CN204604903U - A kind of hot gas is polished and the 3D printing equipment of cold air refrigeration - Google Patents
A kind of hot gas is polished and the 3D printing equipment of cold air refrigeration Download PDFInfo
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- CN204604903U CN204604903U CN201520057428.XU CN201520057428U CN204604903U CN 204604903 U CN204604903 U CN 204604903U CN 201520057428 U CN201520057428 U CN 201520057428U CN 204604903 U CN204604903 U CN 204604903U
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- hot gas
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Abstract
The invention discloses the polishing of a kind of hot gas and the 3D printing equipment of cold air refrigeration, be applicable to the 3D printer of all hot melt moldings.Comprise: hot gas cavity, spiral hot gas annular jet, hot gas pumpback cavity, semiconductor refrigerating cavity, Semi-conductor.The present invention is extruded extruded material polishing by spiral hot gas, the hot gas of pumpback simultaneously, and utilize the cold air of semiconductor refrigerating to piling the material cooled sizing puzzled, the present invention is through polishing extruding, cold air freezes, the hot melt material at every turn extruded and the material extruded before are stirred mutually, reduce gap, and make the material extruded more smooth, eliminate the concavo-convex strain line of a rule, also substantially increase the fastness printing article simultaneously, avoid the more Duola silk because heat produces, floating process reduces floor height, equal to improve printing precision, refrigeration prevents the thermal deformation of article rapidly simultaneously.
Description
Technical field
The present invention relates to the field that 3D prints manufacturing technology, more particularly, relates to the device that a kind of 3D prints the post processing manufactured.
Background technology
When current 3D printer carries out the printing of increasing material, because not carrying out reprocessing process to extrudate, result in following shortcoming.
During common 3D printer work, the deposit extruded mostly is bead moulding or circle drips, when piling up from level to level, must superpose and piece together round by round, and all round stack ups, there is gap centre, especially when when the shake of 3D printer X-axis Y-axis Z axis, precision is not high, the extrudate of front and back different time even can not be closely linked, and in half disengaged position, the article causing product to print are solid not.
When common 3D printer works, because the material extruded, heat can not leave in for a long time, the superposition material of multilayer still has higher temperature, printing objects is made still to have trickle fluid behaviour, and self gravity and move around produce the double influence of rocking under, be easy to the torsional deformation causing printing objects.
During common 3D printer work, because extruded material is hot melt fluid state, printhead in line feed, or when to change layer, at high temperature, inherently produces wire drawing phenomenon, makes the product burr of printing too many and have a strong impact on quality.
When common 3D printer works, even if employ fan to the product blowing printed, because printhead ambient heat is higher, the colder gas that can not blow out, and make refrigeration not good, simultaneously because when fan is dried, the direction of wind is a direction, easily cause the thermal conductive material just extruded by distortion after one direction blowing, thus can be out of shape and lose precision.
Summary of the invention
the technical problem that invention will solve
For solving above technical problem, the invention provides the polishing of a kind of hot gas and the 3D printing equipment of cold air refrigeration, by spiral hot gas to extruded material polishing extruding, the hot gas of pumpback simultaneously, and utilize the cold air of semiconductor refrigerating to piling the material cooled sizing puzzled.
technical scheme
For achieving the above object, the invention provides following technical scheme.
Hot gas is polished and a 3D printing equipment for cold air refrigeration, comprising: hot gas cavity, spiral hot gas annular jet, hot gas pumpback cavity, semiconductor refrigerating cavity, Semi-conductor.Wherein, three cavitys by from the inside to middle, then to outer, are nested together into whole entirety, the printhead of parcel 3D printer mutually.Three cavitys are respectively the hot gas cavity of nexine, middle hot gas pumpback cavity, outer semiconductor refrigerating cavity.
