CN214046180U - Base material leveling device for double-sided digital exposure - Google Patents
Base material leveling device for double-sided digital exposure Download PDFInfo
- Publication number
- CN214046180U CN214046180U CN202023247253.9U CN202023247253U CN214046180U CN 214046180 U CN214046180 U CN 214046180U CN 202023247253 U CN202023247253 U CN 202023247253U CN 214046180 U CN214046180 U CN 214046180U
- Authority
- CN
- China
- Prior art keywords
- substrate
- eddy current
- double
- center
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 239000000725 suspension Substances 0.000 claims abstract description 9
- 230000008713 feedback mechanism Effects 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 12
- 238000003384 imaging method Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The utility model discloses a substrate levels device for two-sided digital exposure, it includes: the device comprises a fixing mechanism and a suspension auxiliary supporting mechanism, wherein the fixing mechanism is used for preliminarily positioning a base material; the suspension auxiliary supporting mechanism comprises an eddy current component and a magnetic component, wherein the eddy current component and the magnetic component interact to exert a supporting force vertical to the surface of the substrate. The utility model discloses a fixed establishment carries out preliminary location to the substrate, prevents that the relative fixed establishment of substrate from moving, then carries out non-contact support to it through suspension auxiliary stay mechanism in the vertical direction of substrate, has just so improved the roughness on substrate surface to guaranteed effectively the substrate exposure surface and the uniformity of exposure camera lens focal plane, improved core indexes such as exposure figure resolution and counterpoint precision greatly; in addition, the substrate leveling device also has the advantages of simple structure, easiness in processing, low cost and the like.
Description
Technical Field
The utility model relates to a digital photoetching field, in particular to a substrate levels device for two-sided digital exposure.
Background
The laser direct imaging technology is that a laser imaging device is driven directly through data output by a CAM workstation, and pattern exposure is carried out on a base material coated with photoresist. The flatness of the substrate is critical to the quality of the exposed pattern, which is particularly shown in the following: the reduction of the flatness of the substrate causes the substrate to be separated from the focal plane of the exposure lens, thereby lowering the indexes of resolution, alignment accuracy and the like of the exposure pattern, and causing poor exposure. Especially in a double-sided exposure laser direct imaging device, the two sides of the substrate need to be exposed simultaneously, and in order to not block the light path, it is a common practice to tension or support the substrate at two ends. However, the substrate is not a rigid structure such as a printed circuit board, and the middle of the substrate sinks under the action of gravity, and the magnitude of the sinking depends on the weight, the rigidity and the tension of the two ends. The longer and softer substrates, the tension required to maintain the substrate within the effective range of the focal plane, often exceeds the limits of the apparatus.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a substrate levels device for two-sided digital exposure realizes carrying out the non-contact to the substrate that exposes and supports.
According to the utility model discloses a substrate levels device for two-sided digital exposure, it includes: the device comprises a fixing mechanism and a suspension auxiliary supporting mechanism, wherein the fixing mechanism is used for preliminarily positioning a base material; the suspension auxiliary supporting mechanism comprises an eddy current component and a magnetic component, wherein the eddy current component and the magnetic component interact to exert a supporting force vertical to the surface of the substrate.
According to the utility model discloses a substrate levels device for two-sided digital exposure has following beneficial effect at least for above-mentioned embodiment: firstly, the base material is preliminarily positioned by the fixing mechanism to prevent the base material from moving relative to the fixing mechanism, and then the base material is supported in a non-contact manner by the suspension auxiliary supporting mechanism in the vertical direction of the base material, so that the flatness of the surface of the base material is improved, the consistency of the exposure surface of the base material and the focal plane of an exposure lens is effectively ensured, and the core indexes of the resolution, the alignment precision and the like of an exposure graph are greatly improved; in addition, the substrate leveling device also has the advantages of simple structure, easiness in processing, low cost and the like.
According to some embodiments of the invention, the fixing mechanism comprises a tensioning mechanism and/or a support mechanism.
According to the utility model discloses a some embodiments, a substrate level and smooth device for two-sided digital exposure still includes detection feedback mechanism, is used for detecting the roughness of substrate surface and according to the roughness adjustment the size of holding power.
