CN105793959B - 衬底处理设备 - Google Patents

衬底处理设备 Download PDF

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Publication number
CN105793959B
CN105793959B CN201380081398.XA CN201380081398A CN105793959B CN 105793959 B CN105793959 B CN 105793959B CN 201380081398 A CN201380081398 A CN 201380081398A CN 105793959 B CN105793959 B CN 105793959B
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China
Prior art keywords
substrate
gas
chamber
ontology
intermediate region
Prior art date
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Active
Application number
CN201380081398.XA
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English (en)
Chinese (zh)
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CN105793959A (zh
Inventor
赵国衡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Charm Engineering Co Ltd
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Charm Engineering Co Ltd
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Publication date
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Publication of CN105793959A publication Critical patent/CN105793959A/zh
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Publication of CN105793959B publication Critical patent/CN105793959B/zh
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles
    • H01L21/205
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
CN201380081398.XA 2013-12-06 2013-12-27 衬底处理设备 Active CN105793959B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130151693A KR101518398B1 (ko) 2013-12-06 2013-12-06 기판 처리 장치
KR10-2013-0151693 2013-12-06
PCT/KR2013/012331 WO2015083884A1 (ko) 2013-12-06 2013-12-27 기판 처리 장치

Publications (2)

Publication Number Publication Date
CN105793959A CN105793959A (zh) 2016-07-20
CN105793959B true CN105793959B (zh) 2019-03-26

Family

ID=53273617

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380081398.XA Active CN105793959B (zh) 2013-12-06 2013-12-27 衬底处理设备

Country Status (3)

Country Link
KR (1) KR101518398B1 (ko)
CN (1) CN105793959B (ko)
WO (1) WO2015083884A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101929192B1 (ko) * 2015-09-22 2018-12-14 어플라이드 머티어리얼스, 인코포레이티드 샤워헤드 지지 구조들
KR101905640B1 (ko) * 2016-04-12 2018-10-10 피에스케이 주식회사 기판 처리 장치
KR102518372B1 (ko) * 2018-03-23 2023-04-06 삼성전자주식회사 가스 분배 장치, 이를 포함하는 기판 처리 장치 및 이를 이용하는 반도체 공정 방법
KR20210088723A (ko) * 2018-12-03 2021-07-14 어플라이드 머티어리얼스, 인코포레이티드 척킹 및 아크 발생 성능이 개선된 정전 척 설계
CN109881187A (zh) * 2019-03-06 2019-06-14 北京捷造光电技术有限公司 一种气相沉积腔室
CN110093593A (zh) * 2019-05-20 2019-08-06 北京捷造光电技术有限公司 一种用于大面积pecvd工艺腔室双层排气结构
KR102404571B1 (ko) * 2019-11-05 2022-06-07 피에스케이 주식회사 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1861837A (zh) * 2005-05-12 2006-11-15 三星Sdi株式会社 用于沉积多晶硅的cvd装置
TW200837867A (en) * 2007-02-06 2008-09-16 Sosul Co Ltd Apparatus for forming a layer
CN103035469A (zh) * 2011-10-05 2013-04-10 应用材料公司 对称等离子体处理室

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL116156A0 (en) * 1994-12-05 1996-01-31 Hughes Aircraft Co Cooled gas distribution system for a plasma
WO2001046498A2 (en) * 1999-12-22 2001-06-28 Aixtron Ag Chemical vapor deposition reactor and process chamber for said reactor
KR100491241B1 (ko) * 2003-07-22 2005-05-25 주식회사 테라세미콘 매엽식 반도체 제조장치
KR101329570B1 (ko) * 2007-02-06 2013-11-22 (주)소슬 막 형성 장치
US20110136346A1 (en) * 2009-12-04 2011-06-09 Axcelis Technologies, Inc. Substantially Non-Oxidizing Plasma Treatment Devices and Processes
US8647485B2 (en) * 2012-03-30 2014-02-11 Applied Materials, Inc. Process kit shield for plasma enhanced processing chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1861837A (zh) * 2005-05-12 2006-11-15 三星Sdi株式会社 用于沉积多晶硅的cvd装置
TW200837867A (en) * 2007-02-06 2008-09-16 Sosul Co Ltd Apparatus for forming a layer
CN103035469A (zh) * 2011-10-05 2013-04-10 应用材料公司 对称等离子体处理室

Also Published As

Publication number Publication date
KR101518398B1 (ko) 2015-05-08
CN105793959A (zh) 2016-07-20
WO2015083884A1 (ko) 2015-06-11

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