CN105814978A - 双重绝缘散热器 - Google Patents
双重绝缘散热器 Download PDFInfo
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- CN105814978A CN105814978A CN201580002932.2A CN201580002932A CN105814978A CN 105814978 A CN105814978 A CN 105814978A CN 201580002932 A CN201580002932 A CN 201580002932A CN 105814978 A CN105814978 A CN 105814978A
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- 239000000463 material Substances 0.000 claims abstract description 17
- 238000009413 insulation Methods 0.000 claims description 15
- 239000011469 building brick Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000005286 illumination Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 description 10
- 239000011230 binding agent Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000004888 barrier function Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 208000010138 Diastema Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 235000012364 Peperomia pellucida Nutrition 0.000 description 1
- 240000007711 Peperomia pellucida Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000000475 diastema Anatomy 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 230000004899 motility Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H05K2201/06—Thermal details
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Abstract
用于供电气设备进行热管理的装置。在一个实施方式中,装置包括:初级散热器,设置在外壳内,其中,外壳包括印刷电路板(PCB),PCB布置有至少一个电子组件,初级散热器是热传导的,外壳的内部至少部分填充有封装材料;次级散热器,联接至外壳的第一壁的外表面,其中次级散热器是热传导的;以及热界面,联接在初级散热器与PCB之间,其中热界面是热传导且电绝缘的。
Description
发明背景
技术领域
本公开的实施方式大体涉及使由高电压电子设备生成的热量消散,更具体地,涉及用于使由高电压电子设备生成的热量消散的双重绝缘散热器。
背景技术
对于工作期间发热的高压电子设备,诸如功率转换器、高强度LED照明设备和高压光伏模块,热管理是重要设计因素。必须使用热管理技术,以使各高压电功率设备在工作期间所生成的热量高效地消散。
因此,本领域需要供电子设备进行高效热管理的装置。
发明内容
如权利要求更完整地阐述,本发明的实施方式大体涉及供电子设备进行热管理的装置,该装置大体如至少一个附图所示和/或如结合至少一个附图所描述。
通过结合附图参照本公开的以下具体说明,可以理解本公开的这些以及其它特征和有益效果,在全部附图中,相同的参考标记表示相同的部件。
