CN105957825A - Working method of multi-platform workbench for manufacturing integrated circuit - Google Patents
Working method of multi-platform workbench for manufacturing integrated circuit Download PDFInfo
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- CN105957825A CN105957825A CN201610574255.8A CN201610574255A CN105957825A CN 105957825 A CN105957825 A CN 105957825A CN 201610574255 A CN201610574255 A CN 201610574255A CN 105957825 A CN105957825 A CN 105957825A
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- wafer
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- motor
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a working method of a multi-platform workbench for manufacturing an integrated circuit. The method comprises the steps as follows: (1) to-be-processed wafers are placed by a clamping device; (2) a control chip controls a main motor through a frequency converter, the main motor rotates and a first to-be-processed wafer is rotated to a work position; (3) an integrated circuit manufacturing and processing device processes the wafer at the work position, the first to-be-processed wafer is shifted out of the work position and a second to-be-processed wafer is shifted into the work position after processing is completed; (4) the integrated circuit manufacturing and processing device processes the second to-be-processed wafer at the work position, meanwhile, the first to-be-processed wafer is shifted out of the workbench by the clamping device and a new to-be-processed wafer is added; and (5) the steps (3) and (4) are repeated. According to the method disclosed by the invention, the work efficiency of manufacturing a semiconductor can be greatly improved; the work process of manufacturing the semiconductor is continuous; and the method disclosed by the invention is suitable for multiple work processes of manufacturing the semiconductor, is wide in application range and suitable for promotion and application.
Description
Technical field
The present invention relates to IC manufacturing field, be specifically related to a kind of multi-platform work of IC manufacturing
The method of work of platform.
Background technology
In ic manufacturing process, need to use relevant device, to the wafer being positioned on workbench
(wafer) process, such as, it is carried out the flow process such as photoetching, ion implanting.In the prior art,
On workbench, to place wafer mostly, pending complete after, use clamping device removed,
And move into untreated wafer.This kind of process moving process is lost time more, and processing procedure time mobile
Can suspend, whole work efficiency is low.
Summary of the invention
For the deficiencies in the prior art, the invention discloses the multi-platform workbench of a kind of IC manufacturing
Method of work.
Technical scheme is as follows:
A kind of IC manufacturing method of work of multi-platform workbench, comprises the following steps:
Step 1, use clamping device, place pending wafer on each secondary rotating circular disk.
Step 2, control chip pass through Frequency Converter Control mair motor, and mair motor rotates, by the first pending crystalline substance
Circle rotates to working position；Control chip passes through Frequency Converter Control auxiliary-motor, and auxiliary-motor drives secondary rotary shaft to rotate,
First pending wafer is adjusted to optimum position；IC manufacturing processing means is to the wafer on working position
Process；
After step 3, process terminate, control chip passes through Frequency Converter Control mair motor, and mair motor rotates,
Drive main rotating shaft rotates, by the first pending wafer removal working position, the second pending wafer immigration work
Position.
Step 4, control chip pass through Frequency Converter Control auxiliary-motor, and auxiliary-motor drives secondary rotary shaft to rotate, will
Second pending wafer adjusts to optimum position；IC manufacturing processing means to being on working position
Two pending wafers process；Meanwhile, clamping device is by the first pending wafer removal workbench, and mends
Enter new pending wafer；
Step 5, repetition step 3, step 4.
The method have the benefit that:
The method of the invention, can be greatly improved the work efficiency of semiconductor manufacturing so that semiconductor manufacturing
Work process serialization, and method of the present invention is applicable to the workflow of multiple semiconductor manufacturing,
Applied widely, it is suitable for promoting the use of.
Accompanying drawing explanation
Fig. 1 is device schematic diagram used in the present invention.
Detailed description of the invention
Fig. 1 is device schematic diagram used in the present invention.Device the most used in the present invention includes
Main rotating shaft 6.Main rotating circular disk 1 it is fixed with on main rotating shaft 6.It is fixed with on main rotating circular disk 1
Multiple secondary rotary shafts 2.Multiple secondary rotary shafts 2 are the most uniformly fixed.It is fixed with pair on secondary rotary shaft 2
Rotating circular disk 3.The upper end of secondary rotating circular disk 3 is provided with wafer fixed bit 4.Workbench is provided above collection
Circuit is become to manufacture processing means 5.Main rotating shaft 6 is by mair motor control.Each secondary rotary shaft 2 is by auxiliary-motor
Control.Mair motor and auxiliary-motor are connected to control chip by converter respectively.
Wherein, IC manufacturing processing means 5 is ion implantation device, mechanical grinding device, photoetching set
Standby or Wafer Cleaning equipment.If using workbench as an entirety, be positioned in vacuum equipment, integrated
It can also be vapor deposition apparatus that circuit manufactures processing means 5.
The operating process of the present invention is:
Step 1, use clamping device, place pending wafer on each secondary rotating circular disk 3.
