CN105802581A - Waterborne grinding fluid for sapphire wafer processing - Google Patents
Waterborne grinding fluid for sapphire wafer processing Download PDFInfo
- Publication number
- CN105802581A CN105802581A CN201610184744.2A CN201610184744A CN105802581A CN 105802581 A CN105802581 A CN 105802581A CN 201610184744 A CN201610184744 A CN 201610184744A CN 105802581 A CN105802581 A CN 105802581A
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- CN
- China
- Prior art keywords
- sapphire wafer
- acid
- polishing liquid
- aqueous polishing
- processing aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Lubricants (AREA)
Abstract
The invention discloses waterborne grinding fluid for sapphire wafer processing.The waterborne grinding fluid is composed of organic acid, organic amine, a corrosion inhibitor, a lubricant additive, a novel surfactant, water and a defoamer.The waterborne grinding fluid is good in lubricating performance, good in abrasive dust settling performance and high in product safety and hygiene quality.
Description
Technical field
The present invention relates to a kind of sapphire wafer processing aqueous polishing liquid.
Background technology
The grinding precision of sapphire wafer requires high (after attrition process wafer surface flatness≤5 μm), owing to domestic R&D work is started late and technique, the reason such as backward in technique, the lapping liquid of present domestic use is all from developed country's imports such as Japan, domestic at present also have many producers to develop this lapping liquid one after another, but there is many defects: one is that greasy property is general, does not reach requirement on machining accuracy；Two is that abrasive dust settleability is poor, and crystal face easily scratches impaired；Three is the material adding chlorine etc. to human body and bad environmental.These drawbacks constrain product especially popularization in high-end user in user.
Summary of the invention
It is an object of the invention to provide the sapphire wafer processing aqueous polishing liquid that a kind of greasy property is good, abrasive dust settling property is good, product safety hygienic quality is high.
The technical solution of the present invention is:
A kind of sapphire wafer processing aqueous polishing liquid, is characterized in that: be made up of the component of following weight percents:
Organic acid 2-15%
Organic amine 10-25%
Corrosion inhibiter 0.5-3%
Lubricating additive 3-12%
Novel surfactant 15-25%
Water 20-45%
Defoamer 0.5-3%
The consumption sum of above-mentioned each component is 100%.
Organic acid be dodecanedioic acid, Nitrodracylic acid or sulfamic acid compound, to one or more in hexyl benzene formic acid, n-nonanoic acid, neodecanoic acid between the tert-butyl group.
Organic amine is one or more in monoethanolamine, three b propanol amine, isopropanolamine, hydroxyethylethylene diamine.
Corrosion inhibiter is one or more in BTA, 2-mercaptobenzothiazole.
Lubricating additive is one or more in non-sulfur and non-phosphorus water-soluble organic molybdenum additive, cetomacrogol 1000, Macrogol 2000.
Novel surfactant is one or more in polyoxyethylene poly-oxygen propylene aether, polyvinylamine, fatty alcohol-polyoxyethylene ether, propylene glycol block polyether.
Defoamer is emulsified silicone oil.
Greasy property of the present invention is good, abrasive dust settling property is good, product safety hygienic quality high.
1, this product selects non-sulfur and non-phosphorus water-soluble organic molybdenum additive and high-quality additive compatibility, makes the greasy property of product obtain higher lifting (through laboratory test, during 5% diluent, tapping torque≤250N cm).
2, this product select function admirable propylene glycol block polyether novel surfactant group 5, make the abrasive dust settleability of product obtain bigger raising (during 5% diluent, abrasive dust sedimentation time≤5S).
3, this product Raw does not use the harmful substance jeopardizing health and Environmental security, the safety and sanitation quality making product is increased dramatically (after testing, product acute oral toxicity LD50 >=5000mg/kg, acute inhalation toxicity LC50 >=5000mg/m3, respiratory mucosa stimulus intensity is 0 grade).
Below in conjunction with embodiment, the invention will be further described.
Detailed description of the invention
Embodiment 1:
A kind of sapphire wafer processing aqueous polishing liquid, is mixed together by the component of following weight percents:
Dodecanedioic acid 4%
Isopropanolamine 8%
Three b propanol amine 11%
N-nonanoic acid 5%
Non-sulfur and non-phosphorus water-soluble organic molybdenum additive
(adopting China Patent Publication No.: the non-sulfur and non-phosphorus water-soluble organic molybdenum additive disclosed in CN102453590A) 7%
Propylene glycol block polyether 20%
Polyvinylamine 2.5%
BTA 0.5%
Emulsified silicone oil 0.5%
Water 41.5%.
Embodiment 2:
A kind of sapphire wafer processing aqueous polishing liquid, is made up of the component of following weight percents:
Organic acid 2-15%(example 2%, 8%, 15%)
Organic amine 10-25%(example 10%, 17%, 25%)
Corrosion inhibiter 0.5-3%(example 0.5%, 2%, 3%)
Lubricating additive 3-12%(example 3%, 8%, 12%)
Novel surfactant 15-25%(example 15%, 20%, 25%)
Water 20-45%(example 20%, 30%, 45%)
Defoamer 0.5-3%(example 0.5%, 2%, 3%)
The consumption sum of above-mentioned each component is 100%.
