CN105950909A - Metal alloy heat conduction material and preparation method thereof - Google Patents
Metal alloy heat conduction material and preparation method thereof Download PDFInfo
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- CN105950909A CN105950909A CN201610298410.8A CN201610298410A CN105950909A CN 105950909 A CN105950909 A CN 105950909A CN 201610298410 A CN201610298410 A CN 201610298410A CN 105950909 A CN105950909 A CN 105950909A
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- heat conduction
- metal alloy
- conduction material
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a metal alloy heat conduction material and a preparation method thereof. The metal alloy heat conduction material is composed of, by mass, 19-37 parts of Pb, 15-42 parts of In, 15-28 parts of Sn, 38-54 parts of Bi, 0.6-1.2 parts of Zn, 0.2-0.8 part of Al and 0.01-0.6 part of Ga. The preparation method sequentially comprises the following processing steps that (1) mixing is conducted, specifically, Pb powder , In powder, Sn powder, Bi powder, Zn powder, Al powder and Ga powder are selected and are evenly mixed according to the ratio of the formula; (2) powder is placed in a vacuum heating furnace, the heating furnace is vacuumized to 0.5-1.5 Torr of air pressure, the temperature of the heating furnace is increased to 650-700 DEG C and is held for 1 hour at 650-700 DEG C; and (3) cooling is conducted, specifically, a heating power source is turned off, a product is naturally cooled to the room temperature, and the metal alloy heat conduction material is obtained. The heat conduction material has the characteristics of low melting point, high heat conduction efficiency and low cost.
Description
Technical field
The present invention relates to a kind of alloy material and preparation method thereof, be specifically related to a kind of metal alloy Heat Conduction Material and system thereof
Preparation Method.
Background technology
At present, microelectric technique develops rapidly so that electronic chip overall power density significantly increases, and heat flow density is the most therewith
Increase.Heat radiation quality can badly influence system stability and hardware longevity.Based on air-cooled, water-cooled and the traditional heat-dissipating of heat pipe
Technology cannot meet the booming needs of high performance chips.More novel heat dissipation technology, such as microchannel, thermoelectricity system
Cold and phase transformations etc., improve radiating efficiency to a certain extent.But being as high power density device large-scale application, these dissipate
The thermal technology the most day by day convergence limit.Chip technology proposes unprecedented urgent needs to high-performance heat dissipating method so that super
The research field of high heat flux chip cooling Showed Very Brisk the most in the world.Chip is the most all to pass through heat conduction
Silica gel connects chip surface and radiator module carries out heat and distributes.Make the most superior radiator and contact difficulty with heaters such as chips
Exempt from there is space, and the air between gap is the non-conductor of heat.The effect of heat conductive silica gel is to utilize its mobility to fill out
Fill gap between thermal source and spreader surface, enable them to more be fully contacted the purpose reaching to accelerate heat transfer.But, due to silicon
Glue is placed the most aging for a long time, and its extremely low thermal conductivity is the heat radiation bottleneck of whole system.
CN 103509987A discloses a kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof, and it is by by quality
The following components of number meter is prepared from；In50-56.5% part；Sn11.0-16.5% part；Bi31-37% part；Zn0-0.5%
Part.The fusing point of described low-melting point metal alloy Heat Conduction Material is 57-63 degree Celsius.But the heat conductivility of this Heat Conduction Material is also
Need to be improved further.
Summary of the invention
For the deficiencies in the prior art, first purpose of the present invention is to be to provide a kind of metal alloy Heat Conduction Material,
This Heat Conduction Material has that fusing point is low, heat transfer efficiency good and the feature of low cost.
Second object of the present invention is to provide for the preparation method of a kind of metal alloy Heat Conduction Material.
First purpose realizing the present invention can reach by adopting the following technical scheme that:
A kind of metal alloy Heat Conduction Material, it is prepared from by following components according to the mass fraction:
Preferably, the fusing point of described metal alloy Heat Conduction Material is 54-62 degree Celsius, as 56 degrees Celsius, 57 degrees Celsius,
58 degrees Celsius, 59 degrees Celsius, 60 degrees Celsius or 61 degrees Celsius.