附图说明
所以,为了能够详细理解本发明的上述特征,可以通过参照实施方式对以上简要概括的本发明进行详细描述,其中,附图示出了这些实施方式中的一些。然而,应当注意,附图仅示出了本发明的典型实施方式,因此不解释成限制本发明,因为本发明可允许其它同样有效的实施方式。
图1是根据本发明一个或多个实施方式的设备箱组件的剖视图;
图2是根据本发明一个或多个替代实施方式的设备箱组件的成角度的俯视立体图;
图3是根据本发明一个或多个实施方式沿图2的线3-3截取的设备箱组件的成角度的立体剖视图;
图4是根据图2所示实施方式的设备箱组件的成角度的仰视立体图;以及
图5是使用本发明一个或多个实施方式用于功率转换的系统的框图。
具体实施方式
图1是根据本发明一个或多个实施方式的设备箱组件100的剖视图。设备箱组件100是电子设备并且包括外壳102,外壳102中设置有印刷电路板(PCB)108,PCB108布置有多个高热密度电子组件104-1和104-2。虽然示出了两个电子组件,但是在其它实施方式中,PCB108上可安装更多或更少的电子组件(以及任何其它必要的组件)。外壳102是用于包覆PCB108的尺寸和形状经适当设计的外壳,并由诸如硬质塑料(例如,聚碳酸酯、高密度聚乙烯(HDPE)、聚乙烯醚(PPE)、以及这些化合物与玻璃和其它填充物的混合物)的绝缘材料形成,外壳102还提供补充绝缘层。
导热孔106-1和导热孔106-2通过PCB108分别从电子组件104-1和104-2延伸至PCB108的下侧,以将热量带离电子组件104-1和104-2。外壳102内沿其一内壁设置有初级散热器112;初级散热器112可由诸如铝和铜或者石墨组合物的高热导率材料形成。初级散热器112和PCB108下侧之间联接有热界面110,以将初级散热器112联接至组件104-1和104-2;热界面110是诸如粘合剂或热焊盘的热传导和电绝缘界面材料(例如,填充有金属氧化物或陶瓷或者玻璃颗粒的硅树脂或环氧树脂基体)。热界面110可以通过粘合剂(诸如热粘合剂)既联接至PCB108又联接至初级散热器112。在一些实施方式中,初级散热器112通过绝缘(例如,聚合物)机械可搭锁(snap-on)紧固件118-1和118-2(以虚位示出)机械联接至PCB108的外围区域或内部区域,其中紧固件118-1和118-2用于在粘合剂固化时将PCB/热界面/初级散热器保持在适当位置。
在外壳102内设置诸如聚合物铸封或保形涂层的封装材料116或将该封装材料116直接涂敷到PCB108,从而使得外壳102的内部至少部分被封装材料116填充(在一些实施方式中内部可以完全被填充)。封装材料116可以是用于防止电子组件104-1和104-2与诸如空气、湿气、盐、酸等潜在有害元素接触的任何合适材料,诸如聚氨基甲酸酯、聚酰亚胺、环氧树脂、硅树脂等。封装材料116可进行湿固化,以使得其在暴露给空气之后变硬,或者可以通过光、热或其它适当的硬化手段变硬,以形成经封装的设备箱组件100。也可以首先在初始制造步骤中将封装材料116涂敷到PCB108,其次通过包覆成型或注入成型步骤形成外壳102。
次级散热器114沿外壳102的外侧(即外部)表面联接,以消除来自PCB108其它区域的、没有被初级散热器112解决的热量。在一些实施方式中,诸如图1所示的实施方式,次级散热器114联接到外壳102的壁的外部上,且该壁与上面联接有初级散热器112的壁相同。次级散热器114可以由诸如铜、铝或石墨填充组合物的热传导材料形成。次级散热器114可以在外壳102成型的同时连接到组件,或者与外壳102预组装在一起。可替代地,可作为组装过程的最终步骤或者在将设备箱100安装到其目的性应用之前,将次级散热器114附接至外壳102。
外壳102安全包围PCB108的带电部件(即,电子组件104),以获得加强绝缘或双重绝缘的认可等级。外壳102不需要次级散热器114来安全包围PCB108的带电部件。初级散热器112使设备箱组件100内生成的热量分散以通过外壳102将其散除;次级散热器114将来自外壳102外表面的热量分散到与围绕设备箱组件100的环境空气交换的更大区域。如在制造结合过程或粘合过程中常见的,初级散热器112和外壳102的内表面之间可存在薄的粘合剂或间隙填充层(即,中间层124)。类似地,次级散热器114和外壳102的外表面之间也可存在薄的粘合剂或间隙填充材料(即,中间层126)。此外,外壳102可具有模制进的对准销,该对准销在组装期间将初级散热器112和次级散热器114固定在适当位置。
根据本发明的一个或多个实施方式,初级散热器112和次级散热器114与PCB108和外壳102集成在一起,并且通过多个单独的绝缘层(例如,热界面110、封装材料116和外壳102)与带电部件绝缘。本发明的实施方式为暴露的金属散热器提供了双层电绝缘并提高了对于湿气进入的鲁棒性。热界面110和涂覆封装材料116的初始封装步骤(例如,在较早的制造步骤中,利用铸封材料铸封外壳102或将保形涂层涂敷至PCB108)限定基础绝缘层,而初级散热器112与次级散热器114之间单独的绝缘层(例如,外壳102)限定补充绝缘。通过有意地不将绝缘紧固件118-1和118-2定位在基础绝缘层与补充绝缘层之间(即,在热界面110/封装材料116与外壳102之间)的同一处,防止了封装过程中任何缺陷发生在同一处,进而增加了湿气进入的鲁棒性。
在外壳102由聚合物形成的一个或多个实施方式中,只要产品可达到“双重绝缘”等级(II级),聚合物外壳的使用便允许设备箱组件100不接地,从而消除对接地线的需求和接地线所引入的成本(即,将常规导电外壳用作外壳102意味着该外壳应接地到设备接地导体(I级产品),且由于联接至设备箱组件100的AC电缆需要添加该接地线并且必须在AC电缆中使用额外的触头,因而增加了产品成本)。
与必须用螺栓安装至PCB108以接地并且仅具有单个绝缘层的金属外壳相比,本发明还能够改善热管理并减少PCB108上的应力。当与使用金属外壳的情况相比时,由于材料利用率更高(使用的金属更少)且简化了制造过程(更少的步骤和子组件,使用注射成型和包覆成型取代螺栓紧固件和螺纹孔以及粘合密封环),本发明还降低了设备箱组件100的生产成本。
在一些实施方式中,设备箱组件100可以是联接到电力源(例如,电池,诸如光伏(PV)模块、风力发电机、水电系统等的可再生能量源)的功率转换器(例如,DC-DC、DC-AC、AC-DC或AC-AC功率转换器)。在某些实施方式中,设备箱组件100是一种功率转换器,该功率转换器应用于包括联接到电力源的多个功率转换器的系统,诸如具有联接到多个PV模块的多个功率转换器的太阳能系统。在一个或多个具体实施方式中,设备箱组件100是DC-AC变换器并且初级散热器112包括彼此电隔离的两个部分(例如两个铝件)。例如,初级散热器112的第一部分可以位于变换器中的变压器的初级侧(即,第一部分联接至变换器的DC级);而初级散热器112的第二部分可以位于变压器的次级侧(即,第二部分联接至变换器的AC级)。在该实施方式中,变换器被认为是双重绝缘系统。
在其它实施方式中,设备箱组件100可以是在上表面上具有光学窗的LED照明设备。
图2是根据本发明一个或多个替换实施方式的设备箱组件100的成角度的俯视立体图。如图2中所示,次级散热器114大体是L形(尽管可替代地可以具有其它形状),并且粘附至外壳周界的外顶部,例如沿着外壳102顶部的右下角进行粘附。次级散热器114的高热消散部202的尺寸设计成使得该高热消散部202覆盖外壳102内的高热消散区域。如图2所示,高热消散部202大体为圆形并且位于次级散热器114的一端,但是在其它实施方式中,高热消散部202可以具有不同的形状和/或位于次级散热器114的不同区域。
如图2所示,次级散热器114还包括安装部204,该安装部204例如沿着次级散热器114的角落/右手边缘。安装部204包括用于将设备箱组件100机械固定至机械结构的多个安装特征部(例如,一个或多个紧固槽、紧固孔、凸缘、机械夹等)。例如,在一些实施方式中,设备箱组件100可以是经由安装部204机械安装到光伏(PV)模块的功率转换器,其中,功率转换器进一步电联接至PV模块,以接收来自PV模块的DC功率并生成DC输出功率或AC输出功率。
图3是根据本发明一个或多个实施方式沿图2的线3-3截取的设备箱组件100的成角度的立体剖视图。在所示实施方式中,初级散热器112设置在PCB108与外壳102之间并位于设备箱组件100底部。次级散热器114联接至外壳102顶端的外部,以使得高热消散部202接近外壳102内的高热消散区域304。
次级散热器114还包括用于将次级散热器114机械联接至外壳102的弹簧锁定特征件302。在中间层126为粘合剂的实施方式中,弹簧锁定特征件302可用于在粘合剂固化时将次级散热器114保持在适当的位置。
图4是根据图2所示实施方式的设备箱组件100的成角度的仰视立体图。如图4所示,次级散热器114的安装部204延伸超过外壳102的侧部。如图4可见,次级散热器114包括第二弹簧锁定特征件402,第二弹簧锁定特征件402位于次级散热器114的与弹簧锁定特征件302相对的一侧。弹簧锁定特征件302和402将次级散热器114机械连接至外壳102。在一些实施方式中,弹簧锁定特征件302和402中的一者或两者可以位于次级散热器114上的不同位置。虽然图4示出了两个弹簧锁定特征件302和402,但是该机械锁定特征件的数量、位置和种类可以变化。例如,次级散热器114和/或外壳102可包括用于将次级散热器114机械联接至外壳102的其它机械紧固特征件,诸如弹簧锁定夹、卡扣夹等。
在一些实施方式中,可以在将设备箱组件100安装到其目的性应用中之前才将次级散热器114附接至外壳102。例如,在一些实施方式中,设备箱组件100是在房主的太阳能系统中使用的功率转换器,并且在太阳能系统的安装期间,次级散热器114可以(例如,通过涂敷少量粘合剂以及将各部分搭(snapping)在适当位置)附接至位于房主的位置处的外壳102。分配(例如,运送)尚未附接次级散热器114的外壳102的一个优势在于,增加了可如何使用设备箱组件100的灵活性。例如,如果在太阳能系统中,设备箱组件100表示框架附接装置而不是轨道附接装置,则次级散热器114可具有不同形状的安装部204;或者外壳102可迅速运送到不同的工件且安装可基于所需安装部204在装置之前才被配置。
图5是使用本发明一个或多个实施方式用于功率转换的系统500的框图。该图仅示出了可利用本发明的各种可能的系统配置和设备的一个变型。本发明可应用于使用在工作期间发热的电子设备的任意系统或设备中,其中,该电子设备诸如为功率转换器(即,DC-DC转换器、DC-AC转换器、AC-DC转换器或者AC-AC转换器)、高强度LED照明设备等。
系统500包括:多个功率转换器202-1、202-2…202-N,共同称为功率转换器202;多个DC电力源504-1、504-2…504-N,共同称为DC电力源504;控制器506;总线508;以及负载中心510。功率转换器502中的每一个都是设备箱组件100的实施方式。
DC电力源504可以是用于提供DC功率的任何合适DC源,诸如来自前一个功率转换级的输出、电池、可再生能量源(例如,太阳能电池板或光伏(PV)模块、风力发电机、水电系统或类似的可再生能量源)等。
每个功率转换器502-1、502-2…502-N以一对一的对应关系分别联接至DC电力源504-1、504-2…504-N,尽管在一些替代实施方式中,多个DC电力源504可以联接到单个功率转换器502。功率转换器502经由总线508联接至控制器506。控制器506能够通过无线通信和/或有线通信(例如,输电线通信)与功率转换器502通信,例如以可操作地对功率转换器502进行控制、从功率转换器502收集数据等。功率转换器502还经由总线508联接至负载中心510。
功率转换器502将来自DC电力源504的DC功率转换成输出功率。在一些实施方式中,输出功率可以是DC输出功率(即,功率转换器502是DC-DC转换器);而在其它实施方式中,输出功率可以是AC输出功率(即,功率转换器502是DC-AC转换器)。功率转换器502经由总线508将生成的输出功率联接到负载中心510。然后,生成的功率可以被分配到例如一个或多个应用以供使用,和/或生成的能量可例如利用电池、热水、液压泵送、水-氢转换等被储存以供之后使用。在一些实施方式中,功率转换器502将DC输入功率转换成符合商用电网的AC功率,并且经由负载中心510将AC功率联接到商用电网。
