Diamond is cut abrasive disc
Technical field
The present invention relates to the technical field of diamond cutting tool, more particularly, the present invention relates to a kind of be applied to stone material, concrete, pottery, brick, watt etc. the building materials diamond of cutting mill cut abrasive disc.
Background technology
Diamond is the highest material of hardness in the known materials, thereby diamond cutting tool becomes the indispensable material of the various stiff materials of processing.Diamond cutting tool is that metal dust is mixed mutually with artificial diamond's stone granulate, and repressed and sintering forms.And along with society constantly develops, the basisization construction scale constantly enlarges, also provide more wide application market to diamond tool, nowadays diamond tool has been widely used in the engineering constructions such as stone material, glass, pottery and house, road, bridge, market also improves constantly the serviceability of diamond tool, sharpness is good, wearability is high, easy to use, and the user of being simple to operate is consistent to be pursued.
The diamond tool serviceability mainly is presented as two aspects: cutting and polishing.These two kinds of performances of diamond tool are all separately carried out on current market, and very inconvenient when the user uses, the device of often changing planes changes product, consumption worker consuming time.Also do not have a product that both are combined at present, the present invention adopts high strength material high-performance powder will cut and grind two kinds of occupation modes and combines by unique design, and the user uses simply, easy to operately obviously enhances productivity.
Summary of the invention
The present invention mainly solves in the current market diamond tool and cuts and grind the separate problem of performance, will cut with grinding two kinds of performances by unique design to combine, and simple and reasonable, easy to operate, cost of manufacture is low, long service life.
In order to realize foregoing invention purpose of the present invention, the invention provides following technical scheme:
Diamond is cut abrasive disc, comprises that the diamond that is arranged on the matrix cuts abrasive disc, it is characterized in that described diamond cuts abrasive disc and be evenly distributed at circumferencial direction, and its surface has the ripple tank of heat radiation chip removal when being conducive to grinding.
Wherein, described matrix is the 65Mn steel.
Wherein, described diamond is cut the diamond concentration 25% in the abrasive disc material.
Wherein, described diamond is cut Sn, the Co of 8~15wt% of Ni, 5~8wt% of Fe, 8~10wt% that metallic bond in the abrasive disc material includes Cu, the 30~40wt% of 30~40wt%.
Wherein, the metallic bond that described diamond is cut in the abrasive disc material is pre-alloyed powder, described pre-alloyed powder is handled by water atomization and is obtained, and described pre-alloyed powder contains following component: Sn, the Co of 8~15wt% of Ni, 5~8wt% of Fe, 8~10wt% that includes Cu, the 30~40wt% of 30~40wt%.
Wherein, the metallic bond that described diamond is cut in the abrasive disc material is pre-alloyed powder, described pre-alloyed powder is handled by water atomization and is obtained, and described pre-alloyed powder is made up of following component: Sn, the Co of 8~15wt% of Ni, 5~8wt% of Fe, 8~10wt% that includes Cu, the 30~40wt% of 30~40wt%.
Wherein, the metallic bond that described diamond is cut in the abrasive disc material is pre-alloyed powder, described pre-alloyed powder is handled by water atomization and is obtained, and described pre-alloyed powder is made up of following component: include the Co of Sn, 8~15wt% of Ni, 5~8wt% of Fe, 8~10wt% of Cu, 30~40wt% of 30~40wt% and the Ce of 0.8-1.2wt%.
Wherein, the metallic bond that described diamond is cut in the abrasive disc material is pre-alloyed powder, described pre-alloyed powder is handled by water atomization and is obtained, and described pre-alloyed powder is made up of following component: include the Co of Si, 8~10wt% of Sn, 3-5wt% of Ni, 5~8wt% of Fe, 8~10wt% of Cu, 30~40wt% of 30~40wt% and the Ce of 0.8-1.2wt%.
Compared with prior art, the present invention has following beneficial effect:
Diamond of the present invention is cut abrasive disc matrix plane and is carved 2 road flume surface annular knurls, has guaranteed metallic bond with the matrix bonding strength, and performance is safe and reliable during use, the present invention has simple and reasonable, and cost of manufacture is low, flexible operation, the product sharpness is good, and the chip removal performance is good.
Description of drawings
Fig. 1 cuts the structural representation of abrasive disc for diamond of the present invention.
The specific embodiment
As shown in Figure 1, diamond of the present invention is cut abrasive disc, comprises that the diamond that is arranged on the matrix cuts abrasive disc, and described diamond is cut abrasive disc and is evenly distributed at circumferencial direction, and its surface has the ripple tank of heat radiation chip removal when being conducive to grinding.Described matrix is the 65Mn steel, and described diamond is cut 20~25 kilograms of diamond intensities in the abrasive disc material, and granularity is 30/40 or 40/50, concentration 25%.Diamond of the present invention is cut abrasive disc, can prepare by the following method:
1, metallic bond and diamond batch mixing, described diamond cut that granularity is 30/40 or 40/50 in the abrasive disc material, and concentration is 25%.
2, matrix processing: choose high-quality 65Mn steel matrix and carry out punching press, mill teeth, reaming, in order to guarantee that metallic bond is connected fastness with matrix, matrix surface is carried out grooving, matrix surface carries out embossing to be handled, metal powder and matrix are combined closely, can not come off during use;
3, compression moulding: matrix is positioned in the special-purpose cold_pressing mould, takes by weighing the constant weight powder and pour in the die cavity, powder is shakeout even with scraping pin, be pressed into patrix, be positioned in the hydraulic press platform, with 3.0t/cm
2Mould unloading takes out the semi-finished product pressed compact after the pressure compression moulding;
4, sintering: diamond is cut the abrasive disc base of colding pressing pack bell-type in freezing of a furnace, logical hydrogen is warmed up to 770~890 ℃ of the holding temperatures of setting, is incubated 90 minutes and comes out of the stove the back and cool off naturally.
5, spray paint and put the first edge on a knife or a pair of scissors: the diamond semi-finished product are cut abrasive disc after surface treatment, spray paint and put the first edge on a knife or a pair of scissors, diamond is fully exposed, then the packing warehouse-in.
Embodiment 1
Described diamond is cut abrasive disc and is adopted method for preparing to obtain, and the simple substance powder of described metallic bond for mixing, and the Sn of Ni, the 5wt% of Fe, the 10wt% of its Cu by 35wt%, 35wt% and the Co of 15wt% form.
Embodiment 2
Described diamond is cut abrasive disc and is adopted method for preparing to obtain, and the metallic bond that described diamond is cut in the abrasive disc material is pre-alloyed powder, described pre-alloyed powder is handled by conventional water atomization and is obtained, and described pre-alloyed powder is made up of following component: the Sn of Ni, the 5wt% of the Cu of 35wt%, the Fe of 35wt%, 10wt% and the Co of 15wt%.
Embodiment 3
Described diamond is cut abrasive disc and is adopted method for preparing to obtain, and the metallic bond that described diamond is cut in the abrasive disc material is pre-alloyed powder, described pre-alloyed powder is handled by conventional water atomization and is obtained, and described pre-alloyed powder is made up of following component: the Co of Sn, the 10wt% of Ni, the 5wt% of the Cu of 35wt%, the Fe of 38.8wt%, 10wt% and the Ce of 1.2wt%.
Embodiment 4
Described diamond is cut abrasive disc and is adopted method for preparing to obtain, and the metallic bond that described diamond is cut in the abrasive disc material is pre-alloyed powder, described pre-alloyed powder is handled by conventional water atomization and is obtained, and described pre-alloyed powder is made up of following component: include the Co of Si, 8wt% of Sn, 4wt% of Ni, 6wt% of Fe, 8wt% of Cu, 37.8wt% of 35wt% and the Ce of 1.2wt%.
The diamond that embodiment 1-4 prepares is cut the performance of abrasive disc (processing object: in hard marble stone material) as shown in table 1.
Table 1 diamond is cut the performance of abrasive disc
? |
Sintering temperature (℃) |
The grinding efficiency ratio |
The cutting efficiency ratio |
Cutting life-span ratio |
Embodiment 1 |
870 |
1 |
1 |
1 |
Embodiment 2 |
820 |
1.23 |
1.18 |
1.32 |
Embodiment 3 |
770 |
1.28 |
1.31 |
1.38 |
Embodiment 4 |
780 |
1.68 |
2.31 |
2.87 |
For the ordinary skill in the art, be to be understood that and do not breaking away from the scope disclosed by the invention, can adopt to be equal to and replace or equivalent transformation form enforcement above-described embodiment.Protection scope of the present invention is not limited to the specific embodiment of specific embodiment part, and the embodiment of short of disengaging invention essence all is interpreted as having dropped within the protection domain of requirement of the present invention.