CN105949710A - Moisture-resistant phenolic molding material - Google Patents

Moisture-resistant phenolic molding material Download PDF

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Publication number
CN105949710A
CN105949710A CN201610502058.5A CN201610502058A CN105949710A CN 105949710 A CN105949710 A CN 105949710A CN 201610502058 A CN201610502058 A CN 201610502058A CN 105949710 A CN105949710 A CN 105949710A
Authority
CN
China
Prior art keywords
parts
moisture
proof
moulding compound
phenolaldehyde moulding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610502058.5A
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Chinese (zh)
Inventor
朱冠军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YUZHOU BROAD PLASTIC ELECTRIC APPLIANCE Co Ltd
Original Assignee
YUZHOU BROAD PLASTIC ELECTRIC APPLIANCE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YUZHOU BROAD PLASTIC ELECTRIC APPLIANCE Co Ltd filed Critical YUZHOU BROAD PLASTIC ELECTRIC APPLIANCE Co Ltd
Priority to CN201610502058.5A priority Critical patent/CN105949710A/en
Publication of CN105949710A publication Critical patent/CN105949710A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/14Polymer mixtures characterised by other features containing polymeric additives characterised by shape
    • C08L2205/16Fibres; Fibrils

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to a moisture-resistant phenolic molding material, which is prepared from the following components in parts by weight: 25 to 30 parts of phenolic resin, 5 to 10 parts of thermosetting resin, 2 to 3 parts of an enhancer, 0.5 to 2 parts of a curing agent, 6 to 10 parts of hexamethylenetetramine, 3 to 5 parts of polyester fibers, 10 to 15 parts of lignin, 20 to 25 parts of a filler and 0.5 to 2 parts of a release agent. The moisture-resistant phenolic molding material has the advantages of strong strength, convenience for molding, high moisture resistance and long service life.

Description

A kind of moisture-proof phenolaldehyde moulding compound
Technical field
The invention belongs to duroplastic moulding materials technical field, be specifically related to a kind of phenolaldehyde moulding compound, particularly relate to a kind of moisture-proof phenolaldehyde moulding compound.
Background technology
Phenolaldehyde moulding compound is also known as bakelite, it it is a kind of broad-spectrum thermosetting plastics, it is with thermoplasticity or thermosetting phenolic resin as substrate, the thermosetting plastics being processed into plus organic and inorganic filler and other compounding ingredients, phenolaldehyde moulding compound is the kind of industrialized production the earliest, it is widely used because of excellent performance, become machinery, electronic apparatus, the indispensable materials in field such as building, but existing phenolaldehyde moulding compound moisture-proof is not enough, in moist environment, service life is short, therefore, there is provided a kind of intensity high, convenient formation, moisture-proof is good, service life, the moisture-proof phenolaldehyde moulding compound of length was necessary.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and provide that a kind of intensity height, convenient formation, moisture-proof be good, the moisture-proof phenolaldehyde moulding compound of length in service life.
The technical scheme is that: a kind of moisture-proof phenolaldehyde moulding compound, it is made up according to following weight proportion of each component: phenolic resin 25-30 part, thermosetting resin 5-10 part, hardening agent 2-3 part, firming agent 0.5-2 part, hexamethylenamine 6-10 part, polyester fiber 3-5 part, lignin 10-15 part, filler 20-25 part, releasing agent 0.5-2 part.
A kind of moisture-proof phenolaldehyde moulding compound, it is made up according to following weight proportion of each component: 25 parts of phenolic resin, thermosetting resin 5 parts, hardening agent 2 parts, 0.5 part of firming agent, hexamethylenamine 6 parts, 3 parts of polyester fiber, lignin 10 parts, filler 20 parts, releasing agent 0.5 part.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described lignin is 100-150 mesh.
Described filler is aluminium hydroxide or mica powder.
The invention have the advantages that the moisture-proof phenolaldehyde moulding compound that the present invention provides has preferable moisture-proof, production technology is simple, and raw material is easy to get, and production cost is low, it is possible to increase substantially moisture resistance properties and the service life of phenolaldehyde moulding compound;The present invention has that intensity height, convenient formation, moisture-proof be good, the advantage of length in service life.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further illustrated.
Embodiment 1
A kind of moisture-proof phenolaldehyde moulding compound, it is made up according to following weight proportion of each component: 25 parts of phenolic resin, thermosetting resin 5 parts, hardening agent 2 parts, 0.5 part of firming agent, hexamethylenamine 6 parts, 3 parts of polyester fiber, lignin 10 parts, filler 20 parts, releasing agent 0.5 part.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described lignin is 100-150 mesh.
Described filler is aluminium hydroxide or mica powder.
The moisture-proof phenolaldehyde moulding compound that the present invention provides has preferable moisture-proof, and production technology is simple, and raw material is easy to get, and production cost is low, it is possible to increase substantially moisture resistance properties and the service life of phenolaldehyde moulding compound;The present invention has that intensity height, convenient formation, moisture-proof be good, the advantage of length in service life.
Embodiment 2
A kind of moisture-proof phenolaldehyde moulding compound, it is made up according to following weight proportion of each component: 30 parts of phenolic resin, thermosetting resin 10 parts, hardening agent 3 parts, 2 parts of firming agent, hexamethylenamine 10 parts, 5 parts of polyester fiber, lignin 15 parts, filler 25 parts, releasing agent 2 parts.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described lignin is 100-150 mesh.
Described filler is aluminium hydroxide or mica powder.
The moisture-proof phenolaldehyde moulding compound that the present invention provides has preferable moisture-proof, and production technology is simple, and raw material is easy to get, and production cost is low, it is possible to increase substantially moisture resistance properties and the service life of phenolaldehyde moulding compound;The present invention has that intensity height, convenient formation, moisture-proof be good, the advantage of length in service life.
Embodiment 3
A kind of moisture-proof phenolaldehyde moulding compound, it is made up according to following weight proportion of each component: 28 parts of phenolic resin, thermosetting resin 8 parts, hardening agent 2.5 parts, 1 part of firming agent, hexamethylenamine 8 parts, 4 parts of polyester fiber, lignin 12 parts, filler 22 parts, releasing agent 1 part.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described lignin is 100-150 mesh.
Described filler is aluminium hydroxide or mica powder.
The moisture-proof phenolaldehyde moulding compound that the present invention provides has preferable moisture-proof, and production technology is simple, and raw material is easy to get, and production cost is low, it is possible to increase substantially moisture resistance properties and the service life of phenolaldehyde moulding compound;The present invention has that intensity height, convenient formation, moisture-proof be good, the advantage of length in service life.

