CN105792597A - Heat-dissipation device, circuit board and design method of heat-dissipation device - Google Patents
Heat-dissipation device, circuit board and design method of heat-dissipation device Download PDFInfo
- Publication number
- CN105792597A CN105792597A CN201410811143.0A CN201410811143A CN105792597A CN 105792597 A CN105792597 A CN 105792597A CN 201410811143 A CN201410811143 A CN 201410811143A CN 105792597 A CN105792597 A CN 105792597A
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- conducting part
- radiating part
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The invention provides a heat-dissipation device, a circuit board and a design method of the heat-dissipation device, and aims at solving the problem that the heat-dissipation efficiency of a heating device cannot be easily improved effectively after the circuit board is designed in the prior art. The heat-dissipation comprises a heat-conducting part and a heat-dissipation part, wherein the heat-conducting part is provided with the heating device and is used for conducting heat generated by the heating device; the heat-dissipation part is connected to the heat-conducting part and is made of an insulating material; the heat conductivity is higher than a preset threshold; and the heat-dissipation part is used for dissipating the heat conducted from the heat-conducting part.
Description
Technical field
The present invention relates to electronic circuit technology field, particularly relate to a kind of heat abstractor, circuit board and method for designing thereof.
Background technology
Device on circuit board inevitably generates heat when working, and can heat distribute the performance affecting device to a great extent as early as possible.
General, these devices, mainly through transferring heat to the microstrip line on circuit board, then pass through microstrip line and transfer heat away from two kinds of approach of horizontal and vertical.Wherein, horizontal heat transfer approach is that the micro-strip by extending in the horizontal direction itself carries out heat biography, and vertical heat transfer path is, by microstrip line, heat vertically passes to board substrate.At the beginning of starting in circuit design, the width of microstrip line and thickness are just it has been determined that what the contact area of microstrip line and base material also determined that, so what the radiating efficiency of device also determined that, it is difficult to the radiating efficiency of device is effectively promoted.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of heat abstractor, circuit board and method for designing thereof, is difficult to the problem that the radiating efficiency to heater members carries out effectively lifting in order to solving in prior art after board design.
On the one hand, the present invention provides a kind of heat abstractor, including:
Heat-conducting part, described heat-conducting part is provided with heater members, derives for the heat produced by described heater members；
Radiating part, described radiating part is connected to described heat-conducting part；Described radiating part be insulant and thermal conductivity higher than predetermined threshold value, for the heat derived from described heat-conducting part is distributed.
Optionally, described radiating part one end is connected to described heat-conducting part, and the other end is connected to the ground of circuit board, for being distributed by the ground on circuit board by the heat derived from described heat-conducting part.
Optionally, described heat-conducting part includes microstrip line.
Optionally, described heat-conducting part be provided around connecting portion, described radiating part one end is connected with described heat-conducting part, and the other end is connected by the ground of described connecting portion with described circuit board.
Optionally, described connecting portion includes pad.
Optionally, described radiating part is connected with described connecting portion by welding or bonding method.
Optionally, described radiating part includes aluminium nitride ceramics.
On the other hand, the present invention also provides for a kind of circuit board, and described circuit board is provided with heat abstractor provided by the invention.
On the other hand, the present invention also provides for the method for designing of a kind of above-mentioned circuit board, including:
Carry out circuit design according to demand；
The circuit designed is carried out heat emulation, to determine heater members；
It is the reserved heat dissipation path of described heater members on circuit boards；Wherein, described heat dissipation path includes: heat-conducting part, and described heat-conducting part is provided with heater members；Radiating part, described radiating part is connected to described heat-conducting part；Described radiating part be insulant and thermal conductivity higher than predetermined threshold value, for the heat derived from described heat-conducting part is distributed.
Heat abstractor, circuit board and the method for designing thereof that the embodiment of the present invention provides, heat abstractor includes heat-conducting part and radiating part, and wherein, the heat that heater members produces can be derived by heat-conducting part；The heat derived from heat-conducting part can be distributed by radiating part, owing to the thermal conductivity of radiating part is higher, it is thus possible to heat is distributed with higher efficiency, again owing to radiating part is insulant, therefore the addition of radiating part is without influence on the electric property of circuit, has good compatibility with the electrical design of circuit board.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the heat abstractor that the embodiment of the present invention provides；
Fig. 2 is the another kind of structural representation of the heat abstractor that the embodiment of the present invention provides；
Fig. 3 is another structural representation of the heat abstractor that the embodiment of the present invention provides；
Fig. 4 is a kind of circuit design schematic diagram of circuit board in the preferred embodiment of the present invention；
Fig. 5 is circuit board pictorial diagram corresponding for Fig. 4；
Fig. 6 is a kind of flow chart of the circuit board designing method that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in detail.Should be appreciated that specific embodiment described herein is only in order to explain the present invention, does not limit the present invention.
