CN103087465A - Phenolic resin moulding compound - Google Patents
Phenolic resin moulding compound Download PDFInfo
- Publication number
- CN103087465A CN103087465A CN2013100660026A CN201310066002A CN103087465A CN 103087465 A CN103087465 A CN 103087465A CN 2013100660026 A CN2013100660026 A CN 2013100660026A CN 201310066002 A CN201310066002 A CN 201310066002A CN 103087465 A CN103087465 A CN 103087465A
- Authority
- CN
- China
- Prior art keywords
- parts
- resin moulding
- phenolic resin
- moulding compound
- alkyd resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a phenolic resin moulding compound. The phenolic resin moulding compound comprises the following raw materials: 100 parts of phenolic resin, 110 to 150 parts of glass fiber, 15 to 40 parts of magnesium hydrate, 15 to 40 parts of zinc borate, 40 to 80 parts of alumina monohydrate, and 20 to 40 parts of other auxiliaries, wherein the other auxiliaries include a coloring agent, a release agent and a curing agent. The phenolic resin moulding compound has the advantages that the product manufactured with the phenolic resin moulding compound serving as the raw material has the characteristics of being high in strength and high in heat resistance and has CTI (Comparative Tracking lndex) up to level 2 and flame resistance up to V-O level, so that the demands of special products of the automobile industry and household appliances can be met, and specifically the packaging requirement of a motor commutator at more than CTI2 level can be met.
Description
Technical field
The present invention relates to a kind of alkyd resin moulding material, relating in particular to a kind of main ingredient is the alkyd resin moulding material of resol, glass fibre, magnesium hydroxide, zinc borate, a water aluminum oxide and other auxiliary agents.
Background technology
In present electronics and automotive industry material, phenolaldehyde moulding compound has purposes widely, and repressed the forming of phenoplast that it mainly adopts take wood powder as filler is commonly called as bakelite.
That its shortcoming of such phenolaldehyde moulding compound is can't reach is heat-resisting, high strength, the low contraction and the requirements such as dimensional stability.Along with electronic devices and components and trolley part to miniaturization, functionalization and the development that becomes more meticulous, selected material not only will satisfy the high strength under normal temperature, more require to have good thermotolerance, the product application that particularly has requires the CTI grade to reach the requirement of 2 grades, higher flame retardant rating requirement, existing phenolaldehyde moulding compound can't reach these requirements.
Summary of the invention
The purpose of this invention is to provide a kind of alkyd resin moulding material, its main ingredient is resol, glass fibre, magnesium hydroxide, zinc borate, a water aluminum oxide and other auxiliary agents, to overcome the deficiency of mentioning in above-mentioned prior art.
For achieving the above object, the present invention is achieved through the following technical solutions:
A kind of alkyd resin moulding material, the proportioning of its feed composition is: 100 parts, resol, 110～150 parts, glass fibre, 15～40 parts of magnesium hydroxides, 15～40 parts of zinc borates, 40～80 parts, a water aluminum oxide, 20～40 parts of other auxiliary agents, wherein other auxiliary agents comprise tinting material, releasing agent and solidifying agent.
Described resol is novolac resin, or the mixture of novolac resin and heat-reactive phenolic resin.
The wire diameter of described glass fibre is 10～13 microns.The employing glass fibre is strongthener, has improved the physical strength of alkyd resin moulding material.
The particle diameter of described magnesium hydroxide is less than 60 microns; The particle diameter of described zinc borate is less than 60 microns.Adopt magnesium hydroxide and zinc borate as composite flame-retardant agent, can improve the flame retardant effect of alkyd resin moulding material, satisfied required flame retardant rating requirement.
The particle diameter of a described water aluminum oxide is less than 70 microns.Adopt a water aluminum oxide both can satisfy the requirement of CTI, the heatproof requirement that can improve alkyd resin moulding material simultaneously.
Above feed composition all by weight.
Beneficial effect of the present invention is: the product that utilizes above-mentioned alkyd resin moulding material to make for raw material, having high strength, high heat resistance, CTI grade reaches 2 grades, flame resistivity and reaches the characteristics such as V-O level, can satisfy the needs of automotive industry and household electrical appliance specialty products, particularly can reach the encapsulation requirement of the above motor commutator of CTI2 level.
