01-17 | 2013-04-17 | 广东电网公司电力调度控制中心 | Stress monitoring method of distributed optical fiber system |
| CN103468258A (en) * | 2013-09-05 | 2013-12-25 | 青岛大学 | Red high-brightness elastic stress luminescent material and preparation method thereof |
| CN103682078A (en) * | 2012-09-21 | 2014-03-26 | 国家纳米科学中心 | Pressure sensor array and manufacturing method thereof |
| CN103954388A (en) * | 2014-05-19 | 2014-07-30 | 哈尔滨工大云帆智慧信息技术有限公司 | Low-power-consumption portable optical stress monitoring device |
| US20140216174A1 (en) * | 2011-09-16 | 2014-08-07 | Sony Mobile Communications Ab | Force sensitive touch sensor |
| WO2014209518A1 (en) * | 2013-06-28 | 2014-12-31 | Synaptics Incorporated | Device and method for proximity sensing with force imaging |
-
2015
- 2015-02-10 CN CN201510069734.XA patent/CN105987781B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1727858A (en) * | 2002-08-26 | 2006-02-01 | 佳能株式会社 | Complex function device, producing method thereof , touch information system and information inputting device |
| CN1853094A (en) * | 2003-09-16 | 2006-10-25 | 株式会社东京大学Tlo | Force vector reconstruction method using optical tactile sensor |
| RU2006108383A (en) * | 2003-09-16 | 2007-09-27 | Тоудаи Тло, Лтд. (Jp) | METHOD FOR RESTORING A POWER VECTOR USING AN OPTICAL TACTICAL SENSOR |
| CN101142598A (en) * | 2005-01-19 | 2008-03-12 | 新加坡科技研究局 | Identification tag, object adapted to be identified, and related methods, devices and systems |
| CN101715589A (en) * | 2007-04-24 | 2010-05-26 | 锡克拜控股有限公司 | Method of marking a document or item |
| CN102364413A (en) * | 2010-03-17 | 2012-02-29 | 罗技欧洲公司 | System and method for capturing hand annotations |
| US20140216174A1 (en) * | 2011-09-16 | 2014-08-07 | Sony Mobile Communications Ab | Force sensitive touch sensor |
| CN103020085A (en) * | 2011-09-26 | 2013-04-03 | 兰州海防信息科技有限公司 | Implementation method and application of dynamic personalized calligraphy character library |
| CN103682078A (en) * | 2012-09-21 | 2014-03-26 | 国家纳米科学中心 | Pressure sensor array and manufacturing method thereof |
| CN102936498A (en) * | 2012-11-11 | 2013-02-20 | 青岛大学 | Zirconium phosphate-based elastic stress luminescent material and preparation method thereof |
| CN103048070A (en) * | 2013-01-17 | 2013-04-17 | 广东电网公司电力调度控制中心 | Stress monitoring method of distributed optical fiber system |
| WO2014209518A1 (en) * | 2013-06-28 | 2014-12-31 | Synaptics Incorporated | Device and method for proximity sensing with force imaging |
| CN103468258A (en) * | 2013-09-05 | 2013-12-25 | 青岛大学 | Red high-brightness elastic stress luminescent material and preparation method thereof |
| CN103954388A (en) * | 2014-05-19 | 2014-07-30 | 哈尔滨工大云帆智慧信息技术有限公司 | Low-power-consumption portable optical stress monitoring device |
Non-Patent Citations (1)
| Title |
|---|
| 王潜: "《对压力的发光传感及机制研究》", 《光化学实验室》 * |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106590634A (en) * | 2016-11-30 | 2017-04-26 | 北京中科卓研科技有限公司 | Preparation of doped zinc sulfide with micro-nano composite structure and application thereof in augmented reality |
| CN108240877B (en) * | 2016-12-23 | 2021-04-16 | 北京纳米能源与系统研究所 | Pressure sensor, pressure measurement system, and method for manufacturing pressure sensor |
| CN108240877A (en) * | 2016-12-23 | 2018-07-03 | 北京纳米能源与系统研究所 | The manufacturing method of pressure sensor, pressure-measuring system and pressure sensor |
| CN107290084B (en) * | 2017-06-28 | 2019-08-30 | 京东方科技集团股份有限公司 | A kind of pressure sensor and preparation method thereof, electronic device |
| US10921200B2 (en) | 2017-06-28 | 2021-02-16 | Boe Technology Group Co., Ltd. | Pressure sensor, manufacturing method thereof, and electronic device |
| CN107290084A (en) * | 2017-06-28 | 2017-10-24 | 京东方科技集团股份有限公司 | A kind of pressure sensor and preparation method thereof, electronic device |
| CN110032913A (en) * | 2018-01-11 | 2019-07-19 | 南昌欧菲生物识别技术有限公司 | Protective film, fingerprint recognition mould group and the terminal of fingerprint recognition mould group |
| CN108680290A (en) * | 2018-06-22 | 2018-10-19 | 西安交通大学 | A kind of hyperpressure field measurement device |
| CN108680290B (en) * | 2018-06-22 | 2020-06-16 | 西安交通大学 | Ultrahigh pressure field measuring device |