According to the utility model discloses a some embodiments, the vortex subassembly is including setting up on the substrate and be located the peripheral vortex coil of exposure area, with the input contact that vortex coil connects, the vortex coil is followed substrate central symmetry distributes, the input contact with detect feedback mechanism electric connection, magnetic component sets up directly over and/or under the substrate center.
According to some embodiments of the invention, the eddy current coil is fabricated by a spatial projection imaging maskless lithography technique.
According to some embodiments of the invention, the eddy current coil is manufactured by FPC manufacturing process.
According to some embodiments of the invention, the eddy current coil is assembled by hot embossing.
According to some embodiments of the utility model, magnetic component is including setting up on the substrate and be located the peripheral permanent magnet of exposure area and/or electromagnet, the magnetic field that permanent magnet and/or electromagnet produced is followed substrate central symmetry distributes, eddy current component sets up directly over and/or under the substrate center, eddy current component with detect feedback mechanism electric connection.
According to some embodiments of the utility model, magnetic component is including setting up at least a set of permanent magnet at substrate center, the magnetic field that the permanent magnet produced is followed substrate central symmetry distributes, eddy current component sets up directly over and/or under the substrate center, eddy current component with detect feedback mechanism and connect, the permanent magnet is the transparent construction.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a top view of an embodiment of the present invention;
fig. 2 is a front view of the embodiment of the present invention.
Reference numerals:
the substrate 100, the fixing mechanism 200, the suspension auxiliary supporting mechanism 300, the eddy current component 310, the magnetic component 320, the eddy current coil 311 and the input contact 312.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, unless explicitly defined otherwise, the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the terms in the present invention by combining the specific contents of the technical solutions.
Referring to fig. 1 and 2, a substrate leveling device for double-sided digital exposure according to an embodiment of the present invention includes: fixing mechanism 200, suspension auxiliary support mechanism 300.
During exposure, the fixture 200 initially positions the substrate 100 to prevent movement of the substrate 100 relative to the fixture 200.
The auxiliary supporting mechanism 300 comprises an eddy current component 310 and a magnetic component 320, wherein when the eddy current component 310 is powered on during operation, a magnetic field is generated around the eddy current component 310 and interacts with the magnetic field generated by the magnetic component 320, so that an upward supporting force perpendicular to the surface of the substrate 100 is generated, and the flatness of the surface of the substrate 100 meets the exposure requirement.
In some embodiments of the present invention, the securing mechanism 200 includes a tensioning mechanism and/or a support mechanism. When the substrate 100 is sufficiently rigid and the central portion thereof sags to the extent allowed by exposure, it is no longer appropriate to apply tension, and only the support mechanism needs to be provided to fix the edge of the substrate 100. When the substrate 100 is not rigid enough and the sagging degree of the middle portion exceeds the allowable degree of exposure, a tensioning mechanism is required to apply a tensioning force parallel to the surface of the substrate 100 to the edge of the substrate 100 to control the sagging degree of the middle portion of the substrate 100. Of course, in some cases, both the tensioning mechanism and the support mechanism may be provided to support and tension the substrate 100 at different locations.
In some embodiments of the present invention, the substrate leveling device for double-sided digital exposure further includes a detection feedback mechanism for detecting the flatness of the surface of the substrate 100, and adjusting the supporting force according to the flatness, so that the flatness of the substrate 100 is within the allowable range of the exposure process. Specifically, a detection feedback mechanism may be formed by the flatness detector and the controller, and the controller adjusts the operating current of the eddy current assembly 310 according to the data fed back by the flatness detector, so as to achieve the purpose of changing the magnitude of the supporting force.
In some embodiments of the present invention, as shown in fig. 1, the eddy current assembly 310 includes an eddy current coil 311 disposed on the substrate 100 and located at the periphery of the exposure area, and an input contact 312 connected to the eddy current coil 311, and the eddy current coil 311 is located at the periphery of the exposure area, so that it cannot block the exposed light path. The eddy current coils 311 are symmetrically distributed along the center of the substrate 100 so that the magnetic field generated by them is uniformly distributed. The input contact 312 is electrically connected to the detection feedback mechanism, the detection feedback mechanism detects the flatness of the surface of the substrate 100, and when the flatness of the substrate 100 is not within the allowable range of the exposure process, the detection feedback mechanism adjusts the input current of the input contact 312, thereby achieving the purpose of adjusting the magnitude of the supporting force. As shown in fig. 2, the magnetic assembly 320 is disposed directly above and/or below the center of the substrate 100, so that the magnetic force acting on the substrate 100 is more uniform.
In some embodiments of the present invention, further, the eddy current coil 311 is formed by space projection imaging maskless lithography, so that it becomes a part of the substrate 100, and only needs to lead out the corresponding input contact 312 when in use. The mode can greatly improve the consistency of the electrical performance parameters, increase the electromagnetic coupling degree of the electromagnetic coupling device and reduce the distributed capacitance of the electromagnetic coupling device.
In some embodiments of the present invention, further, the eddy current coil 311 is manufactured and formed by FPC manufacturing process, and has the characteristics of light weight, thin thickness and good bending property, and can be directly attached to the surface of the substrate 100 by means of pasting.
In some embodiments of the present invention, further, the eddy current coil 311 is assembled by hot stamping technology, and according to the stress condition of the actual process and the substrate 100, the coil of various standard specifications is produced, and then is formed on the substrate 100 by hot stamping technology, and finally the input contact 312 is led out thereon, so as to greatly reduce the production cost.
In some embodiments of the present invention, the magnetic assembly 320 includes a permanent magnet and/or an electromagnet disposed on the substrate 100 and located at the periphery of the exposure area, the magnetic field generated by the permanent magnet and/or the electromagnet is symmetrically distributed along the center of the substrate 100, the eddy current assembly 310 is disposed directly above and/or below the center of the substrate 100, and the eddy current assembly 310 is electrically connected to the detection feedback mechanism.
In some embodiments of the present invention, the magnetic assembly 320 includes at least one set of permanent magnets disposed at the center of the substrate 100, the magnetic field generated by the permanent magnets is distributed along the center of the substrate 100, the eddy current assembly 310 is disposed directly above and/or directly below the center of the substrate 100, the eddy current assembly 310 is connected to the detection feedback mechanism, the permanent magnets are made of transparent magnetic material to form a transparent structure, so that the permanent magnets cannot block the exposed light path.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A substrate flattening apparatus for double-sided digital exposure, comprising:
a fixing mechanism (200) for preliminarily positioning the substrate (100);
the suspension auxiliary supporting mechanism (300) comprises an eddy current component (310) and a magnetic component (320), wherein the eddy current component (310) and the magnetic component (320) interact to exert a supporting force vertical to the surface of the substrate (100).
2. The substrate flattening apparatus for double-sided digital exposure according to claim 1, characterized in that the fixing mechanism (200) comprises a tensioning mechanism and/or a supporting mechanism.
3. The substrate flattening apparatus for double-sided digital exposure according to claim 1, further comprising a detection feedback mechanism for detecting flatness of the surface of the substrate (100) and adjusting the magnitude of the supporting force according to the flatness.
4. The substrate flattening apparatus according to claim 3, wherein the eddy current assembly (310) comprises an eddy current coil (311) disposed on the substrate (100) and located at the periphery of the exposure region, and an input contact (312) connected to the eddy current coil (311), the eddy current coil (311) is symmetrically distributed along the center of the substrate (100), the input contact (312) is electrically connected to the detection feedback mechanism, and the magnetic assembly (320) is disposed directly above and/or below the center of the substrate (100).
5. The substrate flattening apparatus for double-sided digital exposure according to claim 4, characterized in that the eddy current coil (311) is shaped by a spatial projection imaging maskless lithography technique.
6. The substrate flattening apparatus for double-sided digital exposure according to claim 4, characterized in that the eddy current coil (311) is manufactured and shaped by FPC manufacturing process.
7. The substrate flattening apparatus for double-sided digital exposure according to claim 4, characterized in that the eddy current coil (311) is assembled by a hot stamping technique.
