CN105924190B - 一种低导热硅莫砖及其制备方法 - Google Patents
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Abstract
一种低导热硅莫砖及其制备方法,包括工作层和保温层,工作层与保温层通过压制连接在一起,工作层采用微气孔莫来石为主,加入少量碳化硅;保温层使用以废旧硅莫砖为主的保温材质。工作层和保温层分开湿碾,工作层和保温层共同压制成型得砖坯,砖坯经干燥、烘干后,再经1300℃~1450℃保温5~15h烧成,自然冷却后,即得产品。本发明采取复合结构,具有耐火、隔热双重功能,其导热系数低于同类产品,经测试,本发明的低导热硅莫砖使用在水泥窑烧成带时能降低筒体表面温度,相对于市场上同类产品低10~30℃。依靠碳化硅高强耐磨性及莫来石的高温稳定性,可大幅延长产品在运动式热工设备上的使用寿命,同时复合结构带来的节能降耗效果明显。
Description
技术领域
本发明涉及耐火环保材料技术领域,具体涉及一种低导热硅莫砖及其制备方法。
背景技术
新型干法水泥窑的上、下过渡带与烧成带相邻,常常经受着比烧成带更苛刻的使用环境,是整个水泥窑系统选材中最难解决的部位,现在该部普遍使用硅莫砖为衬砖。
目前市场销售的硅莫砖大多使用一级或特级铝矾土,个别企业还添加有电熔刚玉以提高产品高温性能及抗侵蚀能力,但这同时增大了硅莫砖的导热系数,导热系数的增高使得水泥窑内热量损失较快,吨水泥燃料消耗增高,筒体温度升高,易使筒体发生变形,造成筒体使用寿命变短,变形的筒体使得窑内耐火材料砖衬受力不均,易发断裂和破损,造成砖衬使用寿命降低。
发明内容
本发明为了解决现有技术的不足之处,提供了一种低导热硅莫砖及其制备方法,具有耐火、隔热双重功能,导热系数低等优点。
为解决上述技术问题,本发明采用如下技术方案:
一种低导热硅莫砖,包括工作层和保温层,工作层与保温层通过压制连接在一起,工作层包括骨料、粉料、抗氧化剂和结合剂,以质量份配比计,其制备原料如下:骨料:粒度0-1mm的微孔莫来石10-15份,粒度1-3mm的微孔莫来石15-30份,粒度3-5mm的微孔莫来石15-20份;粉料:粒度<0.074mm的微孔莫来石20-25份,粒度<0.074mm的碳化硅细粉10-15份;抗氧化剂3-5份;结合剂:聚乙烯醇溶液3-5份;
保温层包括骨料、粉料、复合有机造孔剂和结合剂,以质量份配比计,其制备原料如下:骨料:粒度0-5mm的废旧硅莫砖颗粒50-60份,粒度0-3mm的微孔莫来石10-20份;粉料:粒度<0.074mm的微孔莫来石细粉5-10份,粒度<0.074mm的废旧硅莫砖细粉20-30份;复合有机造孔剂5-10份;结合剂:聚乙烯醇溶液3-5份。
抗氧化剂为金属硅粉与金属铝粉按 (1-2):1质量比混合,金属硅粉与金属铝粉混合后的混合物的平均粒度<70mm。
复合有机造孔剂为稻壳灰与无烟煤粉按(1-3):(1-2)质量比混合,稻壳灰与无烟煤粉混合后的混合物的平均粒度<0.05mm。
聚乙烯醇的分子量为25-30万,聚乙烯醇溶液的密度为1.01-1.02 g/cm3。
低导热硅莫砖的制备方法,包括以下步骤:
(1)配料:
A、工作层:将工作层所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入工作层所需的粉料和抗氧化剂,再混碾10min,形成工作层泥料,备用;
B、保温层:将保温层所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入保温层所需的粉料和复合有机造孔剂,再混碾10min,形成保温层泥料,备用;
(2)用隔板将预设在630T摩擦压力机上的模具内的腔内分隔为工作层隔室和保温层隔室,工作层隔室和保温层隔室的长度尺寸比为(1-3):(1-2),接着将步骤(1)中的工作层泥料和保温层泥料分别加入工作层隔室内和保温层隔室内,然后抽出隔板,操作630T摩擦压力机对模具进行冲压成型作业,制成砖坯;
(3)将步骤(2)制成的砖坯自然干燥24h,然后在110℃温度下烘干,烘干时间≥12h;
(4)将烘干后的砖坯装入窑内,砖坯在窑内保温5~15h,保温的温度为1300℃~1450℃,自然冷却后,即得产品。
本发明与现有技术相比,本发明具有以下有益效果:本发明以莫来石为主要原料,莫来石具有耐高温、强度高的优点。本发明产品加入复合有机造孔剂,降低保温层的体积密度,增大气孔率,导热系数降低,从而工作层和保温层的整体导热系数降低,经测试使用在水泥窑前后过渡带及窑尾时能降低筒体表面温度,相对于市场上同类产品低10~30℃。本发明保温层中的骨料采用了废旧硅莫砖,降低了成本,实现了废旧资源的重复利用,减少了固体废弃物的排放。
附图说明
图1为本发明实施方式的结构示意图。
图2为图1的剖示图。
图中附图标记:1为工作层,2为保温层。
具体实施方式。
下面结合实验数据和具体实施例对本发明的技术方案作进一步说明。
实施例1:
如图1和图2所述,一种低导热硅莫砖,包括工作层1和保温层2,工作层1与保温层2通过压制连接在一起,工作层1包括骨料、粉料、抗氧化剂和结合剂,以质量份配比计,其制备原料如下:骨料:粒度0-1mm的微孔莫来石10份,粒度1-3mm的微孔莫来石30份,粒度3-5mm的微孔莫来石15份;粉料:粒度<0.074mm的微孔莫来石25份,粒度<0.074mm的碳化硅细粉15份;抗氧化剂 3份;结合剂:聚乙烯醇溶液4份;
保温层2包括骨料、粉料、复合有机造孔剂和结合剂,以质量份配比计,其制备原料如下:骨料:粒度0-5mm的废旧硅莫砖颗粒50份,粒度0-3mm的微孔莫来石10份;粉料:粒度<0.074mm的微孔莫来石细粉10份,粒度<0.074mm的废旧硅莫砖细粉25份;复合有机造孔剂5份;结合剂:聚乙烯醇溶液4份;
其中,抗氧化剂为金属硅粉与金属铝粉按照1:1质量比混合的混合物,混合物的平均粒度<70mm;复合有机造孔剂为稻壳灰与无烟煤粉按1:1质量比混合的混合物,混合物的平均粒度<0.05mm;聚乙烯醇的分子量为25-30万,聚乙烯醇溶液的密度为1.01-1.02 g/cm3。
本实施例的制备方法,包括以下步骤:
(1)配料:
A、工作层1:将工作层1所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入工作层1所需的粉料和抗氧化剂,再混碾10min,形成工作层泥料,备用;
B、保温层2:将保温层2所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入保温层2所需的粉料和复合有机造孔剂,再混碾10min,形成保温层泥料,备用;
(2)用隔板将预设在630T摩擦压力机上的模具内的腔内分隔为工作层隔室和保温层隔室,工作层隔室和保温层隔室的长度尺寸比为7:3,接着将步骤(1)中的工作层泥料和保温层泥料分别加入工作层隔室内和保温层隔室内,然后抽出隔板,操作630T摩擦压力机对模具进行冲压成型作业,制成砖坯;
(3)将步骤(2)制成的砖坯自然干燥24h,然后在110℃温度下烘干24h;
(4)将烘干后的砖坯装入窑内,砖坯在窑内保温5h,保温的温度为1320℃,自然冷却后,即得产品。
实施例2:
一种低导热硅莫砖,包括工作层1和保温层2,工作层1与保温层2通过压制连接在一起,工作层1包括骨料、粉料、抗氧化剂和结合剂,具体由以下质量份配比的原料制成:骨料:粒度0-1mm的微孔莫来石10份,粒度1-3mm的微孔莫来石30份,粒度3-5mm的微孔莫来石15份;粉料:粒度<0.074mm的微孔莫来石20份,粒度<0.074mm的碳化硅细粉15份;抗氧化剂5份;结合剂:聚乙烯醇溶液4份;
保温层2包括骨料、粉料、复合有机造孔剂和结合剂,具体由以下质量份配比的原料制成:骨料:粒度0-5mm的废旧硅莫砖颗粒55份,粒度0-3mm的微孔莫来石10份;粉料:粒度<0.074mm的微孔莫来石细粉5份,粒度<0.074mm的废旧硅莫砖细粉25份;复合有机造孔剂5份;结合剂:聚乙烯醇溶液4份;
其中,抗氧化剂为金属硅粉与金属铝粉按照2:1质量比混合的混合物,混合物的平均粒度<70mm;复合有机造孔剂为稻壳灰与无烟煤粉按1:1质量比混合的混合物,混合物的平均粒度<0.05mm;聚乙烯醇的分子量为25-30万,聚乙烯醇溶液的密度为1.01-1.02 g/cm3。
本实施例的制备方法,包括以下步骤:
(1)配料:
A、工作层1:将工作层1所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入工作层1所需的粉料和抗氧化剂,再混碾10min,形成工作层泥料,备用;
