WO2016101625A1 - Heat sink apparatus, circuit board and method of designing same - Google Patents

Heat sink apparatus, circuit board and method of designing same Download PDF

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Publication number
WO2016101625A1
WO2016101625A1 PCT/CN2015/086621 CN2015086621W WO2016101625A1 WO 2016101625 A1 WO2016101625 A1 WO 2016101625A1 CN 2015086621 W CN2015086621 W CN 2015086621W WO 2016101625 A1 WO2016101625 A1 WO 2016101625A1
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heat
circuit board
conducting portion
heat conducting
dissipating
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PCT/CN2015/086621
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French (fr)
Chinese (zh)
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文睿
孙涵
张煜
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中兴通讯股份有限公司
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Publication of WO2016101625A1 publication Critical patent/WO2016101625A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the field of electronic circuit technology, and in particular, to a heat dissipation device, a circuit board, and a design method thereof.
  • these devices transfer heat through both the horizontal and vertical paths, primarily by transferring heat to the microstrip lines on the board.
  • the horizontal heat transfer path is heat transfer through the microstrip itself extending in the horizontal direction
  • the vertical heat transfer path is to transfer heat to the circuit board substrate in the vertical direction through the microstrip line. Since the width and thickness of the microstrip line have been determined at the beginning of the circuit design, the contact area between the microstrip line and the substrate is also determined, so the heat dissipation efficiency of the device is also determined, and it is difficult to effectively improve the heat dissipation efficiency of the device. .
  • the technical problem to be solved by the embodiments of the present invention is to provide a heat dissipating device, a circuit board, and a design method thereof, which are used to solve the problem that the heat dissipating efficiency of the heat generating device is effectively improved after the circuit board design in the prior art.
  • an embodiment of the present invention provides a heat dissipation device, including:
  • a heat conducting portion wherein the heat conducting portion is provided with a heat generating device configured to derive heat generated by the heat generating device;
  • the heat dissipating portion is connected to the heat conducting portion; the heat dissipating portion is an insulating material and has a thermal conductivity higher than a predetermined threshold, and is configured to dissipate heat derived from the heat conducting portion.
  • one end of the heat dissipating portion is connected to the heat conducting portion, and the other end is connected to the ground of the circuit board, and is configured to dissipate heat extracted from the heat conducting portion through the ground on the circuit board.
  • the heat conducting portion includes a microstrip line.
  • a connecting portion is disposed around the heat conducting portion, and one end of the heat radiating portion is connected to the heat conducting portion, and the other end is connected to the ground of the circuit board through the connecting portion.
  • the connecting portion includes a pad.
  • the heat dissipating portion is connected to the connecting portion by soldering or pasting.
  • the heat dissipation portion includes an aluminum nitride ceramic.
  • an embodiment of the present invention further provides a circuit board on which the heat dissipation device provided by the present invention is disposed.
  • the embodiment of the present invention further provides a method for designing the foregoing circuit board, including:
  • the heat dissipating portion is an insulating material and has a thermal conductivity higher than a preset threshold for dissipating heat derived from the heat conducting portion.
  • the heat dissipating device, the circuit board and the design method thereof are provided in the embodiment of the present invention.
  • the heat dissipating device includes a heat conducting portion and a heat dissipating portion, wherein the heat conducting portion can derive heat generated by the heat generating device; and the heat dissipating portion can dissipate heat derived from the heat conducting portion. Since the heat conductivity of the heat dissipating portion is high, heat can be dissipated with high efficiency, and since the heat dissipating portion is an insulating material, the addition of the heat dissipating portion does not affect the electrical performance of the circuit, and the electrical design of the circuit board is good. Compatibility.
  • FIG. 1 is a schematic structural view of a heat dissipation device according to an embodiment of the present invention
  • FIG. 2 is another schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of another heat dissipation device according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a circuit design of a circuit board in a preferred embodiment of the present invention.
  • Figure 5 is a physical diagram of the circuit board corresponding to Figure 4.
  • FIG. 6 is a flow chart of a circuit board design method according to an embodiment of the present invention.
  • an embodiment of the present invention provides a heat dissipation device, including:
  • the heat conducting portion 11 and the heat conducting portion 11 are provided with a heat generating device 12 configured to derive heat generated by the heat generating device 12;
  • the heat dissipating portion 13 is connected to the heat conducting portion 11 .
  • the heat dissipating portion 13 is made of an insulating material and has a thermal conductivity higher than a predetermined threshold.