Claims (6)

1. a moisture-proof phenolaldehyde moulding compound, it is characterised in that: it is made up according to following weight proportion of each component: phenolic resin 25-30 part, thermosetting resin 5-10 part, hardening agent 2-3 part, firming agent 0.5-2 part, hexamethylenamine 6-10 part, polyester fiber 3-5 part, lignin 10-15 part, filler 20-25 part, releasing agent 0.5-2 part.
2. moisture-proof phenolaldehyde moulding compound as claimed in claim 1 a kind of, it is characterised in that: it is made up according to following weight proportion of each component: 25 parts of phenolic resin, thermosetting resin 5 parts, hardening agent 2 parts, 0.5 part of firming agent, hexamethylenamine 6 parts, 3 parts of polyester fiber, lignin 10 parts, filler 20 parts, releasing agent 0.5 part.
3. a kind of moisture-proof phenolaldehyde moulding compound as claimed in claim 1, it is characterised in that: described firming agent is NL firming agent.
4. a kind of moisture-proof phenolaldehyde moulding compound as claimed in claim 1, it is characterised in that: described hardening agent is hexamethylene tetramine.
5. a kind of moisture-proof phenolaldehyde moulding compound as claimed in claim 1, it is characterised in that: described lignin is 100-150 mesh.
6. a kind of moisture-proof phenolaldehyde moulding compound as claimed in claim 1, it is characterised in that: described filler is aluminium hydroxide or mica powder.
CN201610502058.5A 2016-06-30 2016-06-30 Moisture-resistant phenolic molding material Pending CN105949710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610502058.5A CN105949710A (en) 2016-06-30 2016-06-30 Moisture-resistant phenolic molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610502058.5A CN105949710A (en) 2016-06-30 2016-06-30 Moisture-resistant phenolic molding material

Publications (1)

Publication Number Publication Date
CN105949710A true CN105949710A (en) 2016-09-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610502058.5A Pending CN105949710A (en) 2016-06-30 2016-06-30 Moisture-resistant phenolic molding material

Country Status (1)

Country Link
CN (1) CN105949710A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115160731A (en) * 2022-08-09 2022-10-11 常熟东南塑料有限公司 Moisture-proof phenolic molding plastic and preparation process thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101974199A (en) * 2010-10-14 2011-02-16 常熟东南塑料有限公司 Low-shrinkage phenolic moulding compound
CN101974198A (en) * 2010-10-14 2011-02-16 常熟东南塑料有限公司 Heat-resisting phenolic moulding compound
CN103554828A (en) * 2013-10-12 2014-02-05 常熟东南塑料有限公司 Phenolic molding plastic with no ammonia release
CN104725766A (en) * 2015-03-12 2015-06-24 常熟东南塑料有限公司 Adhesion-free phenolic moulding material and preparation method thereof
CN105237948A (en) * 2015-11-13 2016-01-13 上海欧亚合成材料有限公司 Moisture-proof phenolic molding plastic

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101974199A (en) * 2010-10-14 2011-02-16 常熟东南塑料有限公司 Low-shrinkage phenolic moulding compound
CN101974198A (en) * 2010-10-14 2011-02-16 常熟东南塑料有限公司 Heat-resisting phenolic moulding compound
CN103554828A (en) * 2013-10-12 2014-02-05 常熟东南塑料有限公司 Phenolic molding plastic with no ammonia release
CN104725766A (en) * 2015-03-12 2015-06-24 常熟东南塑料有限公司 Adhesion-free phenolic moulding material and preparation method thereof
CN105237948A (en) * 2015-11-13 2016-01-13 上海欧亚合成材料有限公司 Moisture-proof phenolic molding plastic

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
李成琴等: "《纺织有机化学》", 31 July 2008, 东华大学出版社 *
王尚义: "《实用塑料涂装简明手册》", 31 March 2012, 机械工业出版社 *
黄进等: "《生物质化工与生物质材料》", 31 August 2009, 化学工业出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115160731A (en) * 2022-08-09 2022-10-11 常熟东南塑料有限公司 Moisture-proof phenolic molding plastic and preparation process thereof
CN115160731B (en) * 2022-08-09 2024-02-09 常熟东南塑料有限公司 Moisture-resistant phenolic molding compound and preparation process thereof

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Application publication date: 20160921