CN105932134B - 发光器件封装和包括该发光器件封装的照明设备 - Google Patents
发光器件封装和包括该发光器件封装的照明设备 Download PDFInfo
- Publication number
- CN105932134B CN105932134B CN201610109347.9A CN201610109347A CN105932134B CN 105932134 B CN105932134 B CN 105932134B CN 201610109347 A CN201610109347 A CN 201610109347A CN 105932134 B CN105932134 B CN 105932134B
- Authority
- CN
- China
- Prior art keywords
- light emitting
- layer
- electrode
- emitting device
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/862—Resonant cavity structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0026969 | 2015-02-26 | ||
| KR1020150026969A KR101669122B1 (ko) | 2015-02-26 | 2015-02-26 | 발광 소자 패키지 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105932134A CN105932134A (zh) | 2016-09-07 |
| CN105932134B true CN105932134B (zh) | 2020-03-10 |
Family
ID=55405238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610109347.9A Active CN105932134B (zh) | 2015-02-26 | 2016-02-26 | 发光器件封装和包括该发光器件封装的照明设备 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10109772B2 (enExample) |
| EP (1) | EP3062355A1 (enExample) |
| JP (1) | JP6810927B2 (enExample) |
| KR (1) | KR101669122B1 (enExample) |
| CN (1) | CN105932134B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
| CN205944139U (zh) * | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
| US9666546B1 (en) * | 2016-04-28 | 2017-05-30 | Infineon Technologies Ag | Multi-layer metal pads |
| KR102722845B1 (ko) * | 2017-01-25 | 2024-10-29 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 및 그 제조방법, 반도체 소자 패키지, 객체 검출 장치 |
| TWI790984B (zh) * | 2017-01-26 | 2023-01-21 | 晶元光電股份有限公司 | 發光元件 |
| CN107910420A (zh) * | 2017-12-19 | 2018-04-13 | 扬州科讯威半导体有限公司 | 一种紫外发光二极管及制备方法 |
| KR102607596B1 (ko) * | 2018-05-11 | 2023-11-29 | 삼성전자주식회사 | 반도체 발광소자 및 이를 이용한 반도체 발광소자 패키지 |
| CN111446343B (zh) * | 2019-04-03 | 2021-06-08 | 厦门市三安光电科技有限公司 | 一种半导体发光器件 |
| KR102630680B1 (ko) * | 2019-05-02 | 2024-01-30 | 삼성전자주식회사 | Led 소자, led 소자의 제조 방법 및 led 소자를 포함하는 디스플레이 패널 |
| CN113707041A (zh) * | 2020-05-22 | 2021-11-26 | 北京芯海视界三维科技有限公司 | 发光模组、显示模组、显示屏及显示器 |
| JP7621783B2 (ja) * | 2020-12-10 | 2025-01-27 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光素子の支持基板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1649460A (zh) * | 2004-01-26 | 2005-08-03 | 株式会社半导体能源研究所 | 发光器件 |
| CN103119735A (zh) * | 2010-09-24 | 2013-05-22 | 首尔半导体株式会社 | 晶片级发光二极管封装件及其制造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2357679B1 (en) * | 2008-11-14 | 2018-08-29 | Samsung Electronics Co., Ltd. | Vertical/horizontal light-emitting diode for semiconductor |
| US9070851B2 (en) * | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
| JP2013021175A (ja) * | 2011-07-12 | 2013-01-31 | Toshiba Corp | 半導体発光素子 |
| KR101276053B1 (ko) | 2011-07-22 | 2013-06-17 | 삼성전자주식회사 | 반도체 발광소자 및 발광장치 |
| JP5953155B2 (ja) | 2012-02-24 | 2016-07-20 | スタンレー電気株式会社 | 半導体発光装置 |
| US20130292719A1 (en) * | 2012-05-04 | 2013-11-07 | Chi Mei Lighting Technology Corp. | Light-emitting diode structure and method for manufacturing the same |