As it is shown in figure 1, embodiments of the invention provide a kind of heat abstractor, including:
Heat-conducting part 11, heat-conducting part 11 is provided with heater members 12, derives for the heat produced by heater members 12；
Radiating part 13, radiating part 13 is connected to heat-conducting part 11, radiating part 13 be insulant and thermal conductivity higher than predetermined threshold value, for the heat derived from heat-conducting part 11 is distributed.
The heat abstractor that the embodiment of the present invention provides, including heat-conducting part 11 and radiating part 13, wherein, the heat that heater members 12 can be produced by heat-conducting part 11 is derived；The heat derived from heat-conducting part 11 can be distributed by radiating part 13, owing to the thermal conductivity of radiating part 13 is higher, it is thus possible to heat is distributed with higher efficiency, again owing to radiating part 13 is insulant, therefore the addition of radiating part 13 is without influence on the electric property of circuit, has good compatibility with the electrical design of circuit board.
Optionally, heat-conducting part 11 can for any conduction of heat that can be produced by heater members 12 structure out or device, and this is not construed as limiting by embodiments of the invention.It can be such as the microstrip line etc. between pad or heater members and the circuit board between heater members and circuit board.In this case, heat-conducting part 11 is provided simultaneously with electrical functions and heat conduction function such that it is able to make full use of the original design of circuit, it is not necessary to extra circuits plate design overhead.
Heat-conducting part 11 can be dispelled the heat by radiating part 13 after being derived from heater members by heat.Optionally, radiating part 13 can include all thermal conductivities insulant higher than certain threshold value, for instance aluminium nitride ceramics, boron nitride, magnesium oxide etc..The difference of cooling requirements can be arranged by this threshold value according to circuit, for instance can be the separation of hot good conductor and non-conductor, more than or equal to the good conductor that the material of this threshold value is heat, lower than the non-conductor that the material of this threshold value is heat.The good conductor of so all heat can serve as the material of radiating part 13.Optionally, radiating part 13 can be made up of one or more independent radiating elements, and these multiple radiating elements can be placed side by side, it is also possible to superposition is placed, and this is not construed as limiting by embodiments of the invention.
Further, as in figure 2 it is shown, for the radiating efficiency improving radiating part 13, radiating part 13 one end may connect to heat-conducting part 11, the other end also may connect to the ground 14 of circuit board, for being distributed by the ground 14 on circuit board by the heat derived from heat-conducting part 11.Owing to the ground 14 on circuit board is generally the metal level that area is bigger, thus being greatly accelerated the dissipation of heat.
Optionally, radiating part 13 can pass through number of ways and be connected with the ground 14 on circuit board, such as, as shown in Figure 3, in one embodiment of the invention, the surrounding of heat-conducting part 11 can be provided with connecting portion 15, and connecting portion 15 is connected with ground 14 by the wire within circuit board, radiating part 13 one end can be connected with heat-conducting part 11, and the other end can pass through connecting portion 15 and be connected with the ground 14 of circuit board.Optionally, this connecting portion 15 is specifically as follows the various structures can being connected such as pad with ground 14, and wherein, the number of this pad can be one can also be multiple.And radiating part 13 can be passed through welding manner or is connected with connecting portion 15 and heat-conducting part 11 by bonding method.Owing to the ground in circuit board potentially includes polylith region, and it is distributed in multiple layers of circuit board, and connecting portion 15 both can be connected with the ground of this layer in circuit board, it is also possible to being connected by the ground of pad with through hole with other layers of circuit board, this is not limited as by embodiments of the invention.
Below by specific embodiment, heat abstractor provided by the invention is described in detail.
Fig. 4 is the circuit diagram of TDD (timeDivisionDuplexing, time division duplex) power amplifier high power switch place circuit board, and Fig. 5 is the pictorial diagram that Fig. 4 is corresponding.In conjunction with Fig. 4 and Fig. 5, in the present embodiment, TDD power amplifier high power switch is made up of multiple diodes, and during normal operation, diode can bear relatively high power, becomes high thermal device.In order to it is effectively dispelled the heat, it is possible to each diode at TDD is arranged around multiple pad.Aluminium nitride ceramics (shown in the oval circle in figure part) one end is welded on the microstrip line, and the other end is connected with the ground of circuit board either directly through pad.So, by adding the aluminium nitride of highly heat-conductive material around diode, effectively reduce the temperature rise of diode, improve the maximum power level that switch can bear.Simultaneously as highly heat-conductive material aluminium nitride ceramics is insulator, its introducing on circuit boards, can ignore for radio circuit impact.
After adopting technique scheme, under equal conditions, TDD switching device temperature rise can descend to original 62%, and switch power grade can improve 27%.
Accordingly, embodiments of the invention also provide for a kind of circuit board, described circuit board is provided with the heat abstractor in aforementioned any embodiment, therefore also can reach identical Advantageous Effects, have been carried out above describing in detail, repeat no more herein.
