CN105987781B - Dynamic stress sensor, preparation method and dynamic stress measurement system - Google Patents
Dynamic stress sensor, preparation method and dynamic stress measurement system Download PDFInfo
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Abstract
The invention relates to the technical field of stress luminescent materials, and discloses a dynamic stress sensor, a preparation method and a dynamic stress measurement system, wherein the dynamic stress sensor comprises: a protective layer (1) for elastically deforming in correspondence with a signature when a writer writes the signature on the protective layer (1); the luminous layer (2) is arranged on the lower surface of the protective layer (1) and used for generating visible light signals at a stress position, corresponding to the protective layer (1), in the luminous layer (2) after the protective layer is elastically deformed; and the light-emitting layer (2) is arranged on the upper surface of the transparent substrate (3), and the visible light signal is output through the transparent substrate (3). The dynamic stress sensor can output the dynamic image formed by the corresponding visible light signal when a writer writes a signature by hand so as to display the dynamic process of the handwritten signature, and the dynamic stress sensor is timely, accurate and high in reliability.
Description
Technical Field
The invention relates to the technical field of stress luminescent materials, in particular to a dynamic stress sensor, a preparation method and a dynamic stress measurement system.
Background
The electronic signature can easily and conveniently provide identity authentication and system record through a network, breaks through the limitation on time and space, and is widely applied to the fields of communication, electronic commerce, electronic government affairs, information safety and the like. At present, reliable electronic signatures protected by law in daily life have been used in large quantities, such as handwritten signatures, private codes, personal passwords, and fingerprints, sounds, retinal structures, etc. having personal identification features. Among them, the handwritten signature is popular among users due to its convenience in use, and has irreplaceable effects in unique fields such as digitalization, informatization and networking.
However, as the personal information security threat faced by people becomes more severe, a great challenge is posed to the existing processing technology of only recording the final graphic patterns generated by handwriting of users, and various insecurity factors exist in handwritten signatures.
Disclosure of Invention
The invention aims to provide a dynamic stress sensor which can display the dynamic process of a writer during handwriting signature.
In order to achieve the above object, the present invention provides a dynamic stress sensor comprising: a protective layer for generating elastic deformation corresponding to a signature when a writer writes the signature on the protective layer; the luminous layer is arranged on the lower surface of the protective layer and used for generating visible light signals at the stress position corresponding to the protective layer in the luminous layer after the protective layer is elastically deformed; and the light emitting layer is arranged on the upper surface of the transparent substrate and outputs the visible light signal through the transparent substrate.
Preferably, the light emitting layer is formed by bonding a stress light emitting material powder on the transparent substrate by a first binder.
Preferably, the first adhesive is an ethylene vinyl acetate copolymer (EVA) glue or a photoresist.
Preferably, the light emitting layer formed on the transparent substrate has a lattice.
Preferably, the particle diameter of the stress luminescent material powder is <5 μm.
Preferably, the stress luminescent material is Zn1-xS：MnxX is more than or equal to 0.001 and less than or equal to 0.04; or the stress luminescent material is ZnS doped with Cu or an aluminate system doped with rare earth metal.
Preferably, the dynamic stress sensor further comprises: and the photoresist layer is arranged on the lower surface of the protective layer.
Preferably, the light-blocking layer comprises a metal film having a reflective effect or a black paint.
Preferably, the protective layer is made of a flexible material.
The dynamic stress sensor can output the dynamic image formed by the corresponding visible light signal when a writer writes a signature on the protective layer by hand so as to display the dynamic process of the handwritten signature, and the dynamic stress sensor is timely, accurate and high in reliability.
Another object of the present invention is to provide a method for manufacturing a dynamic stress sensor, which can simplify the manufacturing steps and is convenient to operate.
In order to achieve the above object, the present invention provides a method for manufacturing a dynamic stress sensor, the method comprising: providing a transparent substrate; bonding stress luminescent material powder on the upper surface of the transparent substrate through a first adhesive to form a luminescent layer; and a protective layer is adhered on the light-emitting layer through a second adhesive.
Preferably, the first adhesive is an EVA glue or a photoresist.
Preferably, the method of bonding the stress light emitting material powder on the transparent substrate by the first binder to form the light emitting layer includes: uniformly dispersing stress luminescent material powder in an ethanol solution; coating a layer of EVA (ethylene vinyl acetate) glue on the upper surface of the transparent substrate, and coating an ethanol solution on the upper surface of the transparent substrate with the EVA glue; and under the set temperature, uniformly precipitating the stress luminescent material powder particles and evaporating the ethanol solution to form a luminescent layer on the transparent substrate.
Preferably, the method of bonding the stress light emitting material powder on the transparent substrate by the first binder to form the light emitting layer includes: under the irradiation of corresponding visible light, uniformly mixing the stress luminescent material powder and the photoresist according to a set weight proportion; and coating the mixture on the upper surface of the transparent substrate, and forming a light-emitting layer with lattice points through exposure after baking.
Preferably, before the step of adhering the protective layer on the light-emitting layer by the second adhesive, the method further comprises: and arranging a photoresist layer on the lower surface of the protective layer.
The preparation method of the dynamic stress sensor can form the luminescent layer by bonding the stress luminescent material powder between the transparent substrate and the protective layer, has simple preparation method and convenient operation, and the prepared dynamic stress sensor has simple structure and high detection precision.
It is yet another object of the present invention to provide a dynamic stress measurement system that displays the dynamic progress of a writer in handwriting a signature.
In order to achieve the above object, the present invention provides a dynamic stress measuring system including: the above dynamic stress sensor; the image acquisition unit is arranged corresponding to the dynamic stress sensor and is used for acquiring a dynamic image formed by a visible light signal output by the dynamic stress sensor; and the signal processing unit is connected with the image acquisition unit and is used for acquiring one or more of the following according to the dynamic image: the writer's handwriting trajectory, stress distribution, and writing speed.
Preferably, the signal processing unit superimposes the dynamic images according to space and time to obtain complete writing track, stress distribution and/or writing speed information.
Preferably, the dynamic stress sensor is packaged with the image acquisition unit.
The dynamic stress measuring system has the same advantages as the dynamic stress sensor compared with the prior art, and the detailed description is omitted here.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of the dynamic stress sensor of the present invention;
FIG. 2 is a flow chart of a method of making a dynamic stress sensor of the present invention;
FIG. 3 is a schematic diagram of the dynamic stress measurement system of the present invention;
FIG. 4 is an example of an image recorded by the dynamic stress measurement system of the present invention;
FIG. 5 is a light intensity distribution plot of the image shown in FIG. 4;
FIG. 6 is a graph showing the variation of light intensity in the AB stripe region of FIG. 5;
fig. 7 is an image obtained at different times.
Description of the reference numerals
1 protective layer 2 light-emitting layer
3 transparent substrate 4 photoresist layer.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, directional terms such as "upper", "lower", "front", "rear", "left", "right", and the like, which are not described to the contrary, are merely directions referring to the drawings. Accordingly, the directional terminology used is intended to be in the nature of words of description rather than of limitation.
As shown in fig. 1, the dynamic stress sensor of the present invention includes a protective layer 1 for generating an elastic deformation corresponding to a signature when a writer writes the signature on the protective layer 1; the luminous layer 2 is arranged on the lower surface of the protective layer 1 and used for generating visible light signals at a stress position, corresponding to the protective layer 1, in the luminous layer 2 after the protective layer 1 is elastically deformed; and the light-emitting layer 2 is arranged on the upper surface of the transparent substrate 3, and outputs the visible light signal through the transparent substrate 3.
The light-emitting layer 2 is formed by bonding stress light-emitting material powder on the transparent substrate 3 through a first adhesive. The first adhesive may be an ethylene vinyl acetate copolymer EVA glue or a photoresist.
Wherein, when the light-emitting layer is formed by EVA glue: the stress luminescent material powder can be uniformly dispersed in the ethanol solution; coating a layer of EVA (ethylene vinyl acetate) glue on the upper surface of the transparent substrate, and coating an ethanol solution on the upper surface of the transparent substrate with the EVA glue; and under the set temperature, uniformly precipitating the stress luminescent material powder particles and evaporating the ethanol solution to form a luminescent layer on the transparent substrate. Alternatively, the light emitting layer is formed by a photoresist: under the irradiation of corresponding visible light, uniformly mixing the stress luminescent material powder and the photoresist according to a set weight proportion; and coating the mixture on the transparent substrate, and forming a luminous layer with lattice points by exposure after baking. The luminescent layer with the lattice points can accurately represent the position information of the stress, and the resolution ratio is improved.
For the selection of the stress luminescent material, the stress luminescent materials with different luminescent colors, relaxation times, etc. can be selected according to actual requirements, and in this embodiment, the stress luminescent material is Zn capable of emitting orange visible light1-xS：MnxX is 0.001-0.04, but not limited thereto, and a stressor such as ZnS doped with Cu or an aluminate system doped with a rare earth metal can be selected. Wherein the stress luminescent material powder has a particle diameter<5μm。
The material of protective layer 1 is flexible material, and the person of being convenient for write when writing the signature on the protective layer 1, the corresponding elastic deformation of this signature can take place for protective layer 1 to act on the luminescent layer 2, make luminescent layer 2 correspond the stress position department of protective layer 1 produces visible light signal, and is timely accurate, and the credibility is high. In this embodiment, the protective layer 1 is a polyethylene terephthalate (PET) film, but not limited thereto, and may also be other polymer materials, such as: polymethyl methacrylate, polydimethylsiloxane, epoxy resin, and the like.
In order to enable the dynamic stress sensor of the invention to be normally used in a bright environment and have a high signal-to-noise ratio, the dynamic stress sensor of the invention further comprises a photoresist layer 4, and the photoresist layer 4 is arranged on the lower surface of the protective layer 1. Wherein the photoresist layer 4 comprises a metal film or a black paint having a reflective effect. A layer of metal film can be sputtered on the lower surface of the protective layer 1 by a film coating method such as magnetron sputtering; or coated with a layer of black paint or other material having a light effect. In the present embodiment, the metal film is a silver (Ag) film, but not limited thereto.
The dynamic stress sensor can output corresponding visible light signals to form dynamic images when a writer writes a signature on the protective layer by hand, so as to display the dynamic process of the handwritten signature, and the dynamic stress sensor is timely and accurate, thereby improving the credibility of the electronic signature.
As shown in fig. 2, the preparation method of the dynamic stress sensor of the present invention comprises: step 200: providing a transparent substrate; step 201: bonding stress luminescent material powder on the upper surface of the transparent substrate through a first adhesive to form a luminescent layer; step 202: and a protective layer is adhered on the light-emitting layer through a second adhesive.
The transparent substrate can be a polymer material such as PET, polymethyl methacrylate, polydimethylsiloxane, epoxy resin and the like.
The first adhesive is EVA (ethylene vinyl acetate) glue or photoresist.
The method of bonding the stress luminescent material powder on the transparent substrate by the first binder to form the luminescent layer includes: uniformly dispersing stress luminescent material powder in an ethanol solution; coating EVA glue on the transparent substrate, and coating an ethanol solution on one side surface of the transparent substrate with the EVA glue; and under the set temperature, the stress luminescent material powder particles are precipitated and the ethanol solution is evaporated, and a luminescent layer is formed on the transparent substrate.
Further, the forming of the light emitting layer by bonding the stress light emitting material powder on the transparent substrate by the first binder may further include: under the irradiation of corresponding visible light, uniformly mixing the stress luminescent material powder and the photoresist according to a set weight proportion; and coating the mixture on the transparent substrate, and forming a luminous layer with lattice points by exposure after baking. The luminescent layer obtained by the method has the lattice point, can accurately represent the position information of the stress, and improves the resolution ratio.
The preparation method of the invention also comprises the following steps before the step 203: and arranging a photoresist layer on the lower surface of the protective layer. Wherein the light resistance layer comprises a metal film or black paint with a reflection effect; the method for disposing a photoresist layer on the lower surface of the protection layer comprises: sputtering a layer of metal film on the lower surface of the protective layer by a film coating method; or coating a layer of black paint on the lower surface of the protective layer.
Wherein, the material of protective layer is flexible material, and the person of being convenient for write is in during the handwritten signature on the protective layer, the protective layer can take place and the corresponding elastic deformation of rename, and act on the luminescent layer, make the luminescent layer corresponds the stress position department of protective layer produces visible light signal, and is timely accurate, improves response speed and credibility. In this embodiment, the protective layer is a polyethylene terephthalate (PET) film, but not limited thereto, and may also be other polymer materials, such as: polymethyl methacrylate, polydimethylsiloxane, epoxy resin, and the like.
For the selection of the stress luminescent material, corresponding stress luminescent materials with different luminescent colors, relaxation times, etc. may be selected according to actual requirements, and in this embodiment, the stress luminescent material is ZnS capable of emitting orange visible light: mn, but not limited thereto, a stress luminescent material such as ZnS doped with Cu, an aluminate system doped with a rare earth metal, or the like can be selected. Wherein the particle diameter of the stress luminescent material powder is <5 μm.
According to the preparation method of the dynamic pressure sensor, the stress luminescent material powder is bonded between the transparent substrate and the protective layer to form the luminescent layer, the preparation method is simple, the operation is convenient, and the prepared dynamic stress sensor is simple in structure and high in detection precision.
The following stress luminescent materials were ZnS: mn is described in detail as an example.
The stress luminescent material used in the invention is ZnS: mn, which can be prepared by high-temperature vacuum curing reaction. The preparation method comprises the following steps: (1) weighing high-purity manganese carbonate and zinc sulfide according to stoichiometric ratio, wherein the general formula is Zn1-xS：MnxWherein the value range of x is more than or equal to 0.001 and less than or equal to 0.04. (2) Fully grinding the weighed raw materials by taking ethanol as a dispersion medium. (3) And after drying, placing the dried powder into a high-purity corundum crucible, and placing the crucible into a tubular quartz tube for roasting under the vacuum condition to obtain the stress luminescent material powder. Wherein the roasting temperature is 1000-1150 ℃, the roasting time is 1-4 hours, and further grinding and screening are carried out after sintering to obtain an orange stress luminescent material ZnS with uniform particles: mn powder, the diameter of the stress luminescent material powder particle<5μm。
The following is based on the stress luminescent material ZnS: the Mn powder is further used for preparing a dynamic stress sensor.
The first embodiment is as follows:
and (3) mixing the synthesized stress luminescent material ZnS: the Mn powder is dispersed in an ethanol solution, and sufficiently dispersed and separated by ultrasonic waves, a stirring bar, or the like, so that ZnS: mn powder is uniformly distributed in the ethanol solution; and then quickly transferred to a PET film coated with EVA glue and adhered with a rectangular frame mold at the edge. At a set temperature, ZnS: and uniformly precipitating Mn powder particles and volatilizing an ethanol solution to form a luminous layer, removing the frame-shaped die, covering the upper surface of the luminous layer with another PET film coated with EVA glue, and then packaging and fixing the PET films on the upper side and the lower side through a hot press.
In addition, in order to make the dynamic stress sensor have a better signal-to-noise ratio and make the dynamic stress sensor work well in a bright environment, a light resistance layer can be added, namely, before covering the upper surface of the luminous layer, an Ag film (other metals with a reflection effect can also be used) or a black paint (other materials with a light absorption effect can also be used) is firstly sputtered on the upper PET film (protective layer) by a film coating method such as magnetron sputtering, and the like, after the treatment, EVA glue is coated on the lower surface of the PTE film to cover the luminous layer, and the device with a high signal-to-noise ratio can be obtained by packaging.
Example two
The preparation method of the nano dynamic stress sensor comprises the following steps: (1) under the irradiation of orange color visible light, ZnS with micro-nano size: mn powder and positive photoresist (negative photoresist can be selected according to the requirement of a process pattern, and the photoresist used in the embodiment is AZ P4620) are uniformly mixed according to the weight ratio of 1:3, and other weight ratios can be selected according to the height and the size of an actual array. (2) And then uniformly spin-coating the mixture on a clean and transparent PET film, carrying out thermal drying, exposing by using UV, and carrying out development and drying to obtain the required device pattern.
Rectangular arrays having a side length of 50 microns, a height of about 15 microns, and a pitch of 50 microns were prepared in this example. In order to protect the photoetching pattern and prevent the array structure from being damaged in use, a layer of polymethyl methacrylate (PMMA) can be rotationally coated on the surface of the device, and even a layer of PET coated with EVA glue can be further coated and then hot-pressed and packaged.
The nano dynamic stress sensor prepared by the method has high resolution; the stress positioning device has absolute coordinates, and can clearly determine the position information of the stress; the size is small, and the application range is wide.
As shown in FIG. 3, the dynamic stress measurement system of the present invention includes a dynamic stress sensor; the image acquisition unit is arranged corresponding to the dynamic stress sensor and is used for acquiring a dynamic image formed by a visible light signal output by the dynamic stress sensor; and the signal processing unit is connected with the image acquisition unit and is used for acquiring one or more of the following according to the dynamic image: the writer's handwriting trajectory, stress distribution, and writing speed.
And the signal processing unit superposes the dynamic images according to space and time to obtain complete handwriting tracks, stress distribution and/or writing speed information. The image collecting unit may be a Charge Coupled Device (CCD) image sensor, and a collecting region of the CCD corresponds to the transparent substrate of the dynamic stress sensor. In addition, the image acquisition unit can be improved according to actual requirements, for example, a dynamic stress sensor is directly packaged with a CCD (charge coupled device), and the like. For example, a dynamic stress sensor may be packaged in a dark box together with an image acquisition unit to isolate interference from external light.
The signal processing unit is a key part for effectively presenting image parameters, and corresponding functions can be realized by self-compiling software generally. In the invention, a Matlab program language is utilized to obtain CCD video image frame data according to the dynamic image, perform different matrix calculations, and simultaneously obtain image information such as handwriting tracks, stress distribution, writing speed and the like of a writer and related statistical data, thereby ensuring the safety of the handwritten signature.
Fig. 4 shows an example of a handwritten signature pattern of a writer, fig. 5 is a light intensity distribution diagram of the handwritten signature in fig. 4, fig. 6 shows light intensity variations in the AB bar regions in fig. 5, and fig. 7 shows pattern information at different times. The dynamic stress measurement system can record the image information at different moments, and superpose all the image information according to space and time to obtain the complete personal characteristic information such as stress distribution, writing speed and the like, thereby improving the safety of the handwritten signature.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (16)
1. A dynamic stress measurement system, comprising:
a dynamic stress sensor;
the image acquisition unit is arranged corresponding to the dynamic stress sensor and is used for acquiring a dynamic image formed by a visible light signal output by the dynamic stress sensor; and
the signal processing unit is connected with the image acquisition unit and used for acquiring one or more of the following according to the dynamic image: the handwriting trajectory, stress distribution and writing speed of the writer,
wherein the dynamic stress sensor comprises:
a protective layer (1) for elastically deforming in correspondence with a signature when a writer writes the signature on the protective layer (1);
the luminous layer (2) is arranged on the lower surface of the protective layer (1) and used for generating visible light signals at a stress position, corresponding to the protective layer (1), in the luminous layer (2) after the protective layer (1) is elastically deformed; and
the light emitting layer (2) is arranged on the upper surface of the transparent substrate (3), and the visible light signal is output through the transparent substrate (3).
2. The dynamic stress measurement system of claim 1, wherein the signal processing unit superimposes the dynamic images in space and time to obtain complete handwriting trajectory, stress distribution and/or writing speed information.
