CN105932088A - 一种具有钙钛矿结构的异质结薄膜光电器件及其制备方法 - Google Patents
一种具有钙钛矿结构的异质结薄膜光电器件及其制备方法 Download PDFInfo
- Publication number
- CN105932088A CN105932088A CN201610551748.XA CN201610551748A CN105932088A CN 105932088 A CN105932088 A CN 105932088A CN 201610551748 A CN201610551748 A CN 201610551748A CN 105932088 A CN105932088 A CN 105932088A
- Authority
- CN
- China
- Prior art keywords
- film
- photoelectric device
- oxide film
- preparation
- perovskite structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000000137 annealing Methods 0.000 claims abstract description 15
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 76
- 239000002243 precursor Substances 0.000 claims description 48
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 36
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 36
- 229910010252 TiO3 Inorganic materials 0.000 claims description 30
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 24
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 17
- 239000010409 thin film Substances 0.000 claims description 17
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 13
- 238000003756 stirring Methods 0.000 claims description 13
- 229910002370 SrTiO3 Inorganic materials 0.000 claims description 11
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 7
- 229960000583 acetic acid Drugs 0.000 claims description 7
- FYDKNKUEBJQCCN-UHFFFAOYSA-N lanthanum(3+);trinitrate Chemical compound [La+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O FYDKNKUEBJQCCN-UHFFFAOYSA-N 0.000 claims description 7
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
- 229910002204 La0.8Sr0.2MnO3 Inorganic materials 0.000 claims description 6
- IWOUKMZUPDVPGQ-UHFFFAOYSA-N barium nitrate Chemical compound [Ba+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O IWOUKMZUPDVPGQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 claims description 6
- 238000009938 salting Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- DHEQXMRUPNDRPG-UHFFFAOYSA-N strontium nitrate Chemical compound [Sr+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O DHEQXMRUPNDRPG-UHFFFAOYSA-N 0.000 claims description 6
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 5
- 150000004703 alkoxides Chemical class 0.000 claims description 5
- 229960001484 edetic acid Drugs 0.000 claims description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 5
- 229910052691 Erbium Inorganic materials 0.000 claims description 4
