CN105974748A - Novel high-power and high-speed maskless photoetching system - Google Patents
Novel high-power and high-speed maskless photoetching system Download PDFInfo
- Publication number
- CN105974748A CN105974748A CN201610528092.XA CN201610528092A CN105974748A CN 105974748 A CN105974748 A CN 105974748A CN 201610528092 A CN201610528092 A CN 201610528092A CN 105974748 A CN105974748 A CN 105974748A
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- Prior art keywords
- laser light
- optical fiber
- dot matrix
- light source
- novel high
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2057—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using an addressed light valve, e.g. a liquid crystal device
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
Abstract
The invention discloses a novel high-power and high-speed maskless lithographic system. The novel high-power and high-speed maskless lithographic system comprises a computer control and graphics system, a dot matrix pattern generator, a high-precision moving platform capable of driving a photosensitive substrate to move, a mobile control system and a position synchronizing system. The novel high-power and high-speed maskless lithographic system is characterized in that the dot matrix pattern generator comprises a plurality of laser light sources and a plurality of optical fibers; the laser light sources are directly coupled with the corresponding optical fibers; in addition, the optical fibers are arrayed into a polygonal dot matrix; a lens system and a modulating switch are arranged between the laser light sources and the optical fibers; the modulating switch is electrically connected with the computer control and graphics system and is controlled by the computer control and graphics system, thereby controlling on-off of light beams emitted by the laser light sources and entering the optical fibers.
Description
Technical field
The present invention relates to a kind of etching system, particularly a kind of novel high-power high speed maskless lithography system.
Background technology
In traditional photoetching technique, common recognition is to use mask, and along with the raising of manufacture integrated level, characteristic size is more and more less, and the making of mask is more and more difficult, and the cost of manufacture of mask, fabrication cycle and motility shortcoming make conventional lithography
It is faced with increasing challenge.Above-mentioned factor causes conventional lithography can not meet the low-end subscribers such as small business and laboratory to flexible design, flexible manufacturing and the needs of cost holding capacity, therefore greatly limit the range of application of conventional lithographic techniques.
And in high accuracy HDI multilayer circuit board field, field of flat panel displays, integrated antenna package field, maskless lithography apparatus has the technical advantage of uniqueness, it can save the mask plate of costliness, directly the required line pattern that Computer Design produces is exposed on the substrate scribbling photosensitive layer, especially in terms of high accuracy HDI multi-layer sheet, every laminate through developing, etch, holing, the operation such as lamination there is deformation, the exposure technology of traditional film template cannot meet multi-layer sheet high-precision interconnection requirement.Maskless lithography apparatus is owing to using digitized figure, figure can be converted carry out the deformation of the offset substrate course of processing according to the deformation of every laminate, solve the alignment issues of high density HDI plate, improve high accuracy HDI multiple-plate production yield, simplify production technology, save the energy and reduce production and management cost.Maskless lithography apparatus, compared with traditional lithographic equipment, at Line-width precision, uses flexibly, produces yield, production management, saving consumptive material, saves the aspects such as the energy and have clear superiority, and it is relatively low that shortcoming is mainly production capacity, and equipment disposably puts into big etc..The single laser beam scanning technique being widely used at present, due to modulated device frequency and the restriction of optical system size, it is impossible to accomplish large area high-speed production.Another is widely used that the multibeam scanning technology with DMD device as spatial light modulator, although have employed multiple beam technology, production capacity can be improved, but accepted energy quantitative limitation by DMD device, laser power cannot be improved, method without expense meets the production capacity of high-energy sensitive material, in the production process of the solder mask being especially badly in need of at pcb board, it is impossible to meet the demand of volume production.The invention spatial light modulator of a kind of high power multiple beam, can meet the use of the high-energy sensitive material of pcb board solder mask, can meet maskless high-precision para-position demand, it is possible to carry out batch production at a high speed.
Summary of the invention
In order to overcome the deficiencies in the prior art, the present invention provides a kind of novel high-power high speed maskless lithography system.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of novel high-power high speed maskless lithography system, including computer control and graphics system, dot pattern generator, can the high-precision mobile platform that moves of dynamic photopolymer substrate, mobile control system, position synchronizes system, it is characterized in that: described dot pattern generator includes multiple LASER Light Source and multifiber, described LASER Light Source directly with corresponding Direct couple, and described optical fiber is arranged in polygonal dot matrix, lens combination and modulation switch it is provided with between LASER Light Source and optical fiber, described modulation switch controls with computer and graphics system electrically connects and is controlled, thus control the break-make of the light beam entrance optical fiber that LASER Light Source is sent.