Organic acid be dodecanedioic acid, Nitrodracylic acid or sulfamic acid compound, to one or more in hexyl benzene formic acid, n-nonanoic acid, neodecanoic acid between the tert-butyl group.
Organic amine is one or more in monoethanolamine, three b propanol amine, isopropanolamine, hydroxyethylethylene diamine.
Corrosion inhibiter is one or more in BTA, 2-mercaptobenzothiazole.
Lubricating additive is one or more in non-sulfur and non-phosphorus water-soluble organic molybdenum additive, cetomacrogol 1000, Macrogol 2000.
Novel surfactant is one or more in polyoxyethylene poly-oxygen propylene aether, polyvinylamine, fatty alcohol-polyoxyethylene ether, propylene glycol block polyether.
Defoamer is emulsified silicone oil.
Claims (7)
1. a sapphire wafer processing aqueous polishing liquid, is characterized in that: be made up of the component of following weight percents:
Organic acid 2-15%
Organic amine 10-25%
Corrosion inhibiter 0.5-3%
Lubricating additive 3-12%
Novel surfactant 15-25%
Water 20-45%
Defoamer 0.5-3%
The consumption sum of above-mentioned each component is 100%.
2. sapphire wafer according to claim 1 processing aqueous polishing liquid, is characterized in that: organic acid be dodecanedioic acid, Nitrodracylic acid or sulfamic acid compound, to one or more in hexyl benzene formic acid, n-nonanoic acid, neodecanoic acid between the tert-butyl group.
3. sapphire wafer according to claim 1 processing aqueous polishing liquid, is characterized in that: organic amine is one or more in monoethanolamine, three b propanol amine, isopropanolamine, hydroxyethylethylene diamine.
4. sapphire wafer according to claim 1 processing aqueous polishing liquid, is characterized in that: corrosion inhibiter is one or more in BTA, 2-mercaptobenzothiazole.
5. sapphire wafer according to claim 1 processing aqueous polishing liquid, is characterized in that: lubricating additive is one or more in non-sulfur and non-phosphorus water-soluble organic molybdenum additive, cetomacrogol 1000, Macrogol 2000.
6. sapphire wafer according to claim 1 processing aqueous polishing liquid, is characterized in that: novel surfactant is one or more in polyoxyethylene poly-oxygen propylene aether, polyvinylamine, fatty alcohol-polyoxyethylene ether, propylene glycol block polyether.
7. sapphire wafer according to claim 1 processing aqueous polishing liquid, is characterized in that: defoamer is emulsified silicone oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610184744.2A CN105802581A (en) | 2016-03-28 | 2016-03-28 | Waterborne grinding fluid for sapphire wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610184744.2A CN105802581A (en) | 2016-03-28 | 2016-03-28 | Waterborne grinding fluid for sapphire wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105802581A true CN105802581A (en) | 2016-07-27 |
Family
ID=56453821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610184744.2A Pending CN105802581A (en) | 2016-03-28 | 2016-03-28 | Waterborne grinding fluid for sapphire wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105802581A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108239484A (en) * | 2016-12-23 | 2018-07-03 | 蓝思科技（长沙）有限公司 | A kind of sapphire polishing alumina polishing solution and preparation method thereof |
| CN110540889A (en) * | 2018-07-16 | 2019-12-06 | 蓝思科技（长沙）有限公司 | Grinding fluid for grinding and thinning optical glass, and preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633831A (en) * | 2009-08-26 | 2010-01-27 | 广州机械科学研究院 | Optical product grinding fluid and preparation method and application thereof |
| CN103981008A (en) * | 2014-05-23 | 2014-08-13 | 启东尤希路化学工业有限公司 | High-performance environment-friendly water-based honing working fluid |
-
2016
- 2016-03-28 CN CN201610184744.2A patent/CN105802581A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101633831A (en) * | 2009-08-26 | 2010-01-27 | 广州机械科学研究院 | Optical product grinding fluid and preparation method and application thereof |
| CN103981008A (en) * | 2014-05-23 | 2014-08-13 | 启东尤希路化学工业有限公司 | High-performance environment-friendly water-based honing working fluid |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108239484A (en) * | 2016-12-23 | 2018-07-03 | 蓝思科技（长沙）有限公司 | A kind of sapphire polishing alumina polishing solution and preparation method thereof |
| CN108239484B (en) * | 2016-12-23 | 2020-09-25 | 蓝思科技（长沙）有限公司 | Alumina polishing solution for sapphire polishing and preparation method thereof |
| CN110540889A (en) * | 2018-07-16 | 2019-12-06 | 蓝思科技（长沙）有限公司 | Grinding fluid for grinding and thinning optical glass, and preparation method and application thereof |
| CN110540889B (en) * | 2018-07-16 | 2022-01-28 | 蓝思科技（长沙）有限公司 | Grinding fluid for grinding and thinning optical glass, and preparation method and application thereof |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160727 |
|
| RJ01 | Rejection of invention patent application after publication |