CN105908230A - Sn-plated material for electronic component - Google Patents
Sn-plated material for electronic component Download PDFInfo
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- CN105908230A CN105908230A CN201610101971.4A CN201610101971A CN105908230A CN 105908230 A CN105908230 A CN 105908230A CN 201610101971 A CN201610101971 A CN 201610101971A CN 105908230 A CN105908230 A CN 105908230A
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- Prior art keywords
- coating
- layer
- plated material
- alloy
- copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Abstract
The invention aims to provide a Sn-plated material used for preparing a conductive spring for connectors and terminals, wherein the generation of Sn powders is inhibited and the Sn-plated material is good in surface gloss. The Sn-plated material is provided with a Sn plating layer subjected to reflow soldering treatment and formed on the basis material of copper or copper alloy. The Sn-plated material is characterized in that the reflow soldering Sn plating layer is composed of an upper Sn layer and a lower Cu-Sn alloy layer. On the outermost surface of the Sn-plated material, more than one radial Sn solidification structure is arranged within the area of each 35 mm<2>. The surface roughness Ra of the outermost surface of the Sn-plated material is smaller than 0.05 mum in the rolled right-angle direction.
Description
Technical field
The present invention relates to be suitable as electronic component, particularly the electric conductivity spring material of adapter, terminal etc.
Sn-plated material.
Background technology
As the electric conductivity spring material of adapter, terminal etc., use copper or the copper alloy implementing Sn plating
Bar (hereinafter referred to as " Sn-plated material ").Usually, Sn-plated material is manufactured by following operation: even
After continuous plating production line carries out defat and pickling, form Cu substrate coating by galvanoplastic, then pass through electricity
Plating method forms Sn layer, finally implements reflow process, makes Sn layer melt.
When above-mentioned Sn-plated material being carried out punch process to manufacture adapter etc., plate Sn by platen presses
Material, but owing to pressing plate contacts with Sn-plated material surface, create and produce from the Sn coating of Sn-plated material
Sn powder the problem being mixed into stamping machine.
Typically also, at the assembling operation line of adapter etc., it is provided with the inspection for detecting surface defect
Survey device, by irradiating light to terminal surfaces and its reflection light is carried out detection detecting defect.Therefore, for
Detect defect accurately, it is desirable to the lustrous surface of terminal is high, say, that require electric conductivity spring material
Lustrous surface high.
Along with the miniaturization of adapter in recent years, for Sn-plated material, it is strongly required to suppress above-mentioned Sn powder
Generation and good lustrous surface strong.
For the problem of above-mentioned Sn powder, Patent Document 1 discloses following methods: copper alloy bar is being entered
After row substrate plating, Sn plating, control the frequency of the blower fan of reflow process, thus, make Cu-Sn alloy
Layer is exposed to the most surface of Sn-plated material, and making this Cu-Sn alloy-layer area ratio exposed is 0.5～4%, makes
Every 0.033mm2Number be 100～900.
Patent Document 2 discloses following methods: after copper alloy bar carries out substrate plating, Sn plating,
Heated by reflow soldering, air-cooled after, by water-cooled, make in the Sn layer after Reflow Soldering with 50～1000
Individual/μm2Individual number density there is the Cu-Sn alloying pellet that crystal grain diameter is 10～100nm.
Prior art literature
Patent documentation
Patent documentation 1: No. 5389097 publications of Japanese Patent No.
Patent documentation 2: No. 5587935 publications of Japanese Patent No.
Invent problem to be solved
Above-mentioned Sn-plated material effectively, but is insufficient for in recent years in the generation of suppression Sn powder
The requirement that the suppression Sn powder of the miniaturization of adapter produces.Further, in order to carry out surface inspection accurately,
Also require to improve lustrous surface.
Summary of the invention
It is an object of the invention to improve further to suppress Sn powder to produce, obtain good lustrous surface simultaneously.
As known to the present inventor, in the past, do not found that suppression Sn powder produced and can obtain good surface
The invention of gloss.
The present invention completes in view of above-mentioned problem, its object is to provide a kind of as adapter, terminal etc.