Described on and off switch be acousto-optic modulator, magneto-optic modulator, electrooptic modulator, micro electromechanical photoswitch above-mentioned in any one or more.
Described dot matrix includes several rows and some row, and the X-direction that the orientation of described row is moved with sensitive substrate is parallel；And y-axis direction that the orientation of described row is moved with sensitive substrate is parallel.
Described dot matrix includes several rows and some row, and the X-direction that the orientation of described row and sensitive substrate move has angle；And the y-axis direction that the orientation of described row and sensitive substrate move has angle.
Described lens combination includes the collimating lens being positioned between LASER Light Source and modulation switch and the coupled lens being positioned between modulation switch and optical fiber.
nullThe invention has the beneficial effects as follows: the multibeam scanning technology that the figure owing to using DMD device to produce is modulated，Received laser power by DMD device itself to be limited，High-octane LASER Light Source can not be used to improve the production capacity produced，So the present invention is to use multiple LASER Light Sources to be directly coupled in multiple optical fiber，Optical fiber is lined up array again and forms dot matrix，This dot matrix can be rectangle or be staggered for rhombus or other combined shaped，Remove the switch of control modulation switch according to the figure of input with computer，Thus control the break-make of the light beam entrance optical fiber that LASER Light Source is sent，The light beam adjusted through lens combination is made to scan the figure identical with the figure inputted on the sensitive substrate of movement，Form high-precision exposure figure，Again through development、The operations such as etching，Form high accuracy wiring board，Owing to laser is directly coupled in optical fiber，Fibre loss is the least，So laser energy is the highest，It is adapted to high-octane sensitive material，The demand of the full processing procedure of high-accuracy PCB can be met.It it is a kind of high-energy novel high-speed yield production type maskless lithography apparatus being widely used in high-accuracy PCB, flat faced display, integrated antenna package field.
The laser power that this mode uses is tens times of DMD device, and switching frequency is tens times of DMD, and production capacity is theoretically tens times of DMD.Therefore, it is the maskless lithography apparatus of a kind of high speed yield production type.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
The direction schematic diagram that Fig. 1 is the dot matrix cross section of optical fiber and sensitive substrate moves；
The direction schematic diagram that Fig. 2 is the schematic cross-section after the dot matrix of optical fiber turns an angle and sensitive substrate moves；
Fig. 3 is the schematic diagram of the dot pattern generator of band acousto-optic modulator.
Fig. 4 is the schematic diagram of the dot pattern generator of band magneto-optic modulator.
Fig. 5 is the schematic diagram of the dot pattern generator of band electrooptic modulator.
Fig. 6 is the schematic diagram of the dot pattern generator of band photoswitch manipulator.
Detailed description of the invention
nullReferring to figs. 1 through Fig. 6，The invention discloses a kind of novel high-power high speed maskless lithography system，Including computer control and graphics system、Dot pattern generator、Can the high-precision mobile platform that moves of dynamic photopolymer substrate、Mobile control system、Position synchronizes system，Computer control and graphics system are the computers of band PaintShop，In conjunction with mobile control system、Position synchronizes system and is accurately controlled the switch of the modulation switch in dot pattern generator，Thus control the break-make of the light beam entrance optical fiber that LASER Light Source is sent，Thus bright spot is formed in the predetermined pattern position of sensitive substrate，The exposure of this position is formed the figure after exposure，Just can develop、The subsequent handlings such as etching，Dot pattern generator includes multiple LASER Light Source 1 and multifiber 2，Described LASER Light Source 1 directly with corresponding optical fiber 2 direct-coupling，And described optical fiber 2 is arranged in polygonal dot matrix，The shape of dot matrix can be rectangle、The polygons such as rhombus，Lens combination and modulation switch it is provided with between LASER Light Source 1 and optical fiber 2，Described modulation switch controls with computer and graphics system electrically connects and is controlled，Thus control the break-make of the light beam entrance optical fiber 2 that LASER Light Source 1 is sent，Concrete，Described lens combination includes the collimating lens 4 being positioned between LASER Light Source 1 and modulation switch and the coupled lens 5 being positioned between modulation switch and optical fiber 2.
