Diamond cutting abrasive disc
Technical field
The present invention relates to the technical field of diamond cutting tool, more particularly, the present invention relates to a kind of be applied to stone material, concrete, pottery, brick, watt etc. building materials carry out the diamond cutting abrasive disc that cuts.
Background technology
Diamond is the material that in known materials, hardness is the highest, and thus diamond cutting tool becomes the indispensable material of the various stiff materials of processing.Diamond cutting tool is mixed mutually with synthetic diamond particles by metal dust, and repressed and sintering forms.And along with social development, basisization construction scale constantly expands, also more wide application market is provided to diamond tool, nowadays diamond tool has been widely used in the engineering construction such as stone material, glass, pottery and house, road, bridge, the serviceability of market to diamond tool also improves constantly, sharpness is good, wearability is high, easy to use, and the user of being simple to operate unanimously pursues.
Diamond tool serviceability major embodiment is two aspects: cutting and polishing.These two kinds of performances of diamond tool are all separately carried out on the market today, and very inconvenient when user uses, device of often changing planes, changes product, work consuming consuming time.Also do not have a product both to be combined at present, the present invention is by unique design, and adopt high strength material high-performance powder will cut and grind two kinds of occupation modes and combine, user uses simply, easy to operately significantly improves production efficiency.
Summary of the invention
The present invention mainly solves diamond tool in current market and cuts and grind the separate problem of performance, and will be cut by unique design and grind two kinds of performances and combine, simple and reasonable, easy to operate, cost of manufacture is low, long service life.
In order to realize foregoing invention object of the present invention, the invention provides following technical scheme:
Diamond cutting abrasive disc, comprises the diamond cutting abrasive disc be arranged on matrix, it is characterized in that described diamond cutting abrasive disc is evenly distributed at circumferencial direction, and its surface has the ripple tank of heat radiation chip removal when being conducive to grinding.
Wherein, described matrix is 65Mn steel.
Wherein, the diamond concentration 25% in described diamond cutting abrasive disc material.
Wherein, the metallic bond in described diamond cutting abrasive disc material includes Cu, the Fe of 30 ~ 40wt% of 30 ~ 40wt%, the Ni of 8 ~ 10wt%, the Sn of 5 ~ 8wt%, the Co of 8 ~ 15wt%.
Wherein, metallic bond in described diamond cutting abrasive disc material is pre-alloyed powder, described pre-alloyed powder is obtained by water atomization process, and described pre-alloyed powder contains following component: include the Cu of 30 ~ 40wt%, the Fe of 30 ~ 40wt%, the Ni of 8 ~ 10wt%, the Sn of 5 ~ 8wt%, the Co of 8 ~ 15wt%.
Wherein, metallic bond in described diamond cutting abrasive disc material is pre-alloyed powder, described pre-alloyed powder is obtained by water atomization process, and described pre-alloyed powder is made up of following component: include the Cu of 30 ~ 40wt%, the Fe of 30 ~ 40wt%, the Ni of 8 ~ 10wt%, the Sn of 5 ~ 8wt%, the Co of 8 ~ 15wt%.
Wherein, metallic bond in described diamond cutting abrasive disc material is pre-alloyed powder, described pre-alloyed powder is obtained by water atomization process, and described pre-alloyed powder is made up of following component: include the Cu of 30 ~ 40wt%, the Fe of 30 ~ 40wt%, Ni, the Sn of 5 ~ 8wt% of 8 ~ 10wt%, the Ce of Co and 0.8-1.2wt% of 8 ~ 15wt%.
Wherein, metallic bond in described diamond cutting abrasive disc material is pre-alloyed powder, described pre-alloyed powder is obtained by water atomization process, and described pre-alloyed powder is made up of following component: the Ce including the Cu of 30 ~ 40wt%, Fe, the Ni of 8 ~ 10wt% of 30 ~ 40wt%, the Si of Sn, 3-5wt% of 5 ~ 8wt%, Co and 0.8-1.2wt% of 8 ~ 10wt%.
Compared with prior art, the present invention has following beneficial effect:
Diamond cutting abrasive disc base plane of the present invention carves 2 road flume surface annular knurls, and ensure that metallic bond is with matrix bonding strength, during use, performance safety is reliable, the present invention has simple and reasonable, and cost of manufacture is low, flexible operation, product sharpness is good, and chip removal performance is good.
Accompanying drawing explanation
Fig. 1 is the structural representation of diamond cutting abrasive disc of the present invention.
Detailed description of the invention
As shown in Figure 1, diamond cutting abrasive disc of the present invention, comprises the diamond cutting abrasive disc be arranged on matrix, and described diamond cutting abrasive disc is evenly distributed at circumferencial direction, and its surface has the ripple tank of heat radiation chip removal when being conducive to grinding.Described matrix is 65Mn steel, and the diamond intensity 20 ~ 25 kilograms in described diamond cutting abrasive disc material, granularity is 30/40 or 40/50, concentration 25%.Diamond cutting abrasive disc of the present invention, can prepare by the following method:
1, metallic bond and diamond batch mixing, in described diamond cutting abrasive disc material, granularity is 30/40 or 40/50, and concentration is 25%.
2, matrix processing: choose high-quality 65Mn steel matrix and carry out punching press, mill teeth, reaming, in order to ensure that metallic bond is connected fastness with matrix, carry out grooving to matrix surface, matrix surface carries out embossing process, metal powder and matrix are combined closely, can not come off during use;
3, compressing: to be positioned in special cold_pressing mould by matrix, taking constant weight powder and pour in die cavity, shakeouing even with scraping pin by powder, press-in patrix, is positioned in hydraulic press platform, with 3.0t/cm
2the compressing rear mould unloading of pressure takes out semi-finished product pressed compact;
4, sinter: base of being colded pressing by diamond cutting abrasive disc loads bell-type in freezing of a furnace, and logical hydrogen is warmed up to the holding temperature 770 ~ 890 DEG C of setting, be incubated after within 90 minutes, coming out of the stove and naturally cool.
5, spray paint and put the first edge on a knife or a pair of scissors: diamond semi-finished product are cut sheet and spray paint after surface treatment and put the first edge on a knife or a pair of scissors, diamond is fully exposed, then packs warehouse-in.
Embodiment 1
Described diamond cutting abrasive disc adopts said method to prepare, and described metallic bond is the elemental powders of mixing, and it is made up of the Co of Sn and 15wt% of Ni, 5wt% of Fe, 10wt% of Cu, 35wt% of 35wt%.
Embodiment 2
Described diamond cutting abrasive disc adopts said method to prepare, and the metallic bond in described diamond cutting abrasive disc material is pre-alloyed powder, described pre-alloyed powder is obtained by conventional water atomization process, and described pre-alloyed powder is made up of following component: the Co of Sn and 15wt% of Ni, 5wt% of Fe, 10wt% of Cu, 35wt% of 35wt%.
Embodiment 3
Described diamond cutting abrasive disc adopts said method to prepare, and the metallic bond in described diamond cutting abrasive disc material is pre-alloyed powder, described pre-alloyed powder is obtained by conventional water atomization process, and described pre-alloyed powder is made up of following component: the Ce of Co and 1.2wt% of Sn, 10wt% of Ni, 5wt% of Fe, 10wt% of Cu, 38.8wt% of 35wt%.
Embodiment 4
Described diamond cutting abrasive disc adopts said method to prepare, and the metallic bond in described diamond cutting abrasive disc material is pre-alloyed powder, described pre-alloyed powder is obtained by conventional water atomization process, and described pre-alloyed powder is made up of following component: the Ce including Co and 1.2wt% of Si, 8wt% of Sn, 4wt% of Ni, 6wt% of Fe, 8wt% of Cu, 37.8wt% of 35wt%.
The performance of the diamond cutting abrasive disc that embodiment 1-4 prepares (processing object: in hard stone of marble) as shown in table 1.
The performance of table 1 diamond cutting abrasive disc
|
Sintering temperature (DEG C) |
Grinding efficiency ratio |
Cutting efficiency ratio |
Cutting life ratio |
Embodiment 1 |
870 |
1 |
1 |
1 |
Embodiment 2 |
820 |
1.23 |
1.18 |
1.32 |
Embodiment 3 |
770 |
1.28 |
1.31 |
1.38 |
Embodiment 4 |
780 |
1.68 |
2.31 |
2.87 |
For the ordinary skill in the art, be to be understood that and can without departing from the scope of the present disclosure, equivalent replacement or equivalent transformation form can be adopted to implement above-described embodiment.Protection scope of the present invention is not limited to the specific embodiment of detailed description of the invention part, as long as no the embodiment departing from invention essence, within the protection domain being all interpreted as having dropped on application claims.