CN105928678B - A kind of vibration of ccd image sensor, impact apparatus - Google Patents
A kind of vibration of ccd image sensor, impact apparatus Download PDFInfo
- Publication number
- CN105928678B CN105928678B CN201610244083.8A CN201610244083A CN105928678B CN 105928678 B CN105928678 B CN 105928678B CN 201610244083 A CN201610244083 A CN 201610244083A CN 105928678 B CN105928678 B CN 105928678B
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- China
- Prior art keywords
- image sensor
- ccd image
- cover board
- putting hole
- vibration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/08—Shock-testing
Abstract
The invention discloses a kind of vibrations of ccd image sensor, impact apparatus, including chuck body and cover board, chuck body is cube structure, is provided with the sample putting hole for placing ccd image sensor, sample putting hole axial symmetry or central symmetry on each face on each face；Pin fixation hole is provided on sample putting hole, the ccd image sensor with pin can be inserted into the pin fixation hole of chuck body.Chuck body is designed as cube structure by the present invention, and for each face sample putting hole with a thickness of 0.6cm~1.3cm, six faces surround hollow structure, sample putting hole axial symmetry or central symmetry design, is resonated with preventing from generating in vibration processes, is caused sample damage；Simultaneously in the case where equipment there are certain requirements example weight, to complete the vibration of 60G~80G high-magnitude, 3000G or more impact test, it is easy to accomplish the space-inversion of chuck body.
Description
Technical field
The present invention relates to a kind of for ccd image sensor vibration, the fixture of impact test, belongs to aerospace and is led with component
Domain.
Background technique
Vibration, impact test are the test of aerospace component upscreen and the essential important tests of reliability test
Content.Test can determine the ability that device is subjected to dynamic stress, measure within the scope of assigned frequency, vibrate the influence to device,
Electrical noise caused by device under vibrating conditions is measured, can measurement device, which be useful in, need to be subjected to medium severity impact
In electronic equipment.Currently, high-grade used in aerospace model, high reliability component kind and quantity are more and more.?
Actual mass guarantees in work, can encounter various different forms, various encapsulation and a variety of materials and the component to involve great expense, this
Vibration, the impact apparatus for just needing to develop various adaptability, vibration, impact test for component.
There are fixture method and glue there are many fixed form, common fixed form is tested for ccd image sensor both at home and abroad
Patch method.Be suitable for the fixations of various encapsulation components on sticker law theory, but to the vibration of complicated encapsulation component or high-magnitude,
Impact test sticker method is simultaneously unreliable, easily causes dominant damage and is likely to cause the stealthy damage of component, at present in aerospace
It is not used substantially in the vibration of high-grade component, impact test.
Fixture method is generally according to specific requirements self design fixture.Meanwhile for the vibration of ccd image sensor,
Impact test has its particularity again.For example, ccd image sensor basis material and upper cover translucent material are unlike material, CCD figure
As the glass cover-plate quality of sensor is more crisp, fragmentation is be easy to cause in the field of force, therefore will be to ccd image sensor glass cover
Plate part carries out special protection；For another example, glass cover-plate and the ceramic material of surrounding not in the same plane, are easy to cause stress not
It is impartial；In addition, ccd image sensor also has certain requirement to electrostatic protection.These are all the problems in current fixture design.
Summary of the invention
Technology of the invention solves the problems, such as: in order to overcome the deficiencies of the prior art, providing a kind of ccd image sensor vibration
Dynamic, impact apparatus, preferably to complete vibration impact experiment.
The technical solution of the invention is as follows:
A kind of vibration of ccd image sensor, impact apparatus, including chuck body and cover board, chuck body are cube
Body structure, each face are embedded structure, are provided with the sample putting hole for placing ccd image sensor on each face, each
Sample putting hole axial symmetry or central symmetry on face, prevent ccd image sensor from generating resonance in vibration processes；In sample
Pin fixation hole is provided on putting hole, the ccd image sensor with pin can be inserted into the pin fixation hole of chuck body；
On cover board can be covered on sample putting hole, cover board is equipped with plane hierarchic structure, the glass with ccd image sensor
The hierarchic structure cooperation of glass plane and ceramic flat surface composition, cover board are connect to compress and be placed on sample putting hole with chuck body
Ccd image sensor, so that impact force is evenly distributed to each plane of ccd image sensor.
