CN106435329A - Metal alloy heat conduction material and preparation method thereof - Google Patents
Metal alloy heat conduction material and preparation method thereof Download PDFInfo
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- CN106435329A CN106435329A CN201610877000.9A CN201610877000A CN106435329A CN 106435329 A CN106435329 A CN 106435329A CN 201610877000 A CN201610877000 A CN 201610877000A CN 106435329 A CN106435329 A CN 106435329A
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- heat conduction
- metal alloy
- conduction material
- alloy heat
- powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
Abstract
The invention discloses a metal alloy heat conduction material and a preparation method thereof. The metal alloy heat conduction material is prepared from, by mass, following components including 19-37 parts of Pb, 38-54 parts of Bi, 0.6-1.2 parts of Zn, 0.2-0.8 part of Al, 0.01-0.6 part of Ga, 0.02-0.05 part of In and 0.01-0.03 part of Ba. The preparation method sequentially comprises the following processing steps that firstly, mixing is conducted, and specifically, Pb powder, Bi powder, Zn powder, Al powder, Ga powder, In powder and Ba powder are selected and mixed to be uniform according to a formula proportion; secondly, the powder is put into a vacuum heating furnace, and the heating furnace is vacuumized until the air pressure is 0.5-1.5 Torr, next, the temperature of the heating furnace is raised to 650-700 DEG C, and then the temperature of 650-700 DEG C is kept for 1 hour; and thirdly, cooling is carried out, finally, a heating power source is turned off, the heating furnace is naturally cooled to the room temperature, and the metal alloy heat conduction material is obtained. The heat conduction material has the beneficial effects of being low in melting point, good in heat conduction efficiency and low in cost.
Description
Technical field
The present invention relates to a kind of alloy material and preparation method thereof, be specifically related to a kind of metal alloy Heat Conduction Material and system thereof
Preparation Method.
Background technology
At present, microelectric technique develops rapidly so that electronic chip overall power density significantly increases, and heat flow density is also therewith
Increase.Heat radiation quality can badly influence the stability of a system and hardware longevity.Based on air-cooled, the traditional heat-dissipating of water-cooled and heat pipe
Technology cannot meet the booming needs of high performance chips.More novel heat dissipation technology, such as microchannel, thermoelectricity system
Cold and phase transformations etc., improve radiating efficiency to a certain extent.But being as high power density device large-scale application, these dissipate
The thermal technology also day by day convergence limit.Chip technology proposes unprecedented active demand to high-performance heat dissipating method so that super
The research field of high heat flux chip cooling Showed Very Brisk always in the world.Chip is all to pass through heat conduction under many circumstances
Silica gel connects chip surface and radiator module carries out heat and distributes.Make again the heater such as superior radiator and chip contact difficulty
Exempt from there is space, and the air between gap is the non-conductor of heat.The effect of heat conductive silica gel is to utilize its mobility to fill out
Fill gap between thermal source and spreader surface, enable them to more be fully contacted the purpose reaching to accelerate heat transfer.But, due to silicon
Glue is placed easily aging in atmosphere for a long time, and its extremely low thermal conductivity is the heat radiation bottleneck of whole system.
CN 103509987 A discloses a kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof, and it is by by quality
The following components of number meter is prepared from；In50-56.5% part；Sn11.0-16.5% part；Bi31-37% part；Zn0-0.5%
Part.The fusing point of described low-melting point metal alloy Heat Conduction Material is 57-63 degree Celsius.But the heat conductivility of this Heat Conduction Material is also
Need to be improved further.
Content of the invention
For the deficiencies in the prior art, first purpose of the present invention is to be to provide a kind of metal alloy Heat Conduction Material,
This Heat Conduction Material has that fusing point is low, heat transfer efficiency good and the feature of low cost.
Second object of the present invention is to provide for the preparation method of a kind of metal alloy Heat Conduction Material.
Realize that first purpose of the present invention can be reached by adopting the following technical scheme that：
A kind of metal alloy Heat Conduction Material, it is prepared from by following components according to the mass fraction：
Preferably, the fusing point of described metal alloy Heat Conduction Material is 55-64 degree Celsius, as 56 degrees Celsius, 57 degrees Celsius,
58 degrees Celsius, 59 degrees Celsius, 60 degrees Celsius, 61 degrees Celsius, 62 degrees Celsius or 63 degrees Celsius etc..