Electric conductivity spring material, prevent the generation of Sn powder and there is the Sn-plated material of good lustrous surface.
For solving the scheme of problem
The result that the present inventor studies with keen determination, finds the generation in order to suppress Sn powder, improves Sn-plated material
Surface smoothness is effective.When punch process, it is subject to by Sn layer during pressing plate holding Sn-plated material
To scraping, thus produce Sn powder.Pressing plate is with certain load pressing Sn-plated material, but works as Sn-plated material
When surface roughness is big, as it is shown in figure 1, the area owing to contacting with pressing plate diminishes, pressing plate and Sn-plated material
Contact site unit are on load become big, pressing plate is big relative to the quantitative change of nipping of Sn-plated material.Its knot
Fruit is that the quantitative change that Sn-plated material is scratched is many, and the generation amount of Sn powder also becomes many.
On the contrary, when the surface roughness of Sn-plated material is little, as in figure 2 it is shown, due to the face contacted with pressing plate
Long-pending change is big, and the load in the unit are of the contact site of pressing plate and Sn-plated material diminishes, and pressing plate is relative to plating Sn
The biting amount of material diminishes.As a result of which it is, the quantitative change that Sn-plated material is scratched is few, the generation amount of Sn powder also becomes
Few.And, when the surface roughness of Sn-plated material diminishes, lustrous surface is improved.
In order to reduce the surface roughness of Sn-plated material, need by reflow process, to implementing Sn plating
After the copper alloy bar applied heats, cooling water of spraying out to the surface of Sn-plated material (hereinafter referred to as " mist
Shape water-cooled "), then put into Sn-plated material.
Usually, the cooling means of the plating material after being heated by reflow process is to put into water after the heating
Groove, or after the several seconds is air-cooled, the method putting into tank.In the case of Gai, melt owing to being heated by Reflow Soldering
The Sn melted is solidification at once after putting into tank, therefore, as it is shown on figure 3, the form of the solidified structure of this Sn
In column.Therefore, its section shape such as Fig. 1, surface roughness becomes big.
On the other hand, before the plating material after being heated by reflow process puts into tank, mist is carried out
During shape water-cooled, the water particle owing to spraying out is attached to surface and cools down, therefore, as shown in Figure 4, and this Sn
Solidified structure form radially.Therefore, its section shape such as Fig. 2, surface roughness diminishes.
Like this, after the plating material after being heated by reflow process is carried out vaporific water-cooled, put into
The cooling of tank, makes the Solidification Structures of Sn radially, reduces surface roughness, thus, can suppress
The generation of Sn powder, and good lustrous surface can be obtained.
That is, the present invention includes:
(1) a kind of Sn-plated material, it is characterised in that on the matrix material of copper or copper alloy bar, there is reality
Execute the Sn coating of reflow process, the Reflow Soldering Sn coating Sn layer by upside and the Cu-Sn alloy of downside
Layer is constituted, at the most surface of Sn-plated material, every 35mm2There is more than 1 radial Sn solidified structure,
The surface roughness Ra of the rolling right angle orientation of the most surface of Sn-plated material is below 0.05 μm.
(2) according to the Sn-plated material described in (1), it is characterised in that the Cu-Sn being exposed to most surface closes
The area ratio of layer gold is less than 40%, and the crystal grain of the Cu-Sn alloy-layer exposed described in when surface observation is straight
Footpath is below 3 μm.
(3) according to the Sn-plated material described in (1) or (2), logical on the matrix material of copper or copper alloy bar
Cross Cu substrate coating or Ni substrate coating or the Ni/Cu being laminated by Ni and Cu according to this order
Double base coating covers, and has Reflow Soldering Sn coating on this substrate coating.
(4) manufacture method of a kind of Sn-plated material, it is characterised in that at the matrix material of copper or copper alloy bar
On material, after forming Sn coating or forming Cu, Sn coating in order, by reflow process, at matrix
Forming Sn layer across Cu-Sn alloy-layer on material, the thickness making described Cu coating is 0～0.5 μm, described
The thickness of Sn coating is 0.5～1.5 μm, in described reflow process, with temperature 300～600 DEG C of heating 1～30
After Miao, the cooling water of 20～90 DEG C of spraying out, then put into the tank to 20～90 DEG C.