Described hot gas cavity, every empty hot gas cavity on one, hot melt containment portion cover, the hot gas in its mixing two kinds source: a) heating end generation hot gas after Semi-conductor energising, b) hot gas that outside hot melt cavity, heater members produces, hot gas after converging to the power source of spiral hot gas annular jet squeezing flow from heating air blast end, utilize semiconductor device to go out hot junction and produce hot gas, with fan, this hot gas is blown to hot gas cavity, mix the unnecessary hot gas of the hot melt of self heating outside hot melt cavity simultaneously, blow to spiral hot gas annular jet in the lump.
Described spiral hot gas annular jet, inside establish helical blade set, spiral hot gas is produced under blast, annular tuyere is just to hot melt material nozzle, toroidal helical hot gas carries out polishing extruding to the hot melt material just extruded, and the hot melt material at every turn extruded and the material extruded before is stirred mutually, minimizing gap, and make the material extruded more smooth, eliminate the concavo-convex strain line of a rule.
Described hot gas pumpback cavity, its lower end annular is tight-lipped is second layer cavity by spiral hot gas annular jet, and logical empty up and down, there is fan pumpback hot gas upper end, avoids shower nozzle and print around article overstocking too many hot gas.
Described semiconductor refrigerating cavity, the annular air outlet of its lower end is close to the lower end annular mouth of hot gas pumpback cavity, for third layer cavity, logical empty up and down, upper end connects the refrigeration air blast end of semiconductor, and the air after being freezed by fan blow pressure is downward, from lower end annular mouth air-out, blow to shower nozzle and printing objects, the material after rapid cooling and shaping is polished.
Described Semi-conductor, comprises refrigeration air blast end, heats air blast end.
The refrigeration end configuration metal cold grid of semiconductor chilling plate, drum thermantidote, conduction cooling airduct, every cold case, conduction cooling wire, common composition refrigeration air blast end, be specially: metal cold grid is made up of the multilayered metal film of high thermal conductivity, and be close to the refrigeration end of semiconductor chilling plate, fixing one wiry of the conduction cooling in its surface, conduction cooling remainder wiry is all attached on conduction cooling airduct inwall, conduction cooling airduct connects every cold case, rouses thermantidote and surrounds semiclosed thermal insulation cavity every cold case.
Configure metal fever grid, drum Hot-air fan, heat conduction airduct, heat insulation case, heat-conducting metal silk at the end that heats of semiconductor chilling plate, common composition heats air blast end.Be specially: metal fever grid is made up of the multilayered metal film of high thermal conductivity, and be close to semiconductor chilling plate heat end, its surface fixes one of heat-conducting metal silk, the remainder of heat-conducting metal silk is all attached on heat conduction airduct inwall, heat conduction airduct connects heat insulation case, and drum Hot-air fan and heat insulation case surround semiclosed thermal insulation cavity.
It is below concrete technical scheme.
3D printer is when increasing material and manufacturing, start Semi-conductor, after powered up, the refrigeration end and the one side that produce one side heat end to semiconductor chilling plate simultaneously, produce the temperature of less than 0 ° in refrigeration end, heat the relative high temperatures held and create higher than room temperature.
Heat the relative high temperatures of end, make rapidly metal fever grid also be in relative high temperatures, heat-conducting metal silk is because of the hot grid of connection metal simultaneously, makes the heat-conducting metal silk of heat conduction airduct inwall be in relative high temperatures equally from the beginning to the end.The air of drum Hot-air fan extruding, tentatively heats into hot gas through metal fever grid.Be not easy to be heated by the degree of depth by the hot gas after metal fever grid heats, when hot gas is pressed into after in heat conduction airduct again, extend and increase cold heat conducting contact area, by heat-conducting metal silk further again the degree of depth heat, provide the hot gas heated needed for air blast end.