- 229910002273 La1–xSrxCoO3 Inorganic materials 0.000 claims description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 239000012362 glacial acetic acid Substances 0.000 claims description 4
- 229910002075 lanthanum strontium manganite Inorganic materials 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- RXSHXLOMRZJCLB-UHFFFAOYSA-L strontium;diacetate Chemical compound [Sr+2].CC([O-])=O.CC([O-])=O RXSHXLOMRZJCLB-UHFFFAOYSA-L 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910002262 LaCrO3 Inorganic materials 0.000 claims description 3
- 229910002340 LaNiO3 Inorganic materials 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910002353 SrRuO3 Inorganic materials 0.000 claims description 3
- WFNBSLYTFHMPBY-UHFFFAOYSA-N acetic acid;erbium Chemical compound [Er].CC(O)=O WFNBSLYTFHMPBY-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000013019 agitation Methods 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000005352 clarification Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 claims description 3
- 239000000138 intercalating agent Substances 0.000 claims description 3
- 229910052744 lithium Inorganic materials 0.000 claims description 3
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- YHBDIEWMOMLKOO-UHFFFAOYSA-I pentachloroniobium Chemical compound Cl[Nb](Cl)(Cl)(Cl)Cl YHBDIEWMOMLKOO-UHFFFAOYSA-I 0.000 claims description 3
- 235000011056 potassium acetate Nutrition 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 2
- 238000001556 precipitation Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 11
- 238000000576 coating method Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 10
- 238000004528 spin coating Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 35
- 239000010936 titanium Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 8
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 229910002651 NO3 Inorganic materials 0.000 description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 238000003760 magnetic stirring Methods 0.000 description 2
- 229910000473 manganese(VI) oxide Inorganic materials 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 235000011164 potassium chloride Nutrition 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910002422 La(NO3)3·6H2O Inorganic materials 0.000 description 1