As it can be seen, described on and off switch can be multiple: include acousto-optic modulator 31, magneto-optic modulator 32, electrooptic modulator 33, micro electromechanical photoswitch 34 etc..
As it is shown in figure 1, dot matrix includes several rows and some row, the X-direction that the orientation of described row is moved with sensitive substrate is parallel；And y-axis direction that the orientation of described row is moved with sensitive substrate is parallel.
Because having gap between the every optical fiber 2 in dot matrix, arrange by dot matrix as shown in Figure 1 and scan mode is when scanning, if sensitive substrate moves along X-direction, so, in dot matrix, row and gap in the ranks are scanned on sensitive substrate less than thus are formed dark areas, can not fully expose, in like manner, if sensitive substrate moves along the y-axis direction；So, gap between arranging in dot matrix and arranging is scanned on sensitive substrate less than thus is formed dark areas, thus affect the abundant exposure of figure on sensitive substrate, finally affect graphics resolution or data resolution, thus we need thinner graphics resolution or during data resolution, dot matrix can be rotated a certain angle before scanning, as in figure 2 it is shown, the X-direction that the orientation of described row and sensitive substrate move has angle；And the y-axis direction that the orientation of described row and sensitive substrate move has angle, when sensitive substrate moves along X-direction or y-axis direction, row can eliminate with gap in the ranks by the way of optical fiber 2 arranged askew, gap will not form dark areas, thus reaches thinner graphics resolution or data resolution.
The principle summary of the present invention: the line pattern designed by computer CAD system, through graphics process switching software, CAD vector graphics is converted to dot matrix exposure figure, the dot pattern generator formed by computer controlled laser and optical fiber 2 again produces high energy laser exposure figure on sensitive substrate, by high accuracy imaging system, by exposure figure in required ratio direct imaging on the substrate scribbling sensitive material, formed exposure after figure.High precision mobile platform by mobile carrying exposure base, with position signalling as the synchronizing signal of figure, by figure progressively scan exposure on large-area substrate, then completed the transfer of figure by operations such as follow-up development, etchings, form high accuracy wiring board.
Large-area pattern imaging is the high precision mobile platform by bearing substrate, in X, the Y two movement on direction, the local figure of relevant position is formed the exposure figure consistent with tablet pattern in computer by the on-off control of modulation laser according to the position of X, Building Y cursor position and the dot pattern generator of platform on sensitive substrate by computer, by the most mobile high-precision platform, constantly convert the figure corresponding with shift position, form large-area scan exposure, large-sized figure is quickly exposed on large-area substrate.Multiple dot pattern generators can also be used side by side, reduce the mobile number of times of mobile platform, improve production capacity.The arrangement of dot matrix can with scanning exposure directions parallel or with exposure directions tilt a low-angle, form finer scanning patter resolution.Owing to laser is directly coupled in optical fiber 2, optical fiber 2 is lost the least, so laser energy is the highest, is adapted to high-octane sensitive material, can meet the demand of the full processing procedure of high-accuracy PCB.It it is a kind of high-energy novel high-speed yield production type maskless lithography apparatus being widely used in high-accuracy PCB, flat faced display, integrated antenna package field.
A kind of novel high-power high speed the maskless lithography system above embodiment of the present invention provided, it is described in detail, principle and the embodiment of the present invention are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method and the core concept thereof of the present invention；Simultaneously for one of ordinary skill in the art, according to the thought of the present invention, the most all will change, in sum, this specification content should not be construed as limitation of the present invention.
Claims (5)
1. a novel high-power high speed maskless lithography system, including computer control and graphics system, dot pattern generator, can the high-precision mobile platform that moves of dynamic photopolymer substrate, mobile control system, position synchronizes system, it is characterized in that: described dot pattern generator includes multiple LASER Light Source and multifiber, described LASER Light Source directly with corresponding Direct couple, and described optical fiber is arranged in polygonal dot matrix, lens combination and modulation switch it is provided with between LASER Light Source and optical fiber, described modulation switch controls with computer and graphics system electrically connects and is controlled, thus control the break-make of the light beam entrance optical fiber that LASER Light Source is sent.
A kind of novel high-power high speed maskless lithography system the most according to claim 1, it is characterised in that: described on and off switch be acousto-optic modulator, magneto-optic modulator, electrooptic modulator, micro electromechanical photoswitch above-mentioned in any one or more.