  • the heat dissipating portion 13 is disposed to dissipate heat derived from the heat conducting portion 11 .
  • the heat dissipating device includes a heat conducting portion 11 and a heat dissipating portion 13 , wherein the heat conducting portion 11 can derive the heat generated by the heat generating device 12; the heat dissipating portion 13 can dissipate the heat derived from the heat conducting portion 11 due to the heat dissipating portion
  • the thermal conductivity of 13 is high, so that heat can be dissipated with higher efficiency, and since the heat dissipating portion 13 is an insulating material, the addition of the heat dissipating portion 13 does not affect the electrical performance of the circuit, and the electrical design of the circuit board is good. Compatibility.
  • the heat conducting portion 11 can be any structure or device capable of conducting heat generated by the heat generating device 12, which is not limited by the embodiment of the present invention.
  • it may be a pad between the heat generating device and the circuit board or a microstrip line between the heat generating device and the circuit board.
  • the heat transfer portion 11 has both an electrical function and a heat transfer function, so that the original design of the circuit can be fully utilized without additional board design overhead.
  • the heat dissipating portion 13 may include all insulating materials having a thermal conductivity higher than a certain threshold, such as aluminum nitride ceramics, boron nitride, magnesium oxide, and the like.
  • the threshold can be based on the circuit's requirements for heat dissipation. Also provided, for example, may be a boundary point between a good conductor of heat and a poor conductor, a material greater than or equal to the threshold is a good conductor of heat, and a material below the threshold is a poor conductor of heat.
  • the heat dissipating portion 13 may be formed by one or more independent heat sink members.
  • the plurality of heat dissipating members may be placed side by side or may be stacked, which is not limited by the embodiment of the present invention.
  • one end of the heat dissipation portion 13 may be connected to the heat conduction portion 11, and the other end may be connected to the ground 14 of the circuit board, and configured to be led out from the heat conduction portion 11. Heat is dissipated through the ground 14 on the board. Since the ground 14 on the circuit board is generally a relatively large metal layer, heat dissipation is greatly accelerated.
  • the heat dissipating portion 13 can be connected to the ground 14 on the circuit board in various ways.
  • the heat conducting portion 11 can be provided with a connecting portion around the portion. 15.
  • the connecting portion 15 is connected to the ground 14 through a wire inside the circuit board.
  • One end of the heat radiating portion 13 may be connected to the heat conducting portion 11, and the other end may be connected to the ground 14 of the circuit board through the connecting portion 15.
  • the connecting portion 15 may be a structure such as a pad that can be connected to the ground 14. The number of the pads may be one or more.
  • the heat dissipating portion 13 can be connected to the connecting portion 15 and the heat conducting portion 11 by soldering or by bonding. Since the ground in the circuit board may include multiple regions and are distributed in multiple layers of the circuit board, the connection portion 15 may be connected to the ground of the current layer in the circuit board, or through the pads and the vias and the circuit board. The other layers are connected to each other, and the embodiment of the present invention does not limit this.
  • FIG. 4 is a circuit diagram of a circuit board on which a time division duplex (TDD) power amplifier power switch is located
  • FIG. 5 is a physical diagram corresponding to FIG. 4 and FIG. 5, in this embodiment, the TDD power amplifier power switch is composed of a plurality of diodes. When working normally, the diode will withstand a large power and become a high-heat device. In order to effectively dissipate heat, a plurality of pads may be disposed in the vicinity of each diode of the TDD. One end of an aluminum nitride ceramic (shown in the elliptical circle in the figure) Solder on the microstrip line and connect the other end directly to the ground of the board through the pad.
  • TDD time division duplex
  • the temperature rise of the TDD switching device can be reduced to 62%, and the switching power level can be increased by 27%.
  • an embodiment of the present invention further provides a circuit board, which is provided with the heat dissipating device in any of the foregoing embodiments, and thus can achieve the same beneficial technical effects, which have been described in detail above. I won't go into details here.
  • an embodiment of the present invention further provides a circuit board design method, including:
  • a heat dissipation path is reserved for the heat generating device on the circuit board; wherein the heat dissipation path includes: a heat conducting portion, the heat conducting portion is provided with a heat generating device; and the heat dissipating portion is connected to the heat conducting portion
  • the heat dissipating portion is an insulating material and has a thermal conductivity higher than a preset threshold for dissipating heat derived from the heat conducting portion.
  • the circuit board design method provided by the embodiment of the present invention determines a high heat generating device after performing thermal simulation of the entire circuit board product, and then, in the optimized design, a heat dissipation path is reserved on the circuit board to dissipate heat for the heat generating device.
  • a heat dissipation path is reserved on the circuit board to dissipate heat for the heat generating device.