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction:
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction:
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction:
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction:
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction:
Realize second object of the present invention to reach by adopting the following technical scheme that:
A kind of preparation method of metal alloy Heat Conduction Material, it comprises the following steps that successively:
1) mixing: choose the powder of Pb, In, Sn, Bi, Zn, Al and Ga of formula ratio, mix homogeneously；
2) vacuum furnace heating: the powder after mix homogeneously is contained in crucible, places in vacuum furnace, will add
Hot stove evacuation is to the air pressure of 0.5-1.5Torr；Then heating furnace is warmed up to 650-700 degree Celsius；Keep 650-700 afterwards
Degree Celsius 1 hour；
3) cooling: finally close heating power supply so that it is naturally cool to room temperature, obtain metal alloy Heat Conduction Material.
Step 2) in air pressure can be 0.5Torr, 0.6Torr, 0.8Torr, 1.0Torr, 1.2Torr, 1.4Torr or
1.5Torr etc., the temperature that described heating furnace heats up can be 650 degrees Celsius, 660 degrees Celsius, 670 degrees Celsius, 690 degrees Celsius or
700 degrees Celsius etc..
Preferably, in step 2) in, heating furnace is warmed up to 650-700 degree Celsius of time-consuming 0.5-1 hour, as 0.5 hour,
0.6 hour, 0.8 hour, 0.9 hour or 1.0 hours etc..
The beneficial effects of the present invention is:
1, the fusing point of alloy of the present invention is 54-62 degree Celsius.Therefore, this alloy is solid-state at normal temperatures.For side
Just use, lamellar can be rolled into.As by between this alloys adhesion and computer processor and radiator fan, in the temperature that generally works
Degree (> 70 degrees Celsius) under alloy be liquid by thawing, therefore we are called liquid alloy.
2, alloy of the present invention has higher thermal conductivity in the case of liquid.Measured, it is 80 to take the photograph in temperature
When family name spends, its thermal conductivity is 100-125W/mK.Compared with thermal conductivity 1-5W/mK of common heat conductive silica gel, performance has had tens of
Raising again.
3, the formula of the present invention is that applicant passes through to grope just to finally give to Phase Diagram of Materials analysis and preparation for a long time, adopts
Relevant heat conduction and thermal stability with the alloy material of this formula are the most excellent, can be prepared as liquid by controlling chilling temperature
State, paste and lamellar, operating temperature can be reduced to about 55 DEG C.This product can be not only used for high-performance server, desk-top
The chip heat pipe reason of machine, notebook, industrial computer and communication base station, and at advanced energy field, (industrial exhaust heat utilizes, solar energy
Generating, focuses on light cell cooling, fuel cell etc.), aviation thermal control field, battery cools down, field of photoelectric devices (such as projector,
Power electronics devices etc.), field of LED illumination, micro-nano electronic mechanical system, many crucial necks such as biochip and electric automobile
Territory plays indispensable role.In view of the cloud computing technology in the ascendant demand to high-end heat radiation, this product also may be used
To expand out more wide application.
Detailed description of the invention
Below, in conjunction with detailed description of the invention, the present invention is described further:
Following component is according to the mass fraction.
Embodiment 1:
A kind of metal alloy Heat Conduction Material, it is characterised in that it is prepared from by following components according to the mass fraction: Pb
(lead) 19 parts；In (indium) 42 parts；Sn (stannum) 15 parts；Bi (bismuth) 54 parts；Zn (zinc) 0.6 part；Al (aluminum) 0.8 part；Ga (gallium) 0.01
Part.The fusing point of this alloy material is 62 degrees Celsius.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 100W/mK.
