CN202049432U - Flow guide structure and radiator thereof - Google Patents

Flow guide structure and radiator thereof Download PDF

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Publication number
CN202049432U
CN202049432U CN201020672505XU CN201020672505U CN202049432U CN 202049432 U CN202049432 U CN 202049432U CN 201020672505X U CN201020672505X U CN 201020672505XU CN 201020672505 U CN201020672505 U CN 201020672505U CN 202049432 U CN202049432 U CN 202049432U
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China
Prior art keywords
flow
water conservancy
conservancy diversion
group
heating radiator
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Expired - Fee Related
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CN201020672505XU
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Chinese (zh)
Inventor
吴府融
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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Priority to CN201020672505XU priority Critical patent/CN202049432U/en
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Publication of CN202049432U publication Critical patent/CN202049432U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a flow guide structure, which comprises a rack body, wherein the rack body comprises a hollow frame, at least one first flow channel and at least one flow guide group are arranged in the hollow frame, the flow guide group consists of a plurality of flow guide pieces which are mutually arranged at intervals, and at least one second flow channel is formed between the flow guide pieces, so when airflow is generated by a cooling fan and is blown to a cooling fin group and a circuit board, the airflow is guided to other areas with high heat sources through the flow guide pieces of the flow guide group so as to reduce the temperatures of electronic components with higher heat sources in the areas.