A kind of novel high-power high speed maskless lithography system the most according to claim 1, it is characterised in that: described dot matrix includes several rows and some row, and the X-direction that the orientation of described row is moved with sensitive substrate is parallel；And y-axis direction that the orientation of described row is moved with sensitive substrate is parallel.
A kind of novel high-power high speed maskless lithography system the most according to claim 1, it is characterised in that: described dot matrix includes several rows and some row, and the X-direction that the orientation of described row and sensitive substrate move has angle；And the y-axis direction that the orientation of described row and sensitive substrate move has angle.
A kind of novel high-power high speed maskless lithography system the most according to claim 1, it is characterised in that: described lens combination includes the collimating lens being positioned between LASER Light Source and modulation switch and the coupled lens being positioned between modulation switch and optical fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610528092.XA CN105974748A (en) | 2016-07-07 | 2016-07-07 | Novel high-power and high-speed maskless photoetching system |
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| CN201610528092.XA CN105974748A (en) | 2016-07-07 | 2016-07-07 | Novel high-power and high-speed maskless photoetching system |
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| CN105974748A true CN105974748A (en) | 2016-09-28 |
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| CN201610528092.XA Pending CN105974748A (en) | 2016-07-07 | 2016-07-07 | Novel high-power and high-speed maskless photoetching system |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106707700A (en) * | 2017-03-24 | 2017-05-24 | 上海誉刻智能装备有限公司 | Solder mask exposure method |
| CN107577117A (en) * | 2017-10-26 | 2018-01-12 | 广东工业大学 | One kind is without mask optical lithography system |
| CN112578645A (en) * | 2020-12-08 | 2021-03-30 | 无锡物联网创新中心有限公司 | Maskless laser direct writing system and maskless laser direct writing method |
| CN112764323A (en) * | 2021-01-04 | 2021-05-07 | 无锡物联网创新中心有限公司 | Maskless laser direct writing system and maskless laser direct writing method |
| CN116626997A (en) * | 2023-05-23 | 2023-08-22 | 无锡物联网创新中心有限公司 | High-precision digital photoetching machine |
| CN116626996A (en) * | 2023-05-23 | 2023-08-22 | 无锡物联网创新中心有限公司 | Deep ultraviolet lithography machine based on optical fiber array |
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| CN101285911A (en) * | 2007-04-12 | 2008-10-15 | 中芯国际集成电路制造(上海)有限公司 | Mask-free method and structure for light sensitive material patterning by using optical fiber |
| CN104865800A (en) * | 2015-05-27 | 2015-08-26 | 中山新诺科技股份有限公司 | Synchronous pulse exposure method for maskless lithography equipment and digital laser direct-writing system |
| CN205827054U (en) * | 2016-07-07 | 2016-12-21 | 中山新诺科技股份有限公司 | A kind of novel high-power high speed maskless lithography system |
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| US20030091277A1 (en) * | 2001-11-15 | 2003-05-15 | Wenhui Mei | Flattened laser scanning system |
| CN101088048A (en) * | 2004-12-22 | 2007-12-12 | 3M创新有限公司 | Lensed fiber array for sub-micron optical lithography patterning |
| CN101285911A (en) * | 2007-04-12 | 2008-10-15 | 中芯国际集成电路制造(上海)有限公司 | Mask-free method and structure for light sensitive material patterning by using optical fiber |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106707700A (en) * | 2017-03-24 | 2017-05-24 | 上海誉刻智能装备有限公司 | Solder mask exposure method |
| CN107577117A (en) * | 2017-10-26 | 2018-01-12 | 广东工业大学 | One kind is without mask optical lithography system |
| CN112578645A (en) * | 2020-12-08 | 2021-03-30 | 无锡物联网创新中心有限公司 | Maskless laser direct writing system and maskless laser direct writing method |
| CN112764323A (en) * | 2021-01-04 | 2021-05-07 | 无锡物联网创新中心有限公司 | Maskless laser direct writing system and maskless laser direct writing method |
| WO2022141772A1 (en) * | 2021-01-04 | 2022-07-07 | 无锡物联网创新中心有限公司 | Maskless laser direct writing system and maskless laser direct writing method |
| CN116626997A (en) * | 2023-05-23 | 2023-08-22 | 无锡物联网创新中心有限公司 | High-precision digital photoetching machine |
| CN116626996A (en) * | 2023-05-23 | 2023-08-22 | 无锡物联网创新中心有限公司 | Deep ultraviolet lithography machine based on optical fiber array |
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Application publication date: 20160928 |