CN105977168B - Substrate plastic-sealed body thining method - Google Patents
Substrate plastic-sealed body thining method Download PDFInfo
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- CN105977168B CN105977168B CN201610567921.5A CN201610567921A CN105977168B CN 105977168 B CN105977168 B CN 105977168B CN 201610567921 A CN201610567921 A CN 201610567921A CN 105977168 B CN105977168 B CN 105977168B
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- thinned
- sealed body
- support plate
- substrate plastic
- plastic
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- 239000000758 substrate Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000004033 plastic Substances 0.000 claims abstract description 16
- 239000002390 adhesive tape Substances 0.000 claims abstract description 15
- 239000011800 void material Substances 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to a kind of substrate plastic-sealed body thining methods, characterized in that includes the following steps：（1）Prepare the support plate among one with void region, substrate plastic-sealed body can be embedded in by void region；（2）It is ready to need to carry out thinned substrate plastic-sealed body；（3）One layer of thinned adhesive tape is attached at the support plate back side, and will wait for that thinned substrate plastic-sealed body is positioned over the void region of support plate；（4）By step（3）Obtained support plate is fixed on wafer and is thinned on the platform of machine, carries out being thinned to required thickness to substrate plastic-sealed body；（5）Through step（4）After being thinned, by support plate by being removed on platform；（6）Thinned adhesive tape and support plate are removed, the substrate plastic-sealed body of required thickness is obtained.The thickness of the support plate is less than the thickness after substrate plastic-sealed body is thinned.One aspect of the present invention, which can be realized, is not required to the requirement that different plastic packaging body thicknesses can be realized in mold input, on the other hand, it can be achieved that the requirement of ultra thin substrate plastic packaging body thickness.
Description
Technical field
The present invention relates to a kind of substrate plastic-sealed body thining methods, belong to technical field of semiconductors.
Background technology
With the development of semiconductor technology, the characteristic size of integrated circuit constantly reduces, the ruler of ic chip package
It is very little also to develop towards light, small, thin direction.Influencing chip package size at present mainly has two parts of substrate and plastic-sealed body.
The thickness of plastic-sealed body directly affects the thickness requirement of finished product.
The thickness of plastic-sealed body is mainly influenced by both sides.The first, mold thickness, the input in view of plastic package die are partly to lead
Body encapsulates the major part of the jig of new product input, and the price of single mold is in hundreds of thousands RMB or so；Therefore general encapsulation
Factory can select one module multiple usages, can develop the mold that can meet multiple product demand as possible, constrain ultra-thin plastic-sealed body exploitation
Space.Second, substrate plastic packaging material selection, substrate plastic packaging material ingredient is mainly epoxide-resin glue and filler composition, normal filling
The particle size of object is between 30um ~ 70um；Product plastic packaging need to ensure that chip surface is filled out to plastic packaging material flowing between die surface
The space filled.Therefore plastic packaging body thickness selection at present is compared by limitation, can not accomplish the demand of plastic-sealed body slimming.
Invention content
The purpose of this part is to summarize some aspects of the embodiment of the present invention and briefly introduce some preferably to implement
Example.It may do a little simplified or be omitted to avoid our department is made in this section and the description of the application and the title of the invention
Point, the purpose of abstract of description and denomination of invention it is fuzzy, and this simplification or omit and cannot be used for limiting the scope of the invention.
The problem of can not being thinned in view of plastic-sealed body present in above-mentioned and/or existing semiconductor packages, it is proposed that this hair
It is bright.
The purpose of the present invention is overcoming the deficiencies in the prior art, a kind of substrate plastic-sealed body thining method is provided, one
Aspect can be achieved to be not required to the requirement that different plastic packaging body thicknesses can be realized in mold input, on the other hand, it can be achieved that ultra thin substrate is moulded
Seal the requirement of body thickness.