- JTCFNJXQEFODHE-UHFFFAOYSA-N [Ca].[Ti] Chemical compound [Ca].[Ti] JTCFNJXQEFODHE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- LVYZJEPLMYTTGH-UHFFFAOYSA-H dialuminum chloride pentahydroxide dihydrate Chemical compound [Cl-].[Al+3].[OH-].[OH-].[Al+3].[OH-].[OH-].[OH-].O.O LVYZJEPLMYTTGH-UHFFFAOYSA-H 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- -1 niobium alkoxide Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
Abstract
一种具有钙钛矿结构的异质结薄膜光电器件,涉及一种光电器件,包括基板,以及依次层叠在基板上的下电极、p型钙钛矿型氧化物薄膜、n型钙钛矿型氧化物薄膜和上电极;其中,p型钙钛矿型氧化物薄膜为Er:Li0.1K0.4Bi0.5TiO3,掺杂的Er与Li0.1K0.4Bi0.5TiO3的摩尔比为0.005‑0.2;n型钙钛矿型氧化物薄膜为BaNbxTi1‑xO3,x的取值范围为0.05‑0.1;本发明光电器件的各薄膜层是经旋涂工艺依次涂覆在基板上后,经烘干、退火工序制成的。本发明提出了一种新的钙钛矿型异质结薄膜并应用于光电器件,能够增加异质结光电器件的光生电流,提高其光电转换效率。
Description
技术领域
本发明涉及一种光电器件,具体涉及一种具有钙钛矿结构的异质结薄膜光电器件及其制备方法。
背景技术
近年来,随着能源危机和环境恶化的日益严重,开发可再生的绿色能源成为全社会共同关注的课题。为了实现太阳能发电的经济实惠及大规模应用,探索和开发低成本、高效率的太阳能电池已迫在眉睫。近来,铁电材料的光伏效应激发了人们的研究兴趣。半导体的光生伏打效应是由宏观不均匀性造成的,产生光伏电压一般不超过半导体的禁带宽度(一般为数伏)。而铁电材料具有完全不同于半导体的反常光生伏打(APV)效应:均匀铁电晶体在均匀光照下出现稳态短路光生电流或开路电压的现象,光伏电压不受晶体禁带宽度(Eg)的限制,可比Eg高2~4个数量级,达103~105V/cm。
Brody P S.研究表明某些多晶铁电材料的光伏电压与其剩余极化强度成正比(High voltage photovoltaic effect in bariumtitanate and lead
titanate-lead zirconate ceramics. J.Solid State Chemistry.),因此,具有大的自发极化强度的铁电材料已成为研究热点。K0.5Bi0.5TiO3(KBT)作为一种钙钛矿结构铁电体被发现,但是其剩余极化强度并不是很好。需要寻找一种能够提高其剩余极化强度和铁电性的途径。
研究表明,钛酸铋作为一类压电和铁电材料,在改善其压电和铁电特性过程中发现,这类铋层状氧化物晶格中的钙钛矿层(Am-1BmO3m+1)2-的A位对许多掺杂离子具有很大的相容性,而这种相容性并不改变基质材料晶格的整体结构。这种相容性为采用稀土掺杂铋层状氧化物,设计其上转换发光特性,并在一定程度上保留或改善原有的压电和铁电性能,为开发其多功能化应用提供了可行性。
本发明致力于制备一种新型异质结光电器件,通过对铁电材料的上转换性能进行研究,以获得光电效率得到提升的光电器件,到目前为止,尚没有人采用稀土掺杂的Li0.1K0.4Bi0.5TiO3和BaNbxTi1-xO3制备异质结光电器件。
发明内容
本发明的目的是提供一种异质结光电器件及其制备方法,通过制备稀土掺杂的Li0.1K0.4Bi0.5TiO3薄膜,能够实现对光线进行上转换,进而制备稀土掺杂的Li0.1K0.4Bi0.5TiO3/BaNbxTi1-xO3异质结光电器件,提高光生电流,以提高光电转换效率。
为实现上述发明目的,本发明的技术方案是:一种具有钙钛矿结构的异质结薄膜光电器件,包括基板,以及依次层叠在基板上的下电极、p型钙钛矿型氧化物薄膜、n型钙钛矿型氧化物薄膜和上电极;其中,p型钙钛矿型氧化物薄膜为Er:Li0.1K0.4Bi0.5TiO3,掺杂的Er与Li0.1K0.4Bi0.5TiO3的摩尔比为0.005-0.2;n型钙钛矿型氧化物薄膜为BaNbxTi1-xO3,x的取值范围为0.05-0.1。
进一步地,所述下电极和上电极均为钙钛矿型透明导电氧化物。
更进一步地,所述上电极为LaNiO3、LaCrO3、SrRuO3、CaRuO3、La1-xSrxCoO3、La1-xSrxMnO3、La1-xSrxCrO3、BaPbO3、La1-xSrxTiO3、SrIrO3中的至少一种,其中0<x<1。
所述下电极为La:SrTiO3薄膜,其制备方法为:将醋酸锶、硝酸镧溶于醋酸溶液中形成盐溶液,在 120℃下搅拌 2h;将钛酸四丁酯溶解在乙酰丙酮中,在 80℃搅拌 1h 使其混合均匀,然后将其加入上述盐溶液中,并加入稳定剂乙二醇和溶剂乙二醇甲醚,配制成澄清的1号前驱体溶液;将上述1号前驱体溶液均匀涂覆在基板上,在管式电炉中退火形成La:SrTiO3
薄膜。
所述p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3的制备方法为:将硝酸铋、醋酸钾、硝酸锂和醋酸铒按化学计量比溶解于醋酸中,加入乙二醇作为溶剂,然后加入柠檬酸,形成前驱体溶液A1;将钛酸四丁酯溶解于乙二醇中,然后加入柠檬酸,形成前驱体溶液A2;将前驱体溶液A1与前驱体溶液A2按照化学计量比进行混合,室温下搅拌均匀,从而生成2号前驱体溶液;将2号前驱体溶液涂布到下电极上,干燥后退火形成掺杂有铒的Li0.1K0.4Bi0.5TiO3薄膜。
