CN105916353B - A kind of radiator, erect type system frame, processing equipment and electronic equipment - Google Patents
A kind of radiator, erect type system frame, processing equipment and electronic equipment Download PDFInfo
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- CN105916353B CN105916353B CN201610326864.1A CN201610326864A CN105916353B CN 105916353 B CN105916353 B CN 105916353B CN 201610326864 A CN201610326864 A CN 201610326864A CN 105916353 B CN105916353 B CN 105916353B
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- radiator
- electronic equipment
- system frame
- erect type
- type system
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of radiator, erect type system frame, processing equipment and electronic equipments, at least two radiators can be vertically arranged in an erect type system frame by dismountable mode, it is possible thereby to which the heat spreader structures for solving erect type column electronic equipment are applicable in the more fixed technical problem of the component to radiate, realization can selectively provide at least two heating devices heat dissipation, therefore have the technical effect of the applicability for the radiator for improving erect type column electronic equipment.
Description
Technical field
The present invention relates to electronic technology fields, more particularly to a kind of radiator, erect type system frame, processing equipment
And electronic equipment.
Background technique
Currently, with the development of electronic information technology, the surface structure of intelligent electronic device is just towards more fining, conjunction
Physics and chemistry development.And erect type column computer in the market, radiator are all integral design, heat radiation module is also using whole
Dam Configuration Design is simultaneously centrally positioned, other computer apparatus plates then lock in heat radiation module.But this kind of design structure
More single fixation can not do corresponding adjustment according to the configuration of system, when user does not need using for example video card, sound card etc. need not
When the external equipment wanted, which can still be provided with the radiating module for these external equipments, therefore cause user
Practical application higher cost.
As it can be seen that the more single fixation of heat spreader structures of erect type column electronic equipment, Wu Fagen exists in the prior art
The technical issues of doing corresponding adjustment according to the configuration of system equipment.
Summary of the invention
The application provides a kind of radiator, erect type system frame, processing equipment and electronic equipment, existing to solve
In technology there is erect type column electronic equipment the more single fixation of heat spreader structures, can not be according to the configuration of system equipment
The technical issues of doing corresponding adjustment.
On the one hand the application provides a kind of radiator, comprising:
First radiator radiates for the first heating device to electronic equipment, and first radiator can
It is releasably vertically arranged in the erect type system frame of the electronic equipment；
Second radiator radiates for the second heating device to the electronic equipment, the second radiator energy
It is enough to be removably vertically arranged in the erect type system frame；Wherein, it is also set up in the erect type system frame
State the system board of electronic equipment.
Optionally, after first radiator and second radiator are arranged in the erect type system frame,
First radiator, second radiator and the erect type system frame constitute one of column type equipment combination
Point.
Optionally, first radiator and second radiator constitute one in the side of the column type equipment combination
Part.
Optionally, first radiator includes at least one first cooling fin, at least one described first cooling fin
Each of the first cooling fin height it is different, form air duct between adjacent first cooling fin；
Second radiator includes at least one second cooling fin, each of at least one described second cooling fin
The height of two cooling fins is different, forms air duct between adjacent second cooling fin.
Optionally, the first cooling fin of each of at least one described first cooling fin and each corresponding second cooling fin
Height it is consistent so that after first radiator and second radiator are arranged in the erect type system frame,
Air duct is formed between adjacent first cooling fin and second cooling fin.
Optionally, first radiator, radiates for the central processing unit to the electronic equipment, and described
The size of one radiator is adapted to the motherboard size of the electronic equipment；
Second radiator, radiates for the graphics processor to the electronic equipment, and second heat dissipation
The size of device is adapted to the video card size of the electronic equipment.
On the other hand, the embodiment of the present application also provides a kind of erect type system frame, the erect type system frame is
Bottom edge is round or polygon columnar structures, and the system frame includes:
First radiator support chip is connect, to carry with the bottom edge in the first side of the erect type system frame
First radiator；
Second radiator support chip is connect, to carry with the bottom edge in the second side of the erect type system frame
Second radiator.
