CN105984142A - Double-row-pore-filling 3D printing head - Google Patents

Double-row-pore-filling 3D printing head Download PDF

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CN105984142A
CN105984142A CN201510042566.5A CN201510042566A CN105984142A CN 105984142 A CN105984142 A CN 105984142A CN 201510042566 A CN201510042566 A CN 201510042566A CN 105984142 A CN105984142 A CN 105984142A
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steam
cavity
row
double
cold air
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CN105984142B (en
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周加华
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Changzhou Dong Ke Electronic Science And Technology Co Ltd
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Changzhou Dong Ke Electronic Science And Technology Co Ltd
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Abstract

The invention discloses a double-row-pore-filling 3D printing head which belongs to a 3D printing head specially used for printing a filling material and includes: a hot-melt chamber, an extrusion pump, a rotary motor, a double-row-pore spray nozzle, and a hot-air-polishing and cold-air-shaping device. Through the double-row-pore spray nozzle, large quantity of tightly-arranged molten wires are extruded in one time to rapidly print and fill a hollow chamber, and then through the hot-air-polishing and cold-air-shaping device, the extruded material is polished and extruded and meanwhile hot air is pumped back. Cold air generated through semiconductor refrigeration is employed for cooling and shaping the staked material, so that the 3D printing head can greatly save printing time when being used for filling the hollow chamber in a target object. Through the hot air polishing and cold air cooling, the material after additive printing has a flat and smooth appearance and is free of deformation.

Description

A kind of double-row hole fills 3D printhead
Technical field
The present invention relates to a kind of 3D and print the field of manufacturing technology, more particularly, it relates to a kind of FDM type 3D printer prints the device of packing material.
Background technology
When the 3D printer of the most common FDM type carries out increasing material printing, for the printhead only one of which shower nozzle filled, and extrudate is not carried out reprocessing process, result in following shortcoming.
During common 3D printer work, the printhead of the filling of single spraying head, when filling the cavity of target item, once can only extrude a fuse, when employing is filled only with segment space, it is impossible to ensure the intensity of target item, when employing is stuffed entirely with space, speed is the slowest, significantly wastes the time-write interval.
During common 3D printer work, the deposit of extrusion mostly is bead moulding or circle drips, when piling up from level to level, must round superposition and piece together round, and all round stack ups, there is gap centre, when especially when the shake of 3D printer X-axis Y-axis Z axis, precision is the highest, front and back the extrudate of different time even can not be closely linked, and in half disengaged position, the article causing product to print are the most solid.
When common 3D printer works, because the material of extrusion, heat can not disperse in for a long time, the superposition material of multilamellar still has higher temperature, printing objects is made still to have trickle fluid behaviour, and self gravity and move back and forth generation the double influence rocked under, it is easy to cause the torsional deformation of printing objects.
During common 3D printer work, because extruded material is hot melt fluid state, printhead is in line feed, or when changing layer, at high temperature, inherently produces wire drawing phenomenon, and the product burr making printing is too many and has a strong impact on quality.
When common 3D printer works, even with the fan product blowing to printing, because printhead ambient heat is higher, the colder gas that can not blow out, and make refrigeration the best, simultaneously as during fan blowing, the direction of wind is a direction, it is easily caused after freshly extruded thermal conductive material is dried by one direction and deforms, thus can deform and lose precision.
Summary of the invention
Invention to solve the technical problem that
The invention provides a kind of double-row hole and fill 3D printhead, jumbo tight winding displacement fuse is once extruded by double-row hole shower nozzle, and by the 3D printing equipment of steam polishing cold air refrigeration, utilize spiral steam to extruded material polishing extruding, pumpback steam simultaneously, and utilize the material cooling and shaping that heap puzzles by the cold air of semiconductor refrigerating.
Technical scheme
For reaching above-mentioned purpose, the present invention provides techniques below scheme.
A kind of double-row hole fills 3D printhead, including: the polishing of hot melt cavity, extrusion pump, electric rotating machine, double-row hole shower nozzle, steam cold air shaping equipment.3D printer is printed by X-axis, Y-axis, Z axis three dimensional realization stereoscopic localized, X-axis arranges Z axis lifting platform, hot melt cavity and extrusion pump on Z axis lifting platform are integrated, and connect totally three cavitys, all parcel hot melt cavity, extrusion pump, double-row hole shower nozzles inside and outside double-row hole shower nozzle, steam polishing cold air shaping equipment.Fix elastic high temperature resistant shiny surface flexible pipe on 3D printer frame one, the hot melt cavity of printhead fixes the other end of an elasticity high temperature resistant shiny surface flexible pipe.
Described double-row hole shower nozzle, use when printing packing material for 3D is nozzle specially used, it is arranged above with two row's Parallel micro holes, the often row micro-hole position being always aligned to the edge close to shower nozzle in one line, often row's micro-hole diameter equal to or slightly less than micro-hole separated by a distance, each micro-hole center of upper row is the center position of the gap of row under alignment.
Described steam polishing cold air shaping equipment, also include: steam cavity, spiral steam annular jet, steam pumpback cavity, semiconductor refrigerating cavity, Semi-conductor.Wherein, three cavitys are by from the inside to middle, arrive outer layer again, be nested together into the steam cavity of whole entirety, respectively nexine mutually, middle steam pumpback cavity, outer layer semiconductor refrigerating cavity, spiral steam annular jet is arranged on the bottom of steam cavity, and the air blast end that heats of Semi-conductor connects steam cavity, refrigeration air blast end connects semiconductor refrigerating cavity, and steam pumpback cavity connects extractor fan by guide duct.
Described steam cavity, it is every empty steam cavity on one, hot melt containment portion cover, after Semi-conductor energising, steam is produced heating end, heat air blast end and this steam is blown to steam cavity, the steam that outside mixing hot melt cavity, heater members produces simultaneously, blows to spiral steam annular jet in the lump.
Described spiral steam annular jet, inside set helical blade set, spiral steam is produced under blast, annular tuyere is just to hot melt material nozzle, toroidal helical steam carries out polishing extruding to freshly extruded hot melt material, makes the hot melt material every time extruded and the material extruded before stir mutually, reduces gap, and make the material of extrusion more smooth, eliminate the concavo-convex strain line of a rule.
Described steam pumpback cavity, lower end annular is tight-lipped by spiral steam annular jet, and for second layer cavity, up and down logical sky, there is fan pumpback steam upper end, it is to avoid overstock too many steam around shower nozzle and printing article.
Described semiconductor refrigerating cavity, the tight-lipped lower end annular mouth by steam pumpback cavity of annular air of lower end, for third layer cavity, logical sky up and down, upper end connects the refrigeration air blast end of quasiconductor, after Semi-conductor energising, cold air is produced in refrigeration end, by refrigeration air blast end downward for this cold air blow pressure to lower end annular mouth, and blow to shower nozzle and printing objects, cooling and shaping be polished after material.
Described Semi-conductor, including refrigeration air blast end, heats air blast end.
Semiconductor chilling plate refrigeration end configure the cold grid of metal, drum cooling fan, conduction cooling airduct, every cold case, conduction cooling tinsel, collectively constitute refrigeration air blast end, particularly as follows: the cold grid of metal is made up of the multilayered metal film of high thermal conductivity, and it is close to the refrigeration end of semiconductor chilling plate, one wiry of conduction cooling is fixed on its surface, conduction cooling remainder wiry is all attached on conduction cooling airduct inwall, and conduction cooling airduct connects every cold case, rouses cooling fan and surrounds semiclosed thermal insulation cavity every cold case.
The end that heats at semiconductor chilling plate configures metal fever grid, drum Hot-air fan, heat conduction airduct, heat insulation case, heat-conducting metal silk, collectively constitutes and heats air blast end.Particularly as follows: metal fever grid is made up of the multilayered metal film of high thermal conductivity, and be close to semiconductor chilling plate heat end, one of heat-conducting metal silk is fixed on its surface, the remainder of heat-conducting metal silk is all attached on heat conduction airduct inwall, heat conduction airduct connects heat insulation case, and drum Hot-air fan and heat insulation case surround semiclosed thermal insulation cavity.
