CN105917418A - Conductive particles for back contact solar cell modules, conductive material, and solar cell module - Google Patents
Conductive particles for back contact solar cell modules, conductive material, and solar cell module Download PDFInfo
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- CN105917418A CN105917418A CN201580004075.XA CN201580004075A CN105917418A CN 105917418 A CN105917418 A CN 105917418A CN 201580004075 A CN201580004075 A CN 201580004075A CN 105917418 A CN105917418 A CN 105917418A
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- electroconductive particle
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- solar battery
- particle
- electrode
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- 239000002245 particle Substances 0.000 title claims abstract description 305
- 239000004020 conductor Substances 0.000 title claims description 69
- 239000000758 substrate Substances 0.000 claims description 106
- 239000004744 fabric Substances 0.000 claims description 71
- 238000007639 printing Methods 0.000 claims description 61
- 229910052782 aluminium Inorganic materials 0.000 claims description 40
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 239000004840 adhesive resin Substances 0.000 claims description 19
- 229920006223 adhesive resin Polymers 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims description 10
- 238000001029 thermal curing Methods 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 85
- 239000011162 core material Substances 0.000 description 47
- 239000000463 material Substances 0.000 description 46
- 229910052759 nickel Inorganic materials 0.000 description 42
- 229920000642 polymer Polymers 0.000 description 34
- 238000000034 method Methods 0.000 description 33
- 238000006243 chemical reaction Methods 0.000 description 30
- -1 polyethylene Polymers 0.000 description 30
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 26
- 238000007906 compression Methods 0.000 description 21
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010949 copper Substances 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 230000006835 compression Effects 0.000 description 16
- 239000000178 monomer Substances 0.000 description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 13
- 239000011324 bead Substances 0.000 description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 11
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical class C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000008393 encapsulating agent Substances 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 9
- 229910052700 potassium Inorganic materials 0.000 description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000009396 hybridization Methods 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- GISWNRNUVGGVOS-UHFFFAOYSA-N 3,4-dihydroxybutan-2-yl prop-2-enoate Chemical compound OCC(O)C(C)OC(=O)C=C GISWNRNUVGGVOS-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- 150000002924 oxiranes Chemical class 0.000 description 3
- 229940059574 pentaerithrityl Drugs 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000004087 circulation Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229940125810 compound 20 Drugs 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000002305 electric material Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical group CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- JAXFJECJQZDFJS-XHEPKHHKSA-N gtpl8555 Chemical compound OC(=O)C[C@H](N)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1CCC[C@@H]1C(=O)N[C@H](B1O[C@@]2(C)[C@H]3C[C@H](C3(C)C)C[C@H]2O1)CCC1=CC=C(F)C=C1 JAXFJECJQZDFJS-XHEPKHHKSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- XXQBEVHPUKOQEO-UHFFFAOYSA-N potassium superoxide Chemical compound [K+].[K+].[O-][O-] XXQBEVHPUKOQEO-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000007870 radical polymerization initiator Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- PSYGHMBJXWRQFD-UHFFFAOYSA-N 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound SCC(=O)OCCOC(=O)CS PSYGHMBJXWRQFD-UHFFFAOYSA-N 0.000 description 1
- QBKSIHCSDPPLJI-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]tetradecan-1-ol;sulfuric acid Chemical compound OS(O)(=O)=O.CCCCCCCCCCCCC(CO)N(CCO)CCO QBKSIHCSDPPLJI-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- YICILWNDMQTUIY-UHFFFAOYSA-N 2-methylidenepentanamide Chemical compound CCCC(=C)C(N)=O YICILWNDMQTUIY-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- PFWRHNFNTNMKPC-UHFFFAOYSA-N 4-trimethoxysilylbutan-2-yl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCC(C)OC(=O)C=C PFWRHNFNTNMKPC-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000925 Cd alloy Inorganic materials 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 150000001260 acyclic compounds Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- XEKOWRVHYACXOJ-UHFFFAOYSA-N ethyl acetate Substances CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- WQDGUYZIAJKLAB-UHFFFAOYSA-N octan-2-yl nitrite Chemical compound CCCCCCC(C)ON=O WQDGUYZIAJKLAB-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- ZESXUEKAXSBANL-UHFFFAOYSA-N trifluoromethyl prop-2-enoate Chemical compound FC(F)(F)OC(=O)C=C ZESXUEKAXSBANL-UHFFFAOYSA-N 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H01L31/022441—
-
- H01L31/02366—
-
- H01L31/03926—
-
- H01L31/0516—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Conductive Materials (AREA)
- Photovoltaic Devices (AREA)
Abstract
Provided are conductive particles for back contact solar cell modules, which are capable of improving conduction reliability between electrodes in a back contact solar cell module. The conductive particles are used for the back contact solar cell module, and each of conductive particles has a base particle and a conductive part that is arranged on the surface of the base particle. The outer surface of the conductive part is provided with a plurality of projections. The conductive particles have a compressive modulus of elasticity of from 1,100 N/mm<2> to 5,000 N/mm<2> (inclusive) when compressed by 10%, while having a breaking strain of 55% or more.
Description
Technical field
The present invention relates to the electroconductive particle for back contact solar battery module.The invention still further relates to
Employ the back contact solar battery module conductive material of above-mentioned electroconductive particle.The present invention also relates to
And employ the back contact solar battery module of above-mentioned conductive material.
Background technology
The mode of solar module includes belt and back-contact etc..In the past, belt was mainly used
Solar module.In recent years, the back-contact sun of high-output power and high conversion efficiency can be expected
The expectation of the exploitation of energy battery module is increased day by day.
In back contact solar battery module, at solar battery cell on the whole, solar-electricity is made
Pool unit and flexible printing baseplate-laminating.
The manufacture method of a kind of solar module is had disclosed in following patent documentation 1, comprising: the
One operation, by the back side of multiple solar battery cells towards upper and according to module configuration carry out arranged in parallel,
Further with interconnecting feeder, P-type electrode and the N-type electrode of adjacent solar battery cell are carried out electricity
Connect, thus obtain a series of solar battery cell；Second operation, by encapsulant, above-mentioned one
The guard block of solar battery cell, encapsulant and the rear side of series is stacked in front face side successively
On guard block and carry out integration.Have described in patent documentation 1 one utilize Cu, Ag, Au, Pt,
Sn or containing their alloy etc. to the cloth line electrode of flexible printing substrate and the electrode of solar battery cell
The method being attached.
It addition, the following manufacture method that Patent Document 2 discloses a kind of solar module, its bag
Include: on the surface electrode of solar battery cell, glue via the electric conductivity containing spherical electroconductive particle
Connect the end side of agent configuration lug line, and at the solaode list adjacent with above-mentioned solar battery cell
In the backplate of unit, configure the another of above-mentioned lug line via the conductive adhesive containing electroconductive particle
The operation of end side；Above-mentioned lug line heat is stressed on above-mentioned surface electrode and above-mentioned backplate, utilizes
Above-mentioned lug line is connected to above-mentioned surface electrode and the work of above-mentioned backplate by above-mentioned conductive adhesive
Sequence.In above-mentioned lug line, the one side being connected with above-mentioned conductive adhesive is formed with jog.On
The mean diameter (D) of the average height (H) and electroconductive particle of stating jog meets D >=H.
It addition, in recent years it has been proposed that optionally configure conduction on the cloth line electrode of flexible printing substrate
Property particle.
The following manufacture method that Patent Document 3 discloses a kind of solar module, this solar-electricity
Pond possesses: base material, the aluminum on the surface being disposed in this base material via bond layer connect up, have and is somebody's turn to do
Aluminum wiring connect electrode solar battery cell, seal this solar battery cell encapsulant,
It is configured at the light transmission front panel on the face with aluminum wiring opposition side of above-mentioned encapsulant.Patent documentation 3
Described manufacture method possesses: utilize flux to remove the operation of the oxide film thereon that above-mentioned aluminum connects up in advance；
By printing or allotter aluminium paste solder coated the operation of above-mentioned aluminum wiring；Utilize above-mentioned aluminium paste solder
The operation that the electrode of the wiring of above-mentioned aluminum and above-mentioned solar battery cell is attached.Above-mentioned aluminium paste solder
Containing aluminium powder body and synthetic resin.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2005-11869 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2012-204388 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2013-63443 publication
Invent technical problem to be solved
Sometimes exist concavo-convex on the electrode surface of solar battery cell.It addition, sometimes at flexible printing
There is also concavo-convex on the surface of the cloth line electrode of substrate.Weldering is stuck with paste employing the aluminum described in patent documentation 3
In the case of material, concavo-convex due to electrode surface, aluminium paste solder can not be fully contacted with electrode surface sometimes.
Therefore, interelectrode conducting reliability step-down sometimes.
It addition, as described in patent documentation 3, in recent years, owing to the price of thin copper film electrode is high, because of
This, use the expectation of aluminum cloth line electrode day by day to increase.But, for aluminum cloth line electrode, easily at table
Oxide-film is formed on face.Therefore, the reduction of conducting reliability easily becomes more serious problem.Patent literary composition
Offer in the conductive material that the manufacture of the solar module described in 1～3 is used, particularly to aluminum cloth
When line electrode is electrically connected, there is the problem being difficult to fully improve conducting reliability.
