CN112739028A - Base material leveling device for double-sided digital exposure - Google Patents
Base material leveling device for double-sided digital exposure Download PDFInfo
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- CN112739028A CN112739028A CN202011596251.2A CN202011596251A CN112739028A CN 112739028 A CN112739028 A CN 112739028A CN 202011596251 A CN202011596251 A CN 202011596251A CN 112739028 A CN112739028 A CN 112739028A
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- substrate
- eddy current
- base material
- double
- center
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
Abstract
The invention discloses a substrate flattening device for double-sided digital exposure, which comprises: the device comprises a fixing mechanism and a suspension auxiliary supporting mechanism, wherein the fixing mechanism is used for preliminarily positioning a base material; the suspension auxiliary supporting mechanism comprises an eddy current component and a magnetic component, wherein the eddy current component and the magnetic component interact to exert a supporting force vertical to the surface of the substrate. The invention initially positions the base material through the fixing mechanism, prevents the base material from moving relative to the fixing mechanism, and then supports the base material in a non-contact way through the suspension auxiliary supporting mechanism in the vertical direction of the base material, thereby improving the flatness of the surface of the base material, effectively ensuring the consistency of the exposure surface of the base material and the focal plane of an exposure lens, and greatly improving the core indexes of the resolution, the alignment precision and the like of an exposure graph; in addition, the substrate leveling device also has the advantages of simple structure, easiness in processing, low cost and the like.
Description
Technical Field
The invention relates to the field of digital photoetching, in particular to a substrate flattening device for double-sided digital exposure.
Background
The laser direct imaging technology is that a laser imaging device is driven directly through data output by a CAM workstation, and pattern exposure is carried out on a base material coated with photoresist. The flatness of the substrate is critical to the quality of the exposed pattern, which is particularly shown in the following: the reduction of the flatness of the substrate causes the substrate to be separated from the focal plane of the exposure lens, thereby lowering the indexes of resolution, alignment accuracy and the like of the exposure pattern, and causing poor exposure. Especially in a double-sided exposure laser direct imaging device, the two sides of the substrate need to be exposed simultaneously, and in order to not block the light path, it is a common practice to tension or support the substrate at two ends. However, the substrate is not a rigid structure such as a printed circuit board, and the middle of the substrate sinks under the action of gravity, and the magnitude of the sinking depends on the weight, the rigidity and the tension of the two ends. The longer and softer substrates, the tension required to maintain the substrate within the effective range of the focal plane, often exceeds the limits of the apparatus.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a substrate flattening device for double-sided digital exposure, which realizes non-contact support of the substrate to be exposed.
According to an embodiment of the invention, a substrate flattening apparatus for double-sided digital exposure comprises: the device comprises a fixing mechanism and a suspension auxiliary supporting mechanism, wherein the fixing mechanism is used for preliminarily positioning a base material; the suspension auxiliary supporting mechanism comprises an eddy current component and a magnetic component, wherein the eddy current component and the magnetic component interact to exert a supporting force vertical to the surface of the substrate.
The substrate flattening device for double-sided digital exposure according to the above embodiment of the present invention has at least the following advantages: firstly, the base material is preliminarily positioned by the fixing mechanism to prevent the base material from moving relative to the fixing mechanism, and then the base material is supported in a non-contact manner by the suspension auxiliary supporting mechanism in the vertical direction of the base material, so that the flatness of the surface of the base material is improved, the consistency of the exposure surface of the base material and the focal plane of an exposure lens is effectively ensured, and the core indexes of the resolution, the alignment precision and the like of an exposure graph are greatly improved; in addition, the substrate leveling device also has the advantages of simple structure, easiness in processing, low cost and the like.
According to some embodiments of the invention, the securing mechanism comprises a tensioning mechanism and/or a support mechanism.
According to some embodiments of the present invention, the substrate leveling device for double-sided digital exposure further comprises a detection feedback mechanism for detecting the flatness of the surface of the substrate and adjusting the magnitude of the supporting force according to the flatness.
According to some embodiments of the present invention, the eddy current assembly includes an eddy current coil disposed on the substrate and located at the periphery of the exposure region, and input contacts connected to the eddy current coil, the eddy current coil is symmetrically distributed along the center of the substrate, the input contacts are electrically connected to the detection feedback mechanism, and the magnetic assembly is disposed directly above and/or below the center of the substrate.
According to some embodiments of the invention, the eddy current coil is shaped by a spatial projection imaging maskless lithography technique.
According to some embodiments of the invention, the eddy current coil is manufactured and shaped by an FPC manufacturing process.
According to some embodiments of the invention, the eddy current coil is assembled by a hot stamping technique.