It it is below concrete technical scheme.
When 3D prints, primary granule material, additive, elastic high temperature resistant shiny surface flexible pipe sent into by pigment, this elastic high temperature resistant shiny surface flexible pipe top is fixed on support, lower end is fixed on hot melt cavity, utilize printhead movement back and forth, traction flexible pipe is shaken simultaneously, the automatic slide downward of particle granules is made to realize continuous supplementation, after being transported to the direct hot melt of hot melt cavity, by the extruding heat outputting melt material of extrusion pump, tight winding displacement fuse is extruded by double-row hole shower nozzle, 3D printer control system traction double-row hole double-row hole is filled 3D printhead and is moved accurately in X-axis Y direction, it it is two rows micro-hole side by side on double-row hole shower nozzle, after two row's fuse lines of extrusion sink, it is merged into the tight winding displacement fuse of monolayer.
Control system electric rotating machine at any time makes the direction of micro-hole word order and double-row hole double-row hole fill 3D printhead moving direction and forever keep vertical.
3D printer, when increasing material and manufacturing, starts Semi-conductor simultaneously, and after powered up, the refrigeration end and the one side that produce one side heat end to semiconductor chilling plate, produce the temperature of less than 0 ° in refrigeration end, create the relative high temperatures higher than room temperature heating end.
Heating the relative high temperatures of end, make rapidly metal fever grid be also at relative high temperatures, heat-conducting metal silk is because connecting metal fever grid simultaneously, makes the heat-conducting metal silk of heat conduction airduct inwall be similarly in relative high temperatures from the beginning to the end.The air of drum Hot-air fan extruding, tentatively heats into steam through metal fever grid.Steam after being heated by metal fever grid is not easy to be heated by the degree of depth, after steam is pressed in heat conduction airduct again, extends and increase the contact area of cold and hot conduction, is heated by the heat-conducting metal silk degree of depth the most again, it is provided that heat the steam needed for air blast end.
Heat air blast end and steam is expressed to steam cavity, the steam that the heater members of mixing hot melt cavity produces simultaneously, steam after the steam cavity of nexine collects sprays through helical annular air port, the annular mouth of concentric circles forms the taper wind direction of centripetal angle, converge into downward spiral steam, focus on the hot fuse polishing that alignment has just been extruded, the heat wave that columned paste fuse is rotated turns round and round and pulls into flat pie, the extruding of the most horizontal whirlwind drags hot creamy material and smears the gap around having tamped, thus compressed levels material, tamp space, adjacent material junction, the most floating process, the Loose approach not only circle being superimposed upon in circle has made the compact fashion that flat board is deposited on flat board into, and reduce floor height, thinning floor height is equal to making printing precision substantially increase.
Completing the steam of bruting process, collect in fuse nozzle adapter, the annular suction opeing button below intermediate layer covers on this region, by pumpback cavity, simultaneously at pumpback steam, makes just to increase being evacuated as far as possible of the steam above the material that material is piled up.
The temperature that refrigeration end is less than 0 °, makes rapidly the cold grid of metal be also at 0 ° of temperature below, and conduction cooling tinsel is because connecting the cold grid of metal simultaneously, makes the conduction cooling tinsel of conduction cooling airduct inwall be freezed in relatively low temperature the most equally.The air of drum cooling fan extruding, tentatively freezes into cold air through the cold grid of metal.Cold air after being freezed by the cold grid of metal is not easy by deep refrigerating, after cold air is pressed in conduction cooling airduct again, to extend and increase the contact area of cold and hot conduction, by conduction cooling tinsel deep refrigerating the most again, it is provided that the cold air needed for refrigeration air blast end.