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction：
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction：
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction：
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction：
Preferably, described metal alloy Heat Conduction Material is prepared from by following components according to the mass fraction：
Realize that second object of the present invention can be reached by adopting the following technical scheme that：
The preparation method of a kind of metal alloy Heat Conduction Material, it comprises the following steps that successively：
1) mix：Choose the powder of Pb, Bi, Zn, Al, Ga, In and Ba of formula ratio, mix；
2) vacuum furnace heating：Powder after mixing is contained in crucible, places in vacuum furnace, will add
Hot stove evacuation is to the air pressure of 0.5-1.5Torr；Then heating furnace is warmed up to 650-700 degree Celsius；Keep 650-700 afterwards
Degree Celsius 1 hour；
3) cool down：Finally close heating power supply so that it is naturally cool to room temperature, obtain metal alloy Heat Conduction Material.
Step 2) in air pressure can be 0.5Torr, 0.6Torr, 0.8Torr, 1.0Torr, 1.2Torr, 1.4Torr or
1.5Torr etc., the temperature that described heating furnace heats up can be 650 degrees Celsius, 660 degrees Celsius, 670 degrees Celsius, 690 degrees Celsius or
700 degrees Celsius etc..
Preferably, in step 2) in, heating furnace is warmed up to 650-700 degree Celsius of time-consuming 0.5-1 hour, as 0.5 hour,
0.6 hour, 0.8 hour, 0.9 hour or 1.0 hours etc..
The beneficial effects of the present invention is：
1st, the fusing point of alloy of the present invention is 55-64 degree Celsius.Therefore, this alloy is solid-state at normal temperatures.For side
Just use, sheet can be rolled into.As by between this alloys adhesion and computer processor and radiator fan, in usual work temperature
Degree (>70 degrees Celsius) under alloy by thawing be liquid, therefore we are called liquid alloy.
2nd, alloy of the present invention has higher thermal conductivity in the case of liquid.Measured, it is 80 to take the photograph in temperature
When family name spends, its thermal conductivity is 102-115W/mK.Compared with thermal conductivity 1-5W/mK of common heat conductive silica gel, performance has had tens of
Raising again.
3rd, the formula of the present invention be applicant by for a long time to Phase Diagram of Materials analysis and preparation grope just finally give, adopt
Very excellent with the related heat conduction and thermal stability of the alloy material of this formula, can be prepared as liquid by controlling chilling temperature
State, paste and sheet, operating temperature can be reduced to about 55 DEG C.This product can be not only used for high-performance server, desk-top
The chip heat pipe reason of machine, notebook, industrial computer and communication base station, and at advanced energy field, (industrial exhaust heat utilizes, solar energy
Generating, focuses on photocell cooling, fuel cell etc.), aviation thermal control field, battery cools down, field of photoelectric devices (such as projecting apparatus,
Power electronics devices etc.), field of LED illumination, micro-nano electronic mechanical system, many crucial necks such as biochip and electric automobile
Territory plays indispensable role.In view of the cloud computing technology in the ascendant demand to high-end heat radiation, this product also may be used
To expand out more wide application.
Detailed description of the invention
Below, in conjunction with detailed description of the invention, the present invention is described further：
Following component is according to the mass fraction.
Embodiment 1：
A kind of metal alloy Heat Conduction Material, it is characterised in that it is prepared from by following components according to the mass fraction：Pb
(lead) 19 parts；Bi (bismuth) 54 parts；Zn (zinc) 0.6 part；Al (aluminium) 0.8 part；Ga (gallium) 0.01 part；In (indium) 0.02 part；Ba (barium)
0.03 part.The fusing point of this alloy material is 62 degrees Celsius.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 102W/mK.