3. The dynamic stress measurement system of claim 1, wherein the dynamic stress sensor is packaged with an image acquisition unit.
4. A dynamic stress measuring system according to claim 1, wherein the luminescent layer (2) is formed by a stress luminescent material powder bonded on the transparent substrate (3) by a first adhesive.
5. The dynamic stress measurement system of claim 4, wherein the first adhesive is an Ethylene Vinyl Acetate (EVA) glue or a photoresist.
6. A dynamic stress measuring system according to claim 1, wherein the light emitting layer (2) formed on the transparent substrate (3) has a lattice point.
7. Dynamic stress measurement system according to claim 4, wherein the particle diameter of the stressor phosphor powder is <5 μm.
8. The dynamic stress measurement system of claim 4, wherein the stress luminescent material is Zn1-xS：MnxX is more than or equal to 0.001 and less than or equal to 0.04; or
The stress luminescent material is a ZnS doped with Cu or an aluminate system doped with rare earth metal.
9. The dynamic stress measurement system of claim 1, wherein the dynamic stress sensor further comprises:
and the photoresist layer (4) is arranged on the lower surface of the protective layer (1).
10. Dynamic stress measuring system according to claim 9, wherein the light-blocking layer (4) comprises a metal film with a reflective effect or a black paint.
11. Dynamic stress measurement system according to claim 1, wherein the protective layer (1) is of a flexible material.
12. A method of manufacturing a dynamic stress sensor according to any of claims 1 to 11, comprising:
providing a transparent substrate;
bonding stress luminescent material powder on the upper surface of the transparent substrate through a first adhesive to form a luminescent layer;
and a protective layer is adhered on the light-emitting layer through a second adhesive.
13. The method of manufacturing a dynamic stress sensor according to claim 12, wherein the first adhesive is EVA glue or photoresist.
14. The method for manufacturing a dynamic stress sensor according to claim 12, wherein the method for forming the light emitting layer by bonding the stress light emitting material powder on the upper surface of the transparent substrate by the first adhesive comprises:
uniformly dispersing stress luminescent material powder in an ethanol solution;
coating a layer of EVA (ethylene vinyl acetate) glue on the upper surface of the transparent substrate, and coating an ethanol solution on the upper surface of the transparent substrate with the EVA glue;
and under the set temperature, uniformly precipitating the stress luminescent material powder particles and evaporating the ethanol solution to form a luminescent layer on the transparent substrate.
15. The method for manufacturing a dynamic stress sensor according to claim 12, wherein the method for forming the light emitting layer by bonding the stress light emitting material powder on the upper surface of the transparent substrate by the first adhesive comprises:
under the irradiation of corresponding visible light, uniformly mixing the stress luminescent material powder and the photoresist according to a set weight proportion;
and coating the mixture on the upper surface of the transparent substrate, and forming a light-emitting layer with lattice points through exposure after baking.
16. The method of manufacturing a dynamic stress sensor according to any of claims 12 to 15, further comprising, before adhering a protective layer on the luminescent layer by a second adhesive:
and arranging a photoresist layer on the lower surface of the protective layer.
