CN100389344C - Method for producing light conducting plate mould core - Google Patents
Method for producing light conducting plate mould core Download PDFInfo
- Publication number
- CN100389344C CN100389344C CNB2004100267127A CN200410026712A CN100389344C CN 100389344 C CN100389344 C CN 100389344C CN B2004100267127 A CNB2004100267127 A CN B2004100267127A CN 200410026712 A CN200410026712 A CN 200410026712A CN 100389344 C CN100389344 C CN 100389344C
- Authority
- CN
- China
- Prior art keywords
- substrate surface
- light guiding
- mould core
- probe
- guiding board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention relates to a method for making a mould core of a light guiding plate, which comprises the following steps: providing a base plate; completing the signal processing of mould core patterns in a computer and then carrying out control machining by using mould core pattern signals by the computer; adopting scanning probe lithography to form required patterns on the base plate so as to form the mould core of a light guiding plate with high precision.
Description
[technical field]
The invention relates to a kind of manufacture method of light guiding board mould core, especially about a kind of manufacture method with patterns of high precision light guiding board mould core.
[background technology]
In recent years, along with the colorize of liquid crystal indicator and size maximize, its application more and more widely, as notebook computer, various desk-top computer and LCD TV etc.But because liquid crystal indicator is a kind of passive component, itself can not be luminous, thus need utilize the light source of a light-source system as liquid crystal indicator, as backlight module.Wherein, light guide plate is the significant components in the backlight module, from the transmission direction that light source sends light beam, converts line source or pointolite to area source in order to guiding.
For improving the homogeneity of beam projecting, generally a plurality of sites are set on the light guide plate surface, in order to the total reflection condition of broken beam, and make the homogeneity of its scattering, and then promote the overall performance of backlight module with raising light guide plate outgoing beam in the light guide plate internal transmission.
At present, manufacturing method of light conducting board is broadly divided into two kinds of printing-type and non-printing-types, and wherein the printing-type processing procedure is because press quality is not easy control, and it gradually has the trend that is replaced by non-printing-type processing procedure.Non-printing-type processing procedure is that the leaded light pattern (surface configuration of light guide plate) that will design is produced on the die, adopts straight forming or impression to produce the light guide plate with leaded light pattern.
Seeing also Fig. 1, is a kind of light guiding board mould core manufacture method that the TaiWan, China patent of on Dec 21st, 2002 bulletin is disclosed for No. 514766, and its step comprises: photoresist is coated on the planar substrates; With the photoresist exposure imaging, to constitute some photoresistance patterns; Apply one deck copper film at this planar substrates and some photoresistance patterned surfaces; Become a die in the electroforming mode at this planar substrates surface electrical cast; This die and this substrate surface are broken away from; The copper film etching on this die surface is removed.
But this kind manufacture method need apply to be needed the copper film etching is removed after photoresist and electroforming are finished, the processing procedure complexity, and the die precision is reduced during etching.
[summary of the invention]
For overcoming light guiding board mould core manufacture method processing procedure complexity and the not high problem of precision in the prior art, the invention provides the light guiding board mould core manufacture method that a kind of processing procedure is simple and precision is high.
The method for making of light guiding board mould core provided by the invention comprises the steps: to provide a substrate; In computing machine, finish the die pattern signal and handle, utilize this die pattern signal to control processing by computing machine; Have electric field between probe and the substrate surface, probe scanning is micro-to form required pattern on substrate thereby adopt, to form a light guiding board mould core.
Compared to prior art, the present invention can directly develop on substrate owing to adopt computer control processing, and with the formation light guiding board mould core, so processing procedure is simple; And because of the precision that probe scanning develops higher, so, can make high-precision light guiding board mould core, its precision can be less than 100 nanometers.
[description of drawings]
Fig. 1 is a kind of prior art light guiding board mould core manufacture method process flow diagram.
Fig. 2 is the process flow diagram of light guiding board mould core manufacture method of the present invention.
Fig. 3 is the synoptic diagram that first embodiment of the invention is made the light guiding board mould core processing platform.
Fig. 4 is the synoptic diagram that first embodiment of the invention is made the light guiding board mould core process.
Fig. 5 is the enlarged diagram that first embodiment of the invention is made the light guiding board mould core process.
Fig. 6 is the synoptic diagram of the light guiding board mould core that produces of first embodiment of the invention.
Fig. 7 is the synoptic diagram that second embodiment of the invention is made the light guiding board mould core processing platform.
Fig. 8 is the synoptic diagram that second embodiment of the invention is made the light guiding board mould core process.