Heat air blast end and hot gas is expressed to hot gas cavity, the hot gas that the heater members simultaneously mixing hot melt cavity produces, hot gas after the hot gas cavity of nexine gathers sprays through helical annular air port, the annular mouth of concentric circles forms the taper wind direction of centripetal angle, converge into downward spiral hot gas, focus on the hot fuse polishing of aiming at and being just extruded, columned paste fuse is turned round and round by the heat wave rotated and pulls into flat pie, horizontal whirlwind extruding simultaneously drags hot creamy material and smears the gap around having tamped, thus compressed levels material, tamp space, adjacent material junction, simultaneously floating process, not only the Loose approach that circle is superimposed upon in circle is made into the dull and stereotyped compact fashion be deposited on flat board, and reduce floor height, thinning floor height equals printing precision is substantially increased.
Complete the hot gas of bruting process, collect in fuse nozzle adapter, the annular suction opeing button below intermediate layer covers on this region, and by pumpback cavity, simultaneously at pumpback hot gas, what the hot gas just increased above the material of material accumulation was tried one's best is evacuated.
The temperature that refrigeration end is less than 0 °, makes rapidly metal cold grid also be in less than 0 ° temperature, and conduction cooling wire is because of the cold grid of connection metal simultaneously, makes the conduction cooling wire of conduction cooling airduct inwall cooled equally in lower temperature from the beginning to the end.The air of drum thermantidote extruding, tentatively freezes into cold air through metal cold grid.Cold air after being freezed by metal cold grid is not easy by deep refrigerating, when cold air is pressed into after in conduction cooling airduct again, extends and increases cold heat conducting contact area, by conduction cooling wire deep refrigerating more further, provides the cold air freezed needed for air blast end.
Just also had higher temperature by the material itself increasing material accumulation, the temperature of the material of multilayer also will keep the longer time even up and down, by refrigeration air blast end, downward for this cold air blow pressure is covered on the cold air spout of outer field semiconductor refrigerating cavity and lower end annular to button, and blow to shower nozzle and printing objects.Along with moving around of printhead, the path of ejection cold air is consistent with the path of printhead movement, causes and is just polished solid form by rapid cold fixed, thus make whole target item not produce thermal deformation.
beneficial effect
Adopt technical scheme provided by the invention, compared with existing known technology, there is following remarkable result.
Through polishing extruding, the hot melt material at every turn extruded and the material extruded before are stirred mutually, reduce gap, and make the material extruded more smooth, eliminate the concavo-convex strain line of a rule, substantially increase printing precision, also substantially increase the fastness printing article simultaneously, spiral hot gas the is worn simultaneously silk head of wire drawing.
Through pumpback hot gas, avoid shower nozzle and print around article overstocking too many hot gas, accelerate cooling and the sizing of printing objects.
Through the refrigeration end of semiconductor, less than the 0 ° cold air produced, blow to shower nozzle and printing objects, avoid the more Duola silk because heat produces, cool printing objects rapidly simultaneously, prevent and print article because of overheated, and the gravity of self, and produce torsional deformation under the impact of rocking of the generation that moves around, thus improve the dimensional accuracy printing article.
Accompanying drawing explanation
Fig. 1 is the sectional view of a kind of hot gas polishing of the present invention the 3D printing equipment of cold air refrigeration.
Fig. 2 is spiral hot gas annular jet figure of the present invention.
Fig. 3 is Semi-conductor figure of the present invention.
Fig. 4 is hot gas of the present invention polishing and cold air refrigerating plant inside cuts oblique view open.
6-heat-generating pipe, 21-hot gas cavity, 22-hot gas pumpback cavity, 23-semiconductor refrigerating cavity, 24-spiral hot gas annular jet, 25-annular suction opeing, 26-cold air mouth, 27-Semi-conductor, 28-extractor fan, 29-heats air blast end, 30-refrigeration air blast end, 33-helical blade set, 34-metal cold grid, 35-drum thermantidote, 36-conduction cooling airduct, 37-metal fever grid, 38-drum Hot-air fan, 39-heat conduction airduct, 40-semiconductor chilling plate, 41-guide duct, 42-is every cold case, the heat insulation case of 43-, 44-conduction cooling wire, 45-heat-conducting metal silk, 46-cold wind mouth, 47-hot-air mouth.