Just increased material itself the also higher temperature that material is piled up, the temperature of the material of multilamellar also will keep the longer time even up and down, by refrigeration air blast end, downward for this cold air blow pressure to button is covered on semiconductor refrigerating cavity and the cold air spout of lower end annular of outer layer, and blow to shower nozzle and printing objects.Along with moving back and forth of printhead, the path that the path of ejection cold air is moved with printhead is consistent, causes and is just polished solid form and is freezed off rapidly sizing, so that whole target item does not produce thermal deformation.
Beneficial effect
The technical scheme using the present invention to provide, compared with existing known technology, has following remarkable result.
Once extrude jumbo tight winding displacement fuse, when filling the cavity of target item, be greatly saved the time-write interval.
Being polished by steam, cold air cools down, the material flat smooth after making printing increase material, indeformable.
Accompanying drawing explanation
Fig. 1 is the sectional view of a kind of double-row hole filling 3D printhead of the present invention.
Fig. 2 is the upward view of the double-row hole shower nozzle of the present invention.
Fig. 3 is the procedure chart that the extrusion fuse in the enforcement step of the present invention is filled.
Fig. 4 is steam polishing the cold air shaping equipment figure of invention.
Fig. 5 is the spiral steam annular jet oblique view of the present invention.
Fig. 6 is the Semi-conductor figure of the present invention.
Fig. 7 is that the steam of the present invention is polished and cuts oblique view open inside cold air shaping equipment.
null1-hot melt cavity,2-extrusion pump,3-double-row hole shower nozzle,4-extrudes motor,5-X axle Y-axis framework,6-heat-generating pipe,7-temperature sensor,9-edge,10-micro-hole,12-L distance,15-Z axle lifting platform,The elastic high temperature resistant shiny surface flexible pipe of 16-,17-Z spindle motor,19-fixed mount,20-electric rotating machine,21-steam cavity,22-steam pumpback cavity,23-semiconductor refrigerating cavity,24-spiral steam annular jet,25-annular suction opeing,26-cold air mouth,27-Semi-conductor,28-extractor fan,29-heats air blast end,30-freezes air blast end,Mother's 31-nozzle,33-helical blade set,The cold grid of 34-metal,35-drum cooling fan,36-conduction cooling airduct,37-metal fever grid,38-drum Hot-air fan,39-heat conduction airduct,40-semiconductor chilling plate,41-guide duct,42-is every cold case,The heat insulation case of 43-,44-conduction cooling tinsel,45-heat-conducting metal silk,46-cold wind mouth,47-hot-air mouth.
Detailed description of the invention
For further appreciating that present disclosure, in conjunction with accompanying drawing, the present invention is described in detail.
A kind of double-row hole fills 3D printhead, including: the polishing of hot melt cavity 1, extrusion pump 2, electric rotating machine 20, double-row hole shower nozzle 3, steam cold air shaping equipment (Fig. 4).
Setting up Z axis lifting platform 15 on 3D printer frame, the screw mandrel that Z axis lifting platform 15 is connected by Z axis motor 17 configures fixed mount 19, fixed mount 19 fixes electric rotating machine 20, and connects double-row hole filling 3D printhead.
Hot melt cavity 1 is connected above of elastic high temperature resistant shiny surface flexible pipe 16, and elastic high temperature resistant shiny surface flexible pipe 16 other end is fixed on the framework on 3D printer X-axis Y-axis framework 5 top, and hot melt cavity 1 limit arranges heat-generating pipe 6 and temperature sensor 7.
Extrusion pump 2 and hot melt cavity 1 are in being integrated, and top arranges extruding motor 4.At extrusion pump 2 and hot melt cavity 1 lower end, wide-aperture female nozzle 31 is set, double-row hole shower nozzle 3 is connected on female nozzle 31 as sub-nozzle cage, it is arranged above with two row's micro-holes 10, each micro-hole 10 is separated by certain L distance 12, micro-hole 10 upper-lower position interlaced arrangement on two rows, micro-hole 10 is aligned to the position at the edge 9 close to showerhead face always.