The preparation method of a kind of metal alloy Heat Conduction Material, it comprises the following steps that successively：
1) mix：Choose the powder of Pb, Sn, Bi, Zn, Al, Ga, In and Ba of formula ratio, mix；
2) vacuum furnace heating：Powder after mixing is contained in crucible, places in vacuum furnace, will add
Hot stove evacuation is to the air pressure of 0.5Torr；Then heating furnace is warmed up to 700 degrees Celsius, time-consuming 0.5 hour；Keep afterwards
700 degrees Celsius of 1 hours；
3) cool down：Finally close heating power supply so that it is naturally cooling to room temperature, cool time is 2.5 hours, obtains metal
Alloy Heat Conduction Material.
Embodiment 2：
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 37 parts；Bi (bismuth) 38 parts；Zn (zinc) 1.2 parts；Al (aluminium) 0.2 part；Ga (gallium) 0.6 part；In
(indium) 0.05 part；Ba (barium) 0.01 part.The fusing point of this alloy material is 60 degrees Celsius.
The preparation method of a kind of metal alloy Heat Conduction Material, it comprises the following steps that successively：
1) mix：Choose the powder of Pb, Sn, Bi, Zn, Al, Ga, In and Ba of formula ratio, mix；
2) vacuum furnace heating：Powder after mixing is contained in crucible, places in vacuum furnace, will add
Hot stove evacuation is to the air pressure of 1.5Torr；Then heating furnace is warmed up to 650 degrees Celsius, time-consuming 1 hour；Keep 650 afterwards
Degree Celsius 1 hour；
3) cool down：Finally close heating power supply so that it is naturally cooling to room temperature, cool time is 2.5 hours, obtains metal
Alloy Heat Conduction Material.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 102W/mK.
Embodiment 3：
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 35 parts；Bi (bismuth) 40 parts；Zn (zinc) 1.1 parts；Al (aluminium) 0.3 part；Ga (gallium) 0.5 part；In
(indium) 0.03 part；Ba (barium) 0.02 part.The fusing point of this alloy material is 61 degrees Celsius.
The preparation method of a kind of metal alloy Heat Conduction Material, it comprises the following steps that successively：
1) mix：Choose the powder of Pb, Sn, Bi, Zn, Al, Ga, In and Ba of formula ratio, mix；
2) vacuum furnace heating：Powder after mixing is contained in crucible, places in vacuum furnace, will add
Hot stove evacuation is to the air pressure of 1.0Torr；Then heating furnace is warmed up to 680 degrees Celsius, time-consuming 0.7 hour；Keep afterwards
680 degrees Celsius of 1 hours；
3) cool down：Finally close heating power supply so that it is naturally cooling to room temperature, cool time is 2.5 hours, obtains metal
Alloy Heat Conduction Material.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 105W/mK.
Embodiment 4：
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 22 parts；Bi (bismuth) 52 parts；Zn (zinc) 0.7 part；Al (aluminium) 0.7 part；Ga (gallium) 0.02 part；In
(indium) 0.03 part；Ba (barium) 0.02 part.The fusing point of this alloy material is 58 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 108W/mK.
Embodiment 5：
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 24 parts；Bi (bismuth) 48 parts；Zn (zinc) 0.7 part；Al (aluminium) 0.7 part；Ga (gallium) 0.05 part；In
(indium) 0.04 part；Ba (barium) 0.02 part.The fusing point of this alloy material is 55 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 110W/mK.
Embodiment 6
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 33 parts；Bi (bismuth) 43 parts；Zn (zinc) 1.0 parts；Al (aluminium) 0.4 part；Ga (gallium) 0.4 part；In
(indium) 0.03 part；Ba (barium) 0.03 part.The fusing point of this alloy material is 59 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 107W/mK.
Embodiment 7
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 27 parts；Bi (bismuth) 45 parts；Zn (zinc) 0.8 part；Al (aluminium) 0.5 part；Ga (gallium) 0.1 part；In
(indium) 0.02 part；Ba (barium) 0.02 part.The fusing point of this alloy material is 56 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 115W/mK.
Embodiment 8
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 29 parts；Bi (bismuth) 46 parts；Zn (zinc) 0.9 part；Al (aluminium) 0.6 part；Ga (gallium) 0.15 part；In
(indium) 0.02 part；Ba (barium) 0.03 part.The fusing point of this alloy material is 55 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 110W/mK.