Chuck body and cover board are same metal material, preferably aluminium alloy.
The sample putting hole in each face is with a thickness of 0.6cm~1.3cm.
Six faces of cube structure surround hollow structure, the space overturning of chuck body are realized, to complete 60G~80G
High-magnitude vibration, 3000G impact test.
Gold, silver or aluminum slice are placed on the sample putting hole in each face, to realize that ccd image sensor is rigid with chuck body
Property is fixed, and uniform stressed.
Pin fixation hole is blind hole or through-hole.
Pin and pin fixation hole are clearance fit, and fit clearance is 0.2mm~0.5mm.
Cover board and the one-to-one setting of sample putting hole.
The sample putting hole in each face is all covered by a cover board.
When cover board compresses the ccd image sensor being placed on sample putting hole, cover board is lower than the height of sample putting hole.
The advantages of the present invention over the prior art are that:
(1) chuck body is designed as cube structure by the present invention, each face sample putting hole with a thickness of 0.6cm~
1.3cm, six faces surround hollow structure, sample putting hole axial symmetry or central symmetry design, to prevent from producing in vibration processes
Raw resonance, causes sample damage；Simultaneously in the case where equipment there are certain requirements example weight, to complete 60G~80G a large amount
Grade vibration, 3000G impact test, it is easy to accomplish the space-inversion of chuck body；
(2) present invention uses embedded design, guarantees after installing fixed ccd image sensor, ccd image sensor and whole
A cover board guarantees the once mounting ccd image sensor in mechanical test all in chuck body inside, completes 6 directions
Vibration, impact test；
(3) present invention uses light-weight design, and six faces of cube structure surround hollow structure, is guaranteeing fixture rigidity
Under the premise of, excess weight is removed, guarantees the lightweight of fixture, and then high-magnitude vibration, impact test can be completed.
Detailed description of the invention
Fig. 1 is present clip body construction schematic diagram；
Fig. 2 is the orthographic projection schematic diagram of present clip ontology；
Fig. 3 is the B-B direction cut-away view of Fig. 2 of the present invention；
Fig. 4 is the structural schematic diagram of cover board of the present invention；
Fig. 5 is the sectional view along A-A of Fig. 4 of the present invention；
Fig. 6 is ccd image sensor main view of the present invention；
Fig. 7 is ccd image sensor side view of the present invention.
Specific embodiment
Present invention will now be described in detail with reference to the accompanying drawings..
The present invention is generated by vibration test, simulation by guided missile, propelled at high velocity jet plane and rocket engine device
More distinctive site environment, vibrated with verifying is to the sealing between ceramic body, vitreum, pin or ceramic body and vitreum
It is no to cause defect or damage.
The present invention is by impact test, and simulation is in handling, transport or execute-in-place due to unexpected stress or motion state
Suddenly change and the impact generated, such impact may destruction work characteristic or cause be similar to because vibrate it is too strong due to make
At damage, if shock pulse be it is repeated, damage more serious.
The present invention, which especially simulates, completes the vibration of 60G~80G high-magnitude, 3000G impact test, to overcome current existing fixture
Problem in design, the specific scheme is that
As shown in Figures 1 to 3, a kind of ccd image sensor vibration, impact apparatus, including chuck body 1 and cover board 3,
Chuck body 1 is cube structure, and each face is embedded structure, is provided with places ccd image sensor on each face
Sample putting hole 2 when 2 thickness of sample putting hole in each face is set to 0.6cm~1.3cm, is rushed by test of many times in vibration
It hits in test, it is ensured that in the case where enough rigidity, keep fixture as light as possible.