8. The substrate flattening apparatus according to claim 3, wherein the magnetic assembly (320) comprises a permanent magnet and/or an electromagnet disposed on the substrate (100) and located at the periphery of the exposure region, the magnetic field generated by the permanent magnet and/or the electromagnet is distributed symmetrically along the center of the substrate (100), the eddy current assembly (310) is disposed directly above and/or below the center of the substrate (100), and the eddy current assembly (310) is electrically connected to the detection feedback mechanism.
9. The substrate flattening apparatus according to claim 3, wherein the magnetic assembly (320) comprises at least one set of permanent magnets disposed in the center of the substrate (100), the magnetic field generated by the permanent magnets is distributed symmetrically along the center of the substrate (100), the eddy current assembly (310) is disposed directly above and/or below the center of the substrate (100), the eddy current assembly (310) is connected to the detection feedback mechanism, and the permanent magnets are transparent structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023247253.9U CN214046180U (en) | 2020-12-29 | 2020-12-29 | Base material leveling device for double-sided digital exposure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023247253.9U CN214046180U (en) | 2020-12-29 | 2020-12-29 | Base material leveling device for double-sided digital exposure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214046180U true CN214046180U (en) | 2021-08-24 |
Family
ID=77344194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023247253.9U Active CN214046180U (en) | 2020-12-29 | 2020-12-29 | Base material leveling device for double-sided digital exposure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214046180U (en) |
-
2020
- 2020-12-29 CN CN202023247253.9U patent/CN214046180U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6665053B2 (en) | Supporting system in exposure apparatus | |
| CN103913931B (en) | Flexible printed circuit board and the small-sized photographic means for including it | |
| US10983302B2 (en) | Lens driving mechanism | |
| CN102741993B (en) | Supporting member for substrate, base board delivery device, substrate transfer method adopted therein, exposure device and manufacturing method | |
| CN106444218A (en) | Lens driving device | |
| CN101408735B (en) | Lithographic apparatus having a lorentz actuator with a composite carrier | |
| WO2012022160A1 (en) | Compact imaging device and manufacturing method thereof | |
| CN210803880U (en) | Image blur correction device, camera device, and electronic apparatus | |
| TW200411334A (en) | Lithographic apparatus and device manufacturing method | |
| US20210294068A1 (en) | Camera apparatus, sma driving device and manufacturing method, driving method and wiring method thereof | |
| US8593743B2 (en) | Magnetic structure for compact imaging device | |
| KR20050027757A (en) | Bobin incorporated with winding coil, actuator employing said bobin and manufacturing method thereof | |
| JP2001037201A (en) | Motor device, stage equipment and exposure device | |
| CN214046180U (en) | Base material leveling device for double-sided digital exposure | |
| WO2022121051A1 (en) | Lens driving device and electronic terminal | |
| CN102566336B (en) | The stationary installation of mask and fixing means thereof | |
| WO2020243868A1 (en) | Prism device applied to periscopic lens module and periscopic lens module | |
| CN112739028A (en) | Base material leveling device for double-sided digital exposure | |
| CN211878281U (en) | Lens driving device of ball type voice coil motor, camera device and electronic apparatus | |
| CN219394957U (en) | Novel motor lower spring plate structure | |
| JP2020507811A (en) | Camera module and optical device including liquid lens | |
| CN102648518B (en) | Substrate supporting, conveyance, exposure device, supporting member and manufacturing method | |
| WO2013010324A1 (en) | Magnetic structure for compact imaging device | |
| CN110632730A (en) | Electromagnetic driving device, lens driving device, camera device and electronic apparatus | |
| WO2023000487A1 (en) | Autofocus anti-shake periscope motor having laser etching conductive circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240201 Address after: No. 772-28, Yanfeng Village (Natural Village), Nanyang Street, Xiaoshan District, Hangzhou City, Zhejiang Province, 310000 Patentee after: Hangzhou Xinnuo Microelectronics Co.,Ltd. Country or region after: China Address before: 528400 No. 3 Mingzhu Road, Torch Development Zone, Zhongshan City, Guangdong Province Patentee before: ZHONGSHAN AISCENT TECHNOLOGIES Co.,Ltd. Country or region before: China |