Optionally, the first radiator support chip further includes the first putting hole, to place the first heater；
The second radiator support chip further includes the second putting hole, to place the second heater.
Optionally, it is additionally provided with the first mounting hole on the first radiator support chip, to use the side PAD Thermal
First heater is installed on the first radiator support chip by formula；
It is additionally provided with the second mounting hole on the second radiator support chip, to use Thermal PAD mode by institute
The second heater is stated to be installed on the second radiator support chip.
Optionally, the system frame further include:
Third support chip is connect, to carry the electricity with the bottom edge on the third side of the erect type system frame
Other hardware devices of sub- equipment.
In another aspect, the embodiment of the present application also provides a kind of processing equipments, comprising:
The erect type system frame；
Mainboard is arranged in the erect type system frame；
The radiator is arranged in the erect type system frame.
Another aspect, the embodiment of the present application also provides a kind of electronic equipment, including the processing equipment and projection device,
The processing equipment includes:
First transmission module；
First connector is connect to establish the first signal with the second connector in the projection device；
Processor, the processor are set on the mainboard, to connect by first signal, obtain the throwing
The second identifier information of the second transmission module in shadow equipment, and first identifier information and institute based on first transmission module
Second identifier information is stated, second signal is established with the projection device and connect.
Optionally, first transmission module will be in first electronic equipment to be connected by the second signal
Video signal transmission to the second electronic equipment.
Optionally, the processor, the second identifier information to be written in first transmission module, from described
Identification information is read in first transmission module, and using the identification information read as the second identifier information, based on described
First identifier information and the second identifier information establish the second signal connection.
Optionally, first connector, also to pass through first signal after establishing the first signal connection
Connection transmission current signal.
Optionally, first transmission module and second transmission module are WirelessHD WIHD transmission module.
Optionally, the projection device is specially to be in the predetermined position above the processing equipment.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
At least two radiators can be vertically arranged by the technical solution in the embodiment of the present application by dismountable mode
In an erect type system frame, it is possible thereby to which the heat spreader structures for solving erect type column electronic equipment are applicable in the portion of heat dissipation
The more fixed technical problem of part, realization can selectively provide at least two heating devices heat dissipation, therefore have and improve directly
The technical effect of the applicability of the radiator of vertical type column electronic equipment.
The embodiment of the present application at least also at least has the following technical effects or advantages:
Further, the technical solution in the embodiment of the present application can also be by first radiator and second heat dissipation
Device is arranged in the erect type system frame, constitutes a part that a column type equipment combines with other external equipments, has and mention
The space degree of high structure of system equipment and the technical effect of space applicability.
Further, since first radiator and second radiator constitute the side of the column type equipment combination
In a part, therefore can reduce the erect type system frame uses material, so that finally formed system electronics
Space layout is looser, places the fault that internal electronic element is closer and causes, and improves piece electrical performance.Cause
Technical solution in this embodiment of the present application also has the space layout reasonability for improving electronic equipment, reduces the event of system equipment
The technical effect of barrier rate.
Further, the technical solution in the embodiment of the present application can based on the second electronic equipment communication request with lose
After the electronic equipment of mistake realizes connection, the function of remotely controlling the electronic equipment of the loss by sending signal of communication realization, by
This can according to need the response for obtaining the electronic equipment of the loss at any time, and there is more convenient electronics for giving the loss for change to set
It is standby, the electronic equipment probability for giving loss for change is further increased, and promote the technical effect of user's impression.
Further, the technical solution in the embodiment of the present application, which is also possible that, forms between multiple cooling fins and can accelerate
The air duct of heat dissipation, therefore also there is the technical effect for improving radiating efficiency.
