CN105870193B - 一种坚固的功率半导体场效应晶体管结构 - Google Patents
一种坚固的功率半导体场效应晶体管结构 Download PDFInfo
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- CN105870193B CN105870193B CN201610362466.5A CN201610362466A CN105870193B CN 105870193 B CN105870193 B CN 105870193B CN 201610362466 A CN201610362466 A CN 201610362466A CN 105870193 B CN105870193 B CN 105870193B
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- lightly doped
- source region
- heavy doping
- power semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 230000005669 field effect Effects 0.000 title claims abstract description 12
- 239000011229 interlayer Substances 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000009825 accumulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610362466.5A CN105870193B (zh) | 2016-05-26 | 2016-05-26 | 一种坚固的功率半导体场效应晶体管结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610362466.5A CN105870193B (zh) | 2016-05-26 | 2016-05-26 | 一种坚固的功率半导体场效应晶体管结构 |
Publications (2)
Publication Number | Publication Date |
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CN105870193A CN105870193A (zh) | 2016-08-17 |
CN105870193B true CN105870193B (zh) | 2019-01-01 |
Family
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Family Applications (1)
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CN201610362466.5A Active CN105870193B (zh) | 2016-05-26 | 2016-05-26 | 一种坚固的功率半导体场效应晶体管结构 |
Country Status (1)
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CN (1) | CN105870193B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000019540A1 (en) * | 1998-09-26 | 2000-04-06 | Koninklijke Philips Electronics N.V. | Bi-directional semiconductor switch, and switch circuit for battery-powered equipment |
CN101515584A (zh) * | 2009-04-08 | 2009-08-26 | 扬州扬杰电子科技有限公司 | 一种用mos工艺结构集成的二极管芯片 |
CN201425941Y (zh) * | 2009-04-08 | 2010-03-17 | 扬州扬杰电子科技有限公司 | 用mos工艺结构集成的二极管芯片 |
CN101894865A (zh) * | 2009-05-21 | 2010-11-24 | 中芯国际集成电路制造(北京)有限公司 | 碰撞电离金属氧化物半导体晶体管及制造方法 |
US20130032812A1 (en) * | 2011-08-04 | 2013-02-07 | Epowersoft, Inc. | Method and system for a gan vertical jfet utilizing a regrown channel |
US20130137230A1 (en) * | 2011-11-30 | 2013-05-30 | Infineon Technologies Austria Ag | Semiconductor Device with Field Electrode |
-
2016
- 2016-05-26 CN CN201610362466.5A patent/CN105870193B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000019540A1 (en) * | 1998-09-26 | 2000-04-06 | Koninklijke Philips Electronics N.V. | Bi-directional semiconductor switch, and switch circuit for battery-powered equipment |
CN101515584A (zh) * | 2009-04-08 | 2009-08-26 | 扬州扬杰电子科技有限公司 | 一种用mos工艺结构集成的二极管芯片 |
CN201425941Y (zh) * | 2009-04-08 | 2010-03-17 | 扬州扬杰电子科技有限公司 | 用mos工艺结构集成的二极管芯片 |
CN101894865A (zh) * | 2009-05-21 | 2010-11-24 | 中芯国际集成电路制造(北京)有限公司 | 碰撞电离金属氧化物半导体晶体管及制造方法 |
US20130032812A1 (en) * | 2011-08-04 | 2013-02-07 | Epowersoft, Inc. | Method and system for a gan vertical jfet utilizing a regrown channel |
US20130137230A1 (en) * | 2011-11-30 | 2013-05-30 | Infineon Technologies Austria Ag | Semiconductor Device with Field Electrode |
Also Published As
Publication number | Publication date |
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CN105870193A (zh) | 2016-08-17 |
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C06 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20170601 Address after: The exhibition of Guangdong Torch Development Zone, 528437 East Road Zhongshan City, No. 16 digital building room 1606 Applicant after: HONSON TECHNOLOGIES LTD. Address before: 528437 No. 32, Dong Dong Road, East Town, Guangdong, Zhongshan Applicant before: ZHONGSHAN GANGKE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20221121 Address after: Room 112-30, No.262, Binhai 4th Road, Hangzhou Bay New District, Ningbo, Zhejiang 315000 Patentee after: Ningbo Jisai Semiconductor Co.,Ltd. Address before: 528437 room 1606, digital building, No. 16, exhibition East Road, Torch Development Zone, Zhongshan City, Guangdong Province Patentee before: HONSON TECHNOLOGIES LTD. |
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