Accordingly, as shown in Figure 6, embodiments of the invention also provide for the method for designing of a kind of circuit board, including:
S21, carries out circuit design according to demand；
S22, carries out heat emulation, to determine heater members to the circuit designed；
S23, is the reserved heat dissipation path of described heater members on circuit boards；Wherein, described heat dissipation path includes: heat-conducting part, and described heat-conducting part is provided with heater members；Radiating part, described radiating part is connected to described heat-conducting part；Described radiating part be insulant and thermal conductivity higher than predetermined threshold value, for the heat derived from described heat-conducting part is distributed.
The circuit board designing method that the embodiment of the present invention provides, after carrying out the emulation of whole circuit board product heat, determine high heater members, follow-up when optimizing design, reserve heat dissipation path on circuit boards, in order to dispel the heat for heater members, so compatible circuit function and device heat radiation, under the premise not affecting circuit electric property, substantially increase the radiating efficiency of heater members.
Although being example purpose, having been disclosed for the preferred embodiments of the present invention, it is also possible for those skilled in the art will recognize various improvement, increase and replacement, and therefore, the scope of the present invention should be not limited to above-described embodiment.
Claims (9)
1. a heat abstractor, it is characterised in that including:
Heat-conducting part, described heat-conducting part is provided with heater members, derives for the heat produced by described heater members；
Radiating part, described radiating part is connected to described heat-conducting part；Described radiating part be insulant and thermal conductivity higher than predetermined threshold value, for the heat derived from described heat-conducting part is distributed.
2. device according to claim 1, it is characterised in that
Described radiating part one end is connected to described heat-conducting part, and the other end is connected to the ground of circuit board, for being distributed by the ground on circuit board by the heat derived from described heat-conducting part.
3. device according to claim 1 and 2, it is characterised in that described heat-conducting part includes microstrip line.
4. device according to claim 2, it is characterised in that described heat-conducting part be provided around connecting portion, described radiating part one end is connected with described heat-conducting part, and the other end is connected by the ground of described connecting portion with described circuit board.
5. device according to claim 4, it is characterised in that described connecting portion includes pad.
6. device according to claim 4, it is characterised in that described radiating part is connected with described connecting portion by welding or bonding method.
7. device according to claim 1, it is characterised in that described radiating part includes aluminium nitride ceramics.
8. a circuit board, it is characterised in that be provided with the heat abstractor according to any one of claim 1 to 7 on described circuit board.
9. the method for designing of a circuit board as claimed in claim 8, it is characterised in that including:
Carry out circuit design according to demand；
The circuit designed is carried out heat emulation, to determine heater members；
It is the reserved heat dissipation path of described heater members on circuit boards；Wherein, described heat dissipation path includes: heat-conducting part, and described heat-conducting part is provided with heater members；Radiating part, described radiating part is connected to described heat-conducting part；Described radiating part be insulant and thermal conductivity higher than predetermined threshold value, for the heat derived from described heat-conducting part is distributed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410811143.0A CN105792597A (en) | 2014-12-23 | 2014-12-23 | Heat-dissipation device, circuit board and design method of heat-dissipation device |
| PCT/CN2015/086621 WO2016101625A1 (en) | 2014-12-23 | 2015-08-11 | Heat sink apparatus, circuit board and method of designing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410811143.0A CN105792597A (en) | 2014-12-23 | 2014-12-23 | Heat-dissipation device, circuit board and design method of heat-dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105792597A true CN105792597A (en) | 2016-07-20 |
Family
ID=56149166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410811143.0A Withdrawn CN105792597A (en) | 2014-12-23 | 2014-12-23 | Heat-dissipation device, circuit board and design method of heat-dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105792597A (en) |
| WO (1) | WO2016101625A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2259408A (en) * | 1991-09-07 | 1993-03-10 | Motorola Israel Ltd | A heat dissipation device |
| US20040226696A1 (en) * | 2003-02-28 | 2004-11-18 | Hong Huang | Surface mount resistors as heat transfer augmentation devices |
| CN202524652U (en) * | 2012-04-10 | 2012-11-07 | 孙井斌 | Combined circuit board with high heat conductivity |
| CN103974598A (en) * | 2013-02-05 | 2014-08-06 | 欧司朗有限公司 | Circuit board |
-
2014
- 2014-12-23 CN CN201410811143.0A patent/CN105792597A/en not_active Withdrawn
-
2015
- 2015-08-11 WO PCT/CN2015/086621 patent/WO2016101625A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2259408A (en) * | 1991-09-07 | 1993-03-10 | Motorola Israel Ltd | A heat dissipation device |
| US20040226696A1 (en) * | 2003-02-28 | 2004-11-18 | Hong Huang | Surface mount resistors as heat transfer augmentation devices |
| CN202524652U (en) * | 2012-04-10 | 2012-11-07 | 孙井斌 | Combined circuit board with high heat conductivity |
| CN103974598A (en) * | 2013-02-05 | 2014-08-06 | 欧司朗有限公司 | Circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016101625A1 (en) | 2016-06-30 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160720 |