Steam polishing cold air shaping equipment (Fig. 4), also include: steam cavity 21, spiral steam annular jet 24, steam pumpback cavity 22, semiconductor refrigerating cavity 23, Semi-conductor 27.Wherein, three cavitys are by from the inside to middle, then to outer layer, are nested together into the steam cavity 21 of whole entirety, respectively nexine, middle steam pumpback cavity 22, the semiconductor refrigerating cavity 23 of outer layer mutually.The air blast end 29 that heats of Semi-conductor 27 connects steam cavity 21, refrigeration air blast end 30 connects semiconductor refrigerating cavity 23 straight-through cold air spout 26, extractor fan 28 connects steam pumpback cavity 22 straight-through annular suction opeing 25 by guide duct 41, helical blade set 33 is set in spiral steam annular jet 24, producing spiral steam under blast, spiral steam annular jet 24 faces the hot melt material of extrusion below nozzle.
Described Semi-conductor 27, also includes: refrigeration air blast end 30, heat air blast end 29.
Semiconductor chilling plate 40 refrigeration end configure the cold grid of metal 34, drum cooling fan 35, conduction cooling airduct 36, every cold case 42, conduction cooling tinsel 44, collectively constitute refrigeration air blast end, particularly as follows: the cold grid of metal 34 is made up of the multilayered metal film of high thermal conductivity, and it is close to the refrigeration end of semiconductor chilling plate 40, one of conduction cooling tinsel 44 is fixed on its surface, the remainder of conduction cooling tinsel 44 is all attached on conduction cooling airduct 36 inwall, conduction cooling airduct 36 connects every cold case 42, rouses cooling fan 35 and surrounds semiclosed thermal insulation cavity every cold case 42.
The end that heats at semiconductor chilling plate 40 configures metal fever grid 37, drum Hot-air fan 38, heat conduction airduct 39, heat insulation case 43, heat-conducting metal silk 45, collectively constitutes and heats air blast end.Particularly as follows: metal fever grid 37 is made up of the multilayered metal film of high thermal conductivity, and be close to semiconductor chilling plate 40 heat end, one of heat-conducting metal silk 45 is fixed on its surface, the remainder of heat-conducting metal silk 45 is all attached on heat conduction airduct 39 inwall, heat conduction airduct 39 connects heat insulation case 43, and drum Hot-air fan 38 and heat insulation case 43 surround semiclosed thermal insulation cavity.
Below in conjunction with embodiment, the invention will be further described.
When 3D prints, primary granule material, additive, elastic high temperature resistant shiny surface flexible pipe 16 sent into by pigment, this elastic high temperature resistant shiny surface flexible pipe 16 top is fixed on support, lower end is fixed on hot melt cavity 1, utilize printhead movement back and forth, traction flexible pipe is shaken simultaneously, the automatic slide downward of particle granules is made to realize continuous supplementation, after being transported to the direct hot melt of hot melt cavity 1, by the extruding heat outputting melt material of extrusion pump 2, tight winding displacement fuse is extruded by double-row hole shower nozzle 3, 3D printer control system traction double-row hole is filled 3D printhead and is moved accurately in X-axis Y direction, it is two rows micro-holes 10 side by side on double-row hole shower nozzle 3, after two row's fuse lines sinkings of extrusion (Fig. 3), it is merged into the tight winding displacement fuse of monolayer.
Control system electric rotating machine 20 at any time makes the direction of micro-hole word order and double-row hole fill 3D printhead moving direction and forever keep vertical.
3D printer is when increasing material and manufacturing, starting Semi-conductor 27, after powered up, the refrigeration end and the one side that produce one side heat end to semiconductor chilling plate 40 simultaneously, produce the temperature of less than 0 ° in refrigeration end, create the relative high temperatures higher than room temperature heating end.