Description

Flow-guiding structure and heating radiator thereof
Technical field
The utility model relates to a kind of flow-guiding structure, refers to a kind of may command air flow direction especially, and with the air-flow high and higher electronic package of thermal source that leads simultaneously, in order to flow-guiding structure and the heating radiator thereof that reduces described electronic package temperature.
Background technology
In recent years, along with advancing by leaps and bounds of electronic information science and technology, make the use of electronic product (as computing machine, mobile computer) popularize day by day and use more extensive, and in electronic product, with the computing machine is example, because of the trend development that calculation process speed significantly promotes and access capability increases of the central processing unit of computing machine, make the heating power of central processing unit also along with constantly soaring.
So need be auxiliary increasing radiating efficiency by radiating module, aforementioned electronic assembly Yin Wendu is too high to cause that to carry out usefulness bad to avoid, serious even damage; And radiating module of the prior art, see also shown in Figure 1, by radiating fin 13, fan 12 is formed with supporting structure 10, described supporting structure mainly has a support body 11, described support body 11 upper ends have an end face 111, its end face 111 can be provided with for described radiator fan 12, described support body 11 lower ends then have one be covered with portion 112 can be in order to be installed with radiating fin 13 or frame group on a side of described radiating fin 13, the opposite side of described radiating fin 13 then is covered with the pyrotoxin (central processing unit) of a motherboard 14, so heat energy that pyrotoxin produced that its radiating fin 13 absorbs on its motherboard 14, dispel the heat with motherboard 14 by the radiator fan 12 generation air-flows of opposite side and to its radiating fin 13 again, but because described supporting structure only provides fan combination on radiating fin, there is no the design of water conservancy diversion, so the air-flow that described radiator fan 12 is produced only dispels the heat to the radiating fin 13 of below, and fail the electronic package 141 of all the other each zone heatings on the motherboard 14 is also dispelled the heat simultaneously, and then also influence the operational effect of motherboard 14.
The above, supporting structure of the prior art has following shortcoming:
1. the air-flow that can't utilize radiator fan to produce fully;
2. electronic package can't efficiently radiates heat;
3. influence king's machine plate operational effect.
Therefore, how to solve the problem and the disappearance of above-mentioned common technology, be the direction place that improvement is badly in need of studying in creator of the present utility model and the relevant manufacturer that is engaged in the industry.
The utility model content
Therefore, in order effectively to address the above problem, fundamental purpose of the present utility model provides a kind of flow-guiding structure and heating radiator thereof of may command air flow direction.
Secondary objective of the present utility model provides the higher electronic package of a kind of thermal source that air-flow can be led simultaneously to reduce the heating radiator flow-guiding structure and the heating radiator thereof of described electronic package temperature.
For reaching above-mentioned purpose, the utility model is a kind of flow-guiding structure, comprise: a support body, described support body includes a hollow framework, be provided with at least one first flow and at least one water conservancy diversion group in the described hollow framework, described first flow and described water conservancy diversion group do not overlap, and described water conservancy diversion group has a plurality of flow deflectors, arrange the described flow deflector space of waiting, and between flow deflector, be formed with at least one second runner, make the flow deflector of its water conservancy diversion group can control air-flow and be directed to the high zone of other thermal source, to reduce the temperature of the higher electronic package of described regional thermal source.
For reaching above-mentioned purpose, the utility model is a kind of heating radiator, comprise: a radiator fan, a support body and a radiating fin group, described radiator fan is arranged at a side of described support body, described support body opposite side is provided with described radiating fin group, and described support body has a hollow framework, be provided with at least one first flow and at least one water conservancy diversion group in the described hollow framework, described first flow and described water conservancy diversion group do not overlap, and described water conservancy diversion group has a plurality of flow deflectors, arrange the described flow deflector space of waiting, and between flow deflector, be formed with at least one second runner, therefore, be set up in radiator fan on the described support body when it is produced air-flow and blows to radiating fin group and circuit board, can will control the air-flow high zone of other thermal source of leading by the flow deflector of water conservancy diversion group, in order to reduce the higher electronic package temperature of described regional thermal source.
In order to illustrate further the utility model feature and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended diagram only for reference with the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is that the supporting structure of prior art decomposes the enforcement synoptic diagram;
Fig. 2 is the stereographic map of the preferred embodiment of the utility model flow-guiding structure;
Fig. 3 is the three-dimensional exploded view of another preferred embodiment of the utility model flow-guiding structure;
Fig. 4 A is the three-dimensional exploded view of the preferred embodiment of the utility model heating radiator;
Fig. 4 B is the three-dimensional combination figure of the preferred embodiment of the utility model heating radiator;
Fig. 4 C is the cross-sectional schematic of the preferred embodiment of the utility model heating radiator;
Fig. 5 is the decomposing schematic representation of another preferred embodiment of the utility model heating radiator.
Fig. 6 is the three-dimensional combination figure of a preferred embodiment again of the utility model heating radiator;
[primary clustering symbol description]
Support body 20 borders 32
Hollow framework 21 second runners 33
First flow 22 radiator fans 40
Water conservancy diversion group 30 radiating fin groups 50
Housing 301 motherboards 60
Flow deflector 31
Embodiment
Characteristic on above-mentioned purpose of the present utility model and structure thereof and the function will be illustrated according to appended graphic preferred embodiment.
See also shown in Figure 2, stereographic map for the flow-guiding structure of the utility model preferred embodiment, comprise a support body 20, described support body 20 includes a hollow framework 21, be provided with at least one first flow 22 and at least one water conservancy diversion group 30 in the described hollow framework 21, and selecting a water conservancy diversion group 30 in the utility model is embodiment, described water conservancy diversion group 30 is integrally formed in the hollow framework 21, wherein said first flow 22 does not overlap with water conservancy diversion group 30, and described water conservancy diversion group 30 has a plurality of flow deflectors 31 and at least one border 32, describedly wait flow deflector 31 spaces to arrange and connect described border 32, described 31 of the flow deflectors of waiting are formed with a plurality of second runners 33 with 32 positions, border, and correspond to support body 20 and have the angle of inclination.
As shown in Figure 3, three-dimensional exploded view for the flow-guiding structure of another preferred embodiment of the utility model, it is with assembly and the connection relationship of a last embodiment and running is roughly the same does not promptly give unnecessary details identical assembly and element numbers at this, only different being in described water conservancy diversion group 30 with regard to this preferred embodiment has a housing 301, and be connected in the described hollow framework 21 by described housing 301, and the size of its housing 301 meets the size of described hollow framework 21, and the first flow 22 of hollow framework 21 is formed in the described housing 301, and 33 of second runners of its first flow 22 and flow deflector 31 separate out by described border 32.
Please cooperate simultaneously and consult Fig. 4 A, shown in 4B and the 4C, three-dimensional exploded view for the heating radiator of the utility model preferred embodiment, three-dimensional combination figure and cross-sectional schematic, wherein said heating radiator includes a radiator fan 40, a support body 20 and a radiating fin group 50, wherein said radiator fan 40 1 side groups are provided with described support body 20, described support body 20 opposite side groups are provided with on the motherboard 60 that a radiating fin group 50 and has central processing unit, and described support body 20 includes a hollow framework 21, is provided with at least one first flow 22 and at least one water conservancy diversion group 30 in the described hollow framework 21;
Wherein said hollow framework 21 can be one of the forming with described water conservancy diversion group 30, or described water conservancy diversion group 30 adopts discrete group to be connected in the described hollow framework 21 (as Fig. 5, Fig. 6), and is integrally formed as embodiment with its hollow framework 21 with described water conservancy diversion group 30 in present embodiment;
Described first flow 22 does not overlap with water conservancy diversion group 30, and described water conservancy diversion group 30 has a plurality of flow deflectors 31 and at least one border 32, describedly wait flow deflector 31 spaces to arrange and connect described border 32, and 31 of flow deflectors such as described are formed with a plurality of second runners 33 with 32 positions, border, and correspond to support body 20 and have the angle of inclination, and described motherboard 60 is provided with a plurality of electronic packages, and described motherboard 60 heat energy that its each electronic package produces when running varies in size, therefore support body 20 is the allocation position of described electronic package with the corresponding assembling position of motherboard 60, flow deflector 31 correspondences of its water conservancy diversion group 30 are mounted on the electronic package of high heat energy generation (as south, north bridge chips, or other electric capacity, resistor assembly), and the angle of inclination of its flow deflector 31 can be provided with according to the position of the object of waiting to dispel the heat, so that the air-flow that described radiator fan 40 is produced respectively by described water conservancy diversion group 30 with first flow 22 and deliver to radiating fin group 50, and be directed to the higher zone of thermal source simultaneously by the second runner 33 control air-flows of its flow deflector 31, with the temperature of effective its described regional electronic package of reduction.
In sum, the utility model is a kind of balanced structure of annular axial flow fan, and it has following advantage:
1. the high electronic package of thermal source can lead thermal source;
2. effectively reduce the electronic package temperature;
3. the air-flow that effectively utilizes radiator fan to produce;
4. keep the motherboard operational effect.
The above only is preferable feasible embodiment of the present utility model, and all variations that utilizes the above-mentioned method of the utility model, shape, structure, device to do all should be contained in the interest field of the present utility model.