Further, due to the height of the first cooling fin of each of the embodiment of the present application and corresponding second cooling fin
Unanimously, therefore can be by the way of relative tilt setting, the shape between first cooling fin and corresponding second cooling fin
Technical solution at continuous air duct, therefore in the embodiment of the present application also has the technical effect for further increasing radiating efficiency.
Further, the technical solution in the embodiment of the present application is provided with special for central processing unit and graphics process
The heat spreader structures of device, the size of both heat spreader structures are adapted with mainboard and graphics processor respectively, on the one hand can be with
Radiator material is effectively saved, on the other hand can guarantee radiating efficiency to greatest extent, meanwhile, user can also be as needed
And it voluntarily selects to be arranged or be not provided with.It further increases it can be seen that the technical solution in the embodiment of the present application also has to being
The radiating efficiency of system saves application cost and guarantees the technical effect of heat dissipation performance.
Detailed description of the invention
Fig. 1 is a kind of structure chart of radiator provided in an embodiment of the present invention；
Fig. 2 is the structure chart of the first radiator and the second radiator provided in an embodiment of the present invention；
Fig. 3 is a kind of structure chart of erect type system frame provided in an embodiment of the present invention；
Fig. 4 is a kind of structure chart of processing equipment provided in an embodiment of the present invention.
Specific embodiment
The application provides a kind of radiator, erect type system frame, processing equipment and electronic equipment, existing to solve
In technology there is erect type column electronic equipment the more single fixation of heat spreader structures, can not be according to the configuration of system equipment
The technical issues of doing corresponding adjustment.
Technical solution in the embodiment of the present application is in order to solve the above technical problems, general thought is as follows:
At least two radiators can be vertically arranged by the technical solution in the embodiment of the present application by dismountable mode
In an erect type system frame, it is possible thereby to which the heat spreader structures for solving erect type column electronic equipment are applicable in the portion of heat dissipation
The more fixed technical problem of part, realization can selectively provide at least two heating devices heat dissipation, therefore have and improve directly
The technical effect of the applicability of the radiator of vertical type column electronic equipment.
Technical scheme is described in detail below by attached drawing and specific embodiment, it should be understood that the application
Specific features in embodiment and embodiment are the detailed description to technical scheme, rather than to present techniques
The restriction of scheme, in the absence of conflict, the technical characteristic in the embodiment of the present application and embodiment can be combined with each other.
The terms "and/or", only a kind of incidence relation for describing affiliated partner, indicates that there may be three kinds of passes
System, for example, A and/or B, can indicate: individualism A exists simultaneously A and B, these three situations of individualism B.In addition, herein
Middle character "/" typicallys represent the relationship that forward-backward correlation object is a kind of "or".
Embodiment one
Fig. 1, Fig. 2 are please referred to, the embodiment of the present application one provides a kind of radiator, comprising:
First radiator 101 radiates for the first heating device to electronic equipment, and first radiator can
It is removably vertically arranged in the erect type system frame of the electronic equipment.
Second radiator 102 radiates for the second heating device to the electronic equipment, second radiator
It can removably be vertically arranged in the erect type system frame；Wherein, it is additionally provided in the erect type system frame
The system board of the electronic equipment.
The erect type system frame can be the bracket of diversified forms, for example, bottom surface is circular cylindrical stent, bottom
Face is the four sides body support frame of triangle or bottom surface is polygon column holder of polygon, etc..Certainly, the erect type system branch
Frame may be without side structure, and being provided with can be by the fixed bracket as one side of radiator.As long as it can be seen that energy
The bracket that vertical type is placed all can serve as the erect type system frame.
In practical operation, first radiator is for radiating to the first heating device of electronic equipment, also
It is to say, first radiator can be to being installed in the erect type system frame and the first heating device corresponding position
Heating device radiates.Similarly, second radiator can be for being installed in the erect type system frame and described the
The heating device of two heating device corresponding positions radiates.
When different heating devices is installed on the first heating device corresponding position by user or is sent out with described second
When thermal device corresponding position, first radiator or second radiator can carry out scattered for the heating device of corresponding position
Heat.
It should be pointed out that since first radiator and second radiator are removably to be vertically arranged at
In the erect type system frame, therefore it can make the radiator that can be set as needed or be not provided with described first and dissipate
Hot device, second radiator, and also may make and first radiator, described is installed in institute's erect type system frame
Second radiator, first heating device, second heating device and system board constitute the whole of the electronic equipment
After a system and device, overall appearance structure forms an erect type system equipment.
As it can be seen that the technical solution in the embodiment of the present application can be vertical by dismountable mode by least two radiators
It is arranged in an erect type system frame, it is possible thereby to which the heat spreader structures for solving erect type column electronic equipment are applicable in heat dissipation
The more fixed technical problem of component, realization can selectively provide at least two heating devices heat dissipation, therefore have and mention
The technical effect of the applicability of the radiator of high erect type column electronic equipment.
Optionally, after first radiator and second radiator are arranged in the erect type system frame,
First radiator, second radiator and the erect type system frame constitute one of column type equipment combination
Point.
That is, when the radiator, system board, Yi Jiqi will be installed in the erect type system frame
After its external equipment constitutes the whole system device of the electronic equipment, overall appearance structure forms a column structure and sets
It is standby.The bottom surface of the column structure equipment can be circle, triangle, polygon, etc., in the actual operation process can root
The self-setting according to needs, due to the equipment of column structure not only can be stable be set to ground, inner space relative to
The open ended number of devices of other shapes structure is more, and its space accounting in the horizontal direction is smaller, is more suitable for user
Space mounting arrangement.Simultaneously as the upper bottom surface of column structure may be arranged as level, therefore can place above it
Other external equipments.
As it can be seen that the technical solution in the embodiment of the present application can also set first radiator and second radiator
It sets in the erect type system frame, constitutes a part that a column type equipment combines with other external equipments, have and improve system
The space degree of system device structure and the technical effect of space applicability.
Optionally, first radiator and second radiator constitute one in the side of the column type equipment combination
Part.
One in the side of the column type equipment combination is constituted due to first radiator and second radiator
Point, therefore the use material of the erect type system frame can be reduced, so that the space layout of finally formed system electronics
It is more loose, the fault that internal electronic element is closer and causes is placed, piece electrical performance is improved.Therefore the application
Technical solution in embodiment also has the space layout reasonability for improving electronic equipment, reduces the skill of the failure rate of system equipment
Art effect.
Optionally first radiator includes at least one first cooling fin 1011, at least one described first cooling fin
Each of the first cooling fin height it is different, form air duct between adjacent first cooling fin；
Second radiator includes at least one second cooling fin 1021, every at least one described second cooling fin
The height of a second cooling fin is different, forms air duct between adjacent second cooling fin.
As shown in Figure 1 and Figure 2, the first cooling fin in the first radiator in the embodiment of the present application, which can according to need, sets
It is set to one or more, the height of each first cooling fin, which can according to need, is set as different, to be suitable for corresponding
Heater element, and can be to be parallel to each other between multiple first cooling fins, so that forming heat dissipation channel facilitates air circulation, add
Fast radiation processes.Certainly, in the actual operation process, the surface of the multiple first cooling fin can be a flat surface, can also be with
As long as may be implemented to form air duct between per two adjacent the first cooling fins air is circulated for a curved surface.
And the second cooling fin in second radiator and the first cooling fin set-up mode in first radiator are similarly.
As it can be seen that the technical solution in the embodiment of the present application, which is also possible that be formed between multiple cooling fins, can accelerate to radiate
Air duct, therefore also have improve radiating efficiency technical effect.
Optionally, the first cooling fin of each of at least one described first cooling fin and each corresponding second cooling fin
Height it is consistent so that after first radiator and second radiator are arranged in the erect type system frame,
Air duct is formed between adjacent first cooling fin and second cooling fin.