According to technical solution provided by the invention, the substrate plastic-sealed body thining method, characterized in that including following step
Suddenly：
（1）Prepare the support plate among one with void region, substrate plastic-sealed body can be embedded in by void region；
（2）It is ready to need to carry out thinned substrate plastic-sealed body；
（3）One layer of thinned adhesive tape is attached at the support plate back side, and will wait for that thinned substrate plastic-sealed body is positioned over the hollow out of support plate
Region；
（4）By step（3）Obtained support plate（1）It is fixed on the platform that machine is thinned in wafer（5）On, machine is thinned in wafer
Abrasive wheel is to support plate（1）On substrate plastic-sealed body（4）It carries out being thinned to required thickness；
（5）Through step（4）After being thinned, by support plate by being removed on platform；
（6）Thinned adhesive tape and support plate are removed, the substrate plastic-sealed body of required thickness is obtained.
Further, the size of the void region is more than the size of substrate plastic-sealed body.
Further, it is irradiated by UV exposure sources in the step after adhesive tape is thinned, thinned adhesive tape and support plate is removed.
Further, the thickness of the support plate is less than the thickness after substrate plastic-sealed body is thinned.
Substrate plastic-sealed body is embedded in support plate by the present invention using traditional wafer stripping apparatus, by special support plate, is carried out
Substrate plastic-sealed body thinning back side.In the case of present invention can be implemented in not newly-increased input plastic package die, it is thick to can get different plastic packagings
The requirement of degree and ultra-thin plastic packaging body thickness.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this
For the those of ordinary skill of field, without creative efforts, others are can also be obtained according to these attached drawings
Attached drawing.Wherein：
Fig. 1 is the schematic diagram of the support plate.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the position view in support plate, thinned adhesive tape and substrate plastic-sealed body.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the schematic diagram that support plate is positioned over that wafer is thinned on the platform of machine.
Fig. 6 is the schematic diagram by being removed on platform after substrate plastic-sealed body is thinned.
Fig. 7 is the schematic diagram that adhesive tape is thinned in the irradiation of UV exposure sources.
Specific implementation mode
In order to keep the above objects, features and advantages of the present invention more obvious and easy to understand, with reference to specific attached drawing pair
The specific implementation mode of the present invention is further described.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
Using other different from other manner described here come embodiment, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by following public specific embodiment.
Secondly, combination schematic diagram of the present invention is described in detail, when describing the embodiments of the present invention, for purposes of illustration only, table
Show that the sectional view of device architecture can disobey general proportion and make partial enlargement, and the schematic diagram is example, is not answered herein
Limit the scope of protection of the invention.In addition, three-dimensional space that should be comprising length, width and depth in implementing to make.
Substrate plastic-sealed body thining method of the present invention, includes the following steps：
（1）As shown in Figure 1 and Figure 2, prepare the support plate 1 among one with void region 2,2 size of void region, which is more than, to be subtracted
The size of thin substrate plastic-sealed body；
（2）It is ready to need to carry out thinned substrate plastic-sealed body；
（3）As shown in Figure 3, Figure 4, the thinned adhesive tape 3 of a floor height stickiness is attached at 1 back side of support plate, and will waits for thinned base
Plate plastic-sealed body 4 is positioned over the void region 2 of support plate 1；
（4）As shown in figure 5, by step（3）Obtained support plate 1 is fixed on wafer and is thinned on the platform 5 of machine, according to existing
The thining method of machine is thinned in wafer in technology, and the abrasive wheel of machine is thinned to support plate in wafer（1）On substrate plastic-sealed body（4）Into
Row is thinned to required thickness；
（5）As shown in fig. 6, by step（4）Metacoxal plate plastic-sealed body 4 is thinned and obtains required thickness, by support plate 1 by platform 5
It removes；
（6）As shown in fig. 7, after irradiating thinned adhesive tape 3 by UV exposure sources, thinned adhesive tape 3 and support plate 1 are removed, obtained
To the substrate plastic-sealed body of required thickness.
The thickness of above-mentioned involved support plate is less than the thickness after substrate plastic-sealed body is thinned.
Substrate plastic-sealed body is embedded in support plate by the present invention using traditional wafer stripping apparatus, by special support plate, is carried out
Substrate plastic-sealed body thinning back side.In the case of present invention can be implemented in not newly-increased input plastic package die, it is thick to can get different plastic packagings
The requirement of degree and ultra-thin plastic packaging body thickness.
It should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although with reference to preferable
Embodiment describes the invention in detail, it will be understood by those of ordinary skill in the art that, it can be to the technology of the present invention
Scheme is modified or replaced equivalently, and without departing from the spirit of the technical scheme of the invention and range, should all be covered in this hair
In bright right.
Claims (4)
1. a kind of substrate plastic-sealed body thining method, characterized in that include the following steps：
（1）Prepare that there is void region among one（2）Support plate（1）, void region（2）It can be by substrate plastic-sealed body（4）It is embedded；
（2）It is ready to need to carry out thinned substrate plastic-sealed body；
（3）In support plate（1）The back side attaches one layer of thinned adhesive tape（3）, and will wait for thinned substrate plastic-sealed body（4）It is positioned over support plate
（1）Void region（2）；
（4）By step（3）Obtained support plate（1）It is fixed on the platform that machine is thinned in wafer（5）On, the grinding of machine is thinned in wafer
Wheel is to support plate（1）Void region（2）In substrate plastic-sealed body（4）It carries out being thinned to required thickness；
（5）Through step（4）After being thinned, by support plate（1）By platform（5）On remove；
（6）By thinned adhesive tape（3）And support plate（1）It removes, obtains the substrate plastic-sealed body of required thickness.
2. substrate plastic-sealed body thining method as described in claim 1, it is characterized in that：The void region（2）Size be more than
Substrate plastic-sealed body（4）Size.
3. substrate plastic-sealed body thining method as described in claim 1, it is characterized in that：It is shone by UV exposure sources in the step
Penetrate thinned adhesive tape（3）Afterwards, by thinned adhesive tape（3）And support plate（1）It removes.
4. substrate plastic-sealed body thining method as described in claim 1, it is characterized in that：The thickness of the support plate is less than substrate plastic packaging
Thickness after body is thinned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610567921.5A CN105977168B (en) | 2016-07-18 | 2016-07-18 | Substrate plastic-sealed body thining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610567921.5A CN105977168B (en) | 2016-07-18 | 2016-07-18 | Substrate plastic-sealed body thining method |
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| Publication Number | Publication Date |
|---|---|
| CN105977168A CN105977168A (en) | 2016-09-28 |
| CN105977168B true CN105977168B (en) | 2018-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610567921.5A Active CN105977168B (en) | 2016-07-18 | 2016-07-18 | Substrate plastic-sealed body thining method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722392A (en) * | 2004-07-13 | 2006-01-18 | 株式会社迪斯科 | Semiconductor chip resin encapsulation method |
| CN102496596A (en) * | 2011-12-27 | 2012-06-13 | 复旦大学 | Wafer bearing structure and preparation method thereof, and wafer thinning method |
| CN103021882A (en) * | 2012-12-09 | 2013-04-03 | 华天科技（西安）有限公司 | Flat package part manufacture process based on grinding plastic package body |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3540793B2 (en) * | 2001-12-05 | 2004-07-07 | 松下電器産業株式会社 | Resin-sealed semiconductor device and method of manufacturing the same |
| DE102006025671B4 (en) * | 2006-06-01 | 2011-12-15 | Infineon Technologies Ag | Process for the preparation of thin integrated semiconductor devices |
-
2016
- 2016-07-18 CN CN201610567921.5A patent/CN105977168B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722392A (en) * | 2004-07-13 | 2006-01-18 | 株式会社迪斯科 | Semiconductor chip resin encapsulation method |
| CN102496596A (en) * | 2011-12-27 | 2012-06-13 | 复旦大学 | Wafer bearing structure and preparation method thereof, and wafer thinning method |
| CN103021882A (en) * | 2012-12-09 | 2013-04-03 | 华天科技（西安）有限公司 | Flat package part manufacture process based on grinding plastic package body |
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| Publication number | Publication date |
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| CN105977168A (en) | 2016-09-28 |
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Effective date of registration: 20191202 Address after: Room A107, research building a, high tech think tank center, Nanhai software technology park, Shishan town, Nanhai District, Foshan City, Guangdong Province Patentee after: Guangdong fozhixin microelectronics technology research Co.,Ltd. Address before: 214135 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
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Denomination of invention: Thinning method of substrate plastic package Effective date of registration: 20201224 Granted publication date: 20180928 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |
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Granted publication date: 20180928 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: Guangdong Xinhua Microelectronics Technology Co.,Ltd.|Guangdong fozhixin microelectronics technology research Co.,Ltd. Registration number: Y2020980009995 |
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