Step 2, control chip pass through converter, control mair motor, and mair motor rotates, pending by first
Wafer rotates to working position；Control chip passes through converter, controls auxiliary-motor, and auxiliary-motor drives secondary rotary shaft
2 rotate, and adjust wafer to optimum position；IC manufacturing processing means 5 is to the wafer on working position
Process；
After step 3, process terminate, control chip passes through converter, controls mair motor, and mair motor rotates,
Driving main rotating shaft 6 to rotate, by the first pending wafer removal working position, the second pending wafer moves into work
Make position.
Step 4, control chip pass through converter, control auxiliary-motor, and auxiliary-motor drives secondary rotary shaft 2 to rotate,
Wafer is adjusted to optimum position；Wafer on working position is processed by IC manufacturing processing means 5；
Meanwhile, clamping device is by the first pending wafer removal workbench, and fills into new pending wafer.
Visible, the present invention substantially increases work efficiency so that semiconductor manufacture flow path serialization.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.Permissible
Understanding, those skilled in the art the most directly derive or associate
The oher improvements and changes arrived, within being all considered as being included in protection scope of the present invention.
Claims (1)
1. the IC manufacturing method of work of multi-platform workbench, it is characterised in that include with
Lower step:
Step 1, use clamping device, place pending wafer on each secondary rotating circular disk (3)；
Step 2, control chip pass through Frequency Converter Control mair motor, and mair motor rotates, by the first pending crystalline substance
Circle rotates to working position；Control chip passes through Frequency Converter Control auxiliary-motor, and auxiliary-motor drives secondary rotary shaft (2)
Rotate, the first pending wafer is adjusted to optimum position；IC manufacturing processing means (5) is to work
The wafer made on position processes；
After step 3, process terminate, control chip passes through Frequency Converter Control mair motor, and mair motor rotates,
Driving main rotating shaft (6) to rotate, by the first pending wafer removal working position, the second pending wafer moves
Enter working position；
Step 4, control chip pass through Frequency Converter Control auxiliary-motor, and auxiliary-motor drives secondary rotary shaft (2) to rotate,
Second pending wafer is adjusted to optimum position；IC manufacturing processing means (5) is to being in work
The second pending wafer on position processes；Meanwhile, clamping device is by the first pending wafer removal work
Platform, and fill into new pending wafer；
Step 5, repetition step 3 and step 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610574255.8A CN105957825A (en) | 2016-07-19 | 2016-07-19 | Working method of multi-platform workbench for manufacturing integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610574255.8A CN105957825A (en) | 2016-07-19 | 2016-07-19 | Working method of multi-platform workbench for manufacturing integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105957825A true CN105957825A (en) | 2016-09-21 |
Family
ID=56901173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610574255.8A Pending CN105957825A (en) | 2016-07-19 | 2016-07-19 | Working method of multi-platform workbench for manufacturing integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105957825A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115775735A (en) * | 2022-12-02 | 2023-03-10 | 江苏东海半导体股份有限公司 | Preparation method of silicon carbide accumulation state MOSFET with groove |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5140774A (en) * | 1991-10-31 | 1992-08-25 | System Seiko Co., Ltd. | Apparatus for polishing hard disk substrates |
| US6343975B1 (en) * | 1999-10-05 | 2002-02-05 | Peter Mok | Chemical-mechanical polishing apparatus with circular motion pads |
| KR20110028205A (en) * | 2009-09-11 | 2011-03-17 | 주식회사 아이매스 | Rotary type polishing apparatus for wafer |
| CN102560432A (en) * | 2010-12-13 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate loading device and substrate processing device applying same |
| CN102934220A (en) * | 2010-06-07 | 2013-02-13 | 威科仪器有限公司 | Multi-wafer rotating disc reactor with inertial planetary drive |
-
2016
- 2016-07-19 CN CN201610574255.8A patent/CN105957825A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5140774A (en) * | 1991-10-31 | 1992-08-25 | System Seiko Co., Ltd. | Apparatus for polishing hard disk substrates |
| US6343975B1 (en) * | 1999-10-05 | 2002-02-05 | Peter Mok | Chemical-mechanical polishing apparatus with circular motion pads |
| KR20110028205A (en) * | 2009-09-11 | 2011-03-17 | 주식회사 아이매스 | Rotary type polishing apparatus for wafer |
| CN102934220A (en) * | 2010-06-07 | 2013-02-13 | 威科仪器有限公司 | Multi-wafer rotating disc reactor with inertial planetary drive |
| CN102560432A (en) * | 2010-12-13 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate loading device and substrate processing device applying same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115775735A (en) * | 2022-12-02 | 2023-03-10 | 江苏东海半导体股份有限公司 | Preparation method of silicon carbide accumulation state MOSFET with groove |
| CN115775735B (en) * | 2022-12-02 | 2023-11-07 | 江苏东海半导体股份有限公司 | Preparation method of silicon carbide accumulation state MOSFET with groove |
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Application publication date: 20160921 |
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| WD01 | Invention patent application deemed withdrawn after publication |