2 axial symmetry of sample putting hole or central symmetry on each face, to prevent ccd image sensor in vibration processes
Generate resonance；It specifically, can be by the sample putting hole in the one-to-one setting of cover board 3 and sample putting hole 2 or each face by one
Cover board all covers.
Pin fixation hole is provided on sample putting hole 2, pin fixation hole is designed as blind hole or through-hole, with pin
Ccd image sensor can be inserted into the pin fixation hole of chuck body 1；Pin and pin fixation hole are clearance fit, through testing
Verifying, when fit clearance is determined as 0.2mm~0.5mm, can effectively prevent causing to damage to pin in vibration or impact process
Wound.
As shown in Figures 4 and 5, cover board 3 can be covered on 2 on sample putting hole, and cover board 3 is equipped with plane hierarchic structure, with
The hierarchic structure of glass planar and the ceramic flat surface composition of ccd image sensor cooperates (as shown in figs. 6-7), cover board 3 and fixture
Ontology 1 is connected to compress the ccd image sensor being placed on 2 on sample putting hole, and impact force is made to be evenly distributed to ccd image biography
Each plane of sensor, it is ensured that the glass cover-plate not fragmentation because of ABNORMAL STRESS in vibration, impact test.
Chuck body 1 and cover board 3 are same metal material, preferably aluminium alloy, prevent ccd image sensor and chuck body
Electrostatic is generated between 1 and cover board 3, ccd image sensor is damaged.
Six faces of cube structure surround hollow structure, the space overturning of chuck body are realized, to complete 60G~80G
High-magnitude vibration, 3000G impact test.Gold, silver or aluminum slice are placed on the sample putting hole 2 in each face, to realize ccd image
Sensor is rigidly fixed with chuck body 1, and uniform stressed.
When cover board 3 compresses the ccd image sensor being placed on 2 on sample putting hole, cover board 3 is lower than sample putting hole 2
Highly.
When test, ccd image sensor is inserted into pin fixation hole first, cover board is covered, makes ccd image sensor
Double stress surfaces of biplane and cover board agree with, and then fix cover board and chuck body by screw.
By in actual tests the results show that the fixture design approach can satisfy to aerospace ccd image sensor
It is vibrated, the requirement of impact test.It is easily worked in machining simultaneously, precision is easily guaranteed that, process is few, at low cost.
The content that description in the present invention is not described in detail belongs to the well-known technique of those skilled in the art.
Claims (8)
1. a kind of vibration of ccd image sensor, impact apparatus, which is characterized in that including chuck body (1) and cover board (3),
Chuck body (1) is cube structure, and each face is embedded structure, is provided with placement ccd image sensor on each face
Sample putting hole (2), sample putting hole (2) axial symmetry or central symmetry on each face prevent ccd image sensor from shaking
Resonance is generated during dynamic；It is provided with pin fixation hole on sample putting hole (2), the ccd image sensor with pin can be inserted
In the pin fixation hole for entering chuck body (1)；
Cover board (3) can be covered on sample putting hole on (2), and cover board (3) is equipped with plane hierarchic structure, be sensed with ccd image
The hierarchic structure cooperation of glass planar and the ceramic flat surface composition of device, cover board (3) are connect with chuck body (1) to compress and be placed in sample
Ccd image sensor on product putting hole on (2) makes impact force be evenly distributed to each plane of ccd image sensor；Fixture
8 cover board mounting holes it have been provided on cover board, chuck body (1) and cover board (3) are same metal material, preferably aluminium alloy, often
The sample putting hole (2) in a face is with a thickness of 0.6cm~1.3cm.
2. a kind of ccd image sensor vibration as described in claim 1, impact apparatus, which is characterized in that cube knot
Six faces of structure surround hollow structure, realize the space overturning of chuck body, to complete the vibration of 60G~80G high-magnitude, 3000G
The above impact test.