(5) manufacture method of a kind of Sn-plated material, it is characterised in that at the matrix material of copper or copper alloy bar
After forming Ni, Cu, Sn coating in order on material, by reflow process, matrix material covers Ni
Substrate coating or Ni/Cu double base coating, form Sn layer across Cu-Sn alloy-layer, make described Ni plate
Layer is 0.05～3 μm, and the thickness of described Cu coating is 0.05～0.5 μm, and the thickness of described Sn coating is
0.5～1.5 μm, in described reflow process, after heating 1～30 second with temperature 300～600 DEG C, spray out
The cooling water of 20～90 DEG C, then puts into the tank to 20～90 DEG C.
(6) a kind of electronic component, it possesses the Sn-plated material according to any one of (1)～(3).
Invention effect
By the Sn-plated material of the present invention, particularly for the terminal of automobile and electronic component etc., energy
Make insertion force during joint low, implement surface inspection when terminal assembles accurately.
Accompanying drawing explanation
Fig. 1 be the surface roughness of the most surface of Sn-plated material big in the case of generalized section.
Fig. 2 be the surface roughness of the most surface of Sn-plated material little in the case of generalized section.
After Fig. 3 is the etching of the Sn-plated material after being heated in the case of input tank by reflow process
Most surface macrograph.
Fig. 4 is to implement vaporific water-cooled by reflow process after being heated, in the case of then putting into tank
Most surface macrograph after the etching of Sn-plated material.
Fig. 5 is the explanatory diagram of specular reflectivity assay method.
Detailed description of the invention
Hereinafter, the embodiment for the Sn-plated material of the present invention illustrates.It should be noted that this
In invention, so-called % represents quality %, except as otherwise noted.
(1) composition of matrix material
As the copper bar of the matrix material constituting Sn-plated material, the tough pitch copper of purity more than 99.9%, nothing can be used
Oxygen copper, additionally, as copper alloy bar, can use known copper to close according to required intensity, electric conductivity
Gold.As known copper alloy, such as, can enumerate Cu-Sn-P system alloy, Cu-Zn system alloy, Cu-Ti
It is alloy, Cu-Ni-Si alloy, Cu-Sn-Zn system alloy, Cu-Zr system alloy etc..
(2) radial Sn solidified structure
By carrying out vaporific water-cooled as earlier mentioned, melted Sn is solidified as radial.If every 35mm2Exist
More than 1 this radial Sn solidified structure, then surface roughness Ra is below 0.05 μm.Radial
The number of Sn solidified structure is not specially limited in the range of the effect of the present invention is played, but is manufacturing
On be difficult to more than 10.
(3) surface roughness
The most surface of the Sn-plated material after reflow process, the surface roughness Ra of rolling right angle orientation is
Below 0.05 μm.Preferably Ra be below 0.03 μm, more preferably Ra be below 0.02 μm.When this rolling is straight
When the surface roughness Ra of angular direction is excessive, it is impossible to the generation of suppression Sn powder, good table can not be obtained
Face gloss.The lower limit of surface roughness is not specially limited in the range of the effect of the present invention is played,
But Ra is difficult to less than 0.001 μm on manufacturing.
(4) Cu-Sn system alloy-layer
When implementing reflow process after described Sn plating, matrix material and/or the Cu of Cu substrate coating
Diffuse to Sn coating, be formed with Cu-Sn alloy-layer in the downside of Sn coating.It is generally of Cu6Sn5With/
Or Cu3The composition of Sn but it also may composition containing above-mentioned substrate plating, with copper alloy for matrix material time
Addition element.
Compared with Sn layer, Cu-Sn alloy-layer is hard, accordingly, it is capable to by making it be exposed to plate Sn
The most surface of material and suppress the generation of Sn powder further.But, it is exposed to the most surface of Sn-plated material
The area ratio of Cu-Sn alloy-layer is less than 40%.It is preferably less than 35%, more preferably less than 30%.When
When area ratio is excessive, the surface roughness Ra of Sn coating is excessive, it is impossible to obtain good lustrous surface.