Fig. 9 is the synoptic diagram of the light guiding board mould core that produces of second embodiment of the invention.
[embodiment]
Seeing also Fig. 2, is the manufacture method process flow diagram of light guiding board mould core of the present invention, and it comprises the following steps:
The light guiding board mould core that said method is made, its precision can be less than 100 nanometers, far above the die of commonsense method manufacturing.
Please consulting Fig. 3 to Fig. 6 simultaneously, is that the present invention utilizes the probe scanning microtechnic to make the first embodiment synoptic diagram of light guiding board mould core 15, and it may further comprise the steps:
One substrate 10 is provided, and wherein, this substrate 10 is silicon or metal material, and it is shaped as rectangle.This substrate 10 is placed on the precision stage 16, and with these substrate 10 ground connection, travelling table 16 to temperature is 10～40 ℃ again that relative humidity is in 30%～80% the processing environment.
The die pattern is finished signal Processing in computing machine;
Form probe array by m * n probe 11, wherein, this probe 11 is a carbon nano-tube, and the probe tip diameter is 20～30 nanometers;
According to the size of substrate 10, adjust the distance of 11 of each probes by computer control, make probe array cover whole base plate 10, it is constant to be fixed after the adjustment.
The probe 11 of any two vertical or horizontal interval maximums has pinpoint effect in the probe array, the probe 11 that makes described any two vertical or horizontal interval maximums is separately to substrate 10 scannings, to make the signal of base plate 10 information, be used for the aligning and the correction of substrate 10 when micro-; Each probe 11 in the probe array is distinguished automatic focusings to substrate 10 surfaces, by computer control precision stage 16 along the reciprocal high-speed motion of X-direction, and along the accurate stepping of Y direction, simultaneously unify synchronization modulation probe pin according to the die pattern and be listed as each probe 11 electric switch state, make respectively on some probe 11 and be with negative voltage by computing machine.Because it is 10～40 ℃ that substrate 10 and probe array are positioned at temperature, relative humidity is in 30%～80% the environment, the surface of substrate 10 can cover water membrane 12, when on probe 11, applying negative voltage, then the high electric field of probe 11 and 10 generations of substrate makes the hydrone ionization, the OH that produces after the ionization
-And O
2-Ion and substrate surface atom and generate oxide layer 13, when substrate 10 adopts silicon materials, its oxidation reaction formula is as follows:
Si+2OH
-→SiO
2+2H
++4e
Si+O
2-→SiO
2+2e
Adopt metal materials as substrate 10, the then metallic atom oxidation on substrate 10 surfaces and generate metal oxide layer, its oxidation reaction formula is as follows:
Me+nO
2-→MeO
n+2ne
Wherein, Me represents common metal.
Because precision stage 16 is along the reciprocal high-speed motion of X-direction, and along the accurate stepping of Y direction, probe 11 can form the oxide layer 13 of certain-length and width on substrate 10, promptly form a salient point 14, and probe 11 is by computer control its electric switch state and conduction time, so the length of this salient point and width can be controlled by the conduction time of computer controlled manufacturing probe 11; For the whole probe array, then can on substrate, form a salient point array.
Correspondingly, also can adopt single probe 11 to utilize computer control on substrate 10, to form salient point 14 one by one respectively, thereby form the salient point array.
The surface of this substrate 10 forms rectangle salient point array after the probe scanning oxidation, this salient point ordered series of numbers precision can be less than 100 nanometers, and the I of its bumps array height reaches 3 nanometers, and the I of live width reaches 50 nanometers.
See also Fig. 7 and Fig. 9, the present invention utilizes the probe scanning microtechnic to make the second embodiment synoptic diagram of light guiding board mould core 25, and it may further comprise the steps:
One substrate 20 is provided, and wherein, this substrate 20 is silicon crystal, also can be metal, and it is shaped as rectangle.Place vacuum or inert gas environment to carry out dewatering roast this substrate 20, its baking temperature is 100～120 ℃, and the time is 4～6 hours.Again this substrate 20 is placed on the precision stage 26, and with these substrate 20 ground connection, travelling table 26 is to vacuum or inert gas processing environment again
The die pattern is finished signal Processing in computing machine.
Form probe array by m * n probe 21, wherein, this probe 21 is a carbon nano-tube, and the tip diameter of probe 21 is 20～30 nanometers.
According to the size of substrate 20, adjust the distance of 21 of each probes by computer control, make probe array cover whole base plate 20, it is constant to be fixed after the adjustment.
The probe 21 of any two vertical or horizontal interval maximums has pinpoint effect in the probe array, the probe 21 that makes described any two vertical or horizontal interval maximums is separately to substrate 20 scannings, to make the signal of base plate 20 information, be used for the aligning and the correction of substrate 20 when micro-; Each probe 21 in the probe array is distinguished automatic focusings to substrate 20 surfaces, by computer control precision stage 26 along the reciprocal high-speed motion of X-direction, and along the accurate stepping of Y direction, simultaneously unify synchronization modulation probe pin according to the leaded light pattern and be listed as each probe 21 electric switch state by computing machine, make respectively on some probe 21 and be with negative voltage, because substrate 20 and probe array are arranged in vacuum environment or inert gas environment, therefore when when probe 21 applies negative voltage, 20 of probe 21 and substrates can produce a transmitter current, promptly this moment, probe 21 became electron emission source, produce electron beam, electron beam quickens by the highfield of 21 of substrate 20 and probes, make simultaneously the surface of high-speed impact substrate 20 behind the electron-beam convergence via an electromagnetic lens 23, the kinetic energy of electron motion is converted to heat energy, can be with substrate 20 surface etchings.Electromagnetic lens 23 can be with the electron beam height boundling, and adjusts the coil and the strength of current of electromagnetic lens 23, the minimum diameter behind the scalable electron beam boundling.
Because precision stage 26 is along the reciprocal high-speed motion of X-direction, and along the accurate stepping of Y direction, probe 21 can be got the concave point 24 of a certain-length and width on substrate 20, and probe 21 is by computer control its electric switch state and conduction time, so the length of this concave point 24 and width can be controlled by the conduction time of computer controlled manufacturing probe 21; For the whole probe array, then can on substrate, form a concave point array.
Correspondingly, also can adopt single probe 21 to utilize computer control on substrate 20, to form concave point 24 one by one respectively, thereby form the concave point array.
The surface of this substrate 20 forms a rectangle concave point array behind el, the precision height of this rectangle concave point array, and this precision can be less than 100 nanometers.
Claims (10)
1. light guiding board mould core manufacture method, it comprises the steps: to provide a substrate; In computing machine, finish the die pattern signal and handle, utilize this die pattern signal to control processing by computing machine; Utilize micro-this substrate surface of computer control probe scanning, have electric field between probe and the substrate surface, thereby make substrate surface form required pattern, make light guiding board mould core.
2. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: this baseplate material is a silicon.
3. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: this baseplate material is a metal.
4. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the tip diameter of probe scanning microprobe is 20～30 nanometers.
5. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the probe scanning microprobe is a carbon nano-tube.
6. light guiding board mould core manufacture method as claimed in claim 1, it is characterized in that: utilize micro-this die core substrate surface of probe scanning, the step that forms required pattern on die core substrate surface is that to be in temperature be 10～40 ℃, and relative humidity is in 30%～80% the environment.
7. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: utilize micro-this die core substrate surface of probe scanning, the step that forms required pattern on the die core substrate surface is to be in vacuum environment.
8. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: utilize micro-this die core substrate surface of probe scanning, the step that forms required pattern on the die core substrate surface is to be in the inert gas environment.
9. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: the electric field between probe and the substrate surface makes the substrate surface atom generate oxide layer, thereby forms salient point at substrate surface.