As shown, due to the height of the first cooling fin of each of the embodiment of the present application and corresponding second cooling fin
Unanimously, therefore can be by the way of relative tilt setting, the shape between first cooling fin and corresponding second cooling fin
Technical solution at continuous air duct, therefore in the embodiment of the present application also has the technical effect for further increasing radiating efficiency.
Optionally, first radiator, radiates for the central processing unit to the electronic equipment, and described
The size of one radiator is adapted to the motherboard size of the electronic equipment；
Second radiator, radiates for the graphics processor to the electronic equipment, and second heat dissipation
The size of device is adapted to the video card size of the electronic equipment.
In the actual operation process, since central processing unit and graphics processor are during the work time relative to other electronics
Calorific value is bigger for element, therefore can carry out radiating treatment to it by the way that setting is heat radiator dedicated.
That is, the technical solution in the embodiment of the present application be provided with it is special for central processing unit and graphics process
The heat spreader structures of device, the size of both heat spreader structures are adapted with mainboard and graphics processor respectively, on the one hand can be with
Radiator material is effectively saved, on the other hand can guarantee radiating efficiency to greatest extent, meanwhile, user can also be as needed
And it voluntarily selects to be arranged or be not provided with.It further increases it can be seen that the technical solution in the embodiment of the present application also has to being
The radiating efficiency of system saves application cost and guarantees the technical effect of heat dissipation performance.
Embodiment two
Referring to FIG. 3, the embodiment of the present application two provides a kind of erect type system frame, the erect type system frame is bottom
Side is round or polygon columnar structures, and the system frame includes:
First radiator support chip 201 is connect, to hold with the bottom edge in the first side of the erect type system frame
Carry first radiator；
Second radiator support chip 202 is connect, to hold with the bottom edge in the second side of the erect type system frame
Carry second radiator.
Optionally, the first radiator support chip 201 further includes the first putting hole 2011, to place the first fever
Device；
The second radiator support chip further includes the second putting hole 2021, to place the second heater.
Optionally, it is additionally provided with the first mounting hole on the first radiator support chip, to use the side PAD Thermal
First heater is installed on the first radiator support chip by formula；
The second mounting hole 2022 is additionally provided on the second radiator support chip, to use Thermal PAD mode
Second heater is installed on the second radiator support chip.
Optionally, the system frame further include:
Third support chip is connect, to carry the electricity with the bottom edge on the third side of the erect type system frame
Other hardware devices of sub- equipment.
Various change mode in radiator and specific example in 1 embodiment of earlier figures are equally applicable to the present embodiment
Erect type system frame, by the aforementioned detailed description to radiator, those skilled in the art are clear that this
The implementation method of erect type system frame in embodiment, so this will not be detailed here in order to illustrate the succinct of book.
Embodiment three
Referring to FIG. 4, the embodiment of the present application three provides a kind of processing equipment, comprising:
The erect type system frame；
Mainboard is arranged in the erect type system frame；
The radiator is arranged in the erect type system frame.
Earlier figures 1, the radiator in Fig. 3 embodiment and the various change mode in erect type system frame and specific reality
Example is equally applicable to the processing equipment of the present embodiment, passes through the aforementioned description to radiator and erect type system frame, ability
Field technique personnel are clear that the implementation method of processing equipment in the present embodiment, so in order to illustrate the succinct of book,
This is no longer described in detail.
Example IV
The embodiment of the present application four provides a kind of electronic equipment, including the processing equipment and projection device, the processing are set
It is standby to include:
First transmission module；
First connector is connect to establish the first signal with the second connector in the projection device；
Processor, the processor are set on the mainboard, to connect by first signal, obtain the throwing
The second identifier information of the second transmission module in shadow equipment, and first identifier information and institute based on first transmission module
Second identifier information is stated, second signal is established with the projection device and connect.
Specifically, processing implement body can be general central processing unit (CPU), can be application-specific integrated circuit
(English: Application Specific Integrated Circuit, referred to as: ASIC), it can be one or more and be used for
Control the integrated circuit that program executes.