Embodiment 9
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 26 parts；Bi (bismuth) 47 parts；Zn (zinc) 0.8 part；Al (aluminium) 0.6 part；Ga (gallium) 0.1 part；In
(indium) 0.03 part；Ba (barium) 0.02 part.The fusing point of this alloy material is 64 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 112W/mK.
Embodiment 10
The feature of the present embodiment is：A kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared from：Pb (lead) 30 parts；Bi (bismuth) 47 parts；Zn (zinc) 1.0 parts；Al (aluminium) 0.4 part；Ga (gallium) 0.2 part；In
(indium) 0.02 part；Ba (barium) 0.02 part.The fusing point of this alloy material is 59 degrees Celsius.Other are identical with specific embodiment 1.
Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 110W/mK.
Temperature test：1st, the test system described in employing table 1 carries out temperature test.
Table 1 test system configurations table
At the surface coating silica gel of the prior art of the CPU of desktop computer, carry out temperature test.CPU at desktop computer
Metal alloy Heat Conduction Material in surface configuration embodiment 1-10 of the present invention, carries out temperature test, and test result is shown in Table 2.
Table 2CPU tests temperature comparisons's table
As it can be seen from table 1 use the alloy Heat Conduction Material of the embodiment of the present invention, CPU when running IntelBurn Test
Peak temperature reduce more than 17 DEG C.
3rd, the surface at the video card of desktop computer coats silica gel of the prior art, carries out temperature test.Showing at desktop computer
Metal alloy Heat Conduction Material in the surface configuration embodiment of the present invention of card, carries out temperature test, and test result is shown in Table 3.
Table 3 display card test temperature comparisons's table
From table 3 it can be seen that use the alloy Heat Conduction Material of the embodiment of the present invention, the temperature of video card when running FurMark
Reduce more than 18 DEG C.
For a person skilled in the art, can technical scheme as described above and design, make other each
Plant corresponding change and deformation, and all these changes and deforms the protection model that all should belong to the claims in the present invention
Within enclosing.
Applicant states, the foregoing is only the detailed description of the invention of the present invention, but protection scope of the present invention not office
Being limited to this, person of ordinary skill in the field is it will be clearly understood that any those skilled in the art of belonging to take off in the present invention
In the technical scope of dew, the change that can readily occur in or replacement, within the scope of all falling within protection scope of the present invention and disclosure.
Claims (9)
1. a metal alloy Heat Conduction Material, it is characterised in that described material is prepared from the following components by mass fraction：
2. metal alloy Heat Conduction Material according to claim 1, it is characterised in that：Described metal alloy Heat Conduction Material
Fusing point is 55-64 degree Celsius.
3. metal alloy Heat Conduction Material according to claim 1 and 2, it is characterised in that：Below according to the mass fraction
Component is prepared from：
4. the metal alloy Heat Conduction Material according to one of claim 1-3, it is characterised in that：By according to the mass fraction with
Lower component is prepared from：
5. the metal alloy Heat Conduction Material according to one of claim 1-4, it is characterised in that：By according to the mass fraction with
Lower component is prepared from：
6. the metal alloy Heat Conduction Material according to one of claim 1-5, it is characterised in that：By according to the mass fraction with
Lower component is prepared from：
7. the metal alloy Heat Conduction Material according to one of claim 1-6, it is characterised in that：By according to the mass fraction with
Lower component is prepared from：
8. the preparation method of the metal alloy Heat Conduction Material according to one of claim 1-7, it is characterised in that include successively
Following processing step：
1) mix：Choose the powder of Pb, Bi, Zn, Al, Ga, In and Ba of formula ratio, mix；
2) vacuum furnace heating：Powder after mixing is contained in crucible, places in vacuum furnace, by heating furnace
It is evacuated down to the air pressure of 0.5-1.5Torr；Then heating furnace is warmed up to 650-700 degree Celsius；Keep 650-700 Celsius afterwards
Spend 1 hour；
3) cool down：Finally close heating power supply so that it is naturally cool to room temperature, obtain metal alloy Heat Conduction Material.
9. the preparation method of metal alloy Heat Conduction Material according to claim 8, it is characterised in that：In step 2) in, add
Hot stove is warmed up to 650-700 degree Celsius of time-consuming 0.5-1 hour.
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Application publication date: 20170222 |