CN105895793A - Novel aluminum substrate - Google Patents
Novel aluminum substrate Download PDFInfo
- Publication number
- CN105895793A CN105895793A CN201610353851.3A CN201610353851A CN105895793A CN 105895793 A CN105895793 A CN 105895793A CN 201610353851 A CN201610353851 A CN 201610353851A CN 105895793 A CN105895793 A CN 105895793A
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer
- heat
- conductive layer
- novel aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 30
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 230000004888 barrier function Effects 0.000 claims description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 210000002421 cell wall Anatomy 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 3
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract 4
- 238000001816 cooling Methods 0.000 abstract 3
- 239000004411 aluminium Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a novel aluminum substrate. The novel aluminum substrate comprises a bottom substrate, an insulation layer and a conductive layer, wherein the insulation layer and the conductive layer are sequentially laminated on the bottom substrate, round grooves are formed in the conductive layer and are arranged in an array way, the cross section of each round groove is of an inverted trapezoidal structure with a wide upper part and a narrow lower part, the bottoms of the round grooves pass through the insulation layer and the conductive layer and extend to the bottom substrate, a heat conduction layer is arranged at the bottoms of the round grooves, a light reflection plate is arranged at the upper side of the heat conduction layer, a light reflection ring is arranged on a groove wall of each round groove, conductive blocks are embedded in the light reflection ring and are symmetrically arranged, one end of each conductive block is connected with the conductive layer, the other ends of the conductive blocks are connected with binding posts, a cylindrical groove is formed in the bottom substrate, and a cooling fin covers the bottom of the cylindrical groove and the groove wall. In the novel aluminum substrate, heat is prevented from being completely transferred through the insulation layer, the cooling speed of the cooling fin is effectively increased, moreover, a heat sink is not needed to be additionally arranged at the lower side of the bottom substrate, the thickness of the aluminum substrate is reduced, and the novel aluminum substrate is convenient to install and disassemble.
Description
Technical field
The present invention relates to aluminium base technical field, particularly relate to a kind of Novel aluminum base plate.
Background technology
Aluminium base is a kind of Metal Substrate copperclad plate with good heat radiating function, and general single sided board is made up of three-decker, is circuit layer (Copper Foil), insulating barrier and metal-based layer respectively.Also being designed as dual platen for high-end use, structure is circuit layer, insulating barrier, aluminum base, insulating barrier, circuit layer.Only a few application is multi-layer sheet, can be formed with insulating barrier, the laminating of aluminum base by common multi-layer sheet.
Aluminium base is common in LED illumination product, and main flow is electronics aluminium base in the market, and corresponding aluminium base heat conductivity is everybody parameter of interest, and heat conductivity is the highest is just to represent one of the best mark of performance.Aluminium base of the prior art is the most all by circuit layer, insulating barrier and metal-based layer are constituted, good heat conductivity must be possessed again owing to insulating barrier should have higher insulating properties, it arranges aspect have higher requirement with layer thickness in terms of selection, the especially substantial amounts of heat of LED chip generation quickly to be passed by insulating barrier and metal-based layer, this makes the thickness of insulating barrier and metal-based layer receive certain restriction, sometimes have to reduce the thickness of whole sheet material to improve the heat dispersion of aluminium base, sacrifice the intensity of sheet material, cause the shortening in sheet material life-span；If focusing on the contrary the quality of sheet material, strengthening the thickness of sheet material, inevitably resulting in its radiating effect and reducing, had influence on the service life of LED chip, and increase can the use of material, improve the cost of manufacture of sheet material.
To this end, it is proposed that a kind of Novel aluminum base plate solves the problems referred to above.
Summary of the invention
The invention aims to solve shortcoming present in prior art, and a kind of Novel aluminum base plate proposed.
To achieve these goals, present invention employs following technical scheme:
nullA kind of Novel aluminum base plate，The insulating barrier including substrate and being sequentially overlapped on this substrate and conductive layer，Described conductive layer is provided with the circular groove of distribution in array，The cross section of described circular groove is inverted trapezoidal structure wide at the top and narrow at the bottom，And the bottom of circular groove extends on substrate through insulating barrier and conductive layer，The bottom of described circular groove is provided with heat-conducting layer，The upside of described heat-conducting layer is provided with reflector,The cell wall of described circular groove is provided with taperedchromeplatedbezel，And taperedchromeplatedbezel is positioned at the top of heat-conducting layer，Symmetrically arranged conducting block it is embedded with inside described taperedchromeplatedbezel，Described conducting block one end is connected with conductive layer，And the conducting block other end is connected with binding post，Described binding post is positioned at the upside of reflector，Described substrate is provided with the cylindrical groove being correspondingly arranged with circular groove，It is all covered with fin on the bottom of described cylindrical groove and cell wall.
Preferably, described insulating barrier uses alumina ceramic material.
Preferably, described heat-conducting layer uses heat-conducting silicone grease.
Preferably, described fin is the paillon foil that copper magnesium alloy is made.
With prior art ratio, the invention have the benefit that by arranging circular groove on the electrically conductive, and the bottom of circular groove is arranged on substrate, LED chip in circular groove can transfer heat to fin by heat-conducting layer, again fin is arranged in the cylindrical groove on substrate, avoid fully relying on insulating barrier transmission heat, the effective radiating rate improving fin, and without separately setting radiator in the downside of substrate, decrease the thickness of aluminium base, it is convenient for installation and removal, simultaneously in the case of ensureing aluminium base intensity, reduce the usage amount of metal material, reduce cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of Novel aluminum base plate that the present invention proposes；
Fig. 2 is the top view in Fig. 1 after partial enlargement at A；
Fig. 3 is the side view in Fig. 1 after partial enlargement at A；
Fig. 4 is the upward view in Fig. 1 after partial enlargement at A.
In figure: 1 substrate, 2 insulating barriers, 3 conductive layers, 4 circular grooves, 5 heat-conducting layers, 6 taperedchromeplatedbezels, 7 conducting blocks, 8 binding posts, 9 cylindrical grooves, 10 fin, 11 reflectors.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
nullWith reference to Fig. 1-4，A kind of Novel aluminum base plate，The insulating barrier 2 including substrate 1 and being sequentially overlapped on this substrate 1 and conductive layer 3，Insulating barrier 2 uses alumina ceramic material，Aluminium oxide ceramics ceramic material itself does not put aside heat，And it is strong to have insulating properties、The characteristic that thermal conductivity is high，In contrasting with traditional insulant，Decrease the insulating barrier impact for thermal effect，Conductive layer 3 is provided with the circular groove 4 of distribution in array，Circular groove 4 is used for preventing LED chip，The cross section of circular groove 4 is inverted trapezoidal structure wide at the top and narrow at the bottom，And the bottom of circular groove 4 extends on substrate 1 through insulating barrier 2 and conductive layer 3，The bottom of circular groove 4 is provided with heat-conducting layer 5，Heat-conducting layer 5 uses heat-conducting glue to use heat-conducting silicone grease，The upside of heat-conducting layer 5 is provided with reflector 11,The cell wall of circular groove 4 is provided with taperedchromeplatedbezel 6，And taperedchromeplatedbezel 6 is positioned at the top of heat-conducting layer 5，，Taperedchromeplatedbezel 6 and reflector 11 can effectively reflect the pipeline that LED chip sends，Taperedchromeplatedbezel 6 is internal is embedded with symmetrically arranged conducting block 7，Conducting block 7 one end is connected with conductive layer 3，And conducting block 7 other end is connected with binding post 8，Conductive layer 3、Conducting block 7 and binding post 8 form path，Power for LED chip，Binding post 8 is positioned at the upside of reflector 11，Substrate 1 is provided with the cylindrical groove 9 being correspondingly arranged with circular groove 4，Fin 10 it is all covered with on the bottom of cylindrical groove 9 and cell wall，Fin 10 uses the paillon foil that copper magnesium alloy is made.
In the present invention, by arranging circular groove 4 on conductive layer 3, and the bottom of circular groove 4 is arranged on substrate 1, LED chip in circular groove 4 can transfer heat to fin by heat-conducting layer, and by being arranged by fin in the cylindrical groove 9 on substrate, improve the radiating rate of fin.
The above; it is only the present invention preferably detailed description of the invention; but protection scope of the present invention is not limited thereto; any those familiar with the art is in the technical scope that the invention discloses; according to technical scheme and inventive concept equivalent or change in addition thereof, all should contain within protection scope of the present invention.
Claims (4)
- null1. a Novel aluminum base plate，The insulating barrier (2) including substrate (1) and being sequentially overlapped on this substrate (1) and conductive layer (3)，It is characterized in that，Described conductive layer (3) is provided with the circular groove (4) of distribution in array，The cross section of described circular groove (4) is inverted trapezoidal structure wide at the top and narrow at the bottom，And the bottom of circular groove (4) extends on substrate (1) through insulating barrier (2) and conductive layer (3)，The bottom of described circular groove (4) is provided with heat-conducting layer (5)，The upside of described heat-conducting layer (5) is provided with reflector (11),The cell wall of described circular groove (4) is provided with taperedchromeplatedbezel (6)，And taperedchromeplatedbezel (6) is positioned at the top of heat-conducting layer (5)，Described taperedchromeplatedbezel (6) is internal is embedded with symmetrically arranged conducting block (7)，Described conducting block (7) one end is connected with conductive layer (3)，And conducting block (7) other end is connected with binding post (8)，Described binding post (8) is positioned at the upside of reflector (11)，Described substrate (1) is provided with the cylindrical groove (9) being correspondingly arranged with circular groove (4)，Fin (10) it is all covered with on the bottom of described cylindrical groove (9) and cell wall.
- A kind of Novel aluminum base plate the most according to claim 1, it is characterised in that described insulating barrier (2) uses alumina ceramic material.
- A kind of Novel aluminum base plate the most according to claim 1, it is characterised in that described heat-conducting layer (5) uses heat-conducting silicone grease.
- A kind of Novel aluminum base plate the most according to claim 1, it is characterised in that described fin (10) uses the paillon foil that copper magnesium alloy is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610353851.3A CN105895793A (en) | 2016-05-25 | 2016-05-25 | Novel aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610353851.3A CN105895793A (en) | 2016-05-25 | 2016-05-25 | Novel aluminum substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105895793A true CN105895793A (en) | 2016-08-24 |
Family
ID=56717611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610353851.3A Pending CN105895793A (en) | 2016-05-25 | 2016-05-25 | Novel aluminum substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105895793A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112017550A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof and display device |
-
2016
- 2016-05-25 CN CN201610353851.3A patent/CN105895793A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112017550A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Display panel, manufacturing method thereof and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160824 |
|
| WD01 | Invention patent application deemed withdrawn after publication |