Embodiment
| Component | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Resol | 100 | 100 | 100 |
| Glass fibre | 130 | 130 | 130 |
| Magnesium hydroxide | 25 | 25 | 25 |
| Zinc borate | 20 | 20 | 20 |
| One water aluminum oxide | 45 | 55 | 65 |
| Other auxiliary agents | 25 | 25 | 25 |
Above feed composition all by weight.
Embodiment 1:
A kind of alkyd resin moulding material, the proportioning of its feed composition is: 100 parts, resol, 130 parts, glass fibre, 25 parts of magnesium hydroxides, 20 parts of zinc borates, 45 parts, a water aluminum oxide, 25 parts of other auxiliary agents, wherein other auxiliary agents comprise tinting material, releasing agent and solidifying agent.
Described resol is novolac resin; The wire diameter of described glass fibre is 10～13 microns; The particle diameter of described magnesium hydroxide is less than 60 microns; The particle diameter of described zinc borate is less than 60 microns; The particle diameter of a described water aluminum oxide is less than 70 microns.
Above feed composition all by weight.
Embodiment 2:
Except a water aluminum oxide is 55 parts, other conditions and implementation step are all identical with embodiment 1.
Embodiment 3:
Except a water aluminum oxide is 65 parts, other conditions and implementation step are all identical with embodiment 1.
Below by the evaluating characteristics table of above-mentioned alkyd resin moulding material in concrete the application:
| Flexural strength (Mpa) | 210 | 195 | 190 |
| Modulus in flexure (Gpa) | 16．0 | 16.6 | 17.0 |
| Anti-combustion grade V-O (1.2mm) | ok | ok | ok |
| CTI（V）* | 275 | 300 | 300 |
| Heat-drawn wire (℃) | >260 | >260 | >260 |
Wherein the numerical range with 2 grades of the CTI of * is: 250～399v.All with the moulding of Transfer molding mode, actual conditions is as follows in the making of above-mentioned evaluating characteristics sample used:
Preheating temperature: 90-100 ℃
Die temperature: 165-175 ℃
Injection pressure: 60 MPa
Clamp time: 240 seconds
The after fixing condition: 180 ℃, 8 hours
Evaluating characteristics, flexural strength and modulus in flexure are according to GB/T 9341-2000 standard testing, molding shrinkage is measured according to the E2 type method of GB/T 5471-2008, and heat-drawn wire is according to GB/T 1634.2-2004 standard test, and CTI presses the GB/T4207-2003 standard test.
Claims (5)
1. alkyd resin moulding material, it is characterized in that: the proportioning of its feed composition is: 100 parts, resol, 110～150 parts, glass fibre, 15～40 parts of magnesium hydroxides, 15～40 parts of zinc borates, 40～80 parts, a water aluminum oxide, 20～40 parts of other auxiliary agents, wherein other auxiliary agents comprise tinting material, releasing agent and solidifying agent.
2. alkyd resin moulding material as claimed in claim 1, it is characterized in that: the wire diameter of described glass fibre is 10～13 microns.
3. alkyd resin moulding material as claimed in claim 1, it is characterized in that: the particle diameter of described magnesium hydroxide is less than 60 microns.
4. alkyd resin moulding material as claimed in claim 1, it is characterized in that: the particle diameter of described zinc borate is less than 60 microns.
