CN201274630Y

CN201274630Y - Heat radiation device

Info

Publication number: CN201274630Y
Application number: CNU2008201371776U
Authority: CN
Inventors: 邱黄正宪; 林柏廷
Original assignee: Armorlink SH Corp; IEI Integration Corp
Current assignee: Armorlink SH Corp; IEI Integration Corp
Priority date: 2008-10-13
Filing date: 2008-10-13
Publication date: 2009-07-15
Anticipated expiration: 2018-10-13

Abstract

The utility model relates to a heat radiation device, which is used for radiating the heat of a printed circuit board that is provided with at least one heating element and a memory, and comprises first heat radiation elements, a projection part and a first opening. The first heat radiation elements are identical to the size of the printed circuit board and are arranged on the printed circuit board at intervals; the projection part is arranged at the lower side of the first heat radiation elements and corresponds to the heating element so as to be adhered against the heating element and to guide the heat; the first opening is arranged on the first heat radiation elements and corresponds to the memory, and the first opening is used for the air stream to pass and for leading out the heat of the memory. For the heat radiation device is provided with the opening corresponding to the memory of the printed circuit board, and the air stream is accelerated by a fan to pass through the opening, the heat of the memory can be rapidly brought away, thereby greatly improving the heat radiation efficiency of the memory.

Description

Heat abstractor

Technical field

The utility model relates to a kind of heat abstractor, and is particularly a kind of about fin is offered the heat abstractor of opening corresponding to the position of memory, and then promotes the radiating efficiency of memory.

Background technology

Modular computing (Computer On Modules) design provides central processing unit, peripheral element control chip, memory, storage device and application specific functionality circuit etc. in a undersized printed circuit board (PCB), client only need be used the mainboard of same size, just can utilize this modular computing design to come the development and Design of expedite product.

And the central processing unit in the modular computing, peripheral element control chip and memory all can produce heat when moving in system, and because the size of modular computing is less, can't be as in the computer, install heat abstractor respectively at processor and control chip, therefore traditional method is the identical fin of design one size on the printed circuit board (PCB) of modular computing, so that the heat radiation of central processing unit and peripheral element control chip to be provided.

Though yet the design of this fin can provide the heat radiation of central processing unit and peripheral cell control chip, but make the memory in the modular computing be in comparatively narrow space, and then can't take away heat by more air-flow, and reduced the memory radiating efficiency in the heat that system's runtime storage is produced.

The heat abstractor that main purpose of the present utility model is to provide memory location in a kind of corresponding printed circuit board (PCB) to offer opening is to address the above problem.

Summary of the invention

The purpose of this utility model is to provide a kind of heat abstractor, and its utilization is offered opening corresponding to the position of memory in printed circuit board (PCB), and then entering of air-flow is provided and improves the memory radiating efficiency.

According to a preferred embodiment, heat abstractor of the present utility model can make a printed circuit board radiating that is provided with at least one heater element and a memory, includes first heat dissipation element, protuberance and first opening.A first heat dissipation element and at interval distance and be fixed in above-mentioned printed circuit board (PCB) on identical with above-mentioned printed circuit board (PCB) size; Protuberance is arranged at the downside of this first heat dissipation element and heat is derived in order to fit in above-mentioned heater element in the position of corresponding above-mentioned heater element; First opening is opened in this first heat dissipation element and the position of corresponding above-mentioned memory, with derive the heat of above-mentioned memory so that air communication is crossed.

Heat abstractor of the present utility model can also include second heat dissipation element, second opening, a plurality of radiating fin and fan.Second heat dissipation element is identical with this first heat dissipation element size, in order to fit and to be bonded to this first heat dissipation element top; Second opening is opened in this second heat dissipation element, and is identical corresponding to the position and the size of this first opening; A plurality of radiating fins are arranged on this second heat dissipation element, and arrange formation one holding area near this second opening; Fan is arranged at this holding area, in order to deriving the heat of described a plurality of radiating fins, and makes air-flow derive the heat of above-mentioned memory via described a plurality of radiating fins by this second opening.

Useful technique effect of the present utility model is, because the opening that heat abstractor utilization of the present utility model is offered corresponding to the position of memory in the printed circuit board (PCB), and quicken air communication by fan and cross opening, therefore can take away the heat of memory rapidly, and promote the memory radiating efficiency significantly.

Can be further understood by following embodiment detailed description and accompanying drawing about advantage of the present utility model and spirit.

Description of drawings

Fig. 1 is the end view according to the heat abstractor of an embodiment of the present utility model;

Fig. 2 is the elevational schematic view of first heat dissipation element of heat abstractor among Fig. 1; And

Fig. 3 is the schematic top plan view of second heat dissipation element of heat abstractor among Fig. 1.

Wherein, description of reference numerals is as follows:

10 printed circuit board (PCB)s, 11 heater elements

21 first heat dissipation elements, 22 protuberances

23 first openings, 31 second heat dissipation elements

32 second openings, 33 radiating fins

34 fans, 40 retaining elements

Embodiment

An embodiment of the present utility model sees also Fig. 1 to Fig. 3, and Fig. 1 is the end view according to the heat abstractor of an embodiment of the present utility model; Fig. 2 is the elevational schematic view of first heat dissipation element of heat abstractor among Fig. 1; And Fig. 3 is the schematic top plan view of second heat dissipation element of heat abstractor among Fig. 1.

