CN105950098A - 一种倒装大功率led封装结构用粘结剂 - Google Patents
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- 239000011230 binding agent Substances 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 26
- 239000004945 silicone rubber Substances 0.000 claims abstract description 21
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 14
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims abstract description 14
- OLLFKUHHDPMQFR-UHFFFAOYSA-N dihydroxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](O)(O)C1=CC=CC=C1 OLLFKUHHDPMQFR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 12
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims abstract description 5
- 238000005538 encapsulation Methods 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 14
- QPKFVRWIISEVCW-UHFFFAOYSA-N 1-butane boronic acid Chemical compound CCCCB(O)O QPKFVRWIISEVCW-UHFFFAOYSA-N 0.000 claims description 13
- 239000002994 raw material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 10
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 9
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 229910021485 fumed silica Inorganic materials 0.000 abstract 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 abstract 1
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 abstract 1
- 235000010215 titanium dioxide Nutrition 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 229910000004 White lead Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- PQMFVUNERGGBPG-UHFFFAOYSA-N (6-bromopyridin-2-yl)hydrazine Chemical compound NNC1=CC=CC(Br)=N1 PQMFVUNERGGBPG-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- ZCMKDTDCRHITBV-UHFFFAOYSA-N dibutyltin;silicic acid Chemical compound O[Si](O)(O)O.CCCC[Sn]CCCC ZCMKDTDCRHITBV-UHFFFAOYSA-N 0.000 description 1
- BPYFPNZHLXDIGA-UHFFFAOYSA-N diphenylsilicon Chemical compound C=1C=CC=CC=1[Si]C1=CC=CC=C1 BPYFPNZHLXDIGA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000005431 greenhouse gas Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
