CN105924896A - Phenolic moulding plastic for low-voltage apparatus - Google Patents
Phenolic moulding plastic for low-voltage apparatus Download PDFInfo
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- CN105924896A CN105924896A CN201610502070.6A CN201610502070A CN105924896A CN 105924896 A CN105924896 A CN 105924896A CN 201610502070 A CN201610502070 A CN 201610502070A CN 105924896 A CN105924896 A CN 105924896A
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- moulding plastic
- voltage apparatus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to a phenolic moulding plastic for a low-voltage apparatus. The phenolic moulding plastic is prepared from the following components in weight proportion: 25-30 parts of phenolic resin, 5-10 parts of thermosetting resin, 2-3 parts of reinforcer, 0.5-2 parts of curing agent, 3-5 parts of flame retardant, 1-3 parts of coupling agent, 5-10 parts of reinforcing powder, 0.5-2 parts of release agent, 20-25 parts of filler, and 15-20 parts of reinforced fiber. The phenolic moulding plastic has the advantages of being high in strength, convenient for forming, and good in arc resistance and anti creepage trace performances.
Description
Technical field
The invention belongs to duroplastic moulding materials technical field, be specifically related to a kind of phenolaldehyde moulding compound, particularly relate to a kind of phenolic moulding plastic for low-voltage apparatus.
Background technology
Phenolaldehyde moulding compound is with thermoplasticity or thermosetting phenolic resin as substrate, the thermosetting plastics being processed into plus organic and inorganic filler and other compounding ingredients, phenolaldehyde moulding compound is the kind of industrialized production the earliest, it is widely used because of excellent performance, the indispensable materials in field such as machinery, electronic apparatus, building are become, but phenolaldehyde moulding compound there is also some shortcomings, when phenolaldehyde moulding compound is for low-pressure electronic equipment product, its resistance to electric arc and anti creepage trace performance are the best, are the technical issues that need to address all the time；Therefore it provides the good phenolic moulding plastic for low-voltage apparatus of a kind of intensity height, convenient formation, resistance to electric arc and anti creepage trace performance is necessary.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and the phenolic moulding plastic for low-voltage apparatus that a kind of intensity height, convenient formation, resistance to electric arc and anti creepage trace performance are good is provided.
The technical scheme is that: a kind of phenolic moulding plastic for low-voltage apparatus, it is made up according to following weight proportion of each component: phenolic resin 25-30 part, thermosetting resin 5-10 part, hardening agent 2-3 part, firming agent 0.5-2 part, fire retardant 3-5 part, coupling agent 1-3 part, reinforcement powder body 5-10 part, releasing agent 0.5-2 part, filler 20-25 part, reinforcing fiber 15-20 part.
A kind of phenolic moulding plastic for low-voltage apparatus, it is made up according to following weight proportion of each component: 25 parts of phenolic resin, thermosetting resin 5 parts, hardening agent 2 parts, 0.5 part of firming agent, fire retardant 3 parts, coupling agent 1 part, reinforcement powder body 5 parts, releasing agent 0.5 part, filler 20 parts, reinforcing fiber 15 parts.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described coupling agent is magnesium class coupling agent or stannum class coupling agent.
Described filler is aluminium hydroxide.
Described reinforcement powder body is nanoscale reinforcement powder body.
The invention have the advantages that the phenolic moulding plastic for low-voltage apparatus that the present invention provides has the electrical insulation properties of excellence, the voltage of below 300V is tested, will not its trace, and arc resistance can be preferable, in process of manufacture, it is not necessary to carry out dipping lacquer and surface processes and is just used directly for manufacturing low-pressure electronic equipment product；The advantage that present invention degree of having height, convenient formation, resistance to electric arc and anti creepage trace performance are good.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further illustrated.
Embodiment 1
A kind of phenolic moulding plastic for low-voltage apparatus, it is made up according to following weight proportion of each component: 25 parts of phenolic resin, thermosetting resin 5 parts, hardening agent 2 parts, 0.5 part of firming agent, fire retardant 3 parts, coupling agent 1 part, reinforcement powder body 5 parts, releasing agent 0.5 part, filler 20 parts, reinforcing fiber 15 parts.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described coupling agent is magnesium class coupling agent or stannum class coupling agent.
Described filler is aluminium hydroxide.
Described reinforcement powder body is nanoscale reinforcement powder body.
The phenolic moulding plastic for low-voltage apparatus that the present invention provides has the electrical insulation properties of excellence, the voltage of below 300V is tested, will not its trace, and arc resistance can be preferable, in process of manufacture, it is not necessary to carry out dipping lacquer and surface processes and is just used directly for manufacturing low-pressure electronic equipment product；The advantage that present invention degree of having height, convenient formation, resistance to electric arc and anti creepage trace performance are good.
Embodiment 2
A kind of phenolic moulding plastic for low-voltage apparatus, it is made up according to following weight proportion of each component: 30 parts of phenolic resin, thermosetting resin 10 parts, hardening agent 3 parts, 2 parts of firming agent, fire retardant 5 parts, coupling agent 3 parts, reinforcement powder body 10 parts, releasing agent 2 parts, filler 25 parts, reinforcing fiber 20 parts.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described coupling agent is magnesium class coupling agent or stannum class coupling agent.
Described filler is aluminium hydroxide.
Described reinforcement powder body is nanoscale reinforcement powder body.
The phenolic moulding plastic for low-voltage apparatus that the present invention provides has the electrical insulation properties of excellence, the voltage of below 300V is tested, will not its trace, and arc resistance can be preferable, in process of manufacture, it is not necessary to carry out dipping lacquer and surface processes and is just used directly for manufacturing low-pressure electronic equipment product；The advantage that present invention degree of having height, convenient formation, resistance to electric arc and anti creepage trace performance are good.
Embodiment 3
A kind of phenolic moulding plastic for low-voltage apparatus, it is made up according to following weight proportion of each component: 28 parts of phenolic resin, thermosetting resin 8 parts, hardening agent 2.5 parts, 1 part of firming agent, fire retardant 4 parts, coupling agent 2 parts, reinforcement powder body 8 parts, releasing agent 1 part, filler 22 parts, reinforcing fiber 18 parts.
Described firming agent is NL firming agent.
Described hardening agent is hexamethylene tetramine.
Described coupling agent is magnesium class coupling agent or stannum class coupling agent.
Described filler is aluminium hydroxide.
Described reinforcement powder body is nanoscale reinforcement powder body.
The phenolic moulding plastic for low-voltage apparatus that the present invention provides has the electrical insulation properties of excellence, the voltage of below 300V is tested, will not its trace, and arc resistance can be preferable, in process of manufacture, it is not necessary to carry out dipping lacquer and surface processes and is just used directly for manufacturing low-pressure electronic equipment product；The advantage that present invention degree of having height, convenient formation, resistance to electric arc and anti creepage trace performance are good.
Claims (7)
1. a phenolic moulding plastic for low-voltage apparatus, it is characterised in that: it is made up according to following weight proportion of each component: phenolic resin 25-30 part, thermosetting resin 5-10 part, hardening agent 2-3 part, firming agent 0.5-2 part, fire retardant 3-5 part, coupling agent 1-3 part, reinforcement powder body 5-10 part, releasing agent 0.5-2 part, filler 20-25 part, reinforcing fiber 15-20 part.
2. a kind of phenolic moulding plastic for low-voltage apparatus as claimed in claim 1, it is characterised in that: it is made up according to following weight proportion of each component: 25 parts of phenolic resin, thermosetting resin 5 parts, hardening agent 2 parts, 0.5 part of firming agent, fire retardant 3 parts, coupling agent 1 part, reinforcement powder body 5 parts, releasing agent 0.5 part, filler 20 parts, reinforcing fiber 15 parts.
3. a kind of phenolic moulding plastic for low-voltage apparatus as claimed in claim 1, it is characterised in that: described firming agent is NL firming agent.
4. a kind of phenolic moulding plastic for low-voltage apparatus as claimed in claim 1, it is characterised in that: described hardening agent is hexamethylene tetramine.
5. a kind of phenolic moulding plastic for low-voltage apparatus as claimed in claim 1, it is characterised in that: described coupling agent is magnesium class coupling agent or stannum class coupling agent.
6. a kind of phenolic moulding plastic for low-voltage apparatus as claimed in claim 1, it is characterised in that: described filler is aluminium hydroxide.
7. a kind of phenolic moulding plastic for low-voltage apparatus as claimed in claim 1, it is characterised in that: described reinforcement powder body is nanoscale reinforcement powder body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610502070.6A CN105924896A (en) | 2016-06-30 | 2016-06-30 | Phenolic moulding plastic for low-voltage apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610502070.6A CN105924896A (en) | 2016-06-30 | 2016-06-30 | Phenolic moulding plastic for low-voltage apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105924896A true CN105924896A (en) | 2016-09-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610502070.6A Pending CN105924896A (en) | 2016-06-30 | 2016-06-30 | Phenolic moulding plastic for low-voltage apparatus |
Country Status (1)
| Country | Link |
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| CN (1) | CN105924896A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106147123A (en) * | 2016-09-23 | 2016-11-23 | 杨攀 | A kind of earthed switch cabinet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101343398A (en) * | 2008-08-22 | 2009-01-14 | 常熟东南塑料有限公司 | Halogen-free flame-proof glass fiber reinforcement epoxy molding compound |
| CN101974198A (en) * | 2010-10-14 | 2011-02-16 | 常熟东南塑料有限公司 | Heat-resisting phenolic moulding compound |
| CN102020827A (en) * | 2010-10-14 | 2011-04-20 | 常熟东南塑料有限公司 | Phenolic moulding plastic for low-voltage apparatus |
| CN103897416A (en) * | 2014-03-26 | 2014-07-02 | 浙江嘉民塑胶有限公司 | Phenolic molding plastic and preparation method thereof |
-
2016
- 2016-06-30 CN CN201610502070.6A patent/CN105924896A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101343398A (en) * | 2008-08-22 | 2009-01-14 | 常熟东南塑料有限公司 | Halogen-free flame-proof glass fiber reinforcement epoxy molding compound |
| CN101974198A (en) * | 2010-10-14 | 2011-02-16 | 常熟东南塑料有限公司 | Heat-resisting phenolic moulding compound |
| CN102020827A (en) * | 2010-10-14 | 2011-04-20 | 常熟东南塑料有限公司 | Phenolic moulding plastic for low-voltage apparatus |
| CN103897416A (en) * | 2014-03-26 | 2014-07-02 | 浙江嘉民塑胶有限公司 | Phenolic molding plastic and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106147123A (en) * | 2016-09-23 | 2016-11-23 | 杨攀 | A kind of earthed switch cabinet |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160907 |
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| RJ01 | Rejection of invention patent application after publication |