A kind of preparation method of metal alloy Heat Conduction Material, it comprises the following steps that successively:
1) mixing: choose the powder of Pb, In, Sn, Bi, Zn, Al and Ga of formula ratio, mix homogeneously；
2) vacuum furnace heating: the powder after mix homogeneously is contained in crucible, places in vacuum furnace, will add
Hot stove evacuation is to the air pressure of 0.5-1.5Torr；Then heating furnace being warmed up to 650-700 degree Celsius, time-consuming 0.5-1 little
Time；Keep 650-700 degree Celsius afterwards 1 hour；
3) cooling: finally closing heating power supply so that it is naturally cool to room temperature, cool time is 2.5 hours, obtains metal
Alloy Heat Conduction Material.
Embodiment 2:
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 37 parts；In (indium) 15 parts；Sn (stannum) 28 parts；Bi (bismuth) 38 parts；Zn (zinc) 1.2 parts；Al (aluminum)
0.2 part；Ga (gallium) 0.6 part.The fusing point of this alloy material is 60 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 102W/mK.
Embodiment 3:
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 35 parts；In (indium) 18 parts；Sn (stannum) 27 parts；Bi (bismuth) 40 parts；Zn (zinc) 1.1 parts；Al (aluminum)
0.3 part；Ga (gallium) 0.5 part.The fusing point of this alloy material is 61 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 105W/mK.
Embodiment 4:
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 22 parts；In (indium) 40 parts；Sn (stannum) 17 parts；Bi (bismuth) 52 parts；Zn (zinc) 0.7 part；Al (aluminum)
0.7 part；Ga (gallium) 0.02 part.The fusing point of this alloy material is 58 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 108W/mK.
Embodiment 5:
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 24 parts；In (indium) 35 parts；Sn (stannum) 18 parts；Bi (bismuth) 48 parts；Zn (zinc) 0.7 part；Al (aluminum)
0.7 part；Ga (gallium) 0.05 part.The fusing point of this alloy material is 56 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 110W/mK.
Embodiment 6
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 33 parts；In (indium) 20 parts；Sn (stannum) 24 parts；Bi (bismuth) 43 parts；Zn (zinc) 1.0 parts；Al (aluminum)
0.4 part；Ga (gallium) 0.4 part.The fusing point of this alloy material is 59 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 107W/mK.
Embodiment 7
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 27 parts；In (indium) 30 parts；Sn (stannum) 20 parts；Bi (bismuth) 45 parts；Zn (zinc) 0.8 part；Al (aluminum)
0.5 part；Ga (gallium) 0.1 part.The fusing point of this alloy material is 54 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 125W/mK.
Embodiment 8
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 29 parts；In (indium) 28 parts；Sn (stannum) 21 parts；Bi (bismuth) 46 parts；Zn (zinc) 0.9 part；Al (aluminum)
0.6 part；Ga (gallium) 0.15 part.The fusing point of this alloy material is 55 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 120W/mK.
Embodiment 9
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 26 parts；In (indium) 32 parts；Sn (stannum) 19 parts；Bi (bismuth) 47 parts；Zn (zinc) 0.8 part；Al (aluminum)
0.6 part；Ga (gallium) 0.1 part.The fusing point of this alloy material is 60 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 112W/mK.
Embodiment 10
The feature of the present embodiment is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from: Pb (lead) 30 parts；In (indium) 25 parts；Sn (stannum) 22 parts；Bi (bismuth) 47 parts；Zn (zinc) 1.0 parts；Al (aluminum)
0.4 part；Ga (gallium) 0.2 part.The fusing point of this alloy material is 59 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 117W/mK.
Temperature test: 1, the test system described in employing table 1 carries out temperature test.
Table 1 test system configurations table
Surface-coated silica gel of the prior art at the CPU of desktop computer, carries out temperature test.CPU at desktop computer
Metal alloy Heat Conduction Material in surface configuration embodiment 1-10 of the present invention, carries out temperature test, and test result is shown in Table 2.
Table 2CPU tests temperature comparisons's table
As it can be seen from table 1 use the alloy Heat Conduction Material of the embodiment of the present invention, CPU when running IntelBurn Test
Peak temperature reduce more than 17 DEG C.
3, at the surface-coated silica gel of the prior art of the video card of desktop computer, temperature test is carried out.Showing at desktop computer
Metal alloy Heat Conduction Material in the surface configuration embodiment of the present invention of card, carries out temperature test, and test result is shown in Table 3.
Table 3 display card test temperature comparisons's table
From table 3 it can be seen that use the alloy Heat Conduction Material of the embodiment of the present invention, the temperature of video card when running FurMark
Reduce more than 16 DEG C.
For a person skilled in the art, can technical scheme as described above and design, make other each
Plant corresponding change and deformation, and all these changes and deforms the protection model that all should belong to the claims in the present invention
Within enclosing.
Applicant states, the foregoing is only the detailed description of the invention of the present invention, but protection scope of the present invention not office
Being limited to this, person of ordinary skill in the field is it will be clearly understood that any those skilled in the art of belonging to take off in the present invention
In the technical scope of dew, the change that can readily occur in or replacement, within the scope of all falling within protection scope of the present invention and disclosure.
Claims (9)
1. a metal alloy Heat Conduction Material, it is characterised in that described material is prepared from the following components by mass fraction:
Metal alloy Heat Conduction Material the most according to claim 1, it is characterised in that: described metal alloy Heat Conduction Material
Fusing point is 54-62 degree Celsius.
Metal alloy Heat Conduction Material the most according to claim 1 and 2, it is characterised in that: below according to the mass fraction
Component is prepared from:
4. according to the metal alloy Heat Conduction Material one of claim 1-3 Suo Shu, it is characterised in that: by according to the mass fraction with
Lower component is prepared from:
5. according to the metal alloy Heat Conduction Material one of claim 1-4 Suo Shu, it is characterised in that: by according to the mass fraction with
Lower component is prepared from:
6. according to the metal alloy Heat Conduction Material one of claim 1-5 Suo Shu, it is characterised in that: by according to the mass fraction with
Lower component is prepared from:
7. according to the metal alloy Heat Conduction Material one of claim 1-6 Suo Shu, it is characterised in that: by according to the mass fraction with
Lower component is prepared from:
8. according to the preparation method of the metal alloy Heat Conduction Material one of claim 1-7 Suo Shu, it is characterised in that include successively
Following processing step:
1) mixing: choose the powder of Pb, In, Sn, Bi, Zn, Al and Ga of formula ratio, mix homogeneously；
2) vacuum furnace heating: the powder after mix homogeneously is contained in crucible, places in vacuum furnace, by heating furnace
It is evacuated down to the air pressure of 0.5-1.5Torr；Then heating furnace is warmed up to 650-700 degree Celsius；Keep 650-700 Celsius afterwards
Spend 1 hour；
3) cooling: finally close heating power supply so that it is naturally cool to room temperature, obtain metal alloy Heat Conduction Material.
The preparation method of metal alloy Heat Conduction Material the most according to claim 8, it is characterised in that: in step 2) in, add
Hot stove is warmed up to 650-700 degree Celsius of time-consuming 0.5-1 hour.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435329A (en) * | 2016-09-30 | 2017-02-22 | 无锡市明盛强力风机有限公司 | Metal alloy heat conduction material and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346418A (en) * | 1976-10-08 | 1978-04-26 | Seiko Epson Corp | Low melting point alloy |
| US6367683B1 (en) * | 1997-07-10 | 2002-04-09 | Materials Resources International | Solder braze alloy |
| CN104032199A (en) * | 2014-06-17 | 2014-09-10 | 北京依米康科技发展有限公司 | Low-melting-point liquid metal and preparation method and application thereof |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
-
2016
- 2016-05-04 CN CN201610298410.8A patent/CN105950909B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346418A (en) * | 1976-10-08 | 1978-04-26 | Seiko Epson Corp | Low melting point alloy |
| US6367683B1 (en) * | 1997-07-10 | 2002-04-09 | Materials Resources International | Solder braze alloy |
| CN104032199A (en) * | 2014-06-17 | 2014-09-10 | 北京依米康科技发展有限公司 | Low-melting-point liquid metal and preparation method and application thereof |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106435329A (en) * | 2016-09-30 | 2017-02-22 | 无锡市明盛强力风机有限公司 | Metal alloy heat conduction material and preparation method thereof |
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