CN105802529B - 全方位导电胶膜的制作方法 - Google Patents
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Abstract
本发明公开了全方位导电胶膜的制作方法,生产出的材料能在10MHZ到10GHZ的宽频范围内均能实现有效屏蔽和导通,在应用过程中稳定可靠,且其工艺稳定、操作简单并能确保良好的产品质量。此外,本发明生产的产品具有的良好的性价比,工艺稳定,便于生产,具有很好的电子新材料替代作用。
Description
技术领域
本发明涉及导电胶膜,具体涉及全方位导电胶膜的制作方法。
背景技术
市场上出现的全方位导电胶膜,借助高填充的导电粒子实现左右导通,该产品其用于导电的金属粒子其含量均超过60%,而且因高填充的胶膜其粘结性也会受很大的影响,粘结性一般不会超过10N/cm。
发明内容
本发明针对上述问题,提供了一种连续化高效稳定的导电胶膜的制作方法,生产出的材料能在10MHZ到10GHZ的宽频范围内均能实现有效屏蔽和导通,在应用过程中稳定可靠,且其工艺稳定、操作简单并能确保良好的产品质量。此外,本发明生产的产品具有的良好的性价比,工艺稳定,便于生产,具有很好的电子新材料替代作用。
为解决上述技术问题,本发明采用的一个技术方案是:全方位导电胶膜的制作方法,包括以下工艺步骤:
1)、在离型膜上均匀涂上一层粘度为1000cps-5000ps的导电胶水,在100-200℃的温度下将溶剂表干形成导电胶层,收卷;
2)、真空条件下在步骤1)的导电胶层上镀一层金属屏蔽层;
3)、在金属屏蔽层表面再涂一层粘度为1000cps-5000ps的导电胶水,在100-200℃的温度下烘干后形成导电胶层并在该导电胶层的表面覆一层保护膜。
作为上述方案的优选,镀一层金属屏蔽层的方法为蒸发镀或磁控溅射镀。
作为上述方案的优选,金属屏蔽层的材料为铜或镍,该金属屏蔽层的表面电阻不大于500毫欧/英寸。
作为上述方案的优选,金属屏蔽层的材料为银,该金属屏蔽层的表面电阻不大于200毫欧/英寸。
作为上述方案的优选,保护膜为PP或PET。
作为上述方案的优选,导电胶层的厚度为2-50μm。
本公司发明的这种全方位导电胶膜,胶膜里面的金属粒子含量不会超过5%,而且其粘性均在10/cm以上。
本发明的有益效果是:本发明可连续化高效稳定的生产,且生产出的材料能在10MHZ到10GHZ的宽频范围内均能实现有效屏蔽和导通,在应用过程中稳定可靠,且其工艺稳定、操作简单并能确保良好的产品质量。此外,本发明生产的产品具有的良好的性价比,工艺稳定,便于生产,具有很好的电子新材料替代作用,可靠性良好,高温高湿(85摄氏度/85RH 168小时)性能下降10%以内。
具体实施方式
下面结合实施例,对本发明的具体实施方式作进一步描述。
原料准备:离型膜,厚度10-50μm,幅宽为200-1800mm,要求表面干净,整洁,放卷时张力均匀一致。
采用聚氨酯或环氧胶即金属导电粒子等配置出粘度为1000cps-5000cps的导电胶水,具有更好的柔软性,具体方案如下:
第一种:30%浓度的PU胶水----占70%,固化剂----占5%,金属镍粉---占5%,阻燃剂---占10%,余量为溶剂。
第二种:30%浓度的丙烯酸胶水----占70%,固化剂----占5%,金属铜粉---占5%,阻燃剂---占10%,余量为溶剂。
第三种:30%浓度的PET热熔胶水----占70%,固化剂----占5%,金属镍粉---占5%,阻燃剂---占10%,余量为溶剂。
具体制作过程:下述三种方案中采用的导电胶水为三种胶水配备方案中的任一种。
第一种:将准备好的离型膜在涂布线上放卷经过涂布头,均匀涂上一层20μm厚的导电胶水,在温度为150℃的烘箱内将溶剂表干形成导电胶水层,收卷好后再送入真空室,通过蒸发镀的方式在上述的导电胶水层上镀上一层金属镍形成金属屏蔽层,并将其表面电阻控制在500毫欧/英寸以内,再在该金属屏蔽层的表面涂上厚度为20μm的导电胶水,烘干形成导电胶层并在该导电胶层上覆一层PP或PET保护膜,制成产品,然后对产品进行检验,裁切进而得到所需要的成品。
第二种:将准备好的离型膜在涂布线上放卷经过涂布头,均匀涂上一层20μm厚的导电胶水,在温度为150℃的烘箱内将溶剂表干形成导电胶水层,收卷好后再送入真空室,通过磁控溅射的方式在上述的导电胶水层上镀上一层金属银形成金属屏蔽层,并将其表面电阻控制在200毫欧/英寸以内,采用银镀层,具有良好的抗弯曲性能及屏蔽性能,再在该金属屏蔽层的表面涂上厚度为20μm的导电胶水,烘干形成导电胶层并在该导电胶层上覆一层PP或PET保护膜,制成产品,然后对产品进行检验,裁切进而得到所需要的成品。
第三种:将准备好的离型膜在涂布线上放卷经过涂布头,在该离型膜的上表面或下表面均匀涂上一层20μm厚的导电胶水,在温度为150℃的烘箱内将溶剂表干形成导电胶水层,收卷好后再送入真空室,通过蒸发镀的方式在上述的导电胶水层上镀上一层金属铜形成金属屏蔽层,并将其表面电阻控制在200毫欧/英寸以内,再在该金属屏蔽层的表面涂上厚度为20μm的导电胶水,烘干形成导电胶层并在该导电胶层上覆一层PP或PET保护膜,制成产品,然后对产品进行检验,裁切进而得到所需要的成品。
对于本领域的技术人员来说,依然可以对前述各实施例所记载的技术方案进行修改,或对其中部分技术特征进行等同替换,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (6)
1.全方位导电胶膜的制作方法,其特征在于,包括以下工艺步骤:
1)、在离型膜上均匀涂上一层粘度为1000cps-5000ps的导电胶水,在100-200℃的温度下将溶剂表干形成导电胶层,收卷;
2)、真空条件下在步骤1)的导电胶层上镀一层金属屏蔽层;
3)、在金属屏蔽层表面再涂一层粘度为1000cps-5000ps的导电胶水,在100-200℃的温度下烘干后形成导电胶层并在该导电胶层的表面覆一层保护膜。
2.如权利要求1所述的全方位导电胶膜的制作方法,其特征在于,镀一层金属屏蔽层的方法为蒸发镀或磁控溅射镀。
3.如权利要求1所述的全方位导电胶膜的制作方法,其特征在于,金属屏蔽层的材料为铜或镍,该金属屏蔽层的表面电阻不大于500毫欧/英寸。
4.如权利要求1所述的全方位导电胶膜的制作方法,其特征在于,金属屏蔽层的材料为银,该金属屏蔽层的表面电阻不大于200毫欧/英寸。
5.如权利要求1所述的全方位导电胶膜的制作方法,其特征在于,保护膜为PP或PET。
6.如权利要求1所述的全方位导电胶膜的制作方法,其特征在于,导电胶层的厚度为2-50μm。
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