Detailed description of the invention
For understanding content of the present invention further, the present invention is described in detail by reference to the accompanying drawings.
Hot gas is polished and a 3D printing equipment for cold air refrigeration, comprising: hot gas cavity 21, spiral hot gas annular jet 24, hot gas pumpback cavity 22, semiconductor refrigerating cavity 23, Semi-conductor 27.Wherein, three cavitys by from the inside to middle, then to outer, be nested together into whole entirety mutually, be respectively the hot gas cavity 21 of nexine, middle hot gas pumpback cavity 22, outer field semiconductor refrigerating cavity 23.The air blast end 29 that heats of Semi-conductor 27 connects hot gas cavity 21, refrigeration air blast end 30 connects semiconductor refrigerating cavity 23 and straight-through cold air spout 26, extractor fan 28 connects hot gas pumpback cavity 22 by guide duct 41 and straight-through annular suction opeing 25, helical blade set 33 is established in spiral hot gas annular jet 24, under blast, produce spiral hot gas, spiral hot gas annular jet 24 faces the hot melt material extruded below nozzle.
Described Semi-conductor 27, also comprises: refrigeration air blast end 30, heat air blast end 29.
The refrigeration end configuration metal cold grid 34 of semiconductor chilling plate 40, drum thermantidote 35, conduction cooling airduct 36, every cold case 42, conduction cooling wire 44, common composition refrigeration air blast end, be specially: metal cold grid 34 is made up of the multilayered metal film of high thermal conductivity, and be close to the refrigeration end of semiconductor chilling plate 40, its surface fixes one of conduction cooling wire 44, the remainder of conduction cooling wire 44 is all attached on conduction cooling airduct 36 inwall, conduction cooling airduct 36 connects every cold case 42, rouses thermantidote 35 and surrounds semiclosed thermal insulation cavity every cold case 42.
Configure metal fever grid 37, drum Hot-air fan 38, heat conduction airduct 39, heat insulation case 43, heat-conducting metal silk 45 at the end that heats of semiconductor chilling plate 40, common composition heats air blast end.Be specially: metal fever grid 37 is made up of the multilayered metal film of high thermal conductivity, and be close to semiconductor chilling plate 40 heat end, its surface fixes one of heat-conducting metal silk 45, the remainder of heat-conducting metal silk 45 is all attached on heat conduction airduct 39 inwall, heat conduction airduct 39 connects heat insulation case 43, and drum Hot-air fan 38 and heat insulation case 43 surround semiclosed thermal insulation cavity.
Below in conjunction with embodiment, the invention will be further described.
3D printer is when increasing material and manufacturing, start Semi-conductor 27, after powered up, the refrigeration end and the one side that produce one side heat end to semiconductor chilling plate 40 simultaneously, produce the temperature of less than 0 ° in refrigeration end, heat the relative high temperatures held and create higher than room temperature.
Heat the relative high temperatures of end, make rapidly metal fever grid 37 also be in relative high temperatures, heat-conducting metal silk 45 is because of the hot grid 37 of connection metal simultaneously, makes the heat-conducting metal silk 45 of heat conduction airduct 39 inwall be in relative high temperatures equally from the beginning to the end.The air that drum Hot-air fan 38 extrudes, tentatively heats into hot gas through metal fever grid 37.Be not easy to be heated by the degree of depth by the hot gas after metal fever grid 37 heats, when hot gas is pressed into after in heat conduction airduct 39 again, extend and increase cold heat conducting contact area, by heat-conducting metal silk 45 further again the degree of depth heat, until hot-air mouth 47, provide required hot gas.
Heat air blast end 29 and hot gas is expressed to hot gas cavity 21, mix the hot gas that heat-generating pipe 6 produces simultaneously, spray through helical annular air port 24 in the lump, the annular mouth of concentric circles forms the taper wind direction of centripetal angle, converge into downward spiral hot gas, focus on the hot fuse polishing of aiming at and being just extruded, columned paste fuse is turned round and round by the heat wave rotated and pulls into flat pie, horizontal whirlwind extruding simultaneously drags hot creamy material and smears the gap of tamping surrounding, thus compressed upper and lower out-of-flatness material, tamp space, adjacent material junction, floating one-tenth burnishing surface.