It is an object of the invention to, it is provided that a kind of electroconductive particle, it can be at back contact solar electricity
Pond module improves interelectrode conducting reliability.Another object of the present invention is to, it is provided that a kind of back of the body connects
Touch solar module conductive material, it uses described electroconductive particle.The present invention also provides for
A kind of back contact solar battery module, it uses described conductive material.
For solving the scheme of technical problem
According to present invention aspect widely, it is provided that a kind of back contact solar battery module electric conductivity grain
Son, it is for back contact solar battery module, and wherein, described electroconductive particle has: base material grain
Son and the conductive part being configured on described substrate particle surface, have many on the outer surface of described conductive part
Individual projection, the described electroconductive particle modulus of elasticity in comperssion when compressing 10% is 1100N/mm2Above and
5000N/mm2Hereinafter, and, the breaking strain of described electroconductive particle is more than 55%.
In certain particular aspects of the electroconductive particle of the present invention, the average height of multiple described projections is
More than 50nm and below 800nm.
In certain particular aspects of the electroconductive particle of the present invention, the average height of multiple described projections and institute
The ratio of the thickness stating conductive part is more than 0.1, less than 8.
The electroconductive particle of the present invention is applicable to flexible printing substrate or the surface to surface with cloth line electrode
Described cloth line electrode and the surface of the resin molding with cloth line electrode has the solar battery cell of electrode
Described electrode is electrically connected..
At certain particular aspects of the electroconductive particle of the present invention, described flexible printing substrate or described resin
The described cloth line electrode of film is aluminum cloth line electrode, or the described electrode of described solar battery cell is aluminum
Electrode.
According to present invention aspect widely, it is provided that a kind of back contact solar battery module conductive material,
It comprises above-mentioned back contact solar battery module electroconductive particle and adhesive resin.
In certain particular aspects of the conductive material of the present invention, described adhesive resin contains Thermocurable
Compound and thermal curing agents.
According to present invention aspect widely, it is provided that a kind of back contact solar battery module, it possesses:
Surface has the flexible printing substrate of cloth line electrode or surface has the resin molding of cloth line electrode, surface has
The solar battery cell of electrode, by described flexible printing substrate or described resin molding and described solar-electricity
The connecting portion that pool unit links together, described connecting portion is by containing above-mentioned back contact solar battery mould
The back contact solar battery module of block electroconductive particle and adhesive resin conductive material is formed,
Described cloth line electrode and described electrode achieve electrical connection by described electroconductive particle.
Invention effect
The back contact solar battery module electroconductive particle of the present invention possesses substrate particle and is configured at
Conductive part on the surface of this substrate particle, the outer surface at described conductive part has multiple projection, described
Modulus of elasticity in comperssion when electroconductive particle compresses 10% is 1100N/mm2Above, 5000N/mm2Hereinafter,
The breaking strain of described electroconductive particle is more than 55%, it is thus possible to improve interelectrode conducting is reliable
Property.
Accompanying drawing explanation
Fig. 1 is the back contact solar battery module electric conductivity grain representing first embodiment of the invention
The sectional view of son；
Fig. 2 is the back contact solar battery module electric conductivity grain representing second embodiment of the invention
The sectional view of son；
Fig. 3 is the back contact solar battery module electric conductivity grain representing third embodiment of the invention
The sectional view of son；
Fig. 4 is the back contact solar battery module conduction representing and using first embodiment of the invention
The sectional view of one example of the back contact solar battery module that property particle obtains；
Fig. 5 (a)～(c) are the first manufactures for the back contact solar battery module shown in explanatory diagram 4
The sectional view of each operation of method；
Fig. 6 (a)～(c) are the second manufactures for the back contact solar battery module shown in explanatory diagram 4
The sectional view of each operation of method.
Description of symbols
1 ... solar module
2 ... flexible printing substrate
2a ... cloth line electrode
3 ... solar battery cell
3a ... electrode
4 ... connecting portion
4A ... conductive material
4B ... connecting material
5 ... back sheet material
6 ... encapsulant
21,21A, 21B ... electroconductive particle
21a, 21Aa, 21Ba ... projection
22 ... substrate particle
23,23A, 23B ... conductive part
23a, 23Aa, 23Ba ... projection
23Bx ... the first conductive part
23By ... the second conductive part
24 ... core material
Detailed description of the invention
Hereinafter, the details of the present invention are described.
(back contact solar battery module electroconductive particle)
The back contact solar battery module electroconductive particle of the present invention has substrate particle and is configured at
Conductive part on the surface of this substrate particle.The back contact solar battery module electric conductivity of the present invention
Particle has multiple projection at the outer surface of above-mentioned conductive part.By the back contact solar battery of the present invention
Modulus of elasticity in comperssion (10%K value) when module electroconductive particle compresses 10% is 1100N/mm2Above,
5000N/mm2Below.Rupturing of the back contact solar battery module electroconductive particle of the present invention should
Become more than 55%.
The present invention possesses technique scheme, it is thus possible to improve back contact solar battery module
Interelectrode conducting reliability.It is as a result, it is possible to increase after initial stage energy conversion efficiency and reliability test
Energy conversion efficiency.
Such as, in back contact solar battery module, surface has the flexible printing substrate of cloth line electrode
Or described cloth line electrode and the surface of the surface resin molding with cloth line electrode has the solaode of electrode
Electrode described in unit implements electrical connection.
Above-mentioned electroconductive particle has substrate particle and the conduction being configured on the surface of above-mentioned substrate particle
Portion, thus, can control interelectrode interval accurately.It addition, be in by above-mentioned 10%K value
State specific scope, it is also possible to control interelectrode interval accurately.It addition, electroconductive particle is easy
Variation according to interelectrode interval and deform, it is thus possible to improve concavo-convex interelectrode conducting can
By property.It is as a result, it is possible to increase energy conversion effect after the energy conversion efficiency at initial stage and reliability test
Rate.
It addition, above-mentioned electroconductive particle has multiple projection at the outer surface of conductive part, thus, though
The surface of conductive part and the surface of electrode form oxide-film, it is also possible to utilize projection to puncture oxide-film.Therefore,
Interelectrode conducting reliability improves.
It addition, occasionally there are concavo-convex on the surface of the electrode of solar battery cell.It addition, flexible printing
Sometimes there is also concavo-convex on the surface of the cloth line electrode of substrate or resin molding.Therefore, the most interelectrode
Every uneven.It addition, flexible printing substrate or resin molding are soft, therefore, upon connection, along with
Flexible printing substrate or the deformation of resin molding, interelectrode interval becomes uneven sometimes.In contrast,
It is more than 55% by the breaking strain of above-mentioned electroconductive particle, though the district narrow at interelectrode interval
Territory, electroconductive particle also will not rupture, it is achieved reliably turns on electrode and the flexibility of solar battery cell
The effect of the cloth line electrode of printed base plate or resin molding.Further, since the outer surface at conductive part has many
Individual projection, in the region that interelectrode interval is narrow, crushed by projection or puncture electrode and realize
Conducting, in the region that interelectrode interval is broad, is implemented around conducting in the front end of projection.Therefore,
Above-mentioned electroconductive particle, by having multiple projection at the outer surface of conductive part, can improve conducting reliability.
If it addition, electroconductive particle has projection at the outer surface (surface of electric conductivity) of conductive part, then should
Projection is embedded in electrode.Therefore, even if solar module is applied impact, it is not easy to produce connection
Bad.Therefore, it can be effectively improved conducting reliability, the light in solar module can be improved
Photoelectric transformation efficiency.
The present inventor etc. find first: have projection by using at conductive part outer surface (surface of electric conductivity)
Electroconductive particle, between to the electrode of back contact solar battery module, implement electrical connection, permissible
Obtain the effect above.The particularly average height in the multiple above-mentioned projection of above-mentioned electroconductive particle is 50nm
Above and during below 800nm, can the most effectively play the effect above.It addition, led by above-mentioned
The average height of the multiple above-mentioned projection of conductive particles is more than 50nm and below 600nm, can more enter one
Step plays the effect above effectively.It addition, for for the electrode to back contact solar battery module
Between be electrically connected, and make electroconductive particle have bossed importance and technology on conductive part outer surface
The meaning of property, is first found by the inventors of the present invention.
Hereinafter, the electric conductivity that explanation back contact solar battery module is used more fully with reference to the accompanying
Particle.In following embodiment, different portion of techniques schemes can be exchanged.
Fig. 1 is the back contact solar battery module electric conductivity grain representing first embodiment of the invention
The sectional view of son.
Electroconductive particle 21 shown in Fig. 1 has substrate particle 22 and is configured at the surface of substrate particle 22
On conductive part 23.Conductive part 23 is conductive layer.Conductive part 23 has been coated with the surface of substrate particle 22.
Conductive part 23 connects with substrate particle 22.Electroconductive particle 21 is that the surface of substrate particle 22 is conducted electricity
The coating particles of portion 23 cladding.
Electroconductive particle 21 has multiple projection 21a on the outer surface of conductive part 23.Conductive part 23 exists
There is on outer surface multiple projection 23a.
Electroconductive particle 21 has multiple core material 24 on the surface of substrate particle 22.Conductive part 23
Substrate particle 22 and core material 24 are coated with.By conductive part 23, core material 24 is coated with,
Electroconductive particle 21 has multiple projection 21a on the outer surface of conductive part 23.The appearance of conductive part 23
Face is swelled due to core material 24, forms multiple projection 21a, 23a.
Fig. 2 is the back contact solar battery module electric conductivity grain representing second embodiment of the invention
The sectional view of son.