5. alkyd resin moulding material as claimed in claim 1, it is characterized in that: the particle diameter of a described water aluminum oxide is less than 70 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100660026A CN103087465A (en) | 2013-03-01 | 2013-03-01 | Phenolic resin moulding compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100660026A CN103087465A (en) | 2013-03-01 | 2013-03-01 | Phenolic resin moulding compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103087465A true CN103087465A (en) | 2013-05-08 |
Family
ID=48200619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100660026A Pending CN103087465A (en) | 2013-03-01 | 2013-03-01 | Phenolic resin moulding compound |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103087465A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104194257A (en) * | 2014-07-11 | 2014-12-10 | 蚌埠市天宇高温树脂材料有限公司 | Glass-fiber reinforced molded plastic of heat-resistant environment-friendly phenolic resin |
| CN110577718A (en) * | 2019-10-30 | 2019-12-17 | 上海欧亚合成材料股份有限公司 | aniline modified phenolic molding compound for low-voltage electrical apparatus and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006089665A (en) * | 2004-09-27 | 2006-04-06 | Sumitomo Bakelite Co Ltd | Phenolic resin molding material |
| CN1820052A (en) * | 2003-07-10 | 2006-08-16 | 旭有机材工业株式会社 | Phenol resin composition |
| CN102321340A (en) * | 2011-09-16 | 2012-01-18 | 无锡创达电子有限公司 | High-strength halogen-free epoxy molding compound, and preparation method thereof |
| CN102408670A (en) * | 2011-09-16 | 2012-04-11 | 无锡创达电子有限公司 | Ammonia-free phenolic molding compound and its preparation method |
| CN102532948A (en) * | 2011-12-30 | 2012-07-04 | 大连亚泰科技新材料有限公司 | Preparation method and application of modified magnesium hydroxide flame retardant for copper clad plate |
| CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
-
2013
- 2013-03-01 CN CN2013100660026A patent/CN103087465A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1820052A (en) * | 2003-07-10 | 2006-08-16 | 旭有机材工业株式会社 | Phenol resin composition |
| JP2006089665A (en) * | 2004-09-27 | 2006-04-06 | Sumitomo Bakelite Co Ltd | Phenolic resin molding material |
| CN102321340A (en) * | 2011-09-16 | 2012-01-18 | 无锡创达电子有限公司 | High-strength halogen-free epoxy molding compound, and preparation method thereof |
| CN102408670A (en) * | 2011-09-16 | 2012-04-11 | 无锡创达电子有限公司 | Ammonia-free phenolic molding compound and its preparation method |
| CN102532948A (en) * | 2011-12-30 | 2012-07-04 | 大连亚泰科技新材料有限公司 | Preparation method and application of modified magnesium hydroxide flame retardant for copper clad plate |
| CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104194257A (en) * | 2014-07-11 | 2014-12-10 | 蚌埠市天宇高温树脂材料有限公司 | Glass-fiber reinforced molded plastic of heat-resistant environment-friendly phenolic resin |
| CN104194257B (en) * | 2014-07-11 | 2016-09-14 | 蚌埠市天宇高温树脂材料有限公司 | A kind of fiberglass reinforced moulding compound of heat resistant type Environmental protection phenol formaldehyde resin |
| CN110577718A (en) * | 2019-10-30 | 2019-12-17 | 上海欧亚合成材料股份有限公司 | aniline modified phenolic molding compound for low-voltage electrical apparatus and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102040830B (en) | Polyamide composition and preparation method thereof | |
| CN102070899A (en) | Insulating and heat-conducting polyamide composite material and preparation method thereof | |
| CN102382422B (en) | Epoxy resin composition with hydrated alumina | |
| CN102875977B (en) | Preparation method of flame-retardant phenolic epoxy composite material | |
| CN104736337A (en) | Metal-resin composite, and method for producing same | |
| CN102408230A (en) | Ferrite injection molding granule and preparation method thereof | |
| CN104718070A (en) | Metal-resin composite, and method for producing same | |
| WO2008133211A1 (en) | Thermally conductive compound and process for producing the same | |
| CN110577718B (en) | Aniline modified phenolic molding plastic for low-voltage electrical apparatus and preparation method thereof | |
| CN103183907A (en) | High-temperature-resistant phenolic glass fibre reinforced plastic material | |
| CN102408670A (en) | Ammonia-free phenolic molding compound and its preparation method | |
| CN103409115A (en) | Enhanced heat conducting interface material and preparation method thereof | |
| CN102850716B (en) | Flame retardant conductive composite material | |
| CN102321340B (en) | High-strength halogen-free epoxy molding compound, and preparation method thereof | |
| CN103087465A (en) | Phenolic resin moulding compound | |
| CN103160068A (en) | Phenolic glass fiber reinforced plastic composite material | |
| CN103665775B (en) | Epoxy molding plastic that a kind of silicon powder height is filled and preparation method thereof | |
| CN102875960B (en) | Macromolecular composite phenolic aldehyde material filled with glass beads | |
| CN102875965B (en) | Preparation method of flame-retardant conducting composite material | |
| CN103059536A (en) | Polycarbonate/polyethylene alloy heat conduction composite material and preparation method thereof | |
| CN102993664A (en) | Flame-retardant unsaturated polyester mould plastic | |
| CN114687246B (en) | Epoxy-based silicone resin sizing agent, mica plate and preparation method and application thereof | |
| CN103183903A (en) | Flame-retardant phenolic resin forming material modified by epoxy resin | |
| CN102993382A (en) | Preparation method of flame-retardant unsaturated polyester mould plastic | |
| JP2014148636A (en) | Resin composition and insert molded article |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130508 |