According to some embodiments of the invention, the magnetic assembly comprises a permanent magnet and/or an electromagnet disposed on the substrate and located at the periphery of the exposure area, the magnetic field generated by the permanent magnet and/or the electromagnet is symmetrically distributed along the center of the substrate, the eddy current assembly is disposed directly above and/or below the center of the substrate, and the eddy current assembly is electrically connected to the detection feedback mechanism.
According to some embodiments of the invention, the magnetic assembly comprises at least one group of permanent magnets arranged in the center of the substrate, the magnetic field generated by the permanent magnets is symmetrically distributed along the center of the substrate, the eddy current assembly is arranged right above and/or right below the center of the substrate, the eddy current assembly is connected with the detection feedback mechanism, and the permanent magnets are of transparent structures.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a top view of an embodiment of the present invention;
fig. 2 is a front view of an embodiment of the present invention.
Reference numerals:
the substrate 100, the fixing mechanism 200, the suspension auxiliary supporting mechanism 300, the eddy current component 310, the magnetic component 320, the eddy current coil 311 and the input contact 312.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise explicitly defined, terms such as arrangement, installation, connection and the like should be broadly construed, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the detailed contents of the technical solutions.
Referring to fig. 1 and 2, a substrate flattening apparatus for double-sided digital exposure according to an embodiment of the present invention includes: fixing mechanism 200, suspension auxiliary support mechanism 300.
During exposure, the fixture 200 initially positions the substrate 100 to prevent movement of the substrate 100 relative to the fixture 200.
The auxiliary supporting mechanism 300 comprises an eddy current component 310 and a magnetic component 320, wherein when the eddy current component 310 is powered on during operation, a magnetic field is generated around the eddy current component 310 and interacts with the magnetic field generated by the magnetic component 320, so that an upward supporting force perpendicular to the surface of the substrate 100 is generated, and the flatness of the surface of the substrate 100 meets the exposure requirement.
In some embodiments of the present invention, the securing mechanism 200 includes a tensioning mechanism and/or a support mechanism. When the substrate 100 is sufficiently rigid and the central portion thereof sags to the extent allowed by exposure, it is no longer appropriate to apply tension, and only the support mechanism needs to be provided to fix the edge of the substrate 100. When the substrate 100 is not rigid enough and the sagging degree of the middle portion exceeds the allowable degree of exposure, a tensioning mechanism is required to apply a tensioning force parallel to the surface of the substrate 100 to the edge of the substrate 100 to control the sagging degree of the middle portion of the substrate 100. Of course, in some cases, both the tensioning mechanism and the support mechanism may be provided to support and tension the substrate 100 at different locations.
In some embodiments of the present invention, the substrate leveling apparatus for double-sided digital exposure further comprises a detection feedback mechanism for detecting the flatness of the surface of the substrate 100 and adjusting the supporting force according to the flatness so that the flatness of the substrate 100 is within the allowable range of the exposure process. Specifically, a detection feedback mechanism may be formed by the flatness detector and the controller, and the controller adjusts the operating current of the eddy current assembly 310 according to the data fed back by the flatness detector, so as to achieve the purpose of changing the magnitude of the supporting force.
In some embodiments of the present invention, as shown in FIG. 1, the eddy current assembly 310 includes an eddy current coil 311 disposed on the substrate 100 and located at the periphery of the exposure area, and an input contact 312 connected to the eddy current coil 311, wherein the eddy current coil 311 is located at the periphery of the exposure area so that it cannot block the light path of the exposure. The eddy current coils 311 are symmetrically distributed along the center of the substrate 100 so that the magnetic field generated by them is uniformly distributed. The input contact 312 is electrically connected to the detection feedback mechanism, the detection feedback mechanism detects the flatness of the surface of the substrate 100, and when the flatness of the substrate 100 is not within the allowable range of the exposure process, the detection feedback mechanism adjusts the input current of the input contact 312, thereby achieving the purpose of adjusting the magnitude of the supporting force. As shown in fig. 2, the magnetic assembly 320 is disposed directly above and/or below the center of the substrate 100, so that the magnetic force acting on the substrate 100 is more uniform.
In some embodiments of the present invention, the eddy current coil 311 is further formed by spatial projection imaging maskless lithography, and is formed as a part of the substrate 100, and only needs to be led out of the corresponding input contact 312 when in use. The mode can greatly improve the consistency of the electrical performance parameters, increase the electromagnetic coupling degree of the electromagnetic coupling device and reduce the distributed capacitance of the electromagnetic coupling device.
In some embodiments of the present invention, further, the eddy current coil 311 is manufactured and formed by an FPC manufacturing process, and has the characteristics of light weight, thin thickness and good bending property, and can be directly attached to the surface of the substrate 100 by an adhesive method.
In some embodiments of the present invention, further, the eddy current coil 311 is assembled by a hot stamping technique, and coils with various standard specifications are produced according to the actual process and the stress condition of the substrate 100, and then are formed on the substrate 100 by the hot stamping technique, and finally the input contact 312 is led out thereon, so that the production cost can be greatly reduced.
In some embodiments of the present invention, the magnetic assembly 320 includes a permanent magnet and/or an electromagnet disposed on the substrate 100 and located at the periphery of the exposure region, the magnetic field generated by the permanent magnet and/or the electromagnet is symmetrically distributed along the center of the substrate 100, the eddy current assembly 310 is disposed directly above and/or below the center of the substrate 100, and the eddy current assembly 310 is electrically connected to the inspection feedback mechanism.
In some embodiments of the present invention, the magnetic assembly 320 includes at least one set of permanent magnets disposed in the center of the substrate 100, the magnetic field generated by the permanent magnets is symmetrically distributed along the center of the substrate 100, the eddy current assembly 310 is disposed directly above and/or directly below the center of the substrate 100, the eddy current assembly 310 is connected to the detection feedback mechanism, and the permanent magnets are made of transparent magnetic material to form a transparent structure, so that they cannot block the light path of the exposure light.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (9)
1. A substrate flattening apparatus for double-sided digital exposure, comprising:
a fixing mechanism (200) for preliminarily positioning the substrate (100);
the suspension auxiliary supporting mechanism (300) comprises an eddy current component (310) and a magnetic component (320), wherein the eddy current component (310) and the magnetic component (320) interact to exert a supporting force vertical to the surface of the substrate (100).
2. The substrate flattening apparatus for double-sided digital exposure according to claim 1, characterized in that the fixing mechanism (200) comprises a tensioning mechanism and/or a supporting mechanism.
3. The substrate flattening apparatus for double-sided digital exposure according to claim 1, further comprising a detection feedback mechanism for detecting flatness of the surface of the substrate (100) and adjusting the magnitude of the supporting force according to the flatness.
4. The substrate flattening apparatus according to claim 3, wherein the eddy current assembly (310) comprises an eddy current coil (311) disposed on the substrate (100) and located at the periphery of the exposure region, and an input contact (312) connected to the eddy current coil (311), the eddy current coil (311) is symmetrically distributed along the center of the substrate (100), the input contact (312) is electrically connected to the detection feedback mechanism, and the magnetic assembly (320) is disposed directly above and/or below the center of the substrate (100).
5. The substrate flattening apparatus for double-sided digital exposure according to claim 4, characterized in that the eddy current coil (311) is shaped by a spatial projection imaging maskless lithography technique.
6. The substrate flattening apparatus for double-sided digital exposure according to claim 4, characterized in that the eddy current coil (311) is manufactured and shaped by FPC manufacturing process.
7. The substrate flattening apparatus for double-sided digital exposure according to claim 4, characterized in that the eddy current coil (311) is assembled by a hot stamping technique.
8. The substrate flattening apparatus according to claim 3, wherein the magnetic assembly (320) comprises a permanent magnet and/or an electromagnet disposed on the substrate (100) and located at the periphery of the exposure region, the magnetic field generated by the permanent magnet and/or the electromagnet is distributed symmetrically along the center of the substrate (100), the eddy current assembly (310) is disposed directly above and/or below the center of the substrate (100), and the eddy current assembly (310) is electrically connected to the detection feedback mechanism.
9. The substrate flattening apparatus according to claim 3, wherein the magnetic assembly (320) comprises at least one set of permanent magnets disposed in the center of the substrate (100), the magnetic field generated by the permanent magnets is distributed symmetrically along the center of the substrate (100), the eddy current assembly (310) is disposed directly above and/or below the center of the substrate (100), the eddy current assembly (310) is connected to the detection feedback mechanism, and the permanent magnets are transparent structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011596251.2A CN112739028A (en) | 2020-12-29 | 2020-12-29 | Base material leveling device for double-sided digital exposure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011596251.2A CN112739028A (en) | 2020-12-29 | 2020-12-29 | Base material leveling device for double-sided digital exposure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112739028A true CN112739028A (en) | 2021-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011596251.2A Pending CN112739028A (en) | 2020-12-29 | 2020-12-29 | Base material leveling device for double-sided digital exposure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112739028A (en) |
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2020
- 2020-12-29 CN CN202011596251.2A patent/CN112739028A/en active Pending
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