一种倒装大功率LED封装结构用粘结剂，由以下重量配比的原料组成：液态硅橡胶90‑110；D4处理的气相二氧化硅10‑35；钛白粉1‑7；氧化铁1.3‑3.7；二苯基硅二醇1‑7；正硅酸乙酯3‑10；硼酸正丁酯1‑5；钛酸正丁酯1‑5；二月硅酸二丁基锡0.7‑3.7。本发明主要适用于LED封装的倒装结构，可满足硅基座与基板相粘结，本发明可在‑60℃‑200℃下长期使用，在250℃也可短期使用，具有良好的电气性能和耐潮湿性能，可用于各种硅橡胶之间以及硅橡胶与金属的粘结，同时，也提高了LED芯片的使用寿命。
Description
技术领域
本发明涉及倒装LED封装技术领域，特别是一种倒装大功率LED封装结构用粘结剂。
背景技术
发光二极管是21世纪的照明新光源，它具有光效高，工作电压低，耗电量小，体积小等优点，可平面封装，结构坚固且寿命很长。光源本身不含汞、铅等有害物质，无红外和紫外污染，不会在生产和使用中产生对外界的污染。因此，从节约电能、降低温室气体排放的角度，还是从减少环境污染的角度，发展LRD作用新型照明光源代替传统的照明用具将是大势所趋。目前，现有LED封装的倒装结构，其芯片倒装焊接在硅基座上，然后把完成倒装焊接的硅基座与基板通过粘结材料相接，但是现有的粘结材料粘接力不高，不能满足硅基座与基板之间的连接，并且现有粘结材料无法在-60℃-200℃下长期使用，且其电气性能和耐潮湿性能也较差。
发明内容
本发明要解决的技术问题是针对现有技术的不足，提出一种具有良好电气性能和耐潮湿性能的倒装大功率LED封装结构用粘结剂。
本发明要解决的技术问题是通过以下技术方案实现的。本发明是一种倒装大功率LED封装结构用粘结剂，其特点是，由以下重量配比的原料组成：液态硅橡胶90-110；D4处理的气相二氧化硅10-35；钛白粉1-7；氧化铁1.3-3.7；二苯基硅二醇1-7；正硅酸乙酯3-10；硼酸正丁酯1-5；钛酸正丁酯1-5；二月硅酸二丁基锡0.7-3.7；其制备时，将D4处理的气相二氧化硅、钛白粉、氧化铁和二苯基硅二醇加入液态硅橡胶中，混合均匀得到甲组分主剂，将正硅酸乙酯、硼酸正丁酯、钛酸正丁酯和二月硅酸二丁基锡混合，回流40-90分钟，冷却后得到乙组分交联剂，再将甲组分主剂与乙组分交联剂按照质量比9∶1调制均匀，室温固化后即可制得。
优选的，由以下重量配比的原料组成：液态硅橡胶90；D4处理的气相二氧化硅10；钛白粉1；氧化铁1.3；二苯基硅二醇1；正硅酸乙酯3；硼酸正丁酯1；钛酸正丁酯1；二月硅酸二丁基锡0.7。
优选的，由以下重量配比的原料组成：液态硅橡胶110；D4处理的气相二氧化硅35；钛白粉7；氧化铁3.7；二苯基硅二醇7；正硅酸乙酯10；硼酸正丁酯5；钛酸正丁酯5；二月硅酸二丁基锡3.7。
优选的，由以下重量配比的原料组成：液态硅橡胶105；D4处理的气相二氧化硅30；钛白粉5；氧化铁2；二苯基硅二醇5；正硅酸乙酯6；硼酸正丁酯3；钛酸正丁酯3；二月硅酸二丁基锡2。
优选的，所述液态硅橡胶为107液态有机硅橡胶。
优选的，所述室温固化时施加压力0.1-0.2MPa。
与现有技术相比，本发明主要适用于LED封装的倒装结构，可满足硅基座与基板相粘结，本发明可在在-60℃-200℃下长期使用，在250℃也可短期使用，具有良好的电气性能和耐潮湿性能，可用于各种硅橡胶之间以及硅橡胶与金属的粘结，同时，也提高了LED芯片的使用寿命。
具体实施方式
进一步描述本发明的具体技术方案，以便于本领域的技术人员进一步地理解本发明，而不构成其权力的限制。
实施例1，一种倒装大功率LED封装结构用粘结剂，由以下重量配比的原料组成：液态硅橡胶90-110；D4处理的气相二氧化硅10-35；钛白粉1-7；氧化铁1.3-3.7；二苯基硅二醇1-7；正硅酸乙酯3-10；硼酸正丁酯1-5；钛酸正丁酯1-5；二月硅酸二丁基锡0.7-3.7；其制备时，将D4处理的气相二氧化硅、钛白粉、氧化铁和二苯基硅二醇加入液态硅橡胶中，混合均匀得到甲组分主剂，将正硅酸乙酯、硼酸正丁酯、钛酸正丁酯和二月硅酸二丁基锡混合，回流40-90分钟，冷却后得到乙组分交联剂，再将甲组分主剂与乙组分交联剂按照质量比9∶1调制均匀，室温固化后即可制得。本发明可在-60℃-200℃下长期使用，在250℃短期使用，具有良好的电气性能和耐潮湿性能，可用于各种硅橡胶之间以及硅橡胶与金属的粘结。
实施例2，实施例1所述的一种倒装大功率LED封装结构用粘结剂中：由以下重量配比的原料组成：液态硅橡胶90；D4处理的气相二氧化硅10；钛白粉1；氧化铁1.3；二苯基硅二醇1；正硅酸乙酯3；硼酸正丁酯1；钛酸正丁酯1；二月硅酸二丁基锡0.7。