Further, the electronic equipment can also include memory, and the quantity of memory can be one or more.It deposits
Reservoir may include read-only memory (English: Read Only Memory, referred to as: ROM), random access memory (English:
Random Access Memory, referred to as: RAM) and magnetic disk storage.
Optionally, first transmission module will be in first electronic equipment to be connected by the second signal
Video signal transmission to the second electronic equipment.
Optionally, the processor, the second identifier information to be written in first transmission module, from described
Identification information is read in first transmission module, and using the identification information read as the second identifier information, based on described
First identifier information and the second identifier information establish the second signal connection.
Optionally, first connector, also to pass through first signal after establishing the first signal connection
Connection transmission current signal.
Optionally, first transmission module and second transmission module are WirelessHD WIHD transmission module.
Optionally, the projection device is specially to be in the predetermined position above the processing equipment.
That is, the processing equipment can be used as the system processing unit of a set of computer system, the projection device can
It cooperates as display unit corresponding with the computer system.
Earlier figures 1, the radiator in Fig. 2 embodiment and the various change mode in erect type system frame and specific reality
Example is equally applicable to the electronic equipment of the present embodiment, passes through the aforementioned description to radiator and erect type system frame, ability
Field technique personnel are clear that the implementation method of electronic equipment in the present embodiment, so in order to illustrate the succinct of book,
This is no longer described in detail.
It can be seen that at least two radiators can be passed through dismountable mode by the technical solution in the embodiment of the present application
It is vertically arranged in an erect type system frame, it is possible thereby to which the heat spreader structures for solving erect type column electronic equipment are applicable in
The more fixed technical problem of the component of heat dissipation, realization can selectively provide at least two heating devices heat dissipation, therefore have
It is improved the technical effect of the applicability of the radiator of erect type column electronic equipment.
The embodiment of the present application at least also at least has the following technical effects or advantages:
Further, the technical solution in the embodiment of the present application can also be by first radiator and second heat dissipation
Device is arranged in the erect type system frame, constitutes a part that a column type equipment combines with other external equipments, has and mention
The space degree of high structure of system equipment and the technical effect of space applicability.
Further, since first radiator and second radiator constitute the side of the column type equipment combination
In a part, therefore can reduce the erect type system frame uses material, so that finally formed system electronics
Space layout is looser, places the fault that internal electronic element is closer and causes, and improves piece electrical performance.Cause
Technical solution in this embodiment of the present application also has the space layout reasonability for improving electronic equipment, reduces the event of system equipment
The technical effect of barrier rate.
Further, the technical solution in the embodiment of the present application can based on the second electronic equipment communication request with lose
After the electronic equipment of mistake realizes connection, the function of remotely controlling the electronic equipment of the loss by sending signal of communication realization, by
This can according to need the response for obtaining the electronic equipment of the loss at any time, and there is more convenient electronics for giving the loss for change to set
It is standby, the electronic equipment probability for giving loss for change is further increased, and promote the technical effect of user's impression.
Further, the technical solution in the embodiment of the present application, which is also possible that, forms between multiple cooling fins and can accelerate
The air duct of heat dissipation, therefore also there is the technical effect for improving radiating efficiency.
Further, due to the height of the first cooling fin of each of the embodiment of the present application and corresponding second cooling fin
Unanimously, therefore can be by the way of relative tilt setting, the shape between first cooling fin and corresponding second cooling fin
Technical solution at continuous air duct, therefore in the embodiment of the present application also has the technical effect for further increasing radiating efficiency.
Further, the technical solution in the embodiment of the present application is provided with special for central processing unit and graphics process
The heat spreader structures of device, the size of both heat spreader structures are adapted with mainboard and graphics processor respectively, on the one hand can be with
Radiator material is effectively saved, on the other hand can guarantee radiating efficiency to greatest extent, meanwhile, user can also be as needed
And it voluntarily selects to be arranged or be not provided with.It further increases it can be seen that the technical solution in the embodiment of the present application also has to being
The radiating efficiency of system saves application cost and guarantees the technical effect of heat dissipation performance.