As shown in Figure 1 to Figure 3, heat abstractor of the present utility model can be with so that one have printed circuit board (PCB) 10 heat radiation of a plurality of heater elements 11 and a memory (not shown), heater element 11 can be the control chip of central processing unit and peripheral element etc., is installed on abreast on the printed circuit board (PCB) 10 and memory is direction and a printed circuit board (PCB) 10 with level.Wherein, this printed circuit board (PCB) is the printed circuit board (PCB) of a COM (Computer On Modules) Express specification.

As shown in Figure 2, heat abstractor includes first heat dissipation element 21, protuberance 22 and first opening 23.First heat dissipation element 21 is identical with the size of printed circuit board (PCB) 10, and its upside is smooth plane, and is fixed in above the printed circuit board (PCB) 10 by a plurality of retaining elements 40, and with printed circuit board (PCB) 10 distance at interval; Protuberance 22 is arranged at the downside of first heat dissipation element 21, and position corresponding to heater element 11, when first heat dissipation element 21 is fixed in above the printed circuit board (PCB) 10, protuberance 22 can fit in heater element 11, make when system moves, the heat that heater elements such as central processing unit and peripheral element control chip 11 produce can go out thermal conductance via the protuberance 22 and first heat dissipation element 21; First opening 23 is to be opened in first heat dissipation element 21, and corresponding to the position of memory, the heat that is produced with the guiding system runtime storage through first opening 23 by air-flow.

As shown in Figure 3, in order to promote the radiating efficiency of heat abstractor more significantly, heat abstractor of the present utility model can also include second heat dissipation element 31, second opening 32, a plurality of radiating fin 33 and fan 34.Second heat dissipation element 31 is identical with the size of first heat dissipation element 21, and its downside is smooth plane, and applying that can be complete also is locked in first heat dissipation element, 21 tops, by fitting in first heat dissipation element 21 to derive the heat of first heat dissipation element 21; Second opening 32 is to be opened in second heat dissipation element 31, and is identical corresponding to the position and the size of first opening 23, can allow air-flow enter second opening 32 and first opening 23 and derives the heat of memory; Being arranged on second heat dissipation element 31 of a plurality of radiating fin 33 proper alignment, and arrangement forms a holding area near second opening 32, can increase the area that heat abstractor contacts with air, make the heat of second heat dissipation element 31 to derive via air fast; Fan 34 is in order to be arranged in the holding area, when starting fan 34 when system's operation, the air-flow that fan 34 is produced is except the efficient that can increase radiating fin 33 heat conduction, arrangement position that can also be by radiating fin 33, acceleration with the heat of air-flow via second opening 32 derivation memory with first opening 23.

When the system start-up in the printed circuit board (PCB) 10 of present embodiment moves, the heat that heater element 11 on the printed circuit board (PCB) 10 is produced can derive via first heat dissipation element 21 earlier, then second heat dissipation element 31 is derived the heat of first heat dissipation element 21 again, last radiating fin 33 is derived the heat of second heat dissipation element 31, and heat is derived by air with contacting of air by radiating fin 33; And when system start-up moved, the air-flow that the heat that memory produced is then produced by the fan in the heat abstractor 34 was derived the heat of memory fast by second opening 32 and first opening 23.

Compared to prior art, because heat abstractor of the present utility model is to utilize to offer opening corresponding to the position of memory in the printed circuit board (PCB), make air communication cross opening to derive the heat of memory, also by the fan in the heat abstractor, quicken air communication and cross opening, to promote the radiating efficiency of memory significantly.

Pass through the above detailed description of preferred embodiments; wish to know more and describe feature of the present utility model with spiritual; yet it is not in order to limit the utility model; any person skilled in the art is not in breaking away from spirit and scope of the present utility model; therefore can be used for a variety of modifications and variations, protection range of the present utility model is as the criterion when looking the scope that appending claims defines.

Claims

1. heat abstractor with so that one be provided with the printed circuit board radiating of at least one heater element and a memory, is characterized in that, comprises:

One first heat dissipation element, an and at interval distance and be fixed in above-mentioned printed circuit board (PCB) on identical with above-mentioned printed circuit board (PCB) size;

One protuberance is arranged at the downside of this first heat dissipation element and heat is derived to fit in above-mentioned heater element in the position of corresponding above-mentioned heater element; And

One first opening is opened in this first heat dissipation element and the position of corresponding above-mentioned memory, air communication is crossed and is derived the heat of above-mentioned memory.

2. heat abstractor as claimed in claim 1 is characterized in that, this heat abstractor also comprises:

One second heat dissipation element, identical with this first heat dissipation element size, and fit and be bonded to this first heat dissipation element top;

One second opening is opened in this second heat dissipation element, and is identical corresponding to the position and the size of this first opening;

A plurality of radiating fins are arranged on this second heat dissipation element, and arrange formation one holding area near this second opening; And

One fan is arranged at this holding area, deriving the heat of described a plurality of radiating fins, and makes air-flow derive the heat of above-mentioned memory via described a plurality of radiating fins by this second opening.

3. heat abstractor as claimed in claim 1 or 2 is characterized in that, this printed circuit board (PCB) is the printed circuit board (PCB) of a COM Express specification.