CN1412242A - Low chlorine ion content injection phenolic moulding plastics - Google Patents
Low chlorine ion content injection phenolic moulding plastics Download PDFInfo
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- CN1412242A CN1412242A CN 01131935 CN01131935A CN1412242A CN 1412242 A CN1412242 A CN 1412242A CN 01131935 CN01131935 CN 01131935 CN 01131935 A CN01131935 A CN 01131935A CN 1412242 A CN1412242 A CN 1412242A
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- ion content
- chlorine ion
- moulding plastics
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Abstract
The present invention discloses a low chlorine ion content injection type phenol formaldehyde moulding material, in which the dose of phenolic resin whose chlorine ion content is less than 10 ppm is 30-50%, the dose of solidifying agent whose chlornie ion content is less than 30 ppm is 3-10%, the dose of inorganic reinforcement material whose chlorine ion content is less than 30 ppm is 10-30%, the dose of organic reinforcement fibre whose chlorine ion content is less than 50 ppm is 10-30%, the dose of plasticizer whose chlorine ion content is less than 30 ppm is 1-5% and dose of inorganic filling material whose chlorine ion content is less than 30 ppm is 10-40%.
Description
Technical field
The present invention relates to a kind of special engineering plastics, relate in particular to a kind of low chlorine ion content injection phenolic moulding plastics.
Background technology
The insulation system spare of low-voltage apparatus and spare and accessory parts phenolaldehyde moulding compound commonly used is made.But existing phenolaldehyde moulding compound can not satisfy the anticorrosive requirement to material.For example, in the electrolytic condenser, with ion in the insulation system spare that electrolytic solution contacts (as chlorion CL
-) can slowly move in the electrolytic solution, being immersed in like this between the positive and negative terminal in the electrolytic solution electrochemical reaction can take place, positively charged ion is to cathode motion, and the negatively charged ion anode is moved.Chemical reaction takes place in negatively charged ion and anode metal (as aluminium, silver), makes the anode metal corrosion, and anion concentration is high more, and the anode metal corrosion is fast more.In order to guarantee the work-ing life of anode metal terminal stud, and then the work-ing life of assurance electrolytic condenser, the phenolaldehyde moulding compound of preparation large vol electrolytic condenser insulation system spare and spare and accessory parts just must be made special stipulation to free anionic amounts such as its chloride ion-containings.
The usual component of phenolaldehyde moulding compound has tens kinds.The chloride ion content of all components all is inequality.And resol commonly used is to be catalyzer with basic cpds such as mineral acid such as hydrochloric acid or sodium hydroxide.With hydrochloric acid is that catalyst polymeric resol is matrix resin, owing in the hydrochloric acid a large amount of chlorions are arranged, obtain the moulding compound of low chlorine ion content, is impossible.And the sodium hydroxide of technical grade is made by the sodium chloride aqueous solution electrolysis, contain a certain amount of chlorion, if do not anticipate, directly be used as the catalyzer of resol, resol with this catalyzed polymerization is matrix resin, the phenolaldehyde moulding compound of preparation, its chloride ion content is also higher, can not satisfy the anticorrosive requirement of material.
Summary of the invention
The purpose of this invention is to provide a kind of low chlorine ion content (＜30ppm) injection phenolic moulding plastics that has.
The object of the present invention is achieved like this, and a kind of low chlorine ion content injection phenolic moulding plastics comprises following component:
A. the resol of chloride ion content＜30ppm, weight ratio is 30～50%;
B. the solidifying agent of chloride ion content＜50ppm, weight ratio is 3～10%;
C. the inorganic reinforcement of chloride ion content＜50ppm, weight ratio is 10～30%;
D. the organic reinforced fiber of chloride ion content＜70ppm, weight ratio is 10～30%;
E. the softening agent of chloride ion content＜50ppm, weight ratio is 1～5%;
F. the mineral filler of chloride ion content＜50ppm, weight ratio are 10～40%.
Purpose of the present invention can also realize that so described resol is acid system resol and/or alkaline process resol.
Purpose of the present invention can also realize that so described acid system resol is to be obtained by the low organic acid catalysis polymerization of chloride ion content; Described alkaline process resol is obtained by the basic compound catalysis polymerization.
Purpose of the present invention can also realize like this, and described organic acid is that in oxalic acid, formic acid, acetic acid, Phenylsulfonic acid, the tosic acid etc. one or more are compound; Described basic cpd is that in sodium hydroxide, hydrated barta, calcium hydroxide, magnesium hydroxide, the ammoniacal liquor etc. one or more are compound.
Purpose of the present invention can also realize that so described solidifying agent is acid system phenolic resin curative and/or alkaline process phenolic resin curative.
Purpose of the present invention can also realize like this, and described acid system phenolic resin curative is that in hexamethylenetetramine, triethylamine, Paraformaldehyde 96, many melamine methylols, trimethylol melamine, the many methylol dicyandiamides etc. one or more are compound; Described alkaline process phenolic resin curative is that in tosic acid, boric acid, the phosphoric acid etc. one or more are compound.
Purpose of the present invention can also realize like this, and described inorganic reinforcement is that in glass fibre, the alumina fiber etc. one or more are compound.
Purpose of the present invention can also realize like this, and described organic reinforced fiber is that in Mierocrystalline cellulose, methylcellulose gum, the xylogen etc. one or more are compound.
Purpose of the present invention can also realize that so described softening agent is stearic acid, calcium stearate, Zinic stearas, ethylene list stearylamide, and one or more in the ethylene bis stearamide etc. are compound.
Purpose of the present invention can also realize like this, and described mineral filler is that in nano-calcium carbonate, ultra-fine mica powder, the superfine talcum powder etc. one or more are compound.
Purpose of the present invention can also realize that so described resol weight is more accurate to be 35～45%; Described solidifying agent weight is more accurate to be 5～8%; Described inorganic reinforcement weight is more accurate to be 15～25%; Described organic reinforced fiber weight is more accurate to be 15～25%; Described softening agent weight is more accurate to be 1.5～3.5%; Described mineral filler weight is more accurate to be 15～25%.
The component chloride ion content that the present invention selects for use is extremely low, the resol of selecting for use has the careful degree that methylol structure that different phenol rings and formaldehyde forms has improved system, the weight of resol within the specific limits, adaptation curing stream is deformed into the requirement with solidification rate, the phenolaldehyde moulding compound that production obtains has that chloride ion content is low, injection excellent performance, heat-drawn wire height, advantage that notched Izod impact strength is big, and resulting phenolaldehyde moulding compound can be used for the insulation system spare and the spare and accessory parts of large vol electrolytic condenser.
Embodiment
Embodiment 1
With acid system resol is tackiness agent, selects suitable curing system for use, obtains the moulding compound of following component and content:
A, acid system resol, weight ratio are 30.0～50.0%;
One or more compound weight ratios in b, hexamethylenetetramine, triethylamine, Paraformaldehyde 96, many melamine methylols, trimethylol melamine, the many methylol dicyandiamides etc. are 2.5～10.0%;
C, magnesium oxide, weight ratio are 1.0～5.0%;
D, calcium hydroxide, weight ratio are 1.0～2.5%;
In e, stearic acid, calcium stearate, Zinic stearas, the ethylene list stearylamide etc. one or more are compound, and weight ratio is 1.5～3.0%;
In f, glass fibre, the alumina fiber etc. one or more are compound, and weight ratio is 20.0～30.0%;
In g, Mierocrystalline cellulose, methylcellulose gum, the xylogen etc. one or more are compound, and weight ratio is 10.0～20.0%;
H, colorant, weight ratio are 0.5～1.0%;
I, nano-calcium carbonate, weight ratio are 5.0～15.0%;
J, ultra-fine mica powder, weight ratio 1.0～4.0%.
Acid system resol is pulverized in pulverizer, reach certain fineness requirement after, weigh up various starting material by prescription, mix.Roll extrusion is in blocks on twin-roll machine, and is broken on crusher again, obtains moulding compound.The test chloride ion content, the compacting sample, test performance is as follows: chloride ion content is 17ppm, proportion is 1.72g/cm
3, heat-drawn wire is 190 ℃, notched Izod impact strength is 3.4KJ/m
2
Embodiment 2
With alkaline process resol is tackiness agent, selects suitable curing system for use, obtains the moulding compound of following component and content:
A, alkaline process resol, weight ratio are 30.0～40.0%;
B, tosic acid, weight ratio are 1.0～2.0%;
C, magnesium oxide, weight ratio are 2.0～5.0%;
D, calcium hydroxide, weight ratio are 1.5～2.5%;
In e, stearic acid, calcium stearate, Zinic stearas, the ethylene list stearylamide etc. one or more are compound, and weight ratio is 1.0～2.0%;
In f, glass fibre, the alumina fiber etc. one or more are compound, and weight ratio is 15.0～25.0%;
In g, Mierocrystalline cellulose, methylcellulose gum, the xylogen etc. one or more are compound, and weight ratio is 10.0～20.0%;
H, colorant, weight ratio are 0.5～1.0%;
I, nano-calcium carbonate, weight ratio are 5.0～15.0%;
J, ultra-fine mica powder 1.0～5.0%.
After alkaline process resol weighed up by prescription, add in the kneader, start kneader, add the residue starting material in the prescription again, mix the back discharging.Remove fugitive constituent then on twin-roll machine, roll-in is in blocks, pulverizes in pulverizer again, obtains moulding compound.The test chloride ion content, the compacting sample, test performance is as follows: chloride ion content is 20ppm, proportion is 1.70g/cm
3, heat-drawn wire is 196 ℃, notched Izod impact strength is 3.1KJ/m
2
Embodiment 3
With the compound of acid system resol and alkaline process resol is tackiness agent, selects suitable curing system for use, obtains the moulding compound of following component and content:
A, acid system resol, weight ratio are 15.0～20.0%;
B, alkaline process resol, weight ratio are 20.0～25.0%;
C, hexamethylenetetramine, weight ratio are 1.5～3.0%;
D, tosic acid, weight ratio are 1.0～2.0%;
E, magnesium oxide, weight ratio are 1.5～2.0%;
F, calcium hydroxide, weight ratio are 1.0～2.0%;
G, Zinic stearas, weight ratio are 1.0～2.0%;
In h, glass fibre, the alumina fiber etc. one or more are compound, and weight ratio is 15.0～20.0%;
In i, Mierocrystalline cellulose, methylcellulose gum, the xylogen etc. one or more are compound, and weight ratio is 10.0～20.0%;
J, nano-calcium carbonate, weight ratio are 5.0～10.0%;
K, ultra-fine mica powder, weight ratio are 1.0～5.0%;
L, colorant, weight ratio are 0.5～1.0%.
After acid system resol and alkaline process resol weighed up by prescription, add in the kneader, start kneader, add the residue starting material in the prescription again, mix the back discharging.Remove fugitive constituent then on twin-roll machine, roll-in is in blocks, pulverizes in pulverizer again, obtains moulding compound.The test chloride ion content, the compacting sample, test performance is as follows: chloride ion content is 22ppm, proportion is 1.69g/cm
3, heat-drawn wire is 193 ℃, notched Izod impact strength is 3.3KJ/m
2
Above embodiment shows, this material not only chloride ion content low (＜30ppm), and have higher heat-drawn wire and notched Izod impact strength, the injection moulding performance is good, can reach service requirements.
Below only be preferred embodiment of the present invention, every any modification or change of doing according to this patent all should be included in protection scope of the present invention.
Claims (16)
1, a kind of low chlorine ion content injection phenolic moulding plastics comprises following component:
A. the resol of chloride ion content＜30ppm, weight is 30～50%;
B. the solidifying agent of chloride ion content＜50ppm, weight is 3～10%;
C. the inorganic reinforcement of chloride ion content＜50ppm, weight is 10～30%;
D. the organic reinforced fiber of chloride ion content＜70ppm, weight is 10～30%;
E. the softening agent of chloride ion content＜50ppm, weight is 1～5%;
F. the mineral filler of chloride ion content＜50ppm, weight are 10～40%.
2, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described resol is acid system resol and/or alkaline process resol.
3, low chlorine ion content injection phenolic moulding plastics as claimed in claim 2, it is further characterized in that described acid system resol is to be obtained by the low organic acid catalysis polymerization of chloride ion content; Described alkaline process resol is obtained by the basic compound catalysis polymerization.
4, as low chlorine ion content injection phenolic moulding plastics as described in the claim 3, it is further characterized in that, described organic acid is that in oxalic acid, formic acid, acetic acid, Phenylsulfonic acid, the tosic acid etc. one or more are compound; Described basic cpd is that in sodium hydroxide, hydrated barta, calcium hydroxide, magnesium hydroxide, the ammoniacal liquor etc. one or more are compound.
5, low chlorine ion content injection phenolic moulding plastics as claimed in claim 2, it is further characterized in that described solidifying agent is acid system phenolic resin curative and/or alkaline process phenolic resin curative.
6, as low chlorine ion content injection phenolic moulding plastics as described in the claim 5, it is further characterized in that, described acid system phenolic resin curative is that in hexamethylenetetramine, triethylamine, Paraformaldehyde 96, many melamine methylols, trimethylol melamine, the many methylol dicyandiamides etc. one or more are compound; Described alkaline process phenolic resin curative is that in tosic acid, boric acid, the phosphoric acid etc. one or more are compound.
7, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that, described inorganic reinforcement is that in glass fibre, the alumina fiber etc. one or more are compound.
8, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that, described organic reinforced fiber is that in Mierocrystalline cellulose, methylcellulose gum, the xylogen etc. one or more are compound.
9, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described softening agent is stearic acid, calcium stearate, Zinic stearas, ethylene list stearylamide, one or more in the ethylene bis stearamide etc. are compound.
10, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that, described mineral filler is that in nano-calcium carbonate, ultra-fine mica powder, the superfine talcum powder etc. one or more are compound.
11, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described resol weight is more accurate to be 35～45%.
12, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described solidifying agent weight is more accurate to be 5～8%.
13, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described inorganic reinforcement weight is more accurate to be 15～25%.
14, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described organic reinforced fiber weight is more accurate to be 15～25%.
15, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described softening agent weight is more accurate to be 1.5～3.5%.
16, low chlorine ion content injection phenolic moulding plastics according to claim 1, it is further characterized in that described mineral filler weight is more accurate to be 15～25%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011319356A CN1172988C (en) | 2001-10-16 | 2001-10-16 | Low chlorine ion content injection phenolic moulding plastics |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011319356A CN1172988C (en) | 2001-10-16 | 2001-10-16 | Low chlorine ion content injection phenolic moulding plastics |
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| CN1412242A true CN1412242A (en) | 2003-04-23 |
| CN1172988C CN1172988C (en) | 2004-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB011319356A Expired - Fee Related CN1172988C (en) | 2001-10-16 | 2001-10-16 | Low chlorine ion content injection phenolic moulding plastics |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020827A (en) * | 2010-10-14 | 2011-04-20 | 常熟东南塑料有限公司 | Phenolic moulding plastic for low-voltage apparatus |
| US9564090B2 (en) | 2014-11-05 | 2017-02-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Liquid crystal display panel and gate drive circuit thereof |
| CN107384123A (en) * | 2017-07-27 | 2017-11-24 | 安徽美景工艺品有限公司 | A kind of wicker plaiting article meal basket special coating and preparation method thereof |
-
2001
- 2001-10-16 CN CNB011319356A patent/CN1172988C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020827A (en) * | 2010-10-14 | 2011-04-20 | 常熟东南塑料有限公司 | Phenolic moulding plastic for low-voltage apparatus |
| US9564090B2 (en) | 2014-11-05 | 2017-02-07 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Liquid crystal display panel and gate drive circuit thereof |
| CN107384123A (en) * | 2017-07-27 | 2017-11-24 | 安徽美景工艺品有限公司 | A kind of wicker plaiting article meal basket special coating and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN1172988C (en) | 2004-10-27 |
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Granted publication date: 20041027 Termination date: 20171016 |