3. a kind of ccd image sensor vibration as described in claim 1, impact apparatus, which is characterized in that each face
Gold, silver or aluminum slice are placed on sample putting hole (2), to realize that ccd image sensor is rigidly fixed with chuck body (1), and
Uniform stressed.
4. a kind of ccd image sensor vibration as described in claim 1, impact apparatus, which is characterized in that pin is fixed
Hole is blind hole or through-hole.
5. a kind of ccd image sensor vibration as described in claim 1, impact apparatus, which is characterized in that pin with draw
Foot fixation hole is clearance fit, and fit clearance is 0.2mm~0.5mm.
6. a kind of ccd image sensor vibration as described in claim 1, impact apparatus, which is characterized in that cover board (3)
With sample putting hole (2) one-to-one setting.
7. a kind of ccd image sensor vibration as described in claim 1, impact apparatus, which is characterized in that each face
Sample putting hole (2) is all covered by a cover board.
8. a kind of ccd image sensor vibration as described in claim 1, impact apparatus, which is characterized in that cover board (3)
When compression is placed on sample putting hole the ccd image sensor on (2), cover board (3) is lower than the height of sample putting hole (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610244083.8A CN105928678B (en) | 2016-04-18 | 2016-04-18 | A kind of vibration of ccd image sensor, impact apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610244083.8A CN105928678B (en) | 2016-04-18 | 2016-04-18 | A kind of vibration of ccd image sensor, impact apparatus |
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| Publication Number | Publication Date |
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| CN105928678A CN105928678A (en) | 2016-09-07 |
| CN105928678B true CN105928678B (en) | 2019-03-12 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106405303A (en) * | 2016-11-30 | 2017-02-15 | 环旭电子股份有限公司 | Electronic component test method and test system under high acceleration shock |
| CN106872133A (en) * | 2017-03-31 | 2017-06-20 | 长飞光纤光缆股份有限公司 | Optical device vibration test servicing unit |
| CN108106805A (en) * | 2017-12-13 | 2018-06-01 | 中铁第四勘察设计院集团有限公司 | A kind of impact experiment device suitable for tunnel protection door |
| CN109297812A (en) * | 2018-09-28 | 2019-02-01 | 西北工业大学 | Three axis biaxial compressive loading methods and its system |
| CN109406080B (en) * | 2018-12-12 | 2020-09-15 | 广州广电计量检测股份有限公司 | Clamp and finite element simulation test method thereof |
| CN112345214A (en) * | 2020-09-25 | 2021-02-09 | 华东光电集成器件研究所 | Clamp for high-acceleration centrifugal test of packaged integrated circuit |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8522501D0 (en) * | 1985-09-11 | 1985-10-16 | Marconi Co Ltd | Vibration testing apparatus |
| CN202814674U (en) * | 2012-07-19 | 2013-03-20 | 中国运载火箭技术研究院 | Packaging device impact vibration test clamp |
| CN203385920U (en) * | 2013-07-01 | 2014-01-08 | 宜特科技(昆山)电子有限公司 | Multifunctional lens clamp |
| CN203643118U (en) * | 2013-10-28 | 2014-06-11 | 珠海格力电器股份有限公司 | Multidirection shock test device |
| CN204183448U (en) * | 2014-10-10 | 2015-03-04 | 苏州广博力学环境实验室有限公司 | Pin-connected panel rectangular box type fixture |
| CN104567934B (en) * | 2015-01-22 | 2017-05-24 | 中航捷锐（北京）光电技术有限公司 | Jig for vibration test of fiber-optic gyroscope and testing method |
| CN105203284A (en) * | 2015-09-23 | 2015-12-30 | 河北汉光重工有限责任公司 | Experimental device and method suitable for vibration and impact of small-sized laser gyroscopes |
| CN105269484A (en) * | 2015-10-14 | 2016-01-27 | 华东光电集成器件研究所 | Circuit mechanical shock test fixing device |
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