所述n型钙钛矿型氧化物薄膜BaNbxTi1-xO3的制备方法为:将氯化铌和氢氧化钾加入乙二醇甲醚中,在氩气的保护下进行反应,过滤掉反应生成的KCl沉淀,制备得到铌的醇盐;将所得铌的醇盐与钛酸四丁酯、有机溶剂乙二醇甲醚混合,并加入乙酰丙酮作为鳌合剂,配制成前驱体溶液B1;将过量10%的硝酸钡溶于乙二醇甲醚与冰醋酸的混合液中,混合搅拌均匀,配制成前驱体溶液B2;将前驱体溶液B1和前驱体溶液B2混合均匀并静置2天,从而制备出3号前驱体溶液;将3号前驱体溶液涂布到p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3上,干燥后退火形成BaNbxTi1-xO3薄膜。
所述上电极优选为La0.8Sr0.2MnO3薄膜,其制备方法为:将硝酸镧、硝酸锶和硝酸锰按照化学计量比溶于去离子水中,然后加入柠檬酸和乙二胺四乙酸,加热搅拌,充分络合反应后,得到4号前驱体溶液;将上述4号前驱体溶液均匀涂覆于n型钙钛矿型氧化物薄膜BaNbxTi1-xO3上,干燥后退火形成La0.8Sr0.2MnO3薄膜。
所述的一种具有钙钛矿结构的异质结薄膜光电器件的制备方法,包括如下步骤:
(1)、分别采用丙酮溶液、氢氟酸清洗基板表面,再用无水乙醇和去离子水将基板表面冲洗干净,然后烘干,烘干后采用硅烷偶联剂修饰基板表面,以增强后续形成的薄膜与基板表面的附着力;
(2)、在处理过的基板上从下到上依次制备下电极、p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3、n型钙钛矿型氧化物薄膜BaNbxTi1-xO3和上电极。
本发明中的基板为玻璃、石英或硅片。
本发明与现有技术相比,具有以下有益效果:
1、钙钛矿型的Er:Li0.1K0.4Bi0.5TiO3/BaNbxTi1-xO3异质结薄膜在光电领域中为首次被提出。
2、采用p型钙钛矿型薄膜为Er:Li0.1K0.4Bi0.5TiO3,具有上转换功能,能够增加薄膜对光的吸收范围,从而增加异质结光电器件的光生电流。
3、采用掺有Li的钙钛矿型薄膜作为光吸收层,Li的加入能够降低薄膜的退火温度,能够降低薄膜的漏电流,同时能够降低光吸收层的带隙。
4、采用上电极和下电极都为钙钛矿型材料,使薄膜之间存在完美的晶格匹配,从而能够提高薄膜质量,进而提高器件的性能。
5、采用溶胶凝胶法制备得到三明治型光电器件,制备方法简单,容易操控。
附图说明
图1 为本发明光电器件的结构示意图;
图中标记为:1、基板、2、下电极,3、p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3,4、n型钙钛矿型氧化物薄膜BaNbxTi1-xO3,5、上电极。
具体实施方式
如图1所示,本发明的具有钙钛矿结构的异质结薄膜光电器件,其包括基板1,以及依次层叠在基板1上的下电极2、p型钙钛矿型氧化物薄膜3、n型钙钛矿型氧化物薄膜4和上电极5;其中,p型钙钛矿型氧化物薄膜为Er:Li0.1K0.4Bi0.5TiO3,掺杂的Er与Li0.1K0.4Bi0.5TiO3的摩尔比为0.005-0.2;n型钙钛矿型氧化物薄膜为BaNbxTi1-xO3,x的取值范围为0.05-0.1。
所述下电极和上电极均为钙钛矿型透明导电氧化物。比如,下电极为La:SrTiO3薄膜。上电极为LaNiO3、LaCrO3、SrRuO3、CaRuO3、La1-xSrxCoO3、La1-xSrxMnO3、La1-xSrxCrO3、BaPbO3、La1-xSrxTiO3、SrIrO3中的至少一种,其中,La1-xSrxCoO3、La1-xSrxMnO3、La1-xSrxCrO3、La1-xSrxTiO3中x的取值范围均为0<x<1。
上电极优选为La0.8Sr0.2MnO3薄膜,下面以此为例,详细说明本发明光电器件的制备方法:
(1)步骤101:基板的处理
基板可为玻璃、石英或硅片,先用丙酮溶液对基板进行超声波振荡10min,溶解基板表面的有机污染物,再用氢氟酸洗液浸泡20min去除基板表面的无机污染物,最后用无水乙醇和去离子水重复冲洗干净,放入烘箱中烘干,烘干后采用硅烷偶联剂修饰基板,以增强后续形成的薄膜与基板表面的附着力。
(2)步骤102:制备下电极
在处理过的基板上制备La:SrTiO3薄膜作为下电极; La:SrTiO3薄膜的制备方法为:利用磁力搅拌器将醋酸锶、硝酸镧溶于醋酸溶液中形成盐溶液,在 120℃下搅拌 2h;称取钛酸四丁酯溶解在乙酰丙酮中,在 80℃搅拌 1h 使混合均匀,然后将其加入上述盐溶液中,并加入乙二醇作为稳定剂,乙二醇甲醚为溶剂,乙二醇与乙二醇甲醚的体积配比为1:5,配成金属离子浓度为 0.4
mol/L 的溶液,制成澄清的1号前驱体溶液;将上述1号前驱体溶液均匀涂覆在处理过的基板上,在管式电炉中退火形成La:SrTiO3
薄膜。
上述La:SrTiO3 薄膜的形成方法为:采用多次旋涂和预处理方式。设定匀胶机参数,先在较低转速下(600 rpm)旋转 18 s,然后在 3000 rpm 的转速下旋转 30s;甩胶后将湿膜置于管式电炉中,氧气流量为 0.1 L/min。涂第一层后,以3℃/min 的速度升到 130℃,低温烘干,再升到 450 ℃,缓慢蒸发有机物,形成非晶薄膜;随后重复第一层的旋涂和加热预处理过程数次,达到所需的膜厚100-600nm,最后升到 600℃,保温 2 h,使有机物完全蒸发,然后于 650℃-750 ℃下退火 10-30分钟,生长成晶态的
La:SrTiO3 薄膜。其中,La的掺杂量为:La占La和Sr总摩尔量的0.