10. light guiding board mould core manufacture method as claimed in claim 1 is characterized in that: probe produces electron beam, and the electric field of electron beam between probe and substrate surface quickens and the bump substrate surface, thereby forms concave point at substrate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100267127A CN100389344C (en) | 2004-03-27 | 2004-03-27 | Method for producing light conducting plate mould core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100267127A CN100389344C (en) | 2004-03-27 | 2004-03-27 | Method for producing light conducting plate mould core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1673824A CN1673824A (en) | 2005-09-28 |
| CN100389344C true CN100389344C (en) | 2008-05-21 |
Family
ID=35046455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100267127A Expired - Fee Related CN100389344C (en) | 2004-03-27 | 2004-03-27 | Method for producing light conducting plate mould core |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100389344C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103878227B (en) * | 2014-03-06 | 2015-08-12 | 京东方科技集团股份有限公司 | Die site decompressor |
| CN107053650B (en) * | 2017-06-16 | 2019-10-18 | 东莞质研工业设计服务有限公司 | A kind of light guide plate Zhuan Dian mechanism |
| CN112793051A (en) * | 2019-11-14 | 2021-05-14 | 苏州维旺科技有限公司 | Light guide plate mold core and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07261029A (en) * | 1994-03-25 | 1995-10-13 | Nippon Denyo Kk | Light guide plate and machining method therefor |
| US5504338A (en) * | 1993-06-30 | 1996-04-02 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus and method using low-voltage and/or low-current scanning probe lithography |
| JPH09129637A (en) * | 1995-10-27 | 1997-05-16 | Hitachi Ltd | Formation of microscopic pattern |
| US6181097B1 (en) * | 1999-02-11 | 2001-01-30 | Institute Of Materials Research And Engineering | High precision three-dimensional alignment system for lithography, fabrication and inspection |
| JP2001062791A (en) * | 1999-08-27 | 2001-03-13 | Hitachi Ltd | Probe for drawing and manufacture of the same |
| CN1372161A (en) * | 2001-02-26 | 2002-10-02 | 兴隆发电子股份有限公司 | Light guiding board mould core and making method thereof |
| US20030162004A1 (en) * | 2001-12-17 | 2003-08-28 | Mirkin Chard A. | Patterning of solid state features by direct write nanolithographic printing |
-
2004
- 2004-03-27 CN CNB2004100267127A patent/CN100389344C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5504338A (en) * | 1993-06-30 | 1996-04-02 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus and method using low-voltage and/or low-current scanning probe lithography |
| JPH07261029A (en) * | 1994-03-25 | 1995-10-13 | Nippon Denyo Kk | Light guide plate and machining method therefor |
| JPH09129637A (en) * | 1995-10-27 | 1997-05-16 | Hitachi Ltd | Formation of microscopic pattern |
| US6181097B1 (en) * | 1999-02-11 | 2001-01-30 | Institute Of Materials Research And Engineering | High precision three-dimensional alignment system for lithography, fabrication and inspection |
| JP2001062791A (en) * | 1999-08-27 | 2001-03-13 | Hitachi Ltd | Probe for drawing and manufacture of the same |
| CN1372161A (en) * | 2001-02-26 | 2002-10-02 | 兴隆发电子股份有限公司 | Light guiding board mould core and making method thereof |
| US20030162004A1 (en) * | 2001-12-17 | 2003-08-28 | Mirkin Chard A. | Patterning of solid state features by direct write nanolithographic printing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1673824A (en) | 2005-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101161400B (en) | Method for manufacturing mould core of light conducting plate | |
| TW388190B (en) | Method and apparatus for forming a through hole in a ceramic green sheet | |
| KR20040084314A (en) | Deposition mask for display device and Method for fabricating the same | |
| CN101216663B (en) | Backlight module accurate light guide thin film core production method | |
| CN1671270A (en) | Method of manufacturing tape wiring substrate | |
| CN101266409A (en) | Laser machining apparatus | |
| CN101034183A (en) | Manufacturing method of light guiding board/ light guiding film mould core | |
| CN105974748A (en) | Novel high-power and high-speed maskless photoetching system | |
| CN113126449B (en) | Laser direct-writing photoetching system and method for green oil photoetching | |
| WO2006109921A1 (en) | Manufacturing method of slanted-pyramid microlens and its application to light guide plate | |
| CN106148889A (en) | Deposition fabrication mask device and utilize the deposition mask manufacture method of this device | |
| CN100389344C (en) | Method for producing light conducting plate mould core | |
| US11714353B2 (en) | Mask and method of manufacturing the same, evaporation apparatus and display device | |
| CN110349840B (en) | Two-dimensional material composite substrate preparation system for realizing nitride controllable nucleation | |
| CN113284989A (en) | Micro LED chip stripping device, stripping machine and use method of stripping machine | |
| US8811782B2 (en) | Optical transmission board, optical transmission module, and method for manufacturing optical transmission board | |
| CN101169589B (en) | Method for manufacturing light guide plate cavity | |
| CN201083960Y (en) | Direct-writing lithographic equipment | |
| CN215008252U (en) | Micro LED chip stripping off device and peel off machine | |
| CN214046180U (en) | Base material leveling device for double-sided digital exposure | |
| CN100561356C (en) | Integrative type direct-writing photo-etching method | |
| CN205827054U (en) | A kind of novel high-power high speed maskless lithography system | |
| CN100376953C (en) | Method for manufacturing light guiding plate core | |
| CN112739028A (en) | Base material leveling device for double-sided digital exposure | |
| CN108873620A (en) | Improve the method for energy uniformity in a kind of direct-write type lithography machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080521 Termination date: 20150327 |
|
| EXPY | Termination of patent right or utility model |