Electroconductive particle 21A shown in Fig. 2 has substrate particle 22 and is configured at the table of substrate particle 22
Conductive part 23A on face.Conductive part 23A is conductive layer.Electroconductive particle 21 and electroconductive particle 21A
It is only different whether existing on core material 24.Electroconductive particle 21A does not have core material.
Electroconductive particle 21A has multiple projection 21Aa on the outer surface of conductive part 23A.Conductive part
23A has multiple projection 23Aa on the outer surface.
Conductive part 23A has the Part II that Part I and thickness are thicker than this Part I.Therefore,
Conductive part 23A has projection 23Aa on outer surface (outer surface of conductive layer).Except multiple projections 21Aa,
Part outside 23Aa is the above-mentioned Part I of conductive part 23A.Multiple projections 21Aa, 23Aa are to lead
The above-mentioned Part II that the thickness of electricity portion 23A is thicker.
Such as electroconductive particle 21A, in order to form projection 21Aa, 23Aa, not necessarily use core material.
Fig. 3 is the back contact solar battery module electric conductivity grain representing third embodiment of the invention
The sectional view of son.
Electroconductive particle 21B shown in Fig. 3 has substrate particle 22 and is configured at the table of substrate particle 22
Conductive part 23B on face.Conductive part 23B is conductive layer.Conductive part 23B has and is configured at substrate particle
The first conductive part 23Bx on the surface of 22 leads with second be configured on the surface of the first conductive part 23Bx
Electricity portion 23By.
Electroconductive particle 21B has multiple projection 21Ba on the outer surface of conductive part 23B.Conductive part
23B has multiple projection 23Ba on the outer surface.
Electroconductive particle 21B has multiple core material 24 on the surface of the first conductive part 23Bx.Second
First conductive part 23Bx and core material 24 are coated with by conductive part 23By.Substrate particle 22 and core thing
Matter 24 interval and configure.The first conductive part 23Bx is there is between substrate particle 22 and core material 24.
Being coated with core material 24 by the second conductive part 23By, electroconductive particle 21B is at conductive part 23B
Outer surface on there is multiple projection 21Ba.The surface of conductive part 23B and the second conductive part 23By due to
Core material 24 and swell, and form multiple projection 21Ba, 23Ba.
As electroconductive particle 21B, conductive part 23B can have multiple structure.It addition, it is prominent in order to be formed
Play 21Ba and 23Ba, it is also possible to be configured at by core material 24 on internal layer the first conductive part 23Bx, and profit
With outer layer the second conductive part 23By, core material 24 and the first conductive part 23Bx is coated with.
Additionally, electroconductive particle 21,21A, 21B conductive part 23,23A, 23B outer surface on all
There is multiple projection 21a, 21Aa, 21Ba.Electroconductive particle 21, the above-mentioned 10%K of 21A, 21B
Value and above-mentioned breaking strain are in above-mentioned particular range.
Use electroconductive particle 21 as described above, 21A, 21B etc., make the back contacts of the present invention
Formula solar module.But, as long as electroconductive particle has substrate particle and is configured at above-mentioned base material
Conductive part on the surface of particle, and there is on the outer surface of above-mentioned conductive part multiple projection, and above-mentioned
The above-mentioned 10%K value of electroconductive particle and above-mentioned breaking strain are in above-mentioned particular range, it is also possible to
Use the electroconductive particle beyond electroconductive particle 21,21A, 21B.
Then, explanation uses the back-contact sun of one embodiment of the present invention more fully with reference to the accompanying
One example of the solar module that energy battery module electroconductive particle obtains.
Fig. 4 represents the back contact solar battery using an embodiment of the invention with sectional view
The back contact solar battery module that module electroconductive particle obtains.
Solar module 1 shown in Fig. 4 possesses: flexible printing substrate 2, solar battery cell 3,
Connect flexible printing substrate 2 and the connecting portion 4 of solar battery cell 3.Connecting portion 4 has: by containing
The first connecting portion that the conductive material of electroconductive particle 21 is formed, by the connection material not containing electroconductive particle
The second connecting portion that material is formed.In addition to electroconductive particle 21, it is possible to use electroconductive particle 21A,
21B etc..Above-mentioned connecting portion can also be formed by the conductive material containing only electroconductive particle 21.
It addition, in solar module 1, contrary with connecting portion 4 side at flexible printing substrate 2
The surface configuration of side has back sheet material 5.The table contrary with connecting portion 4 side at solar battery cell 3
Encapsulant 6 it is configured with on face.Can also contrary with solar battery cell 3 side at encapsulant 6
Light-transmitting substrate etc. is configured on surface.
Flexible printing substrate 2 has multiple cloth line electrode 2a on surface (upper surface).Solaode list
Unit 3 has multiple electrode 3a on surface (lower surface, the back side).Cloth line electrode 2a and electrode 3a utilizes 1
Individual or multiple electroconductive particles 21 electrically connect.Therefore, flexible printing substrate 2 and solar battery cell 3
Electroconductive particle 21 is utilized to achieve electrical connection.Above-mentioned first connecting portion is configured at cloth line electrode 2a and electricity
Between the 3a of pole.What above-mentioned second connecting portion was configured at flexible printing substrate 2 is not provided with cloth line electrode 2a's
Between part and the part being not provided with electrode 3a of solar battery cell 3.Above-mentioned second connecting portion also may be used
To be configured between cloth line electrode 2a and electrode 3a.
In addition to there is on surface the flexible printing substrate 2 of cloth line electrode 2a, it is possible to use on surface
There is the resin molding of cloth line electrode.
Solar module shown in Fig. 4 can be via the operation shown in such as figure 5 below (a)～(c)
Obtain.
Prepare the flexible printing substrate 2 on surface with cloth line electrode 2a.It addition, prepare containing conductive
The conductive material 4A of particle 21 and adhesive resin.In present embodiment, adhesive resin uses and contains
Thermocurable compound and thermal curing agents also have the conductive material 4A of Thermocurable.Conductive material 4A is also
It it is connecting material.Then, as shown in Fig. 5 (a), the cloth line electrode 2a of flexible printing substrate 2 selects
Property ground configuration conductive material 4A (the first arrangement step).Can also be at the electrode 3a of solar battery cell 3
On optionally configure conductive material 4A, replace on the cloth line electrode 2a of flexible printing substrate 2 select
Configure to selecting property conductive material 4A.
In present embodiment, in above-mentioned first arrangement step, not globality ground on flexible printing substrate
Applying conductive material equably.Conductive material is configured for target the most as much as possible with cloth line electrode, and
On cloth line electrode, the most only configure conductive material.But it is also possible to being not provided with at flexible printing substrate
The part configuration conductive material of cloth line electrode.The part being not provided with cloth line electrode at flexible printing substrate is joined
The conductive material put is the fewest more good.
Therefore, in above-mentioned first arrangement step, it is configured on above-mentioned flexible printing substrate or above-mentioned resin molding
Conductive material total amount 100 weight % in, or be configured at the conductive material on above-mentioned solar battery cell
In total amount 100 weight %, preferably will be configured at the conductive material on above-mentioned cloth line electrode or on above-mentioned electrode
Amount be set to more than 70 weight %, be more preferably set to more than 90 weight %, be further preferably set to 100 weights
Amount % (whole amount).But it is also possible on the cloth line electrode of above-mentioned flexible printing substrate or above-mentioned resin molding,
And the part being not provided with cloth line electrode of above-mentioned flexible printing substrate or above-mentioned resin molding configures equably and leads
Electric material.Can also on the electrode of above-mentioned solar battery cell with above-mentioned solar battery cell not
The part arranging electrode configures conductive material equably.
From the viewpoint of further improving configuration precision, the configuration of above-mentioned conductive material is preferably by print
Brush or allotter coating are carried out.Therefore, above-mentioned conductive material is preferably conductive paste.But, above-mentioned
Conductive material can also be conducting film.If use conducting film, then can suppress conducting film transition after configuration
Flowing.On the other hand, need to prepare the conducting film of prescribed level.
It addition, have the solar battery cell 3 of electrode 3a on preparation surface.Prepare not contain electric conductivity
Connecting material 4B of particle.Connecting material 4B contains Thermocurable compound and thermal curing agents.Such as Fig. 5 (b)
Shown in, on the surface being provided with electrode 3a side of solar battery cell 3, configuration does not contains electric conductivity grain
Connecting material 4B (the second arrangement step) of son.Additionally, select on the electrode 3a of solar battery cell 3
In the case of configuring to selecting property conductive material 4A, prepare the flexible printing on surface with cloth line electrode 2a
Substrate.The surface configuration being provided with cloth line electrode 2a side at flexible printing substrate 2 does not contains electric conductivity grain
Connecting material 4B (the second arrangement step) of son.Electroconductive particle is not contained in addition it is also possible to do not configure
Connecting material.
Then, following operation is carried out: be configured with conductive material to obtain in above-mentioned first arrangement step
The flexible printing substrate 2 of 4A and obtain in above-mentioned second arrangement step be configured with connecting material 4B
Solar battery cell 3 is fitted.That is, as shown in Fig. 5 (c), to flexible printing substrate 2 and the sun
Can fit by battery unit 3, and make cloth line electrode 2a and the solaode of flexible printing substrate 2
The electrode 3a of unit 3 is electrically connected (bonding process) by electroconductive particle 21.At cloth line electrode 2a
And between electrode 3a, it is configured with the conductive material 4A containing electroconductive particle 21.At flexible printing substrate 2
The part being not provided with cloth line electrode and the part being not provided with electrode of solar battery cell 3 between configure
There is connecting material 4B not containing electroconductive particle.