Complete the hot gas of bruting process, collect near nozzle, annular suction opeing 25 button below intermediate layer covers on this region, and by pumpback cavity 22 and extractor fan 28, simultaneously at pumpback hot gas, what the hot gas just increased above the material of material accumulation was tried one's best is evacuated.
The temperature that refrigeration end is less than 0 °, makes rapidly metal cold grid 34 also be in less than 0 ° temperature, and conduction cooling wire 44 is because of the cold grid 34 of connection metal simultaneously, makes the conduction cooling wire 44 of conduction cooling airduct 36 inwall cooled equally in lower temperature from the beginning to the end.The air that drum thermantidote 35 extrudes, tentatively freezes into cold air through metal cold grid 34.Cold air after being freezed by metal cold grid 34 is not easy by deep refrigerating, when cold air is pressed into after in conduction cooling airduct 36 again, extend and increase cold heat conducting contact area, by conduction cooling wire 44 deep refrigerating more further, until cold wind mouth 46, provide required cold air.
Just also had higher temperature by the material itself increasing material accumulation, the temperature of the material of multilayer also will keep the longer time even up and down.By refrigeration air blast end 30 the downward blow pressure of cold air produced to semiconductor refrigerating cavity 23, until to the cold air mouth 26 of lower end annular, and blow to shower nozzle and printing objects.Along with moving around of printhead, the path of ejection cold air is consistent with the path of printhead movement, causes and often locates just all to be freezed rapidly by the material increasing material accumulation, avoid producing thermal deformation.
Below be schematically described the present invention and embodiment thereof, this description does not have restricted, and shown in accompanying drawing is also one of embodiments of the present invention, and actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, without creatively designing the frame mode similar to this technical scheme and embodiment, all should protection scope of the present invention be belonged to.
Claims (6)
1. a hot gas is polished and the 3D printing equipment of cold air refrigeration, comprise: hot gas cavity, spiral hot gas annular jet, hot gas pumpback cavity, semiconductor refrigerating cavity, Semi-conductor, it is characterized in that: its three cavitys are by from the inside to middle, arrive skin again, be nested together into whole entirety mutually, be respectively the hot gas cavity of nexine, middle hot gas pumpback cavity, outer semiconductor refrigerating cavity, spiral hot gas annular jet is arranged on hot gas cavity bottom, the air blast end that heats of Semi-conductor connects hot gas cavity, refrigeration air blast end connects semiconductor refrigerating cavity, hot gas pumpback cavity connects extractor fan by guide duct.
2. a kind of hot gas according to claim 1 is polished and the 3D printing equipment of cold air refrigeration, it is characterized in that: described hot gas cavity, be one, hot melt containment portion cover at nexine every empty hot gas cavity, the hot gas in its mixing two kinds source: a) heating end generation hot gas after Semi-conductor energising, b) hot gas that outside hot melt cavity, heater members produces, the hot gas after converging to the power source of spiral hot gas annular jet squeezing flow from heating air blast end.
3. a kind of hot gas according to claim 1 is polished and the 3D printing equipment of cold air refrigeration, it is characterized in that: described spiral hot gas annular jet, inner setting is by the helical blade set of the spiral hot gas produced under blast, spiral hot gas annular jet faces the hot melt material extruded below nozzle, and the spiral hot gas of generation rotates and surrounds the hot-melt extruded material that need polish.
4. a kind of hot gas according to claim 1 is polished and the 3D printing equipment of cold air refrigeration, it is characterized in that: described hot gas pumpback cavity, is the cavity of centre, logical empty up and down, its lower end annular is tight-lipped by spiral hot gas annular jet, and upper end configures the fan that hot gas is overstock in a pumpback.