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106590634A (en) * | 2016-11-30 | 2017-04-26 | 北京中科卓研科技有限公司 | Preparation of doped zinc sulfide with micro-nano composite structure and application thereof in augmented reality |
| CN108240877B (en) * | 2016-12-23 | 2021-04-16 | 北京纳米能源与系统研究所 | Pressure sensor, pressure measurement system, and method for manufacturing pressure sensor |
| CN107290084B (en) * | 2017-06-28 | 2019-08-30 | 京东方科技集团股份有限公司 | A kind of pressure sensor and preparation method thereof, electronic device |
| CN110032913A (en) * | 2018-01-11 | 2019-07-19 | 南昌欧菲生物识别技术有限公司 | Protective film, fingerprint recognition mould group and the terminal of fingerprint recognition mould group |
| CN108680290B (en) * | 2018-06-22 | 2020-06-16 | 西安交通大学 | Ultrahigh pressure field measuring device |
| CN108693985A (en) * | 2018-07-10 | 2018-10-23 | 深圳大学 | A kind of novel electron signature sense of touch pen based on stress irradiance |
| CN110954671B (en) * | 2018-09-27 | 2024-01-26 | 中国矿业大学(北京) | Fully-mechanized caving mining simulation experiment device and method based on stress luminescent material |
| CN109443630B (en) * | 2018-10-31 | 2020-11-10 | 福州大学 | Pressure sensor based on QLED light-emitting device |
| CN110134292B (en) * | 2019-05-24 | 2022-12-16 | 京东方科技集团股份有限公司 | Handwriting input device, preparation method thereof and handwriting input equipment |
| CN114910199B (en) * | 2022-05-09 | 2023-08-18 | 北京纳米能源与系统研究所 | Touch sensor, preparation method and information acquisition method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1853094A (en) * | 2003-09-16 | 2006-10-25 | 株式会社东京大学Tlo | Force vector reconstruction method using optical tactile sensor |
| CN103020085A (en) * | 2011-09-26 | 2013-04-03 | 兰州海防信息科技有限公司 | Implementation method and application of dynamic personalized calligraphy character library |
| CN103954388A (en) * | 2014-05-19 | 2014-07-30 | 哈尔滨工大云帆智慧信息技术有限公司 | Low-power-consumption portable optical stress monitoring device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004085304A (en) * | 2002-08-26 | 2004-03-18 | Canon Inc | Multifunctional device and tactile information system |
| WO2006078220A1 (en) * | 2005-01-19 | 2006-07-27 | Agency For Science, Technology And Research | Identification tag, object adapted to be identified, and related methods, devices and systems |
| UA102067C2 (en) * | 2007-04-24 | 2013-06-10 | Сікпа Холдінг Са | Method of marking a document or item, method and device for identifying the marked document or item and method of use of circular polarizing particles |
| US9092129B2 (en) * | 2010-03-17 | 2015-07-28 | Logitech Europe S.A. | System and method for capturing hand annotations |
| US9417141B2 (en) * | 2011-09-16 | 2016-08-16 | Sony Corporation | Force sensitive touch sensor |
| CN103682078B (en) * | 2012-09-21 | 2016-11-23 | 北京纳米能源与系统研究所 | Array of pressure sensors and preparation method thereof |
| CN102936498B (en) * | 2012-11-11 | 2013-12-04 | 青岛大学 | Zirconium phosphate-based elastic stress luminescent material and preparation method thereof |
| CN103048070B (en) * | 2013-01-17 | 2015-05-13 | 广东电网公司电力调度控制中心 | Stress monitoring method of distributed optical fiber system |
| US9201468B2 (en) * | 2013-06-28 | 2015-12-01 | Synaptics Incorporated | Device and method for proximity sensing with force imaging |
| CN103468258B (en) * | 2013-09-05 | 2014-12-24 | 青岛大学 | Red high-brightness elastic stress luminescent material and preparation method thereof |
-
2015
- 2015-02-10 CN CN201510069734.XA patent/CN105987781B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1853094A (en) * | 2003-09-16 | 2006-10-25 | 株式会社东京大学Tlo | Force vector reconstruction method using optical tactile sensor |
| RU2006108383A (en) * | 2003-09-16 | 2007-09-27 | Тоудаи Тло, Лтд. (Jp) | METHOD FOR RESTORING A POWER VECTOR USING AN OPTICAL TACTICAL SENSOR |
| CN103020085A (en) * | 2011-09-26 | 2013-04-03 | 兰州海防信息科技有限公司 | Implementation method and application of dynamic personalized calligraphy character library |
| CN103954388A (en) * | 2014-05-19 | 2014-07-30 | 哈尔滨工大云帆智慧信息技术有限公司 | Low-power-consumption portable optical stress monitoring device |
Non-Patent Citations (1)
| Title |
|---|
| 《对压力的发光传感及机制研究》;王潜;《光化学实验室》;20070609;全文 * |
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