Preferably pressurize in above-mentioned bonding process.By pressurization, projection can puncture conduction effectively
The surface in portion or the oxide-film of electrode surface.It is as a result, it is possible to further improve conducting reliability.On
The pressure stating pressurization is preferably 9.8 × 104More than Pa, preferably 1.0 × 106Below Pa.When above-mentioned pressurization
When pressure is below more than above-mentioned lower limit and the above-mentioned upper limit, further improve interelectrode conducting reliability.
As it has been described above, utilize conductive material 4A and connecting material 4B to form connecting portion 4.It addition, according to
Need, by configuring back sheet material 5 or encapsulant 6, available solar module shown in Fig. 4
1。
Additionally, it is preferred that heat conductive material 4A and connecting material 4B in above-mentioned bonding process.By adding
Heat, makes conductive material 4A and the solidification of connecting material 4B, can form the connecting portion 4 through overcuring.
The temperature of above-mentioned heating is preferably more than 50 DEG C, more preferably more than 80 DEG C, more preferably
More than 100 DEG C, preferably less than 200 DEG C, more preferably less than 170 DEG C.When the temperature of above-mentioned heating is
Time more than above-mentioned lower limit and below the above-mentioned upper limit, can fully solidify, and be effectively improved connection can
By property.
Solar module shown in Fig. 4 can also be via the work shown in such as following Fig. 6 (a)～(c)
Sequence obtains.
Prepare the flexible printing substrate 2 on surface with cloth line electrode 2a.It addition, prepare containing conductive
The conductive material 4A of particle 21 and adhesive resin.As shown in Fig. 6 (a), at flexible printing substrate 2
Conductive material 4A (the first arrangement step) is optionally configured on cloth line electrode 2a.Can be at solaode
Optionally configure conductive material 4A on the electrode 3a of unit 3, replace at flexible printing substrate 2
Conductive material 4A is optionally configured on cloth line electrode 2a.
It addition, prepare not contain connecting material 4B of electroconductive particle.Not setting of flexible printing substrate 2
Put part configuration connecting material 4B (the second arrangement step) of cloth line electrode 2a.First arrangement step and second
In arrangement step, can first carry out the first arrangement step, it is also possible to first carry out the second arrangement step.First
Arrangement step and the second arrangement step can be carried out simultaneously.
It addition, as shown in Fig. 6 (b), prepare the solar battery cell 3 on surface with electrode 3a.This
Outward, in the case of the electrode 3a of solar battery cell 3 optionally configures conductive material 4A,
Prepare the flexible printing substrate 2 on surface with cloth line electrode 2a.
Then, following operation is carried out: being configured with of obtaining in above-mentioned first, second arrangement step is led
Flexible printing substrate 2 and the solar battery cell 3 of electric material 4A and connecting material 4B are fitted.
As shown in Fig. 6 (c), flexible printing substrate 2 and solar battery cell 3 are fitted, and make flexible print
The cloth line electrode 2a of brush the substrate 2 and electrode 3a of solar battery cell 3 is real by electroconductive particle 21
Now electrical connection (bonding process).
As it has been described above, utilize conductive material 4A and connecting material 4B to form connecting portion 4.It addition, according to
Need, the solaode mould shown in Fig. 4 can be obtained by configuring back sheet material 5 or encapsulant 6
Block 1.
As being located at the electrode (cloth line electrode) of above-mentioned flexible printing substrate or above-mentioned resin molding and being located at
State the electrode of solar battery cell, can enumerate: gold electrode, nickel electrode, tin electrode, aluminum electrode, copper
The metal electrodes such as electrode, silver electrode, molybdenum electrode and tungsten electrode.Wherein, preferably copper electrode (thin copper film electricity
Pole) or aluminum electrode (aluminum cloth line electrode), particularly preferably aluminum electrode (aluminum cloth line electrode).Particularly preferably it is located at
The cloth line electrode stating flexible printing substrate or above-mentioned resin molding is aluminum cloth line electrode, or is located at the above-mentioned sun
The electrode of energy battery unit is aluminum electrode.In this case, it is located at above-mentioned flexible printing substrate or above-mentioned tree
The cloth line electrode of adipose membrane and be located at the electrode of above-mentioned solar battery cell, can be one of which electricity
Pole is formed by aluminum, it is also possible to be that two kinds of electrodes are all formed by aluminum.It is located at above-mentioned flexible printing substrate or above-mentioned
The cloth line electrode of resin molding can be aluminum cloth line electrode, and the electrode being located at above-mentioned solar battery cell also may be used
To be aluminum electrode.In the case of using aluminum electrode (aluminum cloth line electrode), further play the effect of the present invention
Really, the effect that the projection of electroconductive particle produces the most further is played.
Hereinafter, other details of electroconductive particle, conductive material and solar module are described.
(electroconductive particle)
As above-mentioned substrate particle, can enumerate: resin particle, inorganic particulate in addition to metallic,
Organic inorganic hybridization particle and metallic etc..Above-mentioned substrate particle is preferably the base in addition to metallic
Material particle, more preferably resin particle, inorganic particulate in addition to metallic or organic inorganic hybridization grain
Son.
Above-mentioned substrate particle is preferably by the resin particle of resin formation.When being attached between to electrode,
After electroconductive particle is configured between electrode, typically electroconductive particle is compressed.If base material grain
Son is resin particle, then electroconductive particle is prone to deform because of compression, thus electroconductive particle and electrode
Contact area becomes big.Therefore, interelectrode conducting reliability improves.
As the resin for forming above-mentioned resin particle, preferably use various Organic substances.As being used for
Form the resin of above-mentioned resin particle, can use such as: polyethylene, polypropylene, polystyrene, polychlorostyrene
The vistanexes such as ethylene, polyvinylidene chloride, polyisobutylene, polybutadiene；Poly-methyl methacrylate
The acrylic resin such as ester, polymethyl acrylate；Polyalkylene terephthalates, Merlon,
Polyamide, phenol formaldehyde resin, melamine resin, benzoguanamin formaldehyde resin, ureaformaldehyde tree
Fat, phenolic resin, melmac, benzoguanamine resin, urea resin, epoxy resin, insatiable hunger
With polyester resin, saturated polyester resin, polysulfones, polyphenylene oxide, polyacetals, polyimides, polyamide acyl
Imines, polyether-ether-ketone, polyether sulfone and by a kind or two or more there are the various of ethylenically unsaturated group
The polymer etc. that polymerizable monomer occurs to be polymerized and obtains.By making a kind or two or more there is olefinic not
The various polymerizable monomers of saturated group are polymerized, can design and synthesize be suitable to conductive material appoint
The resin particle of physical property when there is compression of meaning.
The situation of above-mentioned resin particle is obtained making the monomer with ethylenically unsaturated group carry out being polymerized
Under, as the above-mentioned monomer with ethylenically unsaturated group, monomer and the bridging property of non-crosslinked can be enumerated
Monomer.
As the monomer of above-mentioned non-crosslinked, such as, can enumerate: the benzene second such as styrene, α-methyl styrene
Vinyl monomer；The carboxylic monomers such as (methyl) acrylic acid, maleic acid, maleic anhydride；(methyl) acrylic acid
Methyl ester, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) propylene
Acid 2-Octyl Nitrite, (methyl) lauryl acrylate, (methyl) aliphatic acrylate, (methyl) propylene
(methyl) acrylic acid alkyls such as acid stearyl ester, (methyl) cyclohexyl acrylate, (methyl) isobornyl acrylate
Esters；(methyl) acrylic acid 2-hydroxy methacrylate, (methyl) glycerol acrylate, (methyl) acrylic acid polyoxy second
Alkene ester, (methyl) glycidyl acrylate, (methyl) acrylic acid dicyclopentenyl ester, (methyl) acrylic acid
Dicyclopentenyl epoxide ethyl ester, (methyl) acrylic acid bicyclopentyl ester, 1,3-diamantane (obsolete) glycol two (methyl) propylene
(methyl) esters of acrylic acid containing oxygen atom such as acid esters；(methyl) acrylonitrile etc. are containing nitrile monomer；Ethylene methacrylic
The vinyl ethers such as base ether, ethyl vinyl ether, propyl vinyl ether；Vinyl-acetic ester, butanoic acid second
The acid vinyl ester such as alkenyl esters, vinyl laurate, vinyl stearate base ester；Ethylene, propylene,
The unsaturated hydrocarbons such as isoprene, butadiene；(methyl) acrylic acid trifluoro methyl ester, (methyl) acrylic acid five fluorine second
The halogen containing monomers etc. such as ester, vinyl chloride, fluorothene, chlorostyrene.
From the viewpoint of making compression property further good, preferred aliphat (methyl) acrylate, more
It is preferably (methyl) cyclohexyl acrylate, (methyl) isobornyl acrylate, (methyl) acrylic acid dicyclopentenyl
Base ester, (methyl) acrylic acid dicyclopentenyl epoxide ethyl ester, (methyl) acrylic acid bicyclopentyl ester or 1,3-Buddha's warrior attendant
Alkane glycol two (methyl) acrylate.