5. a kind of hot gas according to claim 1 is polished and the 3D printing equipment of cold air refrigeration, it is characterized in that: described semiconductor refrigerating cavity, for outer field cavity, logical empty up and down, the cold air spout of its lower end is close to the annular suction opeing of hot gas pumpback cavity lower end, upper end connects the refrigeration air blast end of Semi-conductor, Semi-conductor energising after refrigeration end produce the downward blow pressure of cold air to lower end annular mouth, the power source of the downward blow pressure of cold air from refrigeration air blast end, the material after cold air wind direction faces and is polished.
6. a kind of hot gas according to claim 1 is polished and the 3D printing equipment of cold air refrigeration, it is characterized in that: described Semi-conductor, also comprise: refrigeration air blast end, heat air blast end, wherein, the refrigeration end configuration metal cold grid of semiconductor chilling plate, drum thermantidote, conduction cooling airduct, every cold case, conduction cooling wire, common composition refrigeration air blast end, configure metal fever grid, drum Hot-air fan, heat conduction airduct, heat insulation case, heat-conducting metal silk at the end that heats of semiconductor chilling plate, common composition heats air blast end.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520057428.XU CN204604903U (en) | 2015-01-27 | 2015-01-27 | A kind of hot gas is polished and the 3D printing equipment of cold air refrigeration |
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| CN201520057428.XU CN204604903U (en) | 2015-01-27 | 2015-01-27 | A kind of hot gas is polished and the 3D printing equipment of cold air refrigeration |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105984139A (en) * | 2015-01-27 | 2016-10-05 | 常州市东科电子科技有限公司 | 3D printing apparatus with hot air polishing and cold air shaping |
| CN106128647A (en) * | 2016-08-12 | 2016-11-16 | 河南开启电力实业有限公司 | Silanes cross-linked polyethylene insulated cable hot repair equipment |
| CN109070468A (en) * | 2016-03-29 | 2018-12-21 | 惠普发展公司，有限责任合伙企业 | The cooling of printing equipment and the heating of printed material |
| CN109910130A (en) * | 2019-03-25 | 2019-06-21 | 南京理工大学 | A kind of concrete 3D printing spray head with the auxiliary solidifying device of blowing hot wind |
| CN111112613A (en) * | 2019-12-24 | 2020-05-08 | 安徽卓锐三维科技有限公司 | Auxiliary cooling device for working cavity of laser sintering equipment |
| CN113084591A (en) * | 2021-04-13 | 2021-07-09 | 芜湖普尔机械有限公司 | High-precision numerical control milling and boring machine is with circulation heat sink |
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2015
- 2015-01-27 CN CN201520057428.XU patent/CN204604903U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105984139A (en) * | 2015-01-27 | 2016-10-05 | 常州市东科电子科技有限公司 | 3D printing apparatus with hot air polishing and cold air shaping |
| CN109070468A (en) * | 2016-03-29 | 2018-12-21 | 惠普发展公司，有限责任合伙企业 | The cooling of printing equipment and the heating of printed material |
| CN106128647A (en) * | 2016-08-12 | 2016-11-16 | 河南开启电力实业有限公司 | Silanes cross-linked polyethylene insulated cable hot repair equipment |
| CN106128647B (en) * | 2016-08-12 | 2017-12-05 | 河南开启电力实业有限公司 | Silanes cross-linked polyethylene insulated cable hot repair equipment |
| CN109910130A (en) * | 2019-03-25 | 2019-06-21 | 南京理工大学 | A kind of concrete 3D printing spray head with the auxiliary solidifying device of blowing hot wind |
| CN111112613A (en) * | 2019-12-24 | 2020-05-08 | 安徽卓锐三维科技有限公司 | Auxiliary cooling device for working cavity of laser sintering equipment |
| CN113084591A (en) * | 2021-04-13 | 2021-07-09 | 芜湖普尔机械有限公司 | High-precision numerical control milling and boring machine is with circulation heat sink |
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