CN102020827A - Phenolic moulding plastic for low-voltage apparatus - Google Patents
Phenolic moulding plastic for low-voltage apparatus Download PDFInfo
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- CN102020827A CN102020827A CN 201010506472 CN201010506472A CN102020827A CN 102020827 A CN102020827 A CN 102020827A CN 201010506472 CN201010506472 CN 201010506472 CN 201010506472 A CN201010506472 A CN 201010506472A CN 102020827 A CN102020827 A CN 102020827A
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- moulding compound
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Abstract
The invention discloses a phenolic moulding plastic for a low-voltage apparatus, which belongs to the technical field of thermosetting moulding plastic. The phenolic moulding plastic comprises the following raw materials in portions by weight: 20 to 40 portions of phenolic resin, 10 to 30 portions of thermosetting resin, 4 to 10 portions of curing agent, 5 to 15 portions of reinforcing fibers, 10 to 20 portions of nano reinforcing powder, 0.5 to 2.0 portions of coupling agent, 0.2 to 2.0 portions of releasing agent, and 5 to 10 portions of inorganic filler. The phenolic moulding plastic provided by the invention has the advantages of excellent electrical insulation performance and ideal arc resistant performance; the comparative tracking index (CTI) value of the plastic can reach 300V; and the plastic can be directly used for manufacturing low-voltage apparatuses without carrying out dip coating and surface treatment on the plastic.
Description
Technical field
The invention belongs to the duroplastic moulding materials technical field, be specifically related to a kind of low-voltage apparatus phenolaldehyde moulding compound.
Background technology
Phenolaldehyde moulding compound is to be matrix with thermoplasticity or heat-reactive phenolic resin, adds the thermosetting resin that organic and inorganic filler and other Synergist S-421 95 are processed into.Resol and moulding compound thereof are the kinds of suitability for industrialized production the earliest in synthetic resins, the plastics, existing so far nearly over one hundred year history.Raw material sources based on them are wider, production technique and equipment are simple, forming process is good, price is cheaper, and can obtain very good resistance toheat, mechanical property, electrical property, thermal characteristics, ablation property, chemical property and radiation resistance by all means, especially have good flame retardancy, the low rate of being fuming, seldom produce obnoxious flavour, become machinery, electric, building, mining, national defence and other industrial circle indispensable material.
But also there are some shortcomings in phenolaldehyde moulding compound: when phenolaldehyde moulding compound was used for low-pressure electronic equipment product, its anti-tracking performance obviously was inferior to other thermosetting resines such as polyester, amino class.The phase ratio creepage tracking index of phenolaldehyde moulding compound (Comparative Tracking Index is CTI) value is lower, belong to usually insulation group IIIb class (≤175V), just might bring up to 175V～275V and have only by CTI value after the surface treatments such as dipping lacquer.So, require often not use phenolaldehyde moulding compound, thereby limited the expansion of the purposes of phenolaldehyde moulding compound than high product for some electrical insulation properties.As described above, can make its CTI value be increased to 175-275V, but can increase technology difficulty and cause significantly improving of tooling cost by dipping lacquer and surface treatment.Especially: the means that improve the electrical specification of phenolaldehyde moulding compound with dipping lacquer and surface treatment undoubtedly are a kind of passive measures of doing something against one's will, because, even if it also only is to obtain by artificial subsequent disposal that phenolaldehyde moulding compound possesses good again electrical specification, and be not phenolaldehyde moulding compound self and have.
Therefore, phenolaldehyde moulding compound self is had good be not only the production firm of phenolaldehyde moulding compound, and be that low-voltage electrical production firm expects the technical problem that solves jointly such as anti-electric arc and anti creepage trace performance.
If can make phenolaldehyde moulding compound self possess with have such as anti-electric arc and anti creepage trace performance to can yet be regarded as be a kind of ultimate attainment behave, yet in disclosed document, be seen in the corresponding techniques enlightenment.The disclosed antibacterial phenolic moulding plastics of Chinese patent publication number CN141224A is celebrated and can be applicable to daily necessities structural part and low-voltage insulation spare (specification digest and Instructions Page 2 5-countdown line 3 reciprocal), and the prescription of this scheme (by weight percentage) is: resol 30-70%, argentiferous and/or zinc and be the inorganic nano antiseptic 0-5% of carrier with metal or nonmetal oxide and/or inorganic salt, solidifying agent hexamethylenetetramine 1-15%, methylcellulose gum and/or xylogen (organic reinforced fiber) 10-50%, softening agent 1-5% and mineral filler 5-30%.The heat-drawn wire and the insulation resistance of the phenolaldehyde moulding compound that obtains of this patent application scheme are respectively more than 150 ℃ and greater than 10
9Ω, therefore on the low side relatively, and do not point out physical indexs such as anti creepage trace index, anti-leakage and incendivity.
At above-mentioned prior art, the applicant has carried out useful exploration, and technical scheme described below produces under this background.
Summary of the invention
Task of the present invention is to provide a kind of to be had excellent anti-electric arc and anti creepage trace performance and not to need to use through follow-up dipping lacquer and surface treatment again and be directly used in the low-voltage apparatus phenolaldehyde moulding compound of making to the demanding electric equipment products of electric insulation.
Task of the present invention is finished like this, a kind of low-voltage apparatus phenolaldehyde moulding compound, and it is to be made of following raw materials in portion by weight:
Resol 20-40 part;
Thermosetting resin 10-30 part;
Solidifying agent 4-10 part;
Fortifying fibre 5-15 part;
Nanometer reinforcement powder 10-20 part;
Coupling agent 0.5-2.0 part;
Releasing agent 0.2-2.0 part;
Mineral filler 5-10 part.
Resol of the present invention is thermoplastic novolac phenolic resin.
Thermosetting resin of the present invention is one or more in melamino-formaldehyde resin, Resins, epoxy and the unsaturated polyester.
Solidifying agent of the present invention is a hexamethylenetetramine.
Fortifying fibre of the present invention is one or both in glass fibre and the aramid fiber.
Nanometer reinforcement powder of the present invention is a nano-calcium carbonate.
Coupling agent of the present invention is one or more in titante coupling agent, aluminium esters of gallic acid coupling agent and the silane coupling agent.
Releasing agent of the present invention is one or more in Zinic stearas, calcium stearate, Magnesium Stearate and the aluminum stearate.
Mineral filler of the present invention is one or more in stone flour, talcum powder and the kaolin.
Low-voltage apparatus of the present invention also includes by weight ratio tinting material 1-2 part with phenolaldehyde moulding compound, and described tinting material is a printing ink.
Technical scheme provided by the invention has excellent electrical insulation properties, and anti creepage trace index (CTI) value can reach 300V, and arc resistance can ideal, need not can be directly used in the manufacturing low-pressure electronic equipment product to its dipping lacquer and surface treatment.
Embodiment
Example 1:
25 parts of thermoplastic novolac phenolic resin;
25 parts of Resins, epoxy;
6 parts of hexamethylenetetramines;
10 parts in glass fibre;
15 parts of nano-calcium carbonates;
1.5 parts of titante coupling agents;
1.5 parts of Magnesium Stearates;
8 parts of stone flours;
1.6 parts in printing ink.
During concrete enforcement, thermoplastic novolac phenolic resin and the Resins, epoxy dispersion and fining in pulverizer that to produce by acid system earlier, obtain the powdered resin, the various starting material of requirement with above-mentioned weighing mix (kneading) with the powdered resin in kneader by filling a prescription, obtain compound, on two rollers of twin-roll machine, plasticate the compound that mixes promptly mixing then, plasticated 5-10 minute at plasticating temperature 90-110 ℃, after plasticating in flakes, cool to room temperature is ground into particle to the sheet material at last in pulverizer, again through screening, granulation, the low-voltage apparatus phenolaldehyde moulding compound that obtains having technical indicator shown in the table 1.
Example 2:
30 parts of thermoplastic novolac phenolic resin;
20 parts of unsaturated polyesters;
7 parts of hexamethylenetetramines;
10 parts of aramid fibers;
20 parts of nano-calcium carbonates;
0.5 part of aluminium esters of gallic acid coupling agent;
0.3 part of Zinic stearas;
5 parts of kaolin;
1 part in printing ink.All the other are all with the description to embodiment 1.
Example 3:
20 parts of thermoplastic novolac phenolic resin;
20 parts of Resins, epoxy;
10 parts of unsaturated polyesters;
4 parts of hexamethylenetetramines;
5 parts in glass fibre;
5 parts of aramid fibers;
15 parts of nano-calcium carbonates;
1 part of silane coupling agent;
1 part of aluminum stearate;
4 parts of talcum powder;
4 parts of stone flours;
2 parts in printing ink.All the other are all with the description to embodiment 1.
Example 4:
35 parts of thermoplastic novolac phenolic resin;
15 parts of melamino-formaldehyde resins;
5 parts of Resins, epoxy;
5 parts of unsaturated polyesters;
5 parts of hexamethylenetetramines;
15 parts in glass fibre;
10 parts of nano-calcium carbonates;
1 part of aluminium esters of gallic acid coupling agent;
1 part of titante coupling agent;
0.3 part of Zinic stearas;
0.3 part of calcium stearate;
0.3 part of Magnesium Stearate;
0.3 part of aluminum stearate;
4 parts of stone flours;
3 parts of talcum powder;
3 parts of kaolin;
1 part in printing ink.All the other are all with the description to embodiment 1.
Example 5:
40 parts of thermoplastic novolac phenolic resin;
5 parts of Resins, epoxy;
5 parts of unsaturated polyesters;
10 parts of hexamethylenetetramines;
5 parts in glass fibre;
5 parts of aramid fibers;
16 parts of nano-calcium carbonates;
0.8 part of titante coupling agent;
0.8 part of silane coupling agent;
1 part of calcium stearate;
1 part of Magnesium Stearate;
7 parts of stone flours;
1.8 parts in printing ink.All the other are all with the description to embodiment 1.
Has the technique effect shown in the table 1 by the resulting low-voltage apparatus of the foregoing description 1-5 after tested with phenolaldehyde moulding compound.
Table 1
Claims (9)
1. low-voltage apparatus phenolaldehyde moulding compound is characterized in that it is to be made of following raw materials in portion by weight:
Resol 20-40 part;
Thermosetting resin 10-30 part;
Solidifying agent 4-10 part;
Fortifying fibre 5-15 part;
Nanometer reinforcement powder 10-20 part;
Coupling agent 0.5-2.0 part;
Releasing agent 0.2-2.0 part;
Mineral filler 5-10 part.
2. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described resol is thermoplastic novolac phenolic resin.
3. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described thermosetting resin is one or more in melamino-formaldehyde resin, Resins, epoxy and the unsaturated polyester.
4. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described solidifying agent is a hexamethylenetetramine.
5. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described fortifying fibre is one or both in glass fibre and the aramid fiber.
6. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described nanometer reinforcement powder is a nano-calcium carbonate.
7. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described coupling agent is one or more in titante coupling agent, aluminium esters of gallic acid coupling agent and the silane coupling agent.
8. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described releasing agent is one or more in Zinic stearas, calcium stearate, Magnesium Stearate and the aluminum stearate.
9. low-voltage apparatus phenolaldehyde moulding compound according to claim 1 is characterized in that described mineral filler is one or more in stone flour, talcum powder and the kaolin.
10 according to the described low-voltage apparatus phenolaldehyde moulding compound of the arbitrary claim of claim 1-9, it is characterized in that described low-voltage apparatus also includes by weight ratio tinting material 1-2 part with phenolaldehyde moulding compound, and described tinting material is a printing ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010506472 CN102020827A (en) | 2010-10-14 | 2010-10-14 | Phenolic moulding plastic for low-voltage apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010506472 CN102020827A (en) | 2010-10-14 | 2010-10-14 | Phenolic moulding plastic for low-voltage apparatus |
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| CN102020827A true CN102020827A (en) | 2011-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010506472 Pending CN102020827A (en) | 2010-10-14 | 2010-10-14 | Phenolic moulding plastic for low-voltage apparatus |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104072961A (en) * | 2014-06-18 | 2014-10-01 | 安徽宁国市高新管业有限公司 | Heat and corrosion resistant glass fiber reinforced plastics composite material |
| CN105400132A (en) * | 2015-12-14 | 2016-03-16 | 华南理工大学 | Non-continuous fiber-reinforced thermosetting-resin-based composite material and preparation method therefor |
| CN105482141A (en) * | 2016-02-25 | 2016-04-13 | 华南理工大学 | Continuous fiber reinforced thermosetting resin matrix composite material and preparation method thereof |
| CN105504673A (en) * | 2015-12-18 | 2016-04-20 | 神盾防火科技有限公司 | Nnon-inflammable melamine electric appliance shell material |
| CN105924896A (en) * | 2016-06-30 | 2016-09-07 | 禹州市远大塑料电器有限责任公司 | Phenolic moulding plastic for low-voltage apparatus |
| CN106147123A (en) * | 2016-09-23 | 2016-11-23 | 杨攀 | A kind of earthed switch cabinet |
| CN107880493A (en) * | 2017-12-26 | 2018-04-06 | 骆金根 | A kind of epoxide resin nano working of plastics and its processing method |
| CN110577718A (en) * | 2019-10-30 | 2019-12-17 | 上海欧亚合成材料股份有限公司 | aniline modified phenolic molding compound for low-voltage electrical apparatus and preparation method thereof |
| CN110872430A (en) * | 2019-11-29 | 2020-03-10 | 陕西生益科技有限公司 | High CTI resin composition, prepreg, laminated board and metal foil-clad laminated board |
| CN111454585A (en) * | 2020-03-09 | 2020-07-28 | 句容市久诺复合材料有限公司 | High-heat-resistance insulating SMC composite material |
| CN114031891A (en) * | 2021-11-29 | 2022-02-11 | 浙江南方塑胶制造有限公司 | Phenolic molding plastic with good tracking resistance and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412242A (en) * | 2001-10-16 | 2003-04-23 | 上海欧亚合成材料有限公司 | Low chlorine ion content injection phenolic moulding plastics |
| CN1958662A (en) * | 2006-10-30 | 2007-05-09 | 林良菽 | Plastic of phenolic aldehyde mould in no ammonia type, and manufacturing method |
| CN101343397A (en) * | 2008-08-22 | 2009-01-14 | 常熟东南塑料有限公司 | Halogen-free flame-proof phenolic plastic |
| CN101343398A (en) * | 2008-08-22 | 2009-01-14 | 常熟东南塑料有限公司 | Halogen-free flame-proof glass fiber reinforcement epoxy molding compound |
| CN101457012A (en) * | 2008-12-31 | 2009-06-17 | 广东生益科技股份有限公司 | Resin composition and copper clad laminate prepared by metal foil coated with resin composition |
-
2010
- 2010-10-14 CN CN 201010506472 patent/CN102020827A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412242A (en) * | 2001-10-16 | 2003-04-23 | 上海欧亚合成材料有限公司 | Low chlorine ion content injection phenolic moulding plastics |
| CN1958662A (en) * | 2006-10-30 | 2007-05-09 | 林良菽 | Plastic of phenolic aldehyde mould in no ammonia type, and manufacturing method |
| CN101343397A (en) * | 2008-08-22 | 2009-01-14 | 常熟东南塑料有限公司 | Halogen-free flame-proof phenolic plastic |
| CN101343398A (en) * | 2008-08-22 | 2009-01-14 | 常熟东南塑料有限公司 | Halogen-free flame-proof glass fiber reinforcement epoxy molding compound |
| CN101457012A (en) * | 2008-12-31 | 2009-06-17 | 广东生益科技股份有限公司 | Resin composition and copper clad laminate prepared by metal foil coated with resin composition |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104072961A (en) * | 2014-06-18 | 2014-10-01 | 安徽宁国市高新管业有限公司 | Heat and corrosion resistant glass fiber reinforced plastics composite material |
| CN105400132A (en) * | 2015-12-14 | 2016-03-16 | 华南理工大学 | Non-continuous fiber-reinforced thermosetting-resin-based composite material and preparation method therefor |
| CN105504673A (en) * | 2015-12-18 | 2016-04-20 | 神盾防火科技有限公司 | Nnon-inflammable melamine electric appliance shell material |
| CN105482141A (en) * | 2016-02-25 | 2016-04-13 | 华南理工大学 | Continuous fiber reinforced thermosetting resin matrix composite material and preparation method thereof |
| CN105482141B (en) * | 2016-02-25 | 2017-10-20 | 华南理工大学 | A kind of continuous lod thermosetting resin based composites and preparation method thereof |
| CN105924896A (en) * | 2016-06-30 | 2016-09-07 | 禹州市远大塑料电器有限责任公司 | Phenolic moulding plastic for low-voltage apparatus |
| CN106147123A (en) * | 2016-09-23 | 2016-11-23 | 杨攀 | A kind of earthed switch cabinet |
| CN107880493A (en) * | 2017-12-26 | 2018-04-06 | 骆金根 | A kind of epoxide resin nano working of plastics and its processing method |
| CN110577718A (en) * | 2019-10-30 | 2019-12-17 | 上海欧亚合成材料股份有限公司 | aniline modified phenolic molding compound for low-voltage electrical apparatus and preparation method thereof |
| CN110872430A (en) * | 2019-11-29 | 2020-03-10 | 陕西生益科技有限公司 | High CTI resin composition, prepreg, laminated board and metal foil-clad laminated board |
| CN111454585A (en) * | 2020-03-09 | 2020-07-28 | 句容市久诺复合材料有限公司 | High-heat-resistance insulating SMC composite material |
| CN114031891A (en) * | 2021-11-29 | 2022-02-11 | 浙江南方塑胶制造有限公司 | Phenolic molding plastic with good tracking resistance and preparation method thereof |
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Application publication date: 20110420 |