B、保温层2:将保温层2所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入保温层2所需的粉料和复合有机造孔剂,再混碾10min,形成保温层泥料,备用;
(2)用隔板将预设在630T摩擦压力机上的模具内的腔内分隔为工作层隔室和保温层隔室,工作层隔室和保温层隔室的长度尺寸比为7:3,接着将步骤(1)中的工作层泥料和保温层泥料分别加入工作层隔室内和保温层隔室内,然后抽出隔板,操作630T摩擦压力机对模具进行冲压成型作业,制成砖坯;
(3)将步骤(2)制成的砖坯自然干燥24h,然后在110℃温度下烘干24h;
(4)将烘干后的砖坯装入窑内,砖坯在窑内保温5h,保温的温度为1320℃,自然冷却后,即得产品。
将实施例1-2与1680硅莫砖进行性能测试,其性能参数见表1。
表1 实施例1-2、1680硅莫砖的性能测试参数
从表1可以看出,实施例1-2的体积密度均小于1680硅莫砖,新型复合层能实现制品较低的体密,可降低热工设备自重,热工设备自重的减轻有效的降低了设备电机运转时的负荷、运行时的电流、吨产品的电耗,同时提高了电机运行的稳定性,减少了维护次数,为设备长期稳定运行提供了保障。实施例1-2的导热系数小于1680硅莫砖,实施例1-2的荷重软化温度大于1680硅莫砖,实施例1-2的抗热震次数均大于1680硅莫砖,较低的导热系数能减少热量损失,较高的荷软温度和热震稳定性保证了产品使用的安全性及较长的使用寿命。本发明产品用来代替现有普通1680硅莫砖延长使用寿命的同时,节能降耗效果显著。
以上所述仅为本发明的两种具体实施例,但本发明的实施例并不局限于此,任何本领域的技术人员在本发明的领域内,所作的变化或修饰皆涵盖在本发明的保护范围之内。
Claims (4)
1.一种低导热硅莫砖,包括工作层和保温层,工作层与保温层通过压制连接在一起,其特征在于:工作层包括骨料、粉料、抗氧化剂和结合剂,以质量份配比计,其制备原料如下:骨料:粒度0-1mm的微孔莫来石10-15份,粒度1-3mm的微孔莫来石15-30份,粒度3-5mm的微孔莫来石15-20份;粉料:粒度<0.074mm的微孔莫来石20-25份,粒度<0.074mm的碳化硅细粉10-15份;抗氧化剂3-5份;结合剂:聚乙烯醇溶液3-5份;
保温层包括骨料、粉料、复合有机造孔剂和结合剂,以质量份配比计,其制备原料如下:骨料:粒度0-5mm的废旧硅莫砖颗粒50-60份,粒度0-3mm的微孔莫来石10-20份;粉料:粒度<0.074mm的微孔莫来石细粉5-10份,粒度<0.074mm的废旧硅莫砖细粉20-30份;复合有机造孔剂5-10份;结合剂:聚乙烯醇溶液3-5份;
抗氧化剂为金属硅粉与金属铝粉按 (1-2):1质量比混合,金属硅粉与金属铝粉混合后的混合物的平均粒度<70mm。
2.根据权利要求1所述的低导热硅莫砖,其特征在于:复合有机造孔剂为稻壳灰与无烟煤粉按(1-3):(1-2)质量比混合,稻壳灰与无烟煤粉混合后的混合物的平均粒度<0.05mm。
3.根据权利要求1所述的低导热硅莫砖,其特征在于:聚乙烯醇的分子量为25-30万,聚乙烯醇溶液的密度为1.01-1.02 g/cm3。
4.一种制备如权利要求1-3之任一项所述的低导热硅莫砖的方法,其特征在于:包括以下步骤:
(1)配料:
A、工作层:将工作层所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入工作层所需的粉料和抗氧化剂,再混碾10min,形成工作层泥料,备用;
B、保温层:将保温层所需的骨料倒入混碾机内,接着加入结合剂,先混碾5min,然后加入保温层所需的粉料和复合有机造孔剂,再混碾10min,形成保温层泥料,备用;
(2)用隔板将预设在630T摩擦压力机上的模具内的腔内分隔为工作层隔室和保温层隔室,工作层隔室和保温层隔室的长度尺寸比为(1-3):(1-2),接着将步骤(1)中的工作层泥料和保温层泥料分别加入工作层隔室内和保温层隔室内,然后抽出隔板,操作630T摩擦压力机对模具进行冲压成型作业,制成砖坯;
(3)将步骤(2)制成的砖坯自然干燥24h,然后在110℃温度下烘干,烘干时间≥12h;
(4)将烘干后的砖坯装入窑内,砖坯在窑内保温5~15h,保温的温度为1300℃~1450℃,自然冷却后,即得产品。
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