Although the preferred embodiment of the application has been described, it is created once a person skilled in the art knows basic
Property concept, then additional changes and modifications may be made to these embodiments.So it includes excellent that the following claims are intended to be interpreted as
It selects embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (16)
1. a kind of radiator, comprising:
First radiator radiates for the first heating device to electronic equipment, and the size of first radiator is suitable
The motherboard size of electronic equipment described in Ying Yu, first radiator can removably be vertically arranged in the electronic equipment
In erect type system frame；
Second radiator radiates for the second heating device to the electronic equipment, and the ruler of second radiator
The very little video card size for being adapted to the electronic equipment, second radiator can removably be vertically arranged in the erect type
In system frame；Wherein, the system board of the electronic equipment is additionally provided in the erect type system frame；
The erect type system frame other than there is radiator support chip to carry the first radiator and the second radiator,
Also there is third support chip, to carry other hardware devices of the electronic equipment.
2. radiator as described in claim 1, which is characterized in that when first radiator and second radiator are set
After setting in the erect type system frame, first radiator, second radiator and the erect type system branch
Frame constitutes a part of column type equipment combination.
3. radiator as claimed in claim 2, which is characterized in that first radiator and second radiator are constituted
A part in the side of the column type equipment combination.
4. radiator as described in claim 1, which is characterized in that
First radiator includes at least one first cooling fin, and each of at least one described first cooling fin first dissipates
The height of backing is different, forms air duct between adjacent first cooling fin；
Second radiator includes at least one second cooling fin, and each of at least one described second cooling fin second dissipates
The height of backing is different, forms air duct between adjacent second cooling fin.
5. radiator as claimed in claim 4, which is characterized in that each of at least one described first cooling fin first
Cooling fin is consistent with the height of each corresponding second cooling fin, so that when first radiator and second radiator are set
After setting in the erect type system frame, wind is formed between adjacent first cooling fin and second cooling fin
Road.
6. radiator as claimed in claim 5, which is characterized in that
First radiator, radiates for the central processing unit to the electronic equipment, and first radiator
Size is adapted to the motherboard size of the electronic equipment；
Second radiator, radiates for the graphics processor to the electronic equipment, and second radiator
Size is adapted to the video card size of the electronic equipment.
7. a kind of erect type system frame, the erect type system frame is that bottom edge is round or polygon columnar structures, institute
Stating system frame includes:
First radiator support chip is connect with the bottom edge in the first side of the erect type system frame, to carry such as power
Benefit requires the first radiator described in 1-6 any claim；
Second radiator support chip is connect with the bottom edge in the second side of the erect type system frame, to carry such as power
Benefit requires the second radiator described in 1-6 any claim；
Third support chip is connect with the bottom edge on the third side of the erect type system frame, is set to carry the electronics
Standby other hardware devices.
8. erect type system frame as claimed in claim 7, which is characterized in that the first radiator support chip further includes
One putting hole, to place the first heater；
The second radiator support chip further includes the second putting hole, to place the second heater.
9. erect type system frame as claimed in claim 8, which is characterized in that also set up on the first radiator support chip
There is the first mounting hole, is supported first heater is installed on first radiator using Thermal PAD mode
On piece；
Be additionally provided with the second mounting hole on the second radiator support chip, to using Thermal PAD mode by described the
Two heaters are installed on the second radiator support chip.
10. a kind of processing equipment, comprising:
Erect type system frame as described in claim 7-8 any claim；
Mainboard is arranged in the erect type system frame；
Radiator as described in claim 1-6 any claim is arranged in the erect type system frame.