Claims (13)

1. a flow-guiding structure is characterized in that, includes:
A support body, comprise a hollow framework, be provided with at least one first flow and at least one water conservancy diversion group in the described hollow framework, described first flow and described water conservancy diversion group do not overlap, and described water conservancy diversion group is made of a plurality of flow deflector, the described flow deflector that waits is spaced, and a plurality of second runner is respectively formed between the described flow deflector.
2. heating radiator flow-guiding structure as claimed in claim 1 is characterized in that, described water conservancy diversion group also has at least one border, and described flow deflector is provided with along described border.
3. heating radiator flow-guiding structure as claimed in claim 2 is characterized in that described flow deflector connects described border, and forms described a plurality of second runner.
4. heating radiator flow-guiding structure as claimed in claim 1 is characterized in that, described water conservancy diversion group is integrally formed in the hollow framework.
5. heating radiator flow-guiding structure as claimed in claim 1 is characterized in that, described water conservancy diversion group also has a housing, and is connected in the hollow framework by housing.
6. heating radiator flow-guiding structure as claimed in claim 1 is characterized in that, described support body one side group is provided with a radiator fan, and opposite side is combined with a radiating fin group.
7. heating radiator flow-guiding structure as claimed in claim 1 is characterized in that, described flow deflector corresponds to support body and has the angle of inclination.
8. a heating radiator is characterised in that, comprises:
A radiator fan;
A support body, be located at described radiator fan one side, include and be provided with at least one first flow and at least one water conservancy diversion group in the hollow framework, described first flow and described water conservancy diversion group do not overlap, and described water conservancy diversion group has a plurality of flow deflectors, the described flow deflector that waits is spaced, and a plurality of second runner is respectively formed between the described flow deflector; And a radiating fin group, be located at support body and correspond to the radiator fan opposite side.
9. heating radiator as claimed in claim 8 is characterized in that, described water conservancy diversion group also has at least one border, and described flow deflector is provided with along described border.
10. heating radiator as claimed in claim 9 is characterized in that described flow deflector connects described border, and forms described a plurality of second runner.
11. heating radiator as claimed in claim 8 is characterized in that, described water conservancy diversion group is integrally formed in the hollow framework.
12., it is characterized in that described water conservancy diversion group also has a housing as claim 8 a described heating radiator, and be connected in the hollow framework by housing.
13. heating radiator as claimed in claim 8 is characterized in that, described flow deflector corresponds to support body and has the angle of inclination.
CN201020672505XU 2010-12-15 2010-12-15 Flow guide structure and radiator thereof Expired - Fee Related CN202049432U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020672505XU CN202049432U (en) 2010-12-15 2010-12-15 Flow guide structure and radiator thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020672505XU CN202049432U (en) 2010-12-15 2010-12-15 Flow guide structure and radiator thereof

Publications (1)

Publication Number Publication Date
CN202049432U true CN202049432U (en) 2011-11-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020672505XU Expired - Fee Related CN202049432U (en) 2010-12-15 2010-12-15 Flow guide structure and radiator thereof

Country Status (1)

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CN (1) CN202049432U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103260380A (en) * 2012-02-21 2013-08-21 纬创资通股份有限公司 Heat dissipation mechanism suitable for electronic device and electronic device thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103260380A (en) * 2012-02-21 2013-08-21 纬创资通股份有限公司 Heat dissipation mechanism suitable for electronic device and electronic device thereof
CN103260380B (en) * 2012-02-21 2015-09-09 纬创资通股份有限公司 Heat dissipation mechanism suitable for electronic device and electronic device thereof

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111123

Termination date: 20171215