5mol%-10mol%,La和Sr总摩尔量即为醋酸锶和硝酸镧两者的总和。
(3)步骤103:制备钙钛矿型异质结薄膜
A、制备p型钙钛矿型Er:Li0.1K0.4Bi0.5TiO3薄膜
将硝酸铋Bi(NO3)3、醋酸钾KOOCCH3、硝酸锂LiNO3和醋酸铒Er(OOCCH3)3按照化学计量比5:4:1:x溶解于醋酸中,其中x为铒的掺杂量,取值范围为0.05~2,并加入适量的乙二醇作为溶剂,然后加入适量的柠檬酸,使乙二醇、柠檬酸与金属离子的摩尔比为5:1.5:1,形成前驱体溶液A1;将钛酸四丁酯C16H36O4Ti溶解于乙二醇中,加入柠檬酸,使乙二醇、柠檬酸与金属离子的摩尔比为5:1.5:1,形成前驱体溶液A2;将前驱体溶液A1与前驱体溶液A2按照化学计量比进行混合,室温下搅拌均匀,从而生成2号前驱体溶液;将2号前驱体溶液涂布到下电极薄膜上,干燥后退火形成掺杂有铒的Li0.1K0.4Bi0.5TiO3薄膜。
上述掺杂有铒的Li0.1K0.4Bi0.5TiO3薄膜的形成方法为:设定匀胶机参数,控制转速为1000rpm甩胶10秒,然后在3800rpm转速下甩胶30秒;甩胶结束后将带有2号前驱体湿膜的基板在热板上先200℃烘干3分钟,然后在350℃煅烧5分钟;然后重复上述甩胶和热处理过程,直到膜厚达到所需的300-1200nm,最后在氢气气氛下通过快速退火炉烧结5-30分钟,通过控制退火过程的升温速率和降温速率使钙钛矿型薄膜的晶粒尺寸为40-200nm,其中退火温度600-1000℃,优选800℃,最后降温形成掺杂有铒的Li0.1K0.4Bi0.5TiO3薄膜。
B、制备n型钙钛矿型BaNbxTi1-xO3薄膜,x的取值范围为0.05-0.1
将化学计量比1:5的氯化铌 ( NbCl5)和氢氧化钾(KOH)加入乙二醇甲醚中,在保护性气体氩气下进行反应,80℃以上过滤掉反应生成的氯化钾(KCl)沉淀,制备得到铌的醇盐;将所得铌醇盐与钛酸四丁酯 ( C16H36O4Ti)、乙二醇甲醚混合,并加入少量乙酰丙酮作为鳌合剂,搅拌 2h 配制成前驱体溶液B1;将称量好的过量10%的硝酸钡( Ba(NO3) 2)溶于乙二醇甲醚与冰醋酸 (体积配比为3∶1)的混合液中,其中冰醋酸起稳定剂的作用,混合搅拌2h,制备获得前驱体溶液B2;将前驱体溶液B1和前驱体溶液B2按照化学计量比混合搅拌并静置 2 天左右,制备出3号前驱体溶液;将3号前驱体溶液涂布到p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3上,干燥后退火形成BaNbxTi1-xO3薄膜。
BaNbxTi1-xO3薄膜的形成方法为:设定匀胶机参数,控制转速为600rpm甩胶10秒,然后在3000rpm转速下甩胶30秒;甩胶结束后将带有3号前驱体湿膜的基板在热板上先200℃烘干3分钟,然后在350℃煅烧5分钟;然后重复上述甩胶和热处理过程,直到所需的膜厚达到300-1200nm,最后通过快速退火炉在600-1000℃下烧结5-30分钟,优选850℃,最后形成BaNbxTi1-xO3薄膜。
(4)步骤104:制备上电极
在n型钙钛矿型BaNbxTi1-xO3薄膜上制备La0.8Sr0.2MnO3薄膜作为上电极,La0.8Sr0.2MnO3薄膜的制备方法为:按照化学计量比将硝酸镧La(NO3)3·6H2O,硝酸锶Sr(NO3)2和硝酸锰 Mn(NO3)2溶于去离子水中搅拌均匀,将其配成金属离子总浓度为 0.5mol/L 的溶液;然后将柠檬酸和乙二胺四乙酸(EDTA)用作络合剂加入到上述混合溶液中,使得溶液中的金属离子总浓度:柠檬酸浓度:EDTA 浓度为 1:1.5:1;通过滴加浓氨水将混合溶液的 pH 值调节到 8 后,将其转移至 80℃恒温水浴磁力搅拌器中加热搅拌 24 h,确保络合剂与金属阳离子充分络合,得到4号前驱体溶液;将上述4号前驱体溶液均匀涂覆于n型钙钛矿型氧化物薄膜BaNbxTi1-xO3上,涂覆后将其在烘箱中250℃条件下干燥5min,再经600℃预烧 10min,最后在600℃-700℃煅烧10分钟,随炉冷却形成厚度为100-600nm的La0.8Sr0.2MnO3薄膜。