As the monomer of above-mentioned bridging property, such as, can enumerate: tetramethylol methane four (methyl) acrylate,
Tetramethylol methane three (methyl) acrylate, tetramethylol methane two (methyl) acrylate, trihydroxy methyl
Propane three (methyl) acrylate, dipentaerythritol six (methyl) acrylate, dipentaerythritol five (methyl)
Acrylate, three (methyl) glycerol acrylate, two (methyl) glycerol acrylate, (gathering) ethylene glycol bisthioglycolate (first
Base) acrylate, (gathering) propylene glycol two (methyl) acrylate, (gathering) tetramethylene glycol two (methyl) propylene
Acid esters, multifunctional (methyl) esters of acrylic acid such as Isosorbide-5-Nitrae-butanediol two (methyl) acrylate；Triallyl (different)
Cyanurate, triallyl trimellitate, divinylbenzene, diallyl phthalate, diene
Propylacrylamide, diallyl ether, γ-(methyl) acryloxypropyl trimethoxy silane, trimethoxy
The silane-containing monomers etc. such as base silicyl styrene, vinyltrimethoxy silane.
From the viewpoint of making compression property further good, the most multifunctional (methyl) acrylate,
More preferably (gathering) tetramethylene glycol two (methyl) acrylate or 1,4-butanediol two (methyl) acrylic acid
Ester.
By utilizing known method to make the above-mentioned polymerizable monomer with ethylenically unsaturated group be polymerized, can
To obtain above-mentioned resin particle.Can enumerate as the method: such as, depositing at radical polymerization initiator
Carry out the method for suspension polymerisation under and make noncrosslinking kind of particle and radical polymerization initiator one
Monomer swell is made to carry out the method etc. being polymerized.
It is the inorganic particulate in addition to metallic or the feelings of organic inorganic hybridization particle in above-mentioned substrate particle
Under condition, as the inorganic matter of substrate particle material, silicon dioxide and white carbon black etc. can be enumerated.Above-mentioned inorganic matter
The preferably inorganic matter in addition to metal.As the particle formed by above-mentioned silicon dioxide, it is not particularly limited,
But can enumerate such as by the silicon compound of the water-disintegrable alkoxysilyl with more than 2 is carried out
Hydrolysis and after forming cross-linking polymer particle, the particle obtained by carrying out as required burning till.As
Above-mentioned organic inorganic hybridization particle, such as, can enumerate by the alkoxy silicane polymer cross-linked and propylene
The organic inorganic hybridization particle etc. that acid resin is formed.
In the case of above-mentioned substrate particle is metallic, as the metal of this metallic material, can
Enumerate: silver, copper, nickel, silicon, gold and titanium etc..But, substrate particle is not the most metallic.
The mean diameter of above-mentioned substrate particle is preferably more than 0.5 μm, more than more preferably 1 μm, preferably
It is below 500 μm, below more preferably 100 μm, more preferably below 50 μm, particularly preferably
It is below 30 μm.The mean diameter of above-mentioned substrate particle can also be below 20 μm.When substrate particle
When mean diameter is below more than above-mentioned lower limit and the above-mentioned upper limit, connect between electrode using electroconductive particle
In the case of, the contact area of electroconductive particle and electrode fully becomes big, and when forming conductive layer, no
It is easily formed the electroconductive particle of cohesion.It addition, the interelectrode interval via electroconductive particle connection will not
Excessive, and conductive part is difficult to the sur-face peeling from substrate particle.From absorbing solar battery cell circuit table
From the viewpoint of the concavo-convex impact in face, the mean diameter of above-mentioned substrate particle be preferably more than 10 μm and
Below 30 μm.
" mean diameter " of above-mentioned substrate particle represents number average bead diameter.The mean diameter of resin particle is by profit
With any 50 resin particles of ultramicroscope or observation by light microscope, and calculate meansigma methods and try to achieve.
The thickness of above-mentioned conductive part is preferably more than 5nm, more preferably more than 10nm, further preferably
For more than 20nm, particularly preferably more than 50nm, preferably below 1000nm, more preferably 800nm
Hereinafter, more preferably below 500nm, particularly preferably below 400nm, most preferably 300nm
Below.In the case of having multiple conductive part, the thickness of above-mentioned conductive part represents the total of multiple conductive part
Thickness.When the thickness of above-mentioned conductive part is more than above-mentioned lower limit, the electric conductivity of electroconductive particle becomes more
The best.When the thickness of above-mentioned conductive part is below the above-mentioned upper limit, substrate particle and conductive part
The difference of coefficient of thermal expansion diminishes, and conductive part is difficult to peel off from substrate particle.
As the method forming above-mentioned conductive part on the surface of above-mentioned substrate particle, can enumerate and pass through non-electrical
Solve the method that plating forms above-mentioned conductive part, and formed the method etc. of above-mentioned conductive part by plating.
Above-mentioned conductive part preferably comprises metal.The above-mentioned i.e. metal of conductive part material is not particularly limited.As
This metal, such as, can enumerate: gold, silver, copper, platinum, palladium, zinc, lead, aluminum, cobalt, indium, nickel, chromium,
Titanium, antimony, bismuth, germanium, tungsten, molybdenum and cadmium and their alloy etc..It addition, as above-mentioned metal, also
Tin-doped indium oxide (ITO) can be used.Above-mentioned metal can be used alone a kind, it is also possible to is applied in combination
Two or more.
Above-mentioned electroconductive particle has multiple projection on the outer surface of conductive part.By by above-mentioned core material
Imbed in above-mentioned conductive part, projection can be readily formed on the outer surface of above-mentioned conductive part.Most feelings
On the surface of the electrode connected by electroconductive particle, oxide-film is formed under condition.Using, tool is bossed leads
In the case of conductive particles, by configuring electroconductive particle between electrode and crimping, projection is utilized to have
Above-mentioned oxide-film is got rid of on effect ground.Therefore, electrode the most reliably contacts with electroconductive particle, electrode
Between connection resistance further step-down.It addition, utilize projection can effectively get rid of electroconductive particle and electricity
Adhesive resin between pole.Therefore, interelectrode conducting reliability uprises.
As the method forming projection on the surface of above-mentioned electroconductive particle, can enumerate in substrate particle
After adhering to core material on surface, by the method for electroless plating conformal one-tenth conductive part；And pass through non-electrolytic
Plating forms conductive part on the surface of substrate particle, then adheres to core material, passes through non-electrolytic further
Plating forms the method etc. of conductive part.As other method of the above-mentioned projection of formation, can enumerate: at base material
After forming the first conductive part on the surface of particle, this first conductive part configures core material, is then formed
The method of the second conductive part；And on the surface of substrate particle, form midway stage of conductive part, add
The method etc. of core material.As the method for the surface attachment core material in above-mentioned substrate particle, can use
Currently known method.By above-mentioned core material is imbedded in above-mentioned conductive part, it is easy to make above-mentioned conductive part
There is multiple projection on the outer surface.But, in order to be formed on the surface of electroconductive particle and conductive part
Projection, it is not necessary to core material must be used.Above-mentioned core material preferred disposition is in the inside of conductive part or inner side.
As the material of above-mentioned core material, conductive material and non-conducting material can be enumerated.As above-mentioned
Conductive material, such as, can enumerate: the electrically conductive, non-metallics such as metal, the oxide of metal, graphite and
Electric conductive polymer etc..Polyacetylene etc. can be enumerated as above-mentioned electric conductive polymer.As above-mentioned non-conductive
Property material can be enumerated: silicon dioxide, aluminium oxide and zirconium oxide etc..Wherein, owing to electric conductivity can be improved,
And can effectively further reduce connection resistance, therefore preferred metal.The preferred clipped wire of above-mentioned core material
Son.
As above-mentioned metal, such as, can enumerate: gold, silver, copper, platinum, zinc, ferrum, lead, stannum, aluminum,
The metals such as cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium and cadmium, and tin-lead alloy, tin-copper alloy,
The alloy etc. that stannum-silver alloy, stannum-lead-silver alloy and tungsten carbide etc. are made up of two or more metals.Especially
It is preferably nickel, copper, silver-colored or golden.As the metal of above-mentioned core material material, can with as above-mentioned conduction
The metal of portion's material is identical, it is also possible to different.The material of above-mentioned core material preferably comprises nickel.It addition, make
For the oxide of above-mentioned metal, aluminium oxide, silicon dioxide and zirconium oxide etc. can be enumerated.
The shape of above-mentioned core material is not particularly limited.Core material be preferably shaped to bulk.As core thing
Matter, such as, can enumerate emboliform piece, the cohesion block of multiple fine particle cohesion and unbodied piece
Deng.
The average diameter (mean diameter) of above-mentioned core material is preferably more than 0.001 μm, more preferably 0.05 μm
Above, below preferably 0.6 μm, below more preferably 0.4 μm.The average diameter of above-mentioned core material also may be used
Think below 0.9 μm, it is also possible to be below 0.2 μm.When the average diameter of above-mentioned core material is above-mentioned lower limit
Time above and below the above-mentioned upper limit, interelectrode connection resistance can be effectively reduced.
" average diameter (mean diameter) " of above-mentioned core material represents number average diameter (number average bead diameter).Putting down of core material
All footpaths are by utilizing ultramicroscope or any 50 core materials of observation by light microscope, and calculate meansigma methods
And try to achieve.
The above-mentioned number of projection of each above-mentioned electroconductive particle is preferably more than 10, more preferably
More than 200, the most more preferably more than 500.Above-mentioned number of projection can also be more than 3,
Can also be more than 5.The upper limit of above-mentioned number of projection is not particularly limited.Above-mentioned number of projection
The upper limit it is contemplated that the particle diameter etc. of electroconductive particle and suitably select.Above-mentioned number of projection is preferably 1500
Below individual, more preferably less than 1000.