| CN108693985A (en) * | 2018-07-10 | 2018-10-23 | 深圳大学 | A kind of novel electron signature sense of touch pen based on stress irradiance |
| CN110954671B (en) * | 2018-09-27 | 2024-01-26 | 中国矿业大学(北京) | Fully-mechanized caving mining simulation experiment device and method based on stress luminescent material |
| CN110954671A (en) * | 2018-09-27 | 2020-04-03 | 中国矿业大学(北京) | Fully mechanized caving mining simulation experiment device and method based on stress luminescent material |
| CN109443630A (en) * | 2018-10-31 | 2019-03-08 | 福州大学 | A kind of pressure sensor based on QLED luminescent device |
| CN110134292A (en) * | 2019-05-24 | 2019-08-16 | 京东方科技集团股份有限公司 | Hand input device and preparation method thereof, handwriting input device |
| CN110134292B (en) * | 2019-05-24 | 2022-12-16 | 京东方科技集团股份有限公司 | Handwriting input device, preparation method thereof and handwriting input equipment |
| CN114910199B (en) * | 2022-05-09 | 2023-08-18 | 北京纳米能源与系统研究所 | Touch sensor, preparation method and information acquisition method |
| CN114910199A (en) * | 2022-05-09 | 2022-08-16 | 北京纳米能源与系统研究所 | Touch sensor, preparation method and information acquisition method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105987781B (en) | 2021-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105987781A (en) | Dynamic stress sensor and manufacturing method thereof, and dynamic stress measurement system | |
| TWI443612B (en) | Piezochromic security element | |
| Su et al. | Self-powered, ultrasensitive, and high-resolution visualized flexible pressure sensor based on color-tunable triboelectrification-induced electroluminescence | |
| JP6200171B2 (en) | Radiation detection apparatus and imaging system | |
| JP3342015B2 (en) | UV-emitting retroreflective sheet | |
| Zhang et al. | Recent development of elastico-mechanoluminescent phosphors | |
| CN102640563B (en) | Comprise the device of organic light emitting display | |
| CN105949379A (en) | Nanoparticle, surface optical material and preparation method of surface optical material | |
| CN105452895A (en) | Detector for optically detecting at least one object | |
| CN105652505B (en) | Light control device and its manufacturing method | |
| Li et al. | Biologically inspired stretchable, multifunctional, and 3D electronic skin by strain visualization and triboelectric pressure sensing | |
| CN110262114A (en) | A kind of color membrane substrates, display panel and display device | |
| CN1338057A (en) | Durabe, open-faced retroreflective prismatic construction | |
| CN109564304A (en) | Reflection display device light-diffusing film laminated body and the reflection display device for using the laminated body | |
| CN1114837C (en) | Retroreflective graphic article bearing fluorescent legends and method of making same | |
| CN104246543A (en) | Viewing angle limiting sheet and flat panel display | |
| Ji et al. | Skin-driven ultrasensitive mechanoluminescence sensor inspired by spider leg joint slits | |
| CN104553426B (en) | Combined film, advertising picture madeby utilizing combined film and advertising picture making method | |
| JPS5847681B2 (en) | Bisaisudarejiyoushiyakoban | |
| CN111978949B (en) | Elastic force-induced luminous composite material, preparation method and application thereof | |
| JP2007136982A (en) | Anticounterfeit information recording medium and transfer foil | |
| CN108469300A (en) | Environment photographic hole encapsulating structure and its manufacturing method | |
| CN109143431A (en) | A kind of high-strength reflecting film and its preparation process | |
| Riaz et al. | Complex structure of a proto-brown dwarf | |
| CN109946774A (en) | A kind of light diffusion layer and light diffusing sheet of slim high light transmission |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No.8, yangyandong 1st Road, Yanqi Economic Development Zone, Huairou District, Beijing Applicant after: Beijing Institute of Nanoenergy and Nanosystems Address before: 100083, C building, Tiangong building, No. 30, Haidian District, Beijing, Xueyuan Road Applicant before: Beijing Institute of Nanoenergy and Nanosystems |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |