CN105932134B - 发光器件封装和包括该发光器件封装的照明设备 - Google Patents

发光器件封装和包括该发光器件封装的照明设备 Download PDF

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CN105932134B
CN105932134B CN201610109347.9A CN201610109347A CN105932134B CN 105932134 B CN105932134 B CN 105932134B CN 201610109347 A CN201610109347 A CN 201610109347A CN 105932134 B CN105932134 B CN 105932134B
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light emitting
layer
electrode
emitting device
device package
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CN105932134A (zh
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丁星好
任范镇
李尚烈
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Suzhou Liyu Semiconductor Co ltd
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LG Innotek Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/862Resonant cavity structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/833Transparent materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/835Reflective materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8312Electrodes characterised by their shape extending at least partially through the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers

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CN201610109347.9A 2015-02-26 2016-02-26 发光器件封装和包括该发光器件封装的照明设备 Active CN105932134B (zh)

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KR10-2015-0026969 2015-02-26
KR1020150026969A KR101669122B1 (ko) 2015-02-26 2015-02-26 발광 소자 패키지

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CN105932134B true CN105932134B (zh) 2020-03-10

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US (1) US10109772B2 (enExample)
EP (1) EP3062355A1 (enExample)
JP (1) JP6810927B2 (enExample)
KR (1) KR101669122B1 (enExample)
CN (1) CN105932134B (enExample)

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US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
CN205944139U (zh) * 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
US9666546B1 (en) * 2016-04-28 2017-05-30 Infineon Technologies Ag Multi-layer metal pads
KR102722845B1 (ko) * 2017-01-25 2024-10-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 및 그 제조방법, 반도체 소자 패키지, 객체 검출 장치
TWI790984B (zh) * 2017-01-26 2023-01-21 晶元光電股份有限公司 發光元件
CN107910420A (zh) * 2017-12-19 2018-04-13 扬州科讯威半导体有限公司 一种紫外发光二极管及制备方法
KR102607596B1 (ko) * 2018-05-11 2023-11-29 삼성전자주식회사 반도체 발광소자 및 이를 이용한 반도체 발광소자 패키지
CN111446343B (zh) * 2019-04-03 2021-06-08 厦门市三安光电科技有限公司 一种半导体发光器件
KR102630680B1 (ko) * 2019-05-02 2024-01-30 삼성전자주식회사 Led 소자, led 소자의 제조 방법 및 led 소자를 포함하는 디스플레이 패널
CN113707041A (zh) * 2020-05-22 2021-11-26 北京芯海视界三维科技有限公司 发光模组、显示模组、显示屏及显示器
JP7621783B2 (ja) * 2020-12-10 2025-01-27 スタンレー電気株式会社 半導体発光装置及び半導体発光素子の支持基板

Citations (2)

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CN1649460A (zh) * 2004-01-26 2005-08-03 株式会社半导体能源研究所 发光器件
CN103119735A (zh) * 2010-09-24 2013-05-22 首尔半导体株式会社 晶片级发光二极管封装件及其制造方法

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EP2357679B1 (en) * 2008-11-14 2018-08-29 Samsung Electronics Co., Ltd. Vertical/horizontal light-emitting diode for semiconductor
US9070851B2 (en) * 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
JP2013021175A (ja) * 2011-07-12 2013-01-31 Toshiba Corp 半導体発光素子
KR101276053B1 (ko) 2011-07-22 2013-06-17 삼성전자주식회사 반도체 발광소자 및 발광장치
JP5953155B2 (ja) 2012-02-24 2016-07-20 スタンレー電気株式会社 半導体発光装置
US20130292719A1 (en) * 2012-05-04 2013-11-07 Chi Mei Lighting Technology Corp. Light-emitting diode structure and method for manufacturing the same
KR101926361B1 (ko) 2012-06-13 2018-12-07 삼성전자주식회사 반도체 발광소자, 발광장치 및 반도체 발광소자 제조방법
JP2014096539A (ja) 2012-11-12 2014-05-22 Tokuyama Corp 紫外発光素子、および発光構造体
US9482410B2 (en) * 2012-12-11 2016-11-01 Samsung Electronics Co., Ltd. Light emitting module and surface lighting device having the same
JP2014150196A (ja) * 2013-02-01 2014-08-21 Toshiba Corp 半導体発光装置およびその製造方法
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KR102162437B1 (ko) * 2014-05-15 2020-10-07 엘지이노텍 주식회사 발광 소자 및 이를 포함하는 발광 소자 패키지

Patent Citations (2)

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CN1649460A (zh) * 2004-01-26 2005-08-03 株式会社半导体能源研究所 发光器件
CN103119735A (zh) * 2010-09-24 2013-05-22 首尔半导体株式会社 晶片级发光二极管封装件及其制造方法

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JP6810927B2 (ja) 2021-01-13
EP3062355A1 (en) 2016-08-31
US20160254414A1 (en) 2016-09-01
KR101669122B1 (ko) 2016-10-25
US10109772B2 (en) 2018-10-23
KR20160104233A (ko) 2016-09-05
JP2016163045A (ja) 2016-09-05
CN105932134A (zh) 2016-09-07

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Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

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