实施例3，实施例1或2所述的一种倒装大功率LED封装结构用粘结剂中：由以下重量配比的原料组成：液态硅橡胶110；D4处理的气相二氧化硅35；钛白粉7；氧化铁3.7；二苯基硅二醇7；正硅酸乙酯10；硼酸正丁酯5；钛酸正丁酯5；二月硅酸二丁基锡3.7。
实施例4，实施例1或2或3所述的一种倒装大功率LED封装结构用粘结剂中：由以下重量配比的原料组成：液态硅橡胶105；D4处理的气相二氧化硅30；钛白粉5；氧化铁2；二苯基硅二醇5；正硅酸乙酯6；硼酸正丁酯3；钛酸正丁酯3；二月硅酸二丁基锡2。
实施例5，实施例1-4任一项所述的一种倒装大功率LED封装结构用粘结剂中：所述液态硅橡胶为107液态有机硅橡胶。
实施例6，实施例1-5任一项所述的一种倒装大功率LED封装结构用粘结剂中：所述室温固化时施加压力0.1-0.2MPa。本发明在室温固化时，施加0.2MPa的压力，需3-7d，或室温固化1d再80℃下4-5个小时。
Claims (6)
1.一种倒装大功率LED封装结构用粘结剂，其特征在于，由以下重量配比的原料组成：
其制备时，将D4处理的气相二氧化硅、钛白粉、氧化铁和二苯基硅二醇加入液态硅橡胶中，混合均匀得到甲组分主剂，将正硅酸乙酯、硼酸正丁酯、钛酸正丁酯和二月硅酸二丁基锡混合，回流40-90分钟，冷却后得到乙组分交联剂，再将甲组分主剂与乙组分交联剂按照质量比9∶1调制均匀，室温固化后即可制得。
2.根据权利要求1所述的倒装大功率LED封装结构用粘结剂，其特征在于，由以下重量配比的原料组成：液态硅橡胶90；D4处理的气相二氧化硅10；钛白粉1；氧化铁1.3；二苯基硅二醇1；正硅酸乙酯3；硼酸正丁酯1；钛酸正丁酯1；二月硅酸二丁基锡0.7。
3.根据权利要求1所述的倒装大功率LED封装结构用粘结剂，其特征在于，由以下重量配比的原料组成：液态硅橡胶110；D4处理的气相二氧化硅35；钛白粉7；氧化铁3.7；二苯基硅二醇7；正硅酸乙酯10；硼酸正丁酯5；钛酸正丁酯5；二月硅酸二丁基锡3.7。
4.根据权利要求1所述的倒装大功率LED封装结构用粘结剂，其特征在于，由以下重量配比的原料组成：液态硅橡胶105；D4处理的气相二氧化硅30；钛白粉5；氧化铁2；二苯基硅二醇5；正硅酸乙酯6；硼酸正丁酯3；钛酸正丁酯3；二月硅酸二丁基锡2。
5.根据权利要求1所述的倒装大功率LED封装结构用粘结剂，其特征在于：所述液态硅橡胶为107液态有机硅橡胶。
6.根据权利要求1所述的倒装大功率LED封装结构用粘结剂，其特征在于：所述室温固化时施加压力0.1-0.2MPa。
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106752982A (zh) * | 2016-12-11 | 2017-05-31 | 安徽兆利光电科技有限公司 | 一种led灯用密封胶 |
| CN107384300A (zh) * | 2017-08-27 | 2017-11-24 | 江苏菲勒电气有限公司 | 一种高压电设备专用粘结剂 |
| CN107502278A (zh) * | 2017-08-27 | 2017-12-22 | 江苏菲勒电气有限公司 | 一种高压电设备粘结剂 |
| CN110066637A (zh) * | 2019-04-02 | 2019-07-30 | 深圳市鑫业新光电有限公司 | 一种led灯背板胶水的配方及其制备方法 |
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| CN104745141A (zh) * | 2015-03-04 | 2015-07-01 | 深圳广恒威科技有限公司 | 一种双组分缩合型有机硅灌封胶及其制备方法和应用 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106752982A (zh) * | 2016-12-11 | 2017-05-31 | 安徽兆利光电科技有限公司 | 一种led灯用密封胶 |
| CN107384300A (zh) * | 2017-08-27 | 2017-11-24 | 江苏菲勒电气有限公司 | 一种高压电设备专用粘结剂 |
| CN107502278A (zh) * | 2017-08-27 | 2017-12-22 | 江苏菲勒电气有限公司 | 一种高压电设备粘结剂 |
| CN110066637A (zh) * | 2019-04-02 | 2019-07-30 | 深圳市鑫业新光电有限公司 | 一种led灯背板胶水的配方及其制备方法 |
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