And, the crystal grain diameter of the Cu-Sn alloy-layer being exposed to most surface is below 3 μm.It is preferably 2.5 μm
Hereinafter, below more preferably 2 μm.When crystal grain diameter is excessive, the surface of the rolling right angle orientation of Sn coating
Roughness Ra is excessive, it is impossible to obtain good lustrous surface.The lower limit of crystal grain diameter obtains in the effect of the present invention
The most particularly limit in the range of playing, but be difficult to less than 0.1 μm on manufacturing.
(5) manufacture method
The Sn-plated material of embodiments of the present invention can be manufactured by following operation: in continuous plating production line,
After to carrying out defat and pickling as the copper of matrix material or the surface of copper alloy bar, by galvanoplastic shape
Become substrate coating, then pass through known galvanoplastic and form Sn layer, finally implement reflow process, make Sn
Layer is melted.Substrate coating can also be omitted.
Although Cu substrate plating can not be carried out, but in the case of carrying out Cu substrate plating, its thickness
It it is below 0.5 μm.It is preferably below 0.4 μm, below more preferably 0.35 μm.When thickness is excessive, dew
The crystal grain diameter of the Cu-Sn alloy-layer gone out is excessive, the surface roughness Ra of the rolling right angle orientation of Sn coating
Excessive, it is impossible to obtain good lustrous surface.
In order to improve thermostability, it is also possible to carried out Ni substrate plating before Cu substrate plating.In the case of Gai,
The thickness of Ni substrate plating is not specially limited, but the effect of Ni substrate plating when thickness is less than 0.05 μm
Fruit cannot be played, when more than 3 μm, the most less economical, also causes the deterioration of bendability.
Therefore the thickness of Ni substrate plating is preferably 0.05～3 μm.Additionally, the Cu substrate plating after Ni substrate plating
Thickness be not specially limited, but when thickness is less than 0.05 μm or during more than 0.5 μm, after Ni substrate plating
The effect of Cu substrate plating can not get playing.Therefore the thickness of the Cu substrate plating after Ni substrate plating is excellent
Elect 0.05～0.5 μm as.
The thickness of Sn plating is 0.5～1.5 μm.Preferably 0.6～1.2 μm, more preferably 0.7～1.1 μm, when
When the thickness of Sn plating is too small, the thickness of the Sn layer after reflow process is too small as a result, the rolling of Sn coating
The surface roughness Ra of right angle orientation processed is excessive, and the area ratio of Cu-Sn alloy-layer is excessive, it is impossible to obtain
Good lustrous surface.The upper limit of Sn plating thickness is not special in the range of the effect of the present invention is played
Do not limit, but due to less economical when Sn plating thickness thickness, therefore the upper limit is 1.5 μm.
Reflow process is carried out by following method: by Sn-plated material with in-furnace temperature 300～600 DEG C of heating
After 1～30 second, Sn-plated material, to the surface of Sn-plated material, is then thrown by the cooling water of 20～90 DEG C of spraying out
Enter the tank to 20～90 DEG C.
When heating-up temperature is less than 300 DEG C and/or is less than 1 second heat time heating time, there is the melted insufficient of Sn
Probability, manufactures instability.On the contrary, when heating-up temperature more than 600 DEG C and/or heat time heating time more than 30 seconds time,
Being exposed to the area ratio of Cu-Sn alloy-layer of most surface more than 40%, its crystal grain diameter is more than 3 μm, rolling
The surface roughness Ra of right angle orientation is more than 0.05 μm, it is impossible to obtain good lustrous surface.
As it was previously stated, by cooling water of spraying out after the heating, radial Sn solidified structure can be obtained.And
And, the water particle sprayed out is attached to the surface of the plating material after heating, and this part is quenched, and suppresses Cu-Sn
The growth of alloy-layer.On the other hand, the unattached part of water particle is not quenched, the growth of Cu-Sn alloy-layer
It is not inhibited.Accordingly, it is capable to the rate of cooling that plating surface after the heating produces local is poor, it may have make dew
Go out the effect of the crystal grain diameter granular of the Cu-Sn alloy-layer on the surface to plating material.
Embodiment
Following presentation embodiment, but be not intended to limit the present invention by below example.
With tough pitch copper as raw material, cast out the ingot bar that with the addition of each element with the ratio (quality %) shown in table 1,
At 900 DEG C of thickness 10mm that are hot-rolled down to carried out above, and after facing cut falls the oxide skin on surface, it is repeated
Cold rolling and heat treatment, makes the plate (matrix material) of thickness 0.2mm.
[table 1]
Table 1
| Matrix material | Ni | Si | Sn | Zn | P | Ti | Fe | Zr | Co | Cu |
| No.1 | 2.8 | 0.62 | 0.5 | 0.4 | - | - | - | - | - | Remainder |
| No.2 | 1.6 | 0.4 | 0.5 | 0.4 | - | - | - | - | - | Remainder |
| No.3 | - | 0.44 | - | - | - | - | - | - | 1.9 | Remainder |
| No.4 | - | - | - | 30 | - | - | - | - | - | Remainder |
| No.5 | - | - | 8 | - | 0.1 | - | - | - | - | Remainder |
| No.6 | - | - | 0.3 | 8 | - | - | - | - | - | Remainder |
| No.7 | - | - | - | - | - | - | - | 0.1 | - | Remainder |
| No.8 | - | - | - | - | - | 3 | 0.3 | - | - | Remainder |
"-" represents and is not added with.
Then, after the surface of this matrix material is carried out defat and pickling, by galvanoplastic according to Ni coating,
Cu coating sequentially form substrate coating, according to circumstances omit Ni substrate plating and Cu substrate plating, connect
And form Sn coating by galvanoplastic.In the case of implementing Ni substrate plating, by sulfuric acid bath (liquid
Temperature about 50 DEG C, electric current density 5A/dm2) electroplate, the thickness making Ni substrate plating is 0.3um.
In the case of implementing Cu substrate plating, by sulfuric acid bath (temperature of liquid about 25 DEG C, electric current density 30A
/dm2) electroplate.Sn plating is to bathe (temperature of liquid about 35 DEG C, electric current density 12A by phenolsulfonic acid
/dm2) electroplate.Each thickness of coating of Cu substrate coating and Sn coating is by adjusting electrodeposition time
It is adjusted.
Then, after heating 1～30 second in being heated to the stove of 300～650 DEG C, by the cooling water of 70 DEG C with vaporific
After spraying, put into the tank of 70 DEG C.For a part of embodiment, after heating, do not carry out vaporific
Water-cooled just puts into the tank of 70 DEG C.
So obtained each Sn-plated material is carried out the evaluation of every characteristic.
(1) Sn thickness of coating
Use CT-1 type electrolytic film thickness gauge (Co., Ltd.'s electrical measurement manufactures), measure the thickness of Sn coating.
(2) the Sn solidified structure of most surface
Sn-plated material be impregnated in 65% phenolsulfonic acid aqueous solution 5 minutes, after making Sn solidified structure occur,
Microscope (Keyence society (strain) VW-6000 processed) is used to observe 35mm2Scope, such as Fig. 4, survey
Determine the number of Sn solidified structure.
(3) surface roughness
Use Laser Scanning Confocal Microscope (HD100 that Lasertec (strain) society manufactures), mark according to JIS B 0601
The surface roughness Ra of the accurate rolling right angle orientation measuring Sn-plated material and RSm.
(4) area ratio of the Cu-Sn alloy-layer on surface it is exposed to
Use FE-SEM (XL30SFEG that Japan FEI (strain) manufactures), observe with the multiplying powers of 750 times
0.017mm2The reflection electronic picture in the visual field.Owing to being exposed to the Cu-Sn alloy-layer on surface compared with Sn layer,
In dark image, therefore by this image binaryzation, calculate face by obtaining the area of Cu-Sn alloy-layer
Long-pending ratio.Binaryzation is set as that 170 are carried out in altitude range (height range) 255.
(5) crystal grain diameter of the Cu-Sn alloy-layer of most surface it is exposed to
Use FE-SEM (XL30SFEG that Japan FEI (strain) manufactures), see with the multiplying powers of 2000 times
Examine the reflection electronic picture of the Cu-Sn alloy-layer exposed.Hereafter, randomly choose 10 Cu-Sn alloy-layers, point
Do not obtain the maximum diameter of a circle comprising each Cu-Sn alloy-layer, using 10 maximum diameter of a circle meansigma methodss as
The crystal grain diameter of Cu-Sn alloy-layer.
(6) lustrous surface
Use digital varied angle vancometer (VG-1D that Japan's electrical measurement industry (strain) manufactures), measure
The specular reflectivity of Sn-plated material.As it is shown in figure 5, from light-projecting portion with the angle of incidence incident light of 30 °, utilize
Light accepting part detects the light reflected with the angle of 30 ° at Sn-plated material, and thus, the minute surface measuring Sn-plated material is anti-
Penetrate rate.Owing to being directly 100% by specular reflectivity during light from light-projecting portion, so this value is the highest, plate Sn
The lustrous surface of material is the best.
(7) Sn powder
Test portion is placed in friction test device (this Accelerated Life machine Co., Ltd. manufactures, and this adds abrasiometer)
On, felt is placed on test portion surface, felt loads the weight of 30g, makes felt with 1cm
Amplitude test portion surface move back and forth (scan distance 10mm, sweep speed 13mm/s, reciprocal time 30
Secondary).
Hereafter, the felt surface of test portion side, the degree of adhesion of visual assessment Sn powder are observed.Evaluation criterion is as follows.
If evaluating is △, being then nearly free from Sn powder, there is no problem in actual use, the most excellent
Choosing.
: have no that Sn powder is attached to felt.
△: visible Sn powder is sparse is attached to felt.
×: visible Sn powder is dense is attached to felt.
Implement shown in such as table 2 and table 3.
[table 2]
Table 2
"-" represents plating is not carried out.
[table 3]
Table 3
In example 1～39, the surface roughness Ra of the rolling right angle orientation of the most surface of Sn-plated material is
Below 0.05 μm, every 35mm2There is more than 1 radial Sn solidified structure, be exposed to most surface
The area ratio of Cu-Sn alloy-layer is less than 40%, and in the case of Cu-Sn alloy-layer is exposed to most surface, it is brilliant
Below a diameter of 3 μm of grain.The specular reflectivity of these Sn-plated materials is more than 70%, can obtain good
Lustrous surface, it is suppressed that the generation of Sn powder.
Sn plating thickness when comparative example 1 is plating is the example less than 0.5 μm.Sn layer after Reflow Soldering
Thickness is less than 0.2 μm, is exposed to the area ratio of Cu-Sn alloy-layer of most surface more than 40%, rolls right angle
The Ra in direction is less than 70% more than 0.05 μm, specular reflectivity.
Cu substrate plating thickness when comparative example 2 is plating is more than the example of 0.5 μm.It is exposed to most surface
The crystal grain diameter of Cu-Sn alloy-layer is more than 3 μm, and the Ra of rolling right angle orientation is more than 0.05 μm, direct reflection
Rate is less than 70%.
Comparative example 3 is the furnace temperature of the reflow process example more than 600 DEG C, and comparative example 4 is reflow process
Heat time heating time the example more than 30 seconds.Sn layer thickness after the Reflow Soldering of two examples is both less than 0.2 μm, dew
The area ratio going out the Cu-Sn alloy-layer to most surface is above 40%, and crystal grain diameter is above 3 μm, rolling
The Ra of right angle orientation is above 0.05 μm, and specular reflectivity is both less than 70%.
Comparative example 5 and 6 is that vaporific water-cooled is not carried out, and Cu-Sn alloy-layer is not exposed to the example of most surface.
All can't see radial Sn solidified structure, the generation of Sn powder is notable.
Comparative example 7 is that vaporific water-cooled is not carried out, and Cu-Sn alloy-layer is somewhat exposed to the example of most surface.See
Less than radial Sn solidified structure, the Ra of rolling right angle orientation is less than more than 0.05 μm, specular reflectivity
The generation of 70%, Sn powder is notable.
Comparative example 8～11 is that vaporific water-cooled is not carried out, and Cu-Sn alloy-layer is exposed to the example that most surface is a lot.
Owing to Cu-Sn alloy-layer exposes, therefore, the generation of Sn powder is inhibited, but can't see radial Sn
Solidified structure, the Ra of rolling right angle orientation is less than 70% more than 0.05 μm, specular reflectivity.It is to say,
Suppression to the generation of Sn powder can not get both with good lustrous surface.
Claims (6)
1. a Sn-plated material, it is characterised in that
The matrix material of copper or copper alloy bar has the Sn coating implementing reflow process,
Reflow Soldering Sn coating is made up of, at Sn-plated material the Sn layer of upside and the Cu-Sn alloy-layer of downside
Most surface, every 35mm2There is more than 1 radial Sn solidified structure, the most surface of Sn-plated material
The surface roughness Ra of rolling right angle orientation is below 0.05 μm.
Sn-plated material the most according to claim 1, it is characterised in that
The area ratio of the Cu-Sn alloy-layer being exposed to most surface is less than 40%, described in when surface observation
The crystal grain diameter of the Cu-Sn alloy-layer exposed is below 3 μm.
Sn-plated material the most according to claim 1 and 2, wherein,
On the matrix material of copper or copper alloy bar by Cu substrate coating or Ni substrate coating or by Ni with
And the Ni/Cu double base coating that Cu is laminated according to this order covers, this substrate coating has back
Fluid welding plating Sn layer.
4. the manufacture method of a Sn-plated material, it is characterised in that
On the matrix material of copper or copper alloy bar, forming Sn coating or forming Cu, Sn coating in order
After, by reflow process, matrix material forms Sn layer across Cu-Sn alloy-layer,
The thickness making described Cu coating is 0～0.5 μm, and the thickness of described Sn coating is 0.5～1.5 μm, in institute
State in reflow process after with temperature 300～600 DEG C of heating 1～30 second, the cooling water of 20～90 DEG C of spraying out,
Then the tank to 20～90 DEG C is put into.
5. the manufacture method of a Sn-plated material, it is characterised in that
After the matrix material of copper or copper alloy bar forms Ni, Cu, Sn coating in order, pass through Reflow Soldering
Process, matrix material covers Ni substrate coating or Ni/Cu double base coating, across Cu-Sn alloy
Layer forms Sn layer,
Making described Ni coating is 0.05～3 μm, and the thickness of described Cu coating is 0.05～0.5 μm, described Sn
The thickness of coating is 0.5～1.5 μm, heats 1～30 second with temperature 300～600 DEG C in described reflow process
After, the cooling water of 20～90 DEG C of spraying out, then put into the tank to 20～90 DEG C.
6. an electronic component, it possesses the Sn-plated material according to any one of claims 1 to 3.
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| JP2015034246A JP5984981B2 (en) | 2015-02-24 | 2015-02-24 | Sn plating material for electronic parts |
| JP2015-034246 | 2015-02-24 |
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| CN105908230A true CN105908230A (en) | 2016-08-31 |
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| JP (1) | JP5984981B2 (en) |
| KR (2) | KR102043490B1 (en) |
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| CN110644024A (en) * | 2019-09-20 | 2020-01-03 | 中江立江电子有限公司 | Electronic component re-melting production system and production process thereof |
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| JP7040224B2 (en) | 2018-03-30 | 2022-03-23 | 三菱マテリアル株式会社 | Tin-plated copper terminal material and its manufacturing method |
| WO2021065142A1 (en) * | 2019-10-02 | 2021-04-08 | 株式会社村田製作所 | Piezoelectric sound-generating component |
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| JP5984981B2 (en) | 2016-09-06 |
| TWI585244B (en) | 2017-06-01 |
| TW201638397A (en) | 2016-11-01 |
| KR20160103534A (en) | 2016-09-01 |
| KR102043490B1 (en) | 2019-11-11 |
| KR20170120547A (en) | 2017-10-31 |
| CN105908230B (en) | 2018-05-29 |
| JP2016156051A (en) | 2016-09-01 |
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