From the viewpoint of further improving conducting reliability, the average height of multiple above-mentioned projections is preferred
For more than 50nm, more preferably more than 200nm, preferably below 800nm, more preferably 700 μm
Hereinafter, more preferably below 600nm, particularly preferably below 500nm.Multiple above-mentioned projections
Average height is particularly preferably more than 50nm, below 800nm, more preferably more than 50nm, 600nm
Below.When the average height of above-mentioned projection is below more than above-mentioned lower limit and the above-mentioned upper limit, effectively drop
Connection resistance between low electrode.
The height of above-mentioned projection refers to: the line of the front end of connecting conductive particle centre and projection is (shown in Fig. 1
Dotted line L1) on, (false from the dummy line (the dotted line L2 shown in Fig. 1) of the conductive part supposed when not having a projection
On the outer surface of spherical electroconductive particle when surely not having a projection) to the distance of front end of projection.That is, Fig. 1
In, represent the distance from the intersection point of dotted line L1 and the dotted line L2 front end to projection.
From the viewpoint of further improving conducting reliability, the average height of multiple above-mentioned projections is with upper
The ratio of the thickness stating conductive part is preferably more than 1, and more preferably more than 2, preferably less than 7, more excellent
Elect less than 6 as.
Modulus of elasticity in comperssion (10%K value) when above-mentioned electroconductive particle compresses 10% is 1100N/mm2
Above, 5000N/mm2Below.From the viewpoint of further improving conducting reliability, above-mentioned 10%K
Value is preferably 1300N/mm2Above, more preferably 1500N/mm2Above, further it is preferably
1600N/mm2Above, more preferably 1800N/mm2Above, particularly preferably 2000N/mm2
Above, preferably 4500N/mm2Hereinafter, more preferably 4000N/mm2Below.
The above-mentioned modulus of elasticity in comperssion (10%K value) of above-mentioned electroconductive particle can be measured.
Use micro-compression tester, utilize the smooth pressure head end of cylinder (diameter 50 μm, diamond is made)
Face is compression conductive grain under conditions of 25 DEG C, compression speed 2.6mN/ second and maximum test load 10gf
Son.Measure load value (N) now and compression displacement (mm).Can be according to the measured value obtained according to following
Formula tries to achieve above-mentioned modulus of elasticity in comperssion.As above-mentioned micro-compression tester, such as, Fischer can be used public
" the Fischer Scope H-100 " that department manufactures etc..
K value (N/mm2)=(3/21/2)·F·S-3/2·R-1/2
F: electroconductive particle carries out 10%, 30% or load value (N) during 50% compression
S: electroconductive particle carries out 10%, 30% or compression displacement (mm) during 50% compression
The radius (mm) of R: electroconductive particle
Above-mentioned modulus of elasticity in comperssion generally and quantitatively represents the hardness of electroconductive particle.By above-mentioned compression
The use of elastic modelling quantity, can quantitatively and uniquely represent the hardness of electroconductive particle.
The breaking strain of above-mentioned electroconductive particle is more than 55%.From further improving conducting reliability
From the point of view of viewpoint, the breaking strain of above-mentioned electroconductive particle is preferably more than 60%, and more preferably more than 65%,
More preferably more than 70%.Additionally, in the case of unbroken, breaking strain actually exceeds 70%.
Above-mentioned breaking strain can be measured.
Use micro-compression tester, utilize the smooth pressure head end of cylinder (diameter 50 μm, diamond is made)
Face is compression conductive grain under conditions of 25 DEG C, compression speed 2.6mN/ second and maximum test load 10gf
Son.Breaking strain is the mensuration according to compression displacement when electroconductive particle ruptures during compression
The value that value is tried to achieve according to following formula.
Breaking strain (%)=(B/D) × 100
B: the compression displacement (mm) when electroconductive particle ruptures
The diameter (mm) of D: electroconductive particle
For example, it is possible to by the composition adjusting the monomer constituting substrate particle, by above-mentioned modulus of elasticity in comperssion
And above-mentioned breaking strain controls within the above range.
(conductive material and connecting material)
The back contact solar battery module conductive material of the present invention comprise above-mentioned electroconductive particle and
Adhesive resin.Above-mentioned adhesive resin is not particularly limited.As above-mentioned adhesive resin, can make
Use known insulative resin.
Above-mentioned adhesive resin, above-mentioned conductive material and above-mentioned connecting material preferably comprise thermoplastic composition or
Thermocurable composition.Above-mentioned adhesive resin, above-mentioned conductive material and above-mentioned connecting material can also contain
Thermoplastic composition, it is also possible to containing Thermocurable composition.Above-mentioned adhesive resin, above-mentioned conductive material and
Above-mentioned connecting material preferably comprises Thermocurable composition.Above-mentioned adhesive resin, above-mentioned conductive material and on
State connecting material preferably comprise can by heating the curable compound (Thermocurable compound) that solidify and
Thermal curing agents.The above-mentioned curable compound solidified by heating and above-mentioned thermal curing agents are with suitable
Match ratio uses, so that the solidification of above-mentioned adhesive resin.
As above-mentioned Thermocurable compound, can enumerate: epoxide, episulfide compounds, (methyl)
Acyclic compound, oxybenzene compound, amino-compound, unsaturated polyester compound, polyurethane chemical combination
Thing, organo-silicon compound and polyimide compound etc..Above-mentioned Thermocurable compound can only use 1
Kind, it is also possible to it is applied in combination two or more.
As above-mentioned thermal curing agents, can enumerate: imidazole curing agent, amine hardener, phenol cured agent, many
Polythiol hardener, anhydride and hot cationic curing initiator etc..Above-mentioned thermal curing agents can be used alone 1
Kind, it is also possible to it is applied in combination two or more.
In above-mentioned conductive material 100 weight %, the content of above-mentioned adhesive resin be preferably 10 weight % with
On, more than more preferably 30 weight %, more preferably more than 50 weight %, particularly preferably 70
More than weight %, below preferably 99.99 weight %, below more preferably 99.9 weight %.Above-mentioned bonding
When the content of agent resin is below more than above-mentioned lower limit and the above-mentioned upper limit, effectively can configure between electrode
Electroconductive particle, further improves connection reliability.
In above-mentioned conductive material 100 weight %, the content of above-mentioned electroconductive particle is preferably 0.01 weight %
Above, more than more preferably 0.1 weight %, below preferably 80 weight %, more preferably 60 weight %
Hereinafter, more preferably below 40 weight %, below particularly preferably 20 weight %, most preferably
Below 10 weight %.When the content of above-mentioned electroconductive particle is below more than above-mentioned lower limit and the above-mentioned upper limit,
Further improve interelectrode conducting reliability.
Hereinafter, enumerate embodiment and comparative example specifically describes the present invention.The present invention is not limited to following
Embodiment.
(embodiment 1)
(1) making of electroconductive particle
(making of polymer seeds particle dispersion)
Put in separate type flask ion exchange water 2500g, styrene 250g, octyl mercaptan 50g and
Sodium chloride 0.5g, stirs under nitrogen atmosphere.Then, it is heated to 70 DEG C, adds potassium peroxide 2.5g, and
Carry out reaction in 24 hours, thus, obtain polymer seeds granule.
By water-soluble to the polymer seeds granule 5g obtained, ion exchange water 500g, polyvinyl alcohol 5 weight %
Liquid 100g mixes, and after being disperseed by ultrasound wave, puts in separate type flask and is stirred, obtain polymer
Seed grain dispersion liquid.
(making of polymer particle)
By 1,3-diamantane (obsolete) omega-diol diacrylate 5g, 1-Octyl acrylate 95g, divinylbenzene 90g, mistake
BP 2.6g, dodecyltriethanolamine sulfate 10g, ethanol 130g add to ion exchange water
1000g is stirred, obtains emulsion.The emulsion mark time obtained is added to polymer seeds
In grain dispersion liquid, stir 12 hours.Then, add polyvinyl alcohol 5 weight % aqueous solution 500g,
Carry out reaction in 9 hours under the nitrogen atmosphere of 85 DEG C, obtain polymer particle (resin particle, mean diameter
10.0μm)。
The making of electroconductive particle:
Above-mentioned polymer particle is etched and washes.Then, urge to the palladium containing 8 weight %
The palladium catalyst liquid 100mL of agent adds polymer particle and is stirred.Then, carry out filtering,
Washing.In the 0.5 weight % dimethylamine borane liquid of pH6, add polymer particle, obtain being attached with palladium
Polymer particle.
The polymer particle of adhesion palladium is stirred 3 minutes in ion exchange water 300mL and is allowed to disperse,
To dispersion liquid.Then, with 3 minutes nickel particles slurries using 1g (nickel particles average as core material
Particle diameter 400nm) add to above-mentioned dispersion liquid, obtain being attached with the polymer particle of core material.
Use and be attached with the polymer particle of core material, by non-electrolytic plating at the table of polymer particle
Nickel dam is formed on face.It is produced on the outer surface of nickel dam the electroconductive particle with multiple projection.Need
Bright, the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.