| KR101926361B1 (ko) | 2012-06-13 | 2018-12-07 | 삼성전자주식회사 | 반도체 발광소자, 발광장치 및 반도체 발광소자 제조방법 |
| JP2014096539A (ja) | 2012-11-12 | 2014-05-22 | Tokuyama Corp | 紫外発光素子、および発光構造体 |
| US9482410B2 (en) * | 2012-12-11 | 2016-11-01 | Samsung Electronics Co., Ltd. | Light emitting module and surface lighting device having the same |
| JP2014150196A (ja) * | 2013-02-01 | 2014-08-21 | Toshiba Corp | 半導体発光装置およびその製造方法 |
| US20150008465A1 (en) * | 2013-07-08 | 2015-01-08 | Invenlux Corporation | Reflective electrode structure, light emitting device and package |
| KR102162437B1 (ko) * | 2014-05-15 | 2020-10-07 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광 소자 패키지 |
-
2015
- 2015-02-26 KR KR1020150026969A patent/KR101669122B1/ko active Active
-
2016
- 2016-02-22 EP EP16156737.5A patent/EP3062355A1/en not_active Withdrawn
- 2016-02-25 US US15/053,559 patent/US10109772B2/en active Active
- 2016-02-25 JP JP2016034334A patent/JP6810927B2/ja active Active
- 2016-02-26 CN CN201610109347.9A patent/CN105932134B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1649460A (zh) * | 2004-01-26 | 2005-08-03 | 株式会社半导体能源研究所 | 发光器件 |
| CN103119735A (zh) * | 2010-09-24 | 2013-05-22 | 首尔半导体株式会社 | 晶片级发光二极管封装件及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6810927B2 (ja) | 2021-01-13 |
| EP3062355A1 (en) | 2016-08-31 |
| US20160254414A1 (en) | 2016-09-01 |
| KR101669122B1 (ko) | 2016-10-25 |
| US10109772B2 (en) | 2018-10-23 |
| KR20160104233A (ko) | 2016-09-05 |
| JP2016163045A (ja) | 2016-09-05 |
| CN105932134A (zh) | 2016-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105932134B (zh) | 发光器件封装和包括该发光器件封装的照明设备 | |
| US10651345B2 (en) | Light emitting device, light emitting device package including the device, and lighting apparatus including the package | |
| US10205058B2 (en) | Light-emitting device package and light-emitting apparatus comprising same | |
| US10381519B2 (en) | Light emitting device package and lighting apparatus | |
| CN107924968B (zh) | 发光元件、包括发光元件的发光元件封装和包括发光元件封装的发光装置 | |
| US10418523B2 (en) | Light-emitting device and light-emitting device package | |
| CN105529387A (zh) | 发光器件封装及包括该封装的照明装置 | |
| CN106025034A (zh) | 发光器件和包括发光器件的发光器件封装 | |
| KR102569249B1 (ko) | 발광 소자 패키지 | |
| CN105529385B (zh) | 发光器件、发光器件封装以及包括该封装的照明装置 | |
| CN105552189A (zh) | 发光器件封装和包括该封装的发光设备 | |
| KR102408617B1 (ko) | 발광 소자 패키지 및 이를 포함하는 발광 장치 | |
| KR102464028B1 (ko) | 발광 소자 패키지 및 이를 포함하는 발광 장치 | |
| US20190027647A1 (en) | Light emitting diode | |
| KR20160115868A (ko) | 발광 소자, 이 소자를 포함하는 발광 소자 패키지, 및 이 패키지를 포함하는 조명 장치 | |
| KR20160084992A (ko) | 발광 소자 | |
| KR102087948B1 (ko) | 발광 소자 패키지 | |
| KR20160047766A (ko) | 발광 소자 및 이를 포함하는 발광 소자 패키지 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210806 Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Leyu Semiconductor Co.,Ltd. Address before: Seoul City, Korea Patentee before: LG INNOTEK Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee after: Suzhou Liyu Semiconductor Co.,Ltd. Country or region after: China Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Leyu Semiconductor Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |