CN105904597B - Pressureless sintering dry chip - Google Patents
Pressureless sintering dry chip Download PDFInfo
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- CN105904597B CN105904597B CN201610343524.XA CN201610343524A CN105904597B CN 105904597 B CN105904597 B CN 105904597B CN 201610343524 A CN201610343524 A CN 201610343524A CN 105904597 B CN105904597 B CN 105904597B
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- Prior art keywords
- pressureless sintering
- dry chip
- powder
- diamond segment
- diamond
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/16—Ferrous alloys, e.g. steel alloys containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
Abstract
The present invention relates to a kind of pressureless sintering dry chip, the technical fields of superhard cut product.The pressureless sintering dry chip of the present invention includes slice matrix and diamond segment; the annular installation end that the slice matrix includes circular body and the outer edge from the circular body extends outward to form; by cold-press process the annular installation end it is two-sided on form diamond segment green body; and pass through non-pressure sintering technology and form the diamond segment, the non-pressure sintering technology refers to be sintered under the conditions of normal pressure or the protective atmosphere of low pressure.The pressureless sintering dry chip of the present invention in sintering process without impressed pressure, so as to significantly reduce energy consumption and improve the service life of graphite jig, so as to reduce manufacture cost.In addition, the dry chip thickness of the present invention is thin, energy consumption is not only reduced in processing, and reduce the loss for being processed material, improve cut quality.
Description
Technical field
The present invention relates to the technical field of superhard cut product, it is more particularly related to it is a kind of for marble,
The pressureless sintering dry chip of the nonmetallic crisp and hard material processing such as granite, the cutting of cement concrete and deburring.
Background technology
Current market, diamond tool are widely used to marble, granite, concrete, pitch, ceramics, glass, pearl
The cutting of the hard materials such as gem and jade and repairing processing;Cutting efficiency is continuously improved, reduces spillage of material, improves diamond tool
Service life be direction that market is pursued jointly.Diamond tool generally includes diamond segment and matrix, and matrix thickness is determined
Deposit diamond tool bit thickness, matrix thickness is thicker, and joint-cutting is wider during cutting, and cutting efficiency is lower, and spillage of material is bigger, economy effect
Benefit is poorer, and matrix thickness is thinning, and cutter head is thinning, and cutting efficiency is promoted, and spillage of material declines;But matrix it is thinning after will lead to base
Body rigidly declines in itself, bears load-carrying ability reduction, when cutting generates beat, and then loses cutting power.Therefore how to solve
Contradiction between matrix thickness and rigidity is ensureing matrix rigid, produces thinner dry diamond slice and is always
Perplex the problem of people.
Invention content
In order to solve above-mentioned technical problem of the prior art, cut the purpose of the present invention is to provide a kind of pressureless sintering is dry
Piece.
In order to solve to invent the technical issues of described and realize goal of the invention, present invention employs following technical schemes:
A kind of pressureless sintering dry chip, including slice matrix and diamond segment, the slice matrix includes circular body
The annular installation end extended outward to form with the outer edge from the circular body, by cold-press process in the annular installation end
Two-sided upper formation diamond segment green body, and pass through non-pressure sintering technology and form the diamond segment, the pressureless sintering
Technique refers to be sintered under the conditions of normal pressure or the protective atmosphere of low pressure.
Wherein, the temperature of the pressureless sintering is 800-900 DEG C, preferably 810-880 DEG C, more preferably 830-850 DEG C.
Wherein, the U-shaped tooth that concaves, adjacent diamond tool are both provided in the upper and lower surface of the diamond segment
The chip space for extending to the circular body is provided between head.
Wherein, in the dry chip diamond segment quantity 6~30, preferably 8~20, more preferably 8~15
It is a.
Wherein, it is described slice matrix a diameter of 100~300mm, preferably 125~250mm, such as can be 125mm,
150mm, 200mm, 250mm etc..The thickness of the slice matrix is 0.3~5.0mm, such as can be 0.3~2.0mm, 0.5~
1.2mm, 0.3~0.8mm etc..
Wherein, for the slice matrix using steel matrix, the steel matrix contains C in terms of chemical composition:0.62~
0.68wt%, Si:0.18~0.35wt%, Mn:0.88~1.25wt%, Cr:0.05~0.25wt%, Cu:0.10~
0.20wt%, Ni≤0.20wt%, S≤0.03wt%, P≤0.030wt%, surplus are Fe and inevitable impurity;It is described
Steel matrix preferably keeps the temperature 45~60min at 850~880 DEG C, is then furnace-cooled to 720~750 DEG C of 2.0~3.0h of heat preservation, is furnace-cooled to
Air-cooled room temperature after 650~660 DEG C.The steel matrix passes through composition design and (needs to control Ni by high carbon content
Content) and heat treatment process specification, it is high to obtain not only intensity, but also the characteristic of good toughness, so as to by diamond
Tool design and ensures its service life into the form of dry chip.Yield strength >=800MPa of the steel matrix, tensile strength
>=980MPa, yield tensile ratio >=0.8, elongation at break are 15~22%.
Wherein, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the concentration of the diamond
For 0.50~0.80ct/cm3;The carcass powder by weight percentage, by the prealloy powder of 35~40wt%, 25~
The metallic bond composition of the copper powder of 30wt%, the glass putty of 2~4wt% and surplus.
Wherein, the prealloy powder contains the carbon of 0.10~0.15wt%, 0.05~0.15wt% with weight percentage
Boron, the chromium of 12.5~13.0wt%, the manganese of 2.5~3.0wt%, the titanium of 2.0~2.5wt%, the nickel of 2.1~2.5wt%, 0.03
The zirconium of~0.08wt%, surplus are copper.The prealloy powder can be for example atomized alloy powder or mechanical alloy powder, from cost angle
Degree considers that it is preferable to use atomized alloy powder, such as water atomization alloyed powder or aerosolization alloyed powder.
Wherein, the metallic bond, with weight percentage by the copper of 30~35wt%, the tin of 6.0~8.0wt%, 3.0
The pore creating material of~5.0wt% and the iron composition of surplus.
Compared with the immediate prior art, pressureless sintering dry chip of the present invention has the advantages that:
Without impressed pressure in sintering process, so as to significantly reduce energy consumption and improve the service life of graphite jig,
So as to reduce manufacture cost.In addition, the dry chip thickness of the present invention is thin, energy consumption is not only reduced in processing, and reduce
The loss of processed material, improves cut quality.
Description of the drawings
Fig. 1 is the structure diagram of pressureless sintering dry chip of the present invention.
Fig. 2 is cross-sectional structure schematic diagrames of the Fig. 1 along A-A directions.
Specific embodiment
Pressureless sintering dry chip of the present invention is further elaborated below with reference to specific embodiment, to help
Those skilled in the art has more complete, accurate and deep understanding to inventive concept of the invention, technical solution;It may be noted that
Be that description in relation to structure, function and material etc. in embodiment is all exemplary, and do not imply that and model protected to invention
The limitation enclosed.
As shown in attached drawing 1-2, pressureless sintering dry chip of the present invention, including slice matrix 10 and diamond segment
20, the annular installation that the slice matrix 10 includes circular body 11 and the outer edge from the circular body extends outward to form
End 12, by cold-press process the annular installation end it is two-sided on form diamond segment green body, and pass through pressureless sintering work
Skill forms the diamond segment 20, and the non-pressure sintering technology refers to carry out under the conditions of normal pressure or the protective atmosphere of low pressure
Sintering.The U-shaped tooth 21 that concaves, adjacent diamond segment 20 are both provided in the upper and lower surface of the diamond segment 20
Between be provided with the chip space 30 for extending to the circular body.As shown in Figure 1, in the dry chip diamond segment quantity
8, certainly according to the size of slice matrix, the number of the diamond segment can be the differences such as 6~30.In the present invention
In, it is described slice matrix a diameter of 100~300mm, preferably 125~250mm, such as can be 125mm, 150mm,
200mm, 250mm etc..The thickness of the slice matrix is 0.3~5.0mm, such as can be 0.3~2.0mm, 0.5~1.2mm,
0.3~0.8mm etc..In order to enable dry chip has the service life improved, the slice matrix uses base steel in the present invention
Body, the steel matrix contain C in terms of chemical composition:0.62~0.68wt%, Si:0.18~0.35wt%, Mn:0.88~
1.25wt%, Cr:0.05~0.25wt%, Cu:0.10~0.20wt%, Ni≤0.20wt%, S≤0.03wt%, P≤
0.030wt%, surplus are Fe and inevitable impurity;The steel matrix preferably keeps the temperature 45~60min at 850~880 DEG C, so
After be furnace-cooled to 720~750 DEG C heat preservation 2.0~3.0h, air-cooled room temperature after being furnace-cooled to 650~660 DEG C.The steel matrix passes through
High carbon content, and pass through composition design (needing to control the content of Ni) and heat treatment process specification, it can obtain not only strong
Degree is high, and the characteristic of good toughness, so as to which diamond tool to be designed to the form of dry chip, and ensures that it uses the longevity
Life.Yield strength >=800MPa of the steel matrix, tensile strength >=980MPa, yield tensile ratio >=0.8, elongation at break for 15~
22%.In the present invention, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the diamond is dense
It spends for 0.50~0.80ct/cm3;The carcass powder by weight percentage, by the prealloy powder of 35~40wt%, 25~
The metallic bond composition of the copper powder of 30wt%, the glass putty of 2~4wt% and surplus.The prealloy powder is contained with weight percentage
Have the carbon of 0.10~0.15wt%, the boron of 0.05~0.15wt%, the chromium of 12.5~13.0wt%, 2.5~3.0wt% manganese,
The titanium of 2.0~2.5wt%, the nickel of 2.1~2.5wt%, 0.03~0.08wt% zirconium, surplus is copper.The prealloy powder example
Can be such as atomized alloy powder or mechanical alloy powder, it is preferable to use atomized alloy powder, such as water mist chemical combination from a cost perspective
Bronze or aerosolization alloyed powder.The metallic bond, with weight percentage by the copper of 30~35wt%, 6.0~8.0wt%
The iron composition of tin, the pore creating material of 3.0~5.0wt% and surplus.In the present invention, in the diamond, granularity 35/40 accounts for
30~35%, 40/45, which accounts for 35~40%, 45/50, accounts for 25~30%.
In the present invention, the pressureless sintering dry chip is prepared by following process:Dispensing-letter is made-is cold-pressed-without pressure
Sintering-pad punching-paints-puts the first edge on a knife or a pair of scissors-test package storage.
Embodiment 1
In the present embodiment, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the Buddha's warrior attendant
A concentration of 0.60ct/cm of stone3, wherein accounting for for granularity 35,/40 35%, 40/45 account for 40%, 45/50 and account for 25%.The carcass powder
End by weight percentage, is combined by the metal of the prealloy powder of 35wt%, the copper powder of 25wt%, the glass putty of 4wt% and surplus
Agent forms.The prealloy powder be with weight percentage contain the carbon of 0.12wt%, the boron of 0.10wt%, 12.5wt% chromium,
The manganese of 3.0wt%, the titanium of 2.5wt%, the nickel of 2.5wt%, 0.05wt% zirconium, surplus be copper water atomization alloyed powder.It is described
Metallic bond is made of with weight percentage the iron of the copper of 32wt%, the tin of 8.0wt%, the paraffin of 5.0wt% and surplus.
The preparation process of the pressureless sintering dry chip is as follows:
1) dispensing:It is represented with above-mentioned weight percent, takes metallic bond, prealloy powder, copper powder, glass putty and diamond,
Molding mass is made in premix, and using batch mixer, batch mixing obtains molding mass in 120 minutes.
2) it is granulated:Granulating agent is added in into mixed molding mass and carries out batch mixing, it is simple to be granulated.
3) it is cold-pressed:Moulds of industrial equipment are adjusted, the molding mass of half is first launched, is then placed in slice matrix, then launch residue
Molding mass be assembled into cold moudling punching block extrusion forming and obtain dry chip blank.
4) pressureless sintering:The dry chip blank that will be obtained, is assembled in Graphite pad, carries out burning without pressure in argon gas atmosphere
Knot, the temperature of pressureless sintering are maintained at 830~850 DEG C.
5) pad punching, paint, put the first edge on a knife or a pair of scissors:By the dry chip after pressureless sintering, descale is carried out, is processed by technological requirement
Into required size.
Embodiment 2
In the present embodiment, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the Buddha's warrior attendant
A concentration of 0.60ct/cm of stone3, wherein accounting for for granularity 35,/40 35%, 40/45 account for 40%, 45/50 and account for 25%.The carcass powder
End by weight percentage, is combined by the metal of the prealloy powder of 35wt%, the copper powder of 25wt%, the glass putty of 4wt% and surplus
Agent forms.The prealloy powder be with weight percentage contain the carbon of 0.10wt%, the boron of 0.08wt%, 12.8wt% chromium,
The manganese of 2.8wt%, the titanium of 2.2wt%, the nickel of 2.2wt%, 0.08wt% zirconium, surplus be copper water atomization alloyed powder.It is described
Metallic bond is made of with weight percentage the iron of the copper of 30wt%, the tin of 6.0wt%, the paraffin of 5.0wt% and surplus.
The preparation process of the pressureless sintering dry chip is as follows:
1) dispensing:It is represented with above-mentioned weight percent, takes metallic bond, prealloy powder, copper powder, glass putty and diamond,
Molding mass is made in premix, and using batch mixer, batch mixing obtains molding mass in 120 minutes.
2) it is granulated:Granulating agent is added in into mixed molding mass and carries out batch mixing, it is simple to be granulated.
3) it is cold-pressed:Moulds of industrial equipment are adjusted, the molding mass of half is first launched, is then placed in slice matrix, then launch residue
Molding mass be assembled into cold moudling punching block extrusion forming and obtain dry chip blank.
4) pressureless sintering:The dry chip blank that will be obtained, is assembled in Graphite pad, carries out burning without pressure in argon gas atmosphere
Knot, the temperature of pressureless sintering are maintained at 830~850 DEG C.
5) pad punching, paint, put the first edge on a knife or a pair of scissors:By the dry chip after pressureless sintering, descale is carried out, is processed by technological requirement
Into required size.
Embodiment 3
In the present embodiment, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the Buddha's warrior attendant
A concentration of 0.60ct/cm of stone3, wherein accounting for for granularity 35,/40 30%, 40/45 account for 40%, 45/50 and account for 30%.The carcass powder
End by weight percentage, is combined by the metal of the prealloy powder of 40wt%, the copper powder of 30wt%, the glass putty of 2wt% and surplus
Agent forms.The prealloy powder be with weight percentage contain the carbon of 0.10wt%, the boron of 0.08wt%, 12.8wt% chromium,
The manganese of 2.8wt%, the titanium of 2.2wt%, the nickel of 2.2wt%, 0.08wt% zirconium, surplus be copper water atomization alloyed powder.It is described
Metallic bond is made of with weight percentage the iron of the copper of 30wt%, the tin of 6.0wt%, the paraffin of 5.0wt% and surplus.
The preparation process of the pressureless sintering dry chip is as follows:
1) dispensing:It is represented with above-mentioned weight percent, takes metallic bond, prealloy powder, copper powder, glass putty and diamond,
Molding mass is made in premix, and using batch mixer, batch mixing obtains molding mass in 120 minutes.
2) it is granulated:Granulating agent is added in into mixed molding mass and carries out batch mixing, it is simple to be granulated.
3) it is cold-pressed:Moulds of industrial equipment are adjusted, the molding mass of half is first launched, is then placed in slice matrix, then launch residue
Molding mass be assembled into cold moudling punching block extrusion forming and obtain dry chip blank.
4) pressureless sintering:The dry chip blank that will be obtained, is assembled in Graphite pad, carries out burning without pressure in argon gas atmosphere
Knot, the temperature of pressureless sintering are maintained at 830~850 DEG C.
5) pad punching, paint, put the first edge on a knife or a pair of scissors:By the dry chip after pressureless sintering, descale is carried out, is processed by technological requirement
Into required size.
Comparative example 1
In the present embodiment, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the Buddha's warrior attendant
A concentration of 0.60ct/cm of stone3, wherein accounting for for granularity 35,/40 35%, 40/45 account for 40%, 45/50 and account for 25%.The carcass powder
End by weight percentage, is made of the prealloy powder of 64wt% and the metallic bond of surplus.The prealloy powder is with weight
Amount percentage meter contain the carbon of 0.10wt%, the boron of 0.08wt%, the chromium of 12.8wt%, the manganese of 2.8wt%, 2.2wt% titanium,
The nickel of 2.2wt%, the zirconium of 0.08wt%, surplus are the water atomization alloyed powder of copper.The metallic bond, with weight percentage by
The copper of 30wt%, the tin of 6.0wt%, the paraffin of 5.0wt% and surplus iron composition.The preparation of the pressureless sintering dry chip
Technique is as follows:
1) dispensing:It is represented with above-mentioned weight percent, take metallic bond, prealloy powder and diamond, premix is made into
Moulding mixture, using batch mixer, batch mixing obtains molding mass in 120 minutes.
2) it is granulated:Granulating agent is added in into mixed molding mass and carries out batch mixing, it is simple to be granulated.
3) it is cold-pressed:Moulds of industrial equipment are adjusted, the molding mass of half is first launched, is then placed in slice matrix, then launch residue
Molding mass be assembled into cold moudling punching block extrusion forming and obtain dry chip blank.
4) pressureless sintering:The dry chip blank that will be obtained, is assembled in Graphite pad, carries out burning without pressure in argon gas atmosphere
Knot, the temperature of pressureless sintering are maintained at 830~850 DEG C.
5) pad punching, paint, put the first edge on a knife or a pair of scissors:By the dry chip after pressureless sintering, descale is carried out, is processed by technological requirement
Into required size.
Comparative example 2
In this comparative example, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the Buddha's warrior attendant
A concentration of 0.60ct/cm of stone3, wherein accounting for for granularity 35,/40 35%, 40/45 account for 40%, 45/50 and account for 25%.The carcass powder
End by weight percentage, by the copper of 50wt%, the glass putty of 4wt%, the carbon of 0.035wt%, the boron of 0.03wt%, 4.5wt%
Chromium, the manganese of 1.02wt%, the titanium of 0.75wt%, the nickel of 0.70wt%, the zirconium of 0.03wt% and surplus metallic bond group
Into.The prealloy powder is contains with weight percentage.The metallic bond, with weight percentage by 30wt% copper,
The iron composition of the tin of 6.0wt%, the paraffin of 5.0wt% and surplus.The preparation process of the pressureless sintering dry chip is as follows:
1) dispensing:It is represented with above-mentioned weight percent, takes metallic bond, prealloy powder, copper powder, glass putty and diamond,
Molding mass is made in premix, and using batch mixer, batch mixing obtains molding mass in 120 minutes.
2) it is granulated:Granulating agent is added in into mixed molding mass and carries out batch mixing, it is simple to be granulated.
3) it is cold-pressed:Moulds of industrial equipment are adjusted, the molding mass of half is first launched, is then placed in slice matrix, then launch residue
Molding mass be assembled into cold moudling punching block extrusion forming and obtain dry chip blank.
4) pressureless sintering:The dry chip blank that will be obtained, is assembled in Graphite pad, carries out burning without pressure in argon gas atmosphere
Knot, the temperature of pressureless sintering are maintained at 830~850 DEG C.
5) pad punching, paint, put the first edge on a knife or a pair of scissors:By the dry chip after pressureless sintering, descale is carried out, is processed by technological requirement
Into required size.
Comparative example 3
In this comparative example, the raw material of the diamond segment is formed by diamond and carcass powder, wherein the Buddha's warrior attendant
A concentration of 0.60ct/cm of stone3, wherein accounting for for granularity 35,/40 35%, 40/45 account for 40%, 45/50 and account for 25%.The carcass powder
End by weight percentage, is combined by the metal of the prealloy powder of 35wt%, the copper powder of 25wt%, the glass putty of 4wt% and surplus
Agent forms.The prealloy powder be with weight percentage contain the chromium of 12.8wt%, the manganese of 2.8wt%, 2.2wt% titanium,
The nickel of 2.2wt%, the zirconium of 0.08wt%, surplus are the water atomization alloyed powder of copper.The metallic bond, with weight percentage by
The copper of 30wt%, the tin of 6.0wt%, the paraffin of 5.0wt% and surplus iron composition.The preparation of the pressureless sintering dry chip
Technique is as follows:
1) dispensing:It is represented with above-mentioned weight percent, takes metallic bond, prealloy powder, copper powder, glass putty and diamond,
Molding mass is made in premix, and using batch mixer, batch mixing obtains molding mass in 120 minutes.
2) it is granulated:Granulating agent is added in into mixed molding mass and carries out batch mixing, it is simple to be granulated.
3) it is cold-pressed:Moulds of industrial equipment are adjusted, the molding mass of half is first launched, is then placed in slice matrix, then launch residue
Molding mass be assembled into cold moudling punching block extrusion forming and obtain dry chip blank.
4) pressureless sintering:The dry chip blank that will be obtained, is assembled in Graphite pad, carries out burning without pressure in argon gas atmosphere
Knot, the temperature of pressureless sintering are maintained at 830~850 DEG C.
5) pad punching, paint, put the first edge on a knife or a pair of scissors:By the dry chip after pressureless sintering, descale is carried out, is processed by technological requirement
Into required size.
The performance of the diamond segment obtained after sintering, with reference to GB/T 230.1-2009 metal material Rockwell hardness tests
Part 1 tests hardness;Bending strength is measured with reference to GB/T5319-2002 sintered metal materials cross-breaking strength;Reference
GBT5318-1985 sintered metal materials non-incisions impact specimen measures impact flexibility, and the results are shown in Table 1.
Table 1
Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 | Comparative example 2 | Comparative example 3 | |
Hardness (HRB) | 108 | 112 | 105 | 95 | 115 | 90 |
Bending strength (MPa) | 1082 | 1250 | 1180 | 960 | 880 | 950 |
Impact flexibility (J/cm2) | 23 | 25 | 20 | 25 | 13 | 10 |
For the ordinary skill in the art, specific embodiment is only exemplarily described the present invention,
Obviously the present invention specific implementation is not subject to the restrictions described above, as long as employ the inventive concept and technical scheme of the present invention into
The improvement of capable various unsubstantialities or it is not improved by the present invention design and technical solution directly apply to other occasions
, within protection scope of the present invention.
Claims (5)
1. a kind of pressureless sintering dry chip, including slice matrix and diamond segment, the slice matrix include circular body and
The annular installation end extended outward to form from the outer edge of the circular body, by cold-press process in the annular installation end
Two-sided upper formation diamond segment green body, and pass through non-pressure sintering technology and form the diamond segment, the pressureless sintering work
Skill refers to be sintered under the conditions of normal pressure or the protective atmosphere of low pressure;The raw material of the diamond segment is by diamond and tire
Body powder is formed, a concentration of 0.50~0.80ct/cm of the diamond3;The carcass powder by weight percentage, by 35
The prealloy powder of~40wt%, the copper powder of 25~30wt%, the glass putty of 2~4wt% and surplus metallic bond composition;It is described
Prealloy powder contains the carbon of 0.10~0.15wt%, the boron of 0.05~0.15wt%, 12.5~13.0wt% with weight percentage
Chromium, the manganese of 2.5~3.0wt%, the titanium of 2.0~2.5wt%, the nickel of 2.1~2.5wt%, 0.03~0.08wt% zirconium, it is remaining
It measures as copper, the prealloy powder is atomized alloy powder or mechanical alloy powder;The metallic bond, with weight percentage by 30~
The copper of 35wt%, the tin of 6.0~8.0wt%, the pore creating material of 3.0~5.0wt% and surplus iron composition.
2. pressureless sintering dry chip according to claim 1, it is characterised in that:The temperature of the pressureless sintering for 800~
900℃。
3. pressureless sintering dry chip according to claim 1, it is characterised in that:The upper surface of the diamond segment is under
The U-shaped tooth that concaves is both provided on surface, the chip space for extending to the circular body is provided between adjacent diamond segment.
4. pressureless sintering dry chip according to claim 1, it is characterised in that:The number of diamond segment in the dry chip
Amount 6~30.
5. pressureless sintering dry chip according to claim 1, it is characterised in that:A diameter of the 100 of the slice matrix~
300mm, the thickness of the slice matrix is 0.3~5.0mm.
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CN107364010B (en) * | 2017-06-15 | 2018-11-16 | 江苏华昌工具制造有限公司 | Two-sided sintering W type groove diamond tool and preparation method thereof |
CN109628815B (en) * | 2018-12-29 | 2020-12-15 | 郑州机械研究所有限公司 | Diamond saw blade |
ES2919199T3 (en) * | 2019-10-15 | 2022-07-22 | Ecka Granules Germany Gmbh | Premix Alloy Powders for Diamond Tools |
CN114311318A (en) * | 2021-12-10 | 2022-04-12 | 黑旋风锯业股份有限公司 | Semi-arc sintered saw blade matrix and processing technology |
CN114318099B (en) * | 2022-01-13 | 2022-09-23 | 河南黄河旋风股份有限公司 | Metal matrix-diamond composite material for drilling hard rock and preparation method thereof |
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CN201519908U (en) * | 2009-11-17 | 2010-07-07 | 郭和惠 | Multi-layer uniformly-distributed diamond cold-pressing sintering sawblade |
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