11. a kind of first electronic equipment, including processing equipment as claimed in claim 10 and projection device, the processing equipment
Include:
First transmission module；
First connector is connect to establish the first signal with the second connector in the projection device；
Processor, the processor are set on the mainboard, to be connected by first signal, are obtained the projection and are set
The second identifier information of the second transmission module in standby, and the first identifier information based on first transmission module and described the
Two identification informations are established second signal with the projection device and are connect.
12. the first electronic equipment as claimed in claim 11, which is characterized in that first transmission module, to pass through
Second signal connection is stated, by the video signal transmission in first electronic equipment to the second electronic equipment.
13. the first electronic equipment as claimed in claim 11, which is characterized in that the processor, described second to be marked
Know information to be written in first transmission module, identification information, and the mark that will be read are read from first transmission module
Information is known as the second identifier information, is based on the first identifier information and the second identifier information, establishes described the
Binary signal connection.
14. the first electronic equipment as described in claim 12-13 is any, which is characterized in that first connector, also to
After establishing the first signal connection, transmission current signal is connected by first signal.
15. the first electronic equipment as claimed in claim 14, which is characterized in that first transmission module and described second passes
Defeated module is WirelessHD WIHD transmission module.
16. the first electronic equipment as claimed in claim 15, which is characterized in that the projection device is specially to be in the place
Manage the predetermined position above equipment.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610326864.1A CN105916353B (en) | 2016-05-17 | 2016-05-17 | A kind of radiator, erect type system frame, processing equipment and electronic equipment |
| US15/586,544 US10455202B2 (en) | 2016-05-13 | 2017-05-04 | Heat dissipating apparatus and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610326864.1A CN105916353B (en) | 2016-05-17 | 2016-05-17 | A kind of radiator, erect type system frame, processing equipment and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN105916353A CN105916353A (en) | 2016-08-31 |
| CN105916353B true CN105916353B (en) | 2019-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610326864.1A Active CN105916353B (en) | 2016-05-13 | 2016-05-17 | A kind of radiator, erect type system frame, processing equipment and electronic equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1550953A (en) * | 2003-05-13 | 2004-12-01 | 扎尔曼技术株式会社 | Computer |
| TWI274980B (en) * | 2005-03-04 | 2007-03-01 | First Int Computer Inc | Computer host structure |
| CN201229538Y (en) * | 2008-07-04 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Computer machine box |
| CN102238845A (en) * | 2010-04-23 | 2011-11-09 | 昊翔电能运动科技(昆山)有限公司 | Radiating device and speed regulator with same |
| CN102968163A (en) * | 2012-12-13 | 2013-03-13 | 天津华锐源科技有限公司 | Computer case |
| CN104238693A (en) * | 2013-06-07 | 2014-12-24 | 苹果公司 | Computer thermal system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100463338C (en) * | 2006-09-15 | 2009-02-18 | 哈尔滨九洲电气股份有限公司 | High-voltage frequency changing standard transducing power unit |
| JPWO2008114381A1 (en) * | 2007-03-19 | 2010-07-01 | 富士通株式会社 | Heat sink, electronic device, and method of manufacturing electronic device |
-
2016
- 2016-05-17 CN CN201610326864.1A patent/CN105916353B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1550953A (en) * | 2003-05-13 | 2004-12-01 | 扎尔曼技术株式会社 | Computer |
| TWI274980B (en) * | 2005-03-04 | 2007-03-01 | First Int Computer Inc | Computer host structure |
| CN201229538Y (en) * | 2008-07-04 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Computer machine box |
| CN102238845A (en) * | 2010-04-23 | 2011-11-09 | 昊翔电能运动科技(昆山)有限公司 | Radiating device and speed regulator with same |
| CN102968163A (en) * | 2012-12-13 | 2013-03-13 | 天津华锐源科技有限公司 | Computer case |
| CN104238693A (en) * | 2013-06-07 | 2014-12-24 | 苹果公司 | Computer thermal system |
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| CN105916353A (en) | 2016-08-31 |
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