(2) making of conductive material (conductive paste)
Mix the epoxide (" EP-3300P " that ADEKA company manufactures) as Thermocurable compound
20 weight portions, as Thermocurable compound epoxide (DIC company manufacture " EPICLON
HP-4032D ") 15 weight portions, amine additives (the Ajinomoto Fine of imidazoles as thermal curing agents
" PN-F " that Techno company manufactures) 10 weight portions, 2-ethyl-4-methylimidazole as curing accelerator
1 weight portion, aluminium oxide (mean diameter 0.5 μm) 20 weight portions as filler, add electric conductivity further
Particle so as to get conductive paste 100 weight % in the content of electroconductive particle become 10 weight %, so
After, use planetary stirring machine to stir 5 minutes with 2000rpm, thus, obtain conductive material.
(3) making of connecting material (paste)
Mix the epoxide (" EP-3300P " that ADEKA company manufactures) as Thermocurable compound
20 weight portions, as Thermocurable compound epoxide (DIC company manufacture " EPICLON
HP-4032D ") 15 weight portions, amine additives (the Ajinomoto Fine of imidazoles as thermal curing agents
" PN-F " that Techno company manufactures) 10 weight portions, 2-ethyl-4-methylimidazole as curing accelerator
1 weight portion, aluminium oxide (mean diameter 0.5 μm) 20 weight portions as filler, obtain connecting material.
(4) making of solar module
Prepare surface and there is the flexible printing substrate (L/S=300 μm/300 μm) of aluminum cloth line electrode.It addition,
Prepare surface and there is the solar battery cell (L/S=300 μm/300 μm) of copper electrode.
On the cloth line electrode of flexible printing substrate, use allotter optionally applying conductive material, and
It is partially formed the conductive material layer of thickness 60 μm.Whole conductive materials on flexible printing substrate are configured
On cloth line electrode.That is, in conductive material total amount 100 weight % being configured on flexible printing substrate,
The amount of the conductive material being configured on cloth line electrode is 100 weight %.
It addition, on the whole surface of the side being provided with electrode of solar battery cell, be coated with by printing
Connecting material, forms the connecting material layer of thickness 40 μm.
Then, make flexible printing substrate and solar battery cell laminating, and make flexible printing substrate
The copper electrode of aluminum cloth line electrode and solar battery cell realizes electrical connection by electroconductive particle.Now,
Configuration flexible printing substrate and solar battery cell make them be sandwiched in glass baseplate and EVA film, and
The vacuum lamination of 5 minutes is carried out under the atmosphere of 150 DEG C.By heating during lamination, make conductive material layer
And connecting material layer is solidified to form connecting portion.Obtain aluminum cloth line electrode and the solar energy of flexible printing substrate
The copper electrode of battery unit achieves the solar module of electrical connection by electroconductive particle.
(embodiment 2)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use isobornyl acrylate 133g, polytetramethylene glycol
Diacrylate 48g, cyclohexyl acrylate 9g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g,
Beyond 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.
It should be noted that the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.Use
The electroconductive particle obtained in the same manner as in Example 1, obtains solar module.
(embodiment 3)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use isobornyl acrylate 133g, polytetramethylene glycol
Diacrylate 28g, cyclohexyl acrylate 29g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g,
Beyond 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.
It should be noted that the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.Use
The electroconductive particle obtained in the same manner as in Example 1, obtains solar module.
(embodiment 4)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use isobornyl acrylate 133g, polytetramethylene glycol
Diacrylate 38g, cyclohexyl acrylate 19g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g,
Beyond 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.
It should be noted that the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.Use
The electroconductive particle obtained in the same manner as in Example 1, obtains solar module.
(embodiment 5)
Except changing the mean diameter of core material and the average height of multiple projections of electroconductive particle being changed
Become beyond 50nm, in the same manner as in Example 1, obtain electroconductive particle.It should be noted that the thickness of nickel dam
Degree is 0.3 μm.The average height of multiple projections is 50nm.Use the electroconductive particle and embodiment obtained
As 1, obtain solar module.
(embodiment 6)
Except changing the mean diameter of core material and the average height of multiple projections of electroconductive particle being changed
Become beyond 750nm, in the same manner as in Example 1, obtain electroconductive particle.It should be noted that nickel dam
Thickness is 0.3 μm.The average height of multiple projections is 750nm.Use the electroconductive particle and reality obtained
As executing example 1, obtain solar module.
(embodiment 7)
In addition to the electrode of solar battery cell is altered to aluminum electrode by copper electrode, with embodiment 1
Equally, solar module is obtained.
(embodiment 8)
In addition to the mean diameter of polymer particle being altered to 20 μm at the making polymer beads period of the day from 11 p.m. to 1 a.m,
In the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.2 μm.
The average height of multiple projections is 400nm.Use the electroconductive particle obtained in the same manner as in Example 1,
To solar module.
(embodiment 9)
Except changing the mean diameter of core material and the average height of multiple projections of electroconductive particle being changed
Become beyond 200nm, in the same manner as in Example 8, obtain electroconductive particle.It should be noted that nickel dam
Thickness is 0.2 μm.The average height of multiple projections is 200nm.Use the electroconductive particle and reality obtained
As executing example 1, obtain solar module.
(embodiment 10)
Except changing the mean diameter of core material and the average height of multiple projections of electroconductive particle being changed
Become beyond 600nm, in the same manner as in Example 8, obtain electroconductive particle.It should be noted that nickel dam
Thickness is 0.2 μm.The average height of multiple projections is 600nm.Use the electroconductive particle and reality obtained
As executing example 1, obtain solar module.
(embodiment 11)
Use the polymer particle used in embodiment 1, do not use nickel particles slurry, but by reaction
In plating bath, generate nickel core material, and make an electroless nickel plate be eutectoid out together with the core material of generation, thus,
Obtain the electroconductive particle on the outer surface of nickel dam with multiple projection.The thickness of the nickel dam of electroconductive particle
Being 0.1 μm, the average height of multiple projections is 250nm.In addition to using the electroconductive particle obtained,
In the same manner as in Example 1, solar module is obtained.
(embodiment 12)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use isobornyl acrylate 133g, polytetramethylene glycol
Diacrylate 48g, cyclohexyl acrylate 9g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g,
Beyond 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 8, electroconductive particle is obtained.
It should be noted that the thickness of nickel dam is 0.2 μm.The average height of multiple projections is 400nm.Use
The electroconductive particle obtained in the same manner as in Example 1, obtains solar module.
(embodiment 13)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use isobornyl acrylate 133g, polytetramethylene glycol
Diacrylate 28g, cyclohexyl acrylate 29g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g,
Beyond 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 8, electroconductive particle is obtained.
It should be noted that the thickness of nickel dam is 0.2 μm.The average height of multiple projections is 400nm.Use
The electroconductive particle obtained in the same manner as in Example 1, obtains solar module.
(embodiment 14)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use isobornyl acrylate 133g, polytetramethylene glycol
Diacrylate 38g, cyclohexyl acrylate 19g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g,
Beyond 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 8, electroconductive particle is obtained.
It should be noted that the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.Use
The electroconductive particle obtained in the same manner as in Example 1, obtains solar module.
(embodiment 15)
In addition to the thickness of nickel dam is altered to the height of 0.8 μm and change projection, with embodiment 8
Equally, electroconductive particle is obtained.The average height of multiple projections is 500nm.Use the electric conductivity obtained
Particle in the same manner as in Example 1, obtains solar module.
(embodiment 16)
In addition to the thickness of nickel dam is altered to 0.1 μm, in the same manner as in Example 8, electric conductivity grain is obtained
Son.The average height of multiple projections is 400nm.Use the electroconductive particle obtained in the same manner as in Example 1,
Obtain solar module.
(embodiment 17)
In using electroless plating gold to embodiment 8 electroconductive particle that obtains implement gold-plated in addition to, with
As embodiment 8, obtain electroconductive particle.Additionally, the aggregate thickness of nickel dam and layer gold is 0.25 μm (nickel
Layer 0.2 μm).The average height of multiple projections is 400nm.Use the electroconductive particle and embodiment obtained
As 1, obtain solar module.
(embodiment 18)
Except the coating of electroconductive particle being changed to only in addition to layers of copper, in the same manner as in Example 8, obtain
Electroconductive particle.Additionally, the thickness of layers of copper is 0.2 μm.The average height of multiple projections is 400nm.
Use the electroconductive particle obtained in the same manner as in Example 1, obtain solar module.
(embodiment 19)
In addition to the outermost layer of the coating of electroconductive particle is altered to palladium layers, as embodiment 17,
Obtain electroconductive particle.Additionally, the aggregate thickness of nickel dam and palladium layers is 0.25 μm (nickel dam 0.2 μm).Multiple
The average height of projection is 400nm.Use the electroconductive particle obtained in the same manner as in Example 1, obtain too
Sun can battery module.
(embodiment 20)
Except the nickel dam as electroconductive particle coating is become layers of copper, and the outermost layer as coating is become
More become beyond palladium layers, as embodiment 17, obtain electroconductive particle.Additionally, layers of copper and the conjunction of palladium layers
Meter thickness is 0.25 μm (layers of copper 0.2 μm).The average height of multiple projections is 400nm.Use obtains
Electroconductive particle in the same manner as in Example 1, obtains solar module.
(embodiment 21)
In addition to the outermost layer of the coating of electroconductive particle is altered to silver layer, as embodiment 17,
Obtain electroconductive particle.Additionally, the aggregate thickness of nickel dam and silver layer is 0.25 μm (nickel dam 0.2 μm).Multiple
The average height of projection is 400nm.Use the electroconductive particle obtained in the same manner as in Example 1, obtain too
Sun can battery module.