Claims (10)
1.一种具有钙钛矿结构的异质结薄膜光电器件,其特征在于:包括基板,以及依次层叠在基板上的下电极、p型钙钛矿型氧化物薄膜、n型钙钛矿型氧化物薄膜和上电极;其中,p型钙钛矿型氧化物薄膜为Er:Li0.1K0.4Bi0.5TiO3,掺杂的Er与Li0.1K0.4Bi0.5TiO3的摩尔比为0.005-0.2;n型钙钛矿型氧化物薄膜为BaNbxTi1-xO3,x的取值范围为0.05-0.1。
2.如权利要求1所述的一种具有钙钛矿结构的异质结薄膜光电器件,其特征在于:所述下电极和上电极均为钙钛矿型透明导电氧化物。
3.如权利要求1所述的一种具有钙钛矿结构的异质结薄膜光电器件,其特征在于:所述上电极为LaNiO3、LaCrO3、SrRuO3、CaRuO3、La1-xSrxCoO3、La1-xSrxMnO3、La1-xSrxCrO3、BaPbO3、La1-xSrxTiO3、SrIrO3中的至少一种,其中,0<x<1。
4.如权利要求1所述的一种具有钙钛矿结构的异质结薄膜光电器件,其特征在于:所述下电极为La:SrTiO3薄膜。
5.如权利要求1所述的一种具有钙钛矿结构的异质结薄膜光电器件,其特征在于:所述基板为玻璃、石英或硅片。
6.如权利要求1所述的一种具有钙钛矿结构的异质结薄膜光电器件的制备方法,其特征在于,包括如下步骤:
(1)、分别采用丙酮溶液、氢氟酸清洗基板表面,再用无水乙醇和去离子水将基板表面冲洗干净,然后烘干,烘干后采用硅烷偶联剂修饰基板表面,以增强后续形成的薄膜与基板表面的附着力;
(2)、在处理过的基板上从下到上依次制备下电极、p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3、n型钙钛矿型氧化物薄膜BaNbxTi1-xO3和上电极。
7.如权利要求6所述的一种具有钙钛矿结构的异质结薄膜光电器件的制备方法,其特征在于:所述下电极为La:SrTiO3薄膜,其制备方法为:
将醋酸锶、硝酸镧溶于醋酸溶液中形成盐溶液,在 120℃下搅拌 2h;将钛酸四丁酯溶解在乙酰丙酮中,在 80℃搅拌 1h 使其混合均匀,然后将其加入上述盐溶液中,并加入稳定剂乙二醇和溶剂乙二醇甲醚,配制成澄清的1号前驱体溶液;将上述1号前驱体溶液均匀涂覆在基板上,在管式电炉中退火形成La:SrTiO3 薄膜。
8.如权利要求6所述的一种具有钙钛矿结构的异质结薄膜光电器件的制备方法,其特征在于:所述p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3的制备方法为:
将硝酸铋、醋酸钾、硝酸锂和醋酸铒按化学计量比溶解于醋酸中,加入乙二醇作为溶剂,然后加入柠檬酸,形成前驱体溶液A1;将钛酸四丁酯溶解于乙二醇中,然后加入柠檬酸,形成前驱体溶液A2;将前驱体溶液A1与前驱体溶液A2按照化学计量比进行混合,室温下搅拌均匀,从而生成2号前驱体溶液;将2号前驱体溶液涂布到下电极上,干燥后退火形成掺杂有铒的Li0.1K0.4Bi0.5TiO3薄膜。
9.如权利要求6所述的一种具有钙钛矿结构的异质结薄膜光电器件的制备方法,其特征在于:所述n型钙钛矿型氧化物薄膜BaNbxTi1-xO3的制备方法为:
将氯化铌和氢氧化钾加入乙二醇甲醚中,在氩气的保护下进行反应,过滤掉反应生成的KCl沉淀,制备得到铌的醇盐;将所得铌的醇盐与钛酸四丁酯、有机溶剂乙二醇甲醚混合,并加入乙酰丙酮作为鳌合剂,配制成前驱体溶液B1;将过量10%的硝酸钡溶于乙二醇甲醚与冰醋酸的混合液中,混合搅拌均匀,配制成前驱体溶液B2;将前驱体溶液B1和前驱体溶液B2混合均匀并静置2天,从而制备出3号前驱体溶液;将3号前驱体溶液涂布到p型钙钛矿型氧化物薄膜Er:Li0.1K0.4Bi0.5TiO3上,干燥后退火形成BaNbxTi1-xO3薄膜。