Heating the relative high temperatures of end, make rapidly metal fever grid 37 be also at relative high temperatures, heat-conducting metal silk 45 is because connecting metal fever grid 37 simultaneously, makes the heat-conducting metal silk 45 of heat conduction airduct 39 inwall be similarly in relative high temperatures from the beginning to the end.The air of drum Hot-air fan 38 extruding, tentatively heats into steam through metal fever grid 37.Steam after being heated by metal fever grid 37 is not easy to be heated by the degree of depth, after steam is pressed in heat conduction airduct 39, extend and increase the contact area of cold and hot conduction again, heated by heat-conducting metal silk 45 degree of depth the most again, until hot-air mouth 47, it is provided that required steam.
Heat 29 steam of air blast end and be expressed to steam cavity 21, the steam that mixing heat-generating pipe 6 produces simultaneously, spray through helical annular air port 24 in the lump, the annular mouth of concentric circles forms the taper wind direction of centripetal angle, converge into downward spiral steam, focus on the hot fuse polishing that alignment has just been extruded, the heat wave that columned paste fuse is rotated turns round and round and pulls into flat pie, the extruding of the most horizontal whirlwind drags hot creamy material and smears the gap tamping surrounding, thus compressed upper and lower out-of-flatness material, space, adjacent material junction, floating one-tenth burnishing surface are tamped.
Completing the steam of bruting process, collect near nozzle, annular suction opeing 25 below intermediate layer button covers on this region, by pumpback cavity 22 and extractor fan 28, simultaneously at pumpback steam, makes just to increase being evacuated as far as possible of the steam above the material that material is piled up.
The temperature that refrigeration end is less than 0 °, makes rapidly the cold grid of metal 34 be also at 0 ° of temperature below, and conduction cooling tinsel 44 is because connecting the cold grid of metal 34 simultaneously, makes the conduction cooling tinsel 44 of conduction cooling airduct 36 inwall be freezed in relatively low temperature the most equally.The air of drum cooling fan 35 extruding, tentatively freezes into cold air through the cold grid of metal 34.Cold air after being freezed by the cold grid of metal 34 is not easy by deep refrigerating, after cold air is pressed in conduction cooling airduct 36 again, extend and increase the contact area of cold and hot conduction, by conduction cooling tinsel 44 deep refrigerating the most again, until cold wind mouth 46, it is provided that required cold air.
Just being increased material itself the also higher temperature that material is piled up, the temperature of the material of multilamellar also will keep the longer time even up and down.The downward blow pressure of cold air produced by 30, air blast end of refrigeration to button covers on semiconductor refrigerating cavity 23 and the cold air mouth 26 of lower end annular of outer layer, and blows to shower nozzle and printing objects.Along with moving back and forth of printhead, the path that the path of ejection cold air is moved with printhead is consistent, causes and often locates just all to be freezed rapidly by the material increasing material accumulation, it is to avoid produces thermal deformation.
Below being schematically described the present invention and embodiment thereof, this description does not has restricted, and shown in accompanying drawing is also one of embodiments of the present invention, and actual structure is not limited thereto.So, if those of ordinary skill in the art is enlightened by it, in the case of without departing from the invention objective, without creatively designing the frame mode similar to this technical scheme and embodiment, protection scope of the present invention all should be belonged to.

Claims (8)

1. a double-row hole fills 3D printhead, including: the polishing of hot melt cavity, extrusion pump, electric rotating machine, double-row hole shower nozzle, steam cold air shaping equipment, it is characterized in that: by elastic high temperature resistant shiny surface hose connection hot melt cavity and the upper end of extrusion pump, extrusion pump and hot melt cavity are integrated, double-row hole shower nozzle is installed in the lower end of hot melt cavity and extrusion pump, and steam polishing cold air shaping equipment are installed at the periphery of hot melt cavity and extrusion pump.
A kind of double-row hole the most according to claim 1 fills 3D printhead, it is characterized in that: described steam polishing cold air shaping equipment, also include: steam cavity, spiral steam annular jet, steam pumpback cavity, semiconductor refrigerating cavity, Semi-conductor, wherein, above three cavity is by from the inside to middle, arrive outer layer again, it is nested together into whole entirety mutually, it is respectively the steam cavity of nexine, middle steam pumpback cavity, outer layer semiconductor refrigerating cavity, spiral steam annular jet is arranged on the bottom of steam cavity, the air blast end that heats of Semi-conductor connects steam cavity, refrigeration air blast end connects semiconductor refrigerating cavity, steam pumpback cavity connects extractor fan by guide duct.
A kind of double-row hole the most according to claim 1 fills 3D printhead, it is characterized in that: described double-row hole shower nozzle, use when printing packing material for 3D is nozzle specially used, at hot melt cavity and extrusion pump lower end, wide-aperture female nozzle is set, double-row hole shower nozzle is connected on female nozzle as sub-nozzle cage, it is arranged above with two row's Parallel micro holes, micro-hole upper-lower position interlaced arrangement on two rows, the often row micro-hole position being always aligned to the edge close to shower nozzle in one line, often row's micro-hole diameter equal to or less than micro-hole separated by a distance, each micro-hole center of upper row is the center position of the gap of row under alignment.
Steam the most according to claim 2 polishing cold air shaping equipment, it is characterized in that: described steam cavity, be at hot melt one nexine of containment portion cover every empty steam cavity, mix the steam in two kinds of sources, a) end generation steam is being heated after Semi-conductor energising, b) steam that outside hot melt cavity, heater members produces, the steam converged extrudes the power source of flowing from heating air blast end to spiral steam annular jet.
Steam the most according to claim 2 polishing cold air shaping equipment, it is characterized in that: described spiral steam annular jet, internal setting is by the helical blade set of the spiral steam produced under blast, spiral steam annular jet faces the hot melt material of extrusion below nozzle, and the spiral steam of generation rotates and surrounds the hot-melt extruded material that need to polish.
Steam the most according to claim 2 polishing cold air shaping equipment, it is characterized in that: described steam pumpback cavity, for middle cavity, up and down logical sky, the tight-lipped steam overstock around spiral steam annular jet, upper end configuration fan pumpback shower nozzle and printing article of its lower end annular.
Steam the most according to claim 2 polishing cold air shaping equipment, it is characterized in that: described semiconductor refrigerating cavity, cavity for outer layer, logical sky up and down, the cold air spout of its lower end is close to the annular suction opeing of steam pumpback cavity lower end, upper end connects the refrigeration air blast end of Semi-conductor, Semi-conductor energising after refrigeration end produce the downward blow pressure of cold air to lower end annular mouth, the power source of the downward blow pressure of cold air is from refrigeration air blast end, and cold air wind direction faces the material after being polished.
Steam the most according to claim 2 polishing cold air shaping equipment, it is characterized in that: described Semi-conductor, also include: refrigeration air blast end, heat air blast end, semiconductor chilling plate refrigeration end configure the cold grid of metal, drum cooling fan, conduction cooling airduct, every cold case, conduction cooling tinsel, collectively constitute refrigeration air blast end, the end that heats at semiconductor chilling plate configures metal fever grid, drum Hot-air fan, heat conduction airduct, heat insulation case, heat-conducting metal silk, collectively constitutes and heats air blast end.
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CN109501270A (en) * 2018-12-26 2019-03-22 象山金鹏电子器材有限公司 A kind of 3D printer raw material handling mechanism based on generation information technology
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TWI680859B (en) * 2018-09-03 2020-01-01 三緯國際立體列印科技股份有限公司 Three dimensional printing method and three dimensional printing apparatus
CN113508025A (en) * 2019-03-05 2021-10-15 博泽沃尔兹堡汽车零部件欧洲两合公司 3D printing apparatus for applying printing material with temperature adjustment device
US11260590B1 (en) 2020-12-30 2022-03-01 Kilncore Inc. Flow control of molten material and gas extraction via electrolysis
US11633916B2 (en) 2019-12-12 2023-04-25 Kilncore Inc. Very high temperature hot end for fused deposition modeling printer

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