根据本发明一个或多个实施方式,功率转换器502中的每一个包括初级散热器和次级散热器(初级散热器112和次级散热器114)以及用于隔离散热器的多层电绝缘(例如,热界面110/封装材料116和外壳102),以提供热管理。在某些实施方式中,每个功率转换器502的外壳(即,外壳102)由聚合物形成,以使每个功率转换器502达到双重绝缘等级(II级),从而消除功率转换器502接地的需求。在一个或多个这样的实施方式中,每个功率转换器502都是DC-AC变换器,并且功率转换器502的初级散热器(即,初级散热器112)包括彼此电隔离的两个部分(诸如两个铝件)。例如,对于每个功率转换器502来说,初级散热器的第一部分位于功率转换器502的变压器的初级侧(即,第一部分联接到功率转换器502的DC级),而初级散热器的第二部分位于变压器的次级侧(即,第二部分联接至功率转换器502的AC级)。
在一个或多个实施方式中,功率转换器502中的每一个都是图2至图4所示的设备箱组件100的实施方式,并且功率转换器502通过次级散热器的安装部(即,安装部204)各自机械安装到相应DC功率源504。
本发明实施方式的以上描述包括执行如所述各种功能的诸多元件、设备、电路和/或组件。这些元件、设备、电路和/或组件是用于执行其分别描述的功能的装置的示例性实施例。
虽然前文集中在本发明的实施方式,但是在没有背离本发明的基本范围的情况下,可以想到本发明的其它和进一步的实施方式,并且本发明的范围由以下权利要求限定。
Claims (15)
1.用于供电气设备进行热管理的装置,包括:
初级散热器,设置在外壳内,其中,所述外壳包括印刷电路板(PCB),所述PCB布置有至少一个电子组件,所述初级散热器是热传导的,所述外壳的内部至少部分填充有封装材料;
次级散热器,联接至所述外壳的第一壁的外表面,其中,所述次级散热器是热传导的;以及
热界面,联接在所述初级散热器与所述PCB之间,其中所述热界面是热传导且电绝缘的。
2.如权利要求1所述的装置,其中,所述初级散热器沿所述第一壁的内表面设置。
3.如权利要求1或2所述的装置,其中,所述外壳由绝缘材料形成。
4.如权利要求1至3中的任一项所述的装置,其中,所述热界面通过多个热通孔热联接到所述至少一个电子组件,所述多个热通孔通过所述PCB从所述至少一个电子组件延伸到所述热界面。
5.如权利要求1至4中的任一项所述的装置,其中,所述热界面通过热粘合剂联接至所述PCB和所述初级散热器中的每一个。
6.如权利要求1至5中的任一项所述的装置,其中,所述PCB通过至少一个绝缘机械紧固件机械联接至所述初级散热器。
7.如权利要求1所述的装置,其中,所述初级散热器包括第一部分和第二部分,所述第一部分和所述第二部分彼此电隔离。
8.如权利要求1至6中的任一项所述的装置,其中,所述外壳是LED照明设备的一部分。
9.如权利要求1至6中的任一项所述的装置,其中,所述外壳是功率转换器的一部分。
10.如权利要求9所述的装置,其中,所述外壳由聚合物形成。
11.如权利要求10所述的装置,其中,所述功率转换器具有II级双重绝缘等级。
12.如权利要求9至11中的任一项所述的装置,其中,所述功率转换器为DC-AC变换器。
13.如权利要求12所述的装置,其中,所述初级散热器包括第一部分和第二部分,所述初级散热器的第一部分联接至所述DC-AC变换器的DC级,而所述初级散热器的第二部分联接至所述DC-AC变换器的AC级。
14.如权利要求9至13中的任一项所述的装置,还包括用于提供DC输入功率的、联接至所述功率转换器的可再生能量源。
15.如权利要求14所述的装置,其中,所述可再生能量源为光伏(PV)模块。
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Also Published As
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WO2015105849A1 (en) | 2015-07-16 |
US20150195956A1 (en) | 2015-07-09 |
US10098261B2 (en) | 2018-10-09 |
CN105814978B (zh) | 2018-06-22 |
US9480185B2 (en) | 2016-10-25 |
US20170020033A1 (en) | 2017-01-19 |
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