10.如权利要求6所述的一种具有钙钛矿结构的异质结薄膜光电器件的制备方法,其特征在于:所述上电极为La0.8Sr0.2MnO3薄膜,其制备方法为:将硝酸镧、硝酸锶和硝酸锰按照化学计量比溶于去离子水中,然后加入柠檬酸和乙二胺四乙酸,加热搅拌,充分络合反应后,得到4号前驱体溶液;将上述4号前驱体溶液均匀涂覆于n型钙钛矿型氧化物薄膜BaNbxTi1-xO3上,干燥后退火形成La0.8Sr0.2MnO3薄膜。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610551748.XA CN105932088B (zh) | 2016-07-14 | 2016-07-14 | 一种具有钙钛矿结构的异质结薄膜光电器件及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610551748.XA CN105932088B (zh) | 2016-07-14 | 2016-07-14 | 一种具有钙钛矿结构的异质结薄膜光电器件及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105932088A true CN105932088A (zh) | 2016-09-07 |
CN105932088B CN105932088B (zh) | 2017-04-12 |
Family
ID=56828032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610551748.XA Expired - Fee Related CN105932088B (zh) | 2016-07-14 | 2016-07-14 | 一种具有钙钛矿结构的异质结薄膜光电器件及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105932088B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110335946A (zh) * | 2019-06-26 | 2019-10-15 | 上海黎元新能源科技有限公司 | 一种钙钛矿太阳能电池的钙钛矿吸光层材料及太阳能电池 |
CN111564560A (zh) * | 2020-07-14 | 2020-08-21 | 杭州纤纳光电科技有限公司 | 一种钙钛矿太阳能电池及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001156307A (ja) * | 1999-11-29 | 2001-06-08 | Natl Inst Of Advanced Industrial Science & Technology Meti | 太陽電池の光吸収層形成用材料 |
CN102276248A (zh) * | 2011-04-22 | 2011-12-14 | 同济大学 | 铋层状类钙钛矿结构的氧化物上转换发光压电材料及其制备方法 |
CN102593191A (zh) * | 2011-01-17 | 2012-07-18 | 中国科学院物理研究所 | 偏置电场调制的氧化物半导体异质结构、其制备方法和装置 |
-
2016
- 2016-07-14 CN CN201610551748.XA patent/CN105932088B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001156307A (ja) * | 1999-11-29 | 2001-06-08 | Natl Inst Of Advanced Industrial Science & Technology Meti | 太陽電池の光吸収層形成用材料 |
CN102593191A (zh) * | 2011-01-17 | 2012-07-18 | 中国科学院物理研究所 | 偏置电场调制的氧化物半导体异质结构、其制备方法和装置 |
CN102276248A (zh) * | 2011-04-22 | 2011-12-14 | 同济大学 | 铋层状类钙钛矿结构的氧化物上转换发光压电材料及其制备方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110335946A (zh) * | 2019-06-26 | 2019-10-15 | 上海黎元新能源科技有限公司 | 一种钙钛矿太阳能电池的钙钛矿吸光层材料及太阳能电池 |
CN111564560A (zh) * | 2020-07-14 | 2020-08-21 | 杭州纤纳光电科技有限公司 | 一种钙钛矿太阳能电池及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105932088B (zh) | 2017-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101702377B (zh) | 一种氧化锌/二氧化钛杂化电极及其制备方法 | |
CN101794834B (zh) | 设有上转换荧光材料膜层的高效太阳能薄膜电池及其膜层制备方法 | |
CN106449979B (zh) | 通过双氨基有机物制备热稳定钙钛矿CsPbI3的方法 | |
CN105702865A (zh) | 一种金属掺杂钙钛矿薄膜、其制备方法及应用 | |
CN103603045B (zh) | 铒掺杂四方相钙钛矿结构钛酸铅单晶纳米纤维的制备方法 | |
CN103078014B (zh) | 铁酸铋/钛酸铋钠-钛酸钡异质结构铁电薄膜太阳能电池的制备方法 | |
CN103833416B (zh) | 一种镍酸镧导电薄膜的化学溶液沉积制备方法 | |
CN108281550B (zh) | 基于镁掺杂二氧化钛的钙钛矿太阳能电池及其制备方法 | |
CN109768167A (zh) | 无电流迟滞的钙钛矿太阳电池及其制备方法 | |
CN105932088B (zh) | 一种具有钙钛矿结构的异质结薄膜光电器件及其制备方法 | |
CN101811889B (zh) | 一种镧系元素掺杂的钛酸铋薄膜及其制备方法 | |
CN103107242A (zh) | 在玻璃基板上制备钒酸铋太阳能电池的方法 | |
CN105470395A (zh) | 一种基于钙钛矿甲胺铅碘单晶切片的异质结太阳能电池及其制备方法 | |
CN101996771B (zh) | 一种二氧化锡陶瓷电极及其制备方法和一种染料敏化太阳能电池 | |
CN105914243B (zh) | 一种具有铁电性能的薄膜光电器件及其制备方法 | |
CN109292820A (zh) | VO2/ZnO双层薄膜及其制备方法 | |
CN100480437C (zh) | 一种取向生长的介电常数可调钛酸锶铅薄膜的制备方法 | |
CN107342229A (zh) | 一种非晶薄膜器件以及制作方法 | |
CN105552139A (zh) | 一种n型硅太阳能电池及其制备方法 | |
CN102060529B (zh) | 纳米Ag颗粒-Pb(Zr0.52Ti0.48)O3渗流型复合陶瓷薄膜及其制备方法 | |
CN101333684B (zh) | 铈钇共掺钛酸锶钡纳米材料及其制备方法 | |
CN109970358A (zh) | 一种基于钛酸铋基铁电薄膜的光驱动逻辑器及其应用方法 | |
CN104177084B (zh) | 制备高质量Ba(TixSn1-x)O3铁电薄膜的方法 | |
TWI435846B (zh) | A method for preparing transparent conductive zinc oxide thin film by dipping stitch doping technique | |
CN103910380A (zh) | Nkbt水基溶胶、由其制备的二元铁电压电薄膜及制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170412 Termination date: 20180714 |
|
CF01 | Termination of patent right due to non-payment of annual fee |