(embodiment 22)
In addition to the thickness of nickel dam is altered to 1.3 μm, in the same manner as in Example 8, electric conductivity grain is obtained
Son.The average height of multiple projections is 600nm.Use the electroconductive particle obtained in the same manner as in Example 1,
Obtain solar module.
(embodiment 23)
In addition to the thickness of nickel dam is altered to 0.09 μm, in the same manner as in Example 8, electric conductivity grain is obtained
Son.The average height of multiple projections is 400nm.Use the electroconductive particle obtained in the same manner as in Example 1,
Obtain solar module.
(comparative example 1)
Prepare the polymer particle obtained in embodiment 1.Use this polymer particle, pass through electroless plating
The method of applying forms nickel dam on the surface of polymer particle, makes electroconductive particle.In comparative example 1, do not have
The surface of the conductive part of electroconductive particle is formed projection.Use the electroconductive particle and embodiment 1 obtained
Equally, solar module is obtained.
(comparative example 2)
In addition to conductive material (conductive paste) is altered to solder paste, in the same manner as in Example 1, obtain
Solar module.
(comparative example 3)
In addition to conductive material (conductive paste) is altered to Ag paste, in the same manner as in Example 1, obtain
Solar module.
(comparative example 4)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use 1,3-diamantane (obsolete) omega-diol diacrylate 5g, acrylic acid
Monooctyl ester 135g, divinylbenzene 50g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g, acrylic acid
Beyond monooctyl ester 95g, divinylbenzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.Need
Bright, the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.Use obtains
Electroconductive particle in the same manner as in Example 1, obtains solar module.
(comparative example 5)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use isobornyl acrylate 113g, polytetramethylene glycol
Diacrylate 68g, cyclohexyl acrylate 9g, replace 1,3-diamantane (obsolete) omega-diol diacrylate 5g,
Beyond 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.
It should be noted that the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.Use
The electroconductive particle obtained in the same manner as in Example 1, obtains solar module.
(comparative example 6)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, divinylbenzene 190g is used to replace 1,3-diamantane (obsolete) glycol
Beyond diacrylate 5g, 1-Octyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 1,
Obtain electroconductive particle.It should be noted that the thickness of nickel dam is 0.3 μm.The mean height of multiple projections
Degree is 400nm.Use the electroconductive particle obtained in the same manner as in Example 1, obtain solar module.
(comparative example 7)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, use polytetramethylene glycol diacrylate 152g, diethyl
Alkenyl benzene 38g, replaces 1,3-diamantane (obsolete) omega-diol diacrylate 5g, 1-Octyl acrylate 95g, divinyl
Beyond base benzene 90g, in the same manner as in Example 1, obtain electroconductive particle.It should be noted that nickel dam
Thickness is 0.3 μm.The average height of multiple projections is 400nm.Use the electroconductive particle and reality obtained
As executing example 1, obtain solar module.
(evaluation)
(1) modulus of elasticity in comperssion (10%K value) of electroconductive particle
By above-mentioned method, use micro-compression tester (" the Fischer Scope that Fischer company manufactures
H-100 ") measure the modulus of elasticity in comperssion (10%K value) of electroconductive particle obtained.
(2) breaking strain of electroconductive particle
By above-mentioned method, use micro-compression tester (" the Fischer Scope that Fischer company manufactures
H-100 ") measure the breaking strain of electroconductive particle obtained.
(3) initial stage energy conversion efficiency
Measure the energy conversion efficiency of the solar module obtained.It addition, sentenced by following benchmark
Determine the energy conversion efficiency at initial stage.
[metewand of initial stage energy conversion efficiency]
0000: energy conversion efficiency is more than 22%
000: energy conversion efficiency is more than 20% and less than 22%
00: energy conversion efficiency is more than 18% and less than 20%
Zero: energy conversion efficiency is more than 16% and less than 18%
△: energy conversion efficiency is more than 14% and less than 16%
×: energy conversion efficiency is less than 14%
(4) energy conversion efficiency after reliability test
For the solar module obtained, utilize circulation testing machine to carry out the following of 200 circulations and follow
Ring test: at-40 DEG C～90 DEG C, the retention time be 30 minutes, rate of temperature change be 87 DEG C/h,
Then, energy conversion efficiency is measured.The energy conversion efficiency after reliability test is judged by following benchmark.
[metewand of the energy conversion efficiency after reliability test]
0000: energy conversion efficiency is more than 22%
000: energy conversion efficiency is more than 20% and less than 22%
00: energy conversion efficiency is more than 18% and less than 20%
Zero: energy conversion efficiency is more than 16% and less than 18%
△: energy conversion efficiency is more than 14% and less than 16%
×: energy conversion efficiency is less than 14%
(5) clearance control
The flexible printing substrate at 4 angles of unit in the solar module that mensuration obtains and solar-electricity
The wide length of pool unit bottom, is judged by following benchmark.
[determinating reference of clearance control]
Zero: the minima of width and the difference of maximum are more than 50 μm
The minima of △: width and the difference of maximum are that 20 μm are less than 50 μm
×: the minima of width and the difference of maximum are less than 20 μm
Result shown in table 1 below.
[table 1]
Additionally, in embodiment 1, solar battery cell uses copper electrode, in embodiment 7, solar energy
Battery unit uses aluminum electrode.In embodiment 1 and embodiment 7, the initial stage drawn by said reference
The evaluation result of the energy conversion efficiency after energy conversion efficiency and reliability test is identical, but with regard to aluminum electrode
For, be there is the electroconductive particle of the composition of the present invention by use, with the structure that use does not have the present invention
The situation of the electroconductive particle become is compared, and confirms the effect more effectively embodying the present invention.Additionally, it is real
Execute example 1～23 and the projection quantity of each single-particle of comparative example 4～7 be about 300～about 900.
Claims (8)
1. a back contact solar battery module electroconductive particle, it is used for the back-contact sun
Energy battery module, wherein,
Described electroconductive particle has: substrate particle and the conduction being configured on described substrate particle surface
Portion,
The outer surface of described conductive part has multiple projection,
The described electroconductive particle modulus of elasticity in comperssion when compressing 10% is 1100N/mm2Above and
5000N/mm2Hereinafter, and,
The breaking strain of described electroconductive particle is more than 55%.
2. back contact solar battery module electroconductive particle as claimed in claim 1, wherein,
The average height of multiple described projections is more than 50nm and below 800nm.
3. back contact solar battery module electroconductive particle as claimed in claim 1 or 2,
Wherein,
The average height of multiple described projections is more than 0.1 and less than 8 with the ratio of the thickness of described conductive part.
4. the back contact solar battery module electric conductivity as according to any one of claims 1 to 3
Particle, it has the tree of cloth line electrode for the flexible printing substrate or surface to surface with cloth line electrode
The described electrode of the solar battery cell that the described cloth line electrode of adipose membrane and surface have electrode carries out electricity
Connect.
5. back contact solar battery module electroconductive particle as claimed in claim 4, wherein,
The described cloth line electrode of described flexible printing substrate or described resin molding is aluminum cloth line electrode, or institute
The described electrode stating solar battery cell is aluminum electrode.
6. a back contact solar battery module conductive material, it comprises in Claims 1 to 5
Back contact solar battery module electroconductive particle described in any one and adhesive resin.
7. back contact solar battery module conductive material as claimed in claim 6, wherein,
Described adhesive resin contains Thermocurable compound and thermal curing agents.
8. a back contact solar battery module, comprising:
Surface has a flexible printing substrate of cloth line electrode or surface have cloth line electrode resin molding,
Surface have electrode solar battery cell,
Described flexible printing substrate or described resin molding are linked together with described solar battery cell
Connecting portion,
Described connecting portion is by containing the back contact solar battery according to any one of Claims 1 to 5
The back contact solar battery module conductive material shape of module electroconductive particle and adhesive resin
Become,
Described cloth line electrode and described electrode achieve electrical connection by described electroconductive particle.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014001589 | 2014-01-08 | ||
| JP2014-001589 | 2014-01-08 | ||
| PCT/JP2015/050233 WO2015105120A1 (en) | 2014-01-08 | 2015-01-07 | Conductive particles for back contact solar cell modules, conductive material, and solar cell module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105917418A true CN105917418A (en) | 2016-08-31 |
| CN105917418B CN105917418B (en) | 2018-02-13 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580004075.XA Expired - Fee Related CN105917418B (en) | 2014-01-08 | 2015-01-07 | Back contact solar battery module electroconductive particle, conductive material and solar module |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2015105120A1 (en) |
| KR (1) | KR20160106562A (en) |
| CN (1) | CN105917418B (en) |
| WO (1) | WO2015105120A1 (en) |
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| US20160300981A1 (en) * | 2015-04-08 | 2016-10-13 | Korea Institute Of Science And Technology | Nanostructured hybrid particle, manufacturing method thereof, and device including the nanostructured hybrid particle |
| CN110660880A (en) * | 2019-08-29 | 2020-01-07 | 泰州隆基乐叶光伏科技有限公司 | Back contact solar cell module production method and back contact solar cell module |
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Also Published As
| Publication number | Publication date |
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| JPWO2015105120A1 (en) | 2017-03-23 |
| WO2015105120A1 (en) | 2015-07-16 |
| KR20160106562A (en) | 2016-09-12 |
| CN105917418B (en) | 2018-02-13 |
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