Abstract

A heat sink apparatus, a circuit board and a method of designing the circuit board. The heat sink apparatus comprises: a heat conduction portion (11) provided thereon with a heating device (12) and configured to direct heat out, the heat being generated by the heating device (12); and a heat sink portion (13) connected to the heat conduction portion (11). The heat sink portion (13) is made of an insulating material, has higher heat conductivity than a preset threshold and is configured to dissipate the heat directed out of the heat conduction portion (11).

Description

一种散热装置、电路板及其设计方法Heat sink, circuit board and design method thereof 技术领域Technical field
本发明涉及电子电路技术领域，特别是涉及一种散热装置、电路板及其设计方法。The present invention relates to the field of electronic circuit technology, and in particular, to a heat dissipation device, a circuit board, and a design method thereof.
背景技术Background technique
电路板上的器件工作时不可避免会发热，热量能否尽快散发出去在很大程度上影响着器件的性能。Devices on the board inevitably heat up when they work, and the heat can be dissipated as quickly as possible, which greatly affects the performance of the device.
一般的，这些器件主要通过将热量传递给电路板上的微带线，然后通过微带线以水平和垂直两种途径将热量传递出去。其中，水平传热途径是通过在水平方向上延伸的微带本身进行热传，垂直传热途径是通过微带线将热量沿垂直方向传递给电路板基材。由于在电路设计开始之初，微带线的宽度和厚度就已经确定，微带线和基材的接触面积也是确定的，所以器件的散热效率也是确定的，难以对器件的散热效率进行有效提升。Typically, these devices transfer heat through both the horizontal and vertical paths, primarily by transferring heat to the microstrip lines on the board. Among them, the horizontal heat transfer path is heat transfer through the microstrip itself extending in the horizontal direction, and the vertical heat transfer path is to transfer heat to the circuit board substrate in the vertical direction through the microstrip line. Since the width and thickness of the microstrip line have been determined at the beginning of the circuit design, the contact area between the microstrip line and the substrate is also determined, so the heat dissipation efficiency of the device is also determined, and it is difficult to effectively improve the heat dissipation efficiency of the device. .
发明内容Summary of the invention
本发明实施例要解决的技术问题是提供一种散热装置、电路板及其设计方法，用以解决现有技术中在电路板设计之后难以对发热器件的散热效率进行有效提升的问题。The technical problem to be solved by the embodiments of the present invention is to provide a heat dissipating device, a circuit board, and a design method thereof, which are used to solve the problem that the heat dissipating efficiency of the heat generating device is effectively improved after the circuit board design in the prior art.
一方面，本发明实施例提供一种散热装置，包括：In one aspect, an embodiment of the present invention provides a heat dissipation device, including:
导热部，所述导热部上设置有发热器件，配置为将所述发热器件产生的热量导出；a heat conducting portion, wherein the heat conducting portion is provided with a heat generating device configured to derive heat generated by the heat generating device;
散热部，所述散热部连接于所述导热部；所述散热部为绝缘材料且热导率高于预设阈值，配置为将从所述导热部导出的热量散发。 The heat dissipating portion is connected to the heat conducting portion; the heat dissipating portion is an insulating material and has a thermal conductivity higher than a predetermined threshold, and is configured to dissipate heat derived from the heat conducting portion.
本发明实施例中，所述散热部一端连接于所述导热部，另一端连接于电路板的地，配置为将从所述导热部导出的热量通过电路板上的地散发。In the embodiment of the present invention, one end of the heat dissipating portion is connected to the heat conducting portion, and the other end is connected to the ground of the circuit board, and is configured to dissipate heat extracted from the heat conducting portion through the ground on the circuit board.
本发明实施例中，所述导热部包括微带线。In an embodiment of the invention, the heat conducting portion includes a microstrip line.
本发明实施例中，所述导热部的周围设置有连接部，所述散热部一端与所述导热部相连，另一端通过所述连接部与所述电路板的地相连。In the embodiment of the present invention, a connecting portion is disposed around the heat conducting portion, and one end of the heat radiating portion is connected to the heat conducting portion, and the other end is connected to the ground of the circuit board through the connecting portion.
本发明实施例中，所述连接部包括焊盘。In an embodiment of the invention, the connecting portion includes a pad.
本发明实施例中，所述散热部通过焊接或粘贴方式与所述连接部相连。In the embodiment of the invention, the heat dissipating portion is connected to the connecting portion by soldering or pasting.
本发明实施例中，所述散热部包括氮化铝陶瓷。In an embodiment of the invention, the heat dissipation portion includes an aluminum nitride ceramic.
另一方面，本发明实施例还提供一种电路板，所述电路板上设置有本发明提供的散热装置。In another aspect, an embodiment of the present invention further provides a circuit board on which the heat dissipation device provided by the present invention is disposed.
另一方面，本发明实施例还提供一种上述的电路板的设计方法，包括：In another aspect, the embodiment of the present invention further provides a method for designing the foregoing circuit board, including:
根据需求进行电路设计；Circuit design according to requirements;
对设计好的电路进行热仿真，以确定发热器件；Thermal simulation of the designed circuit to determine the heating device;
在电路板上为所述发热器件预留散热路径；其中，所述散热路径包括：导热部，所述导热部上设置有发热器件；散热部，所述散热部连接于所述导热部；所述散热部为绝缘材料且热导率高于预设阈值，用于将从所述导热部导出的热量散发。Dissipating a heat dissipation path for the heat generating device on the circuit board; wherein the heat dissipation path includes: a heat conducting portion, the heat conducting portion is provided with a heat generating device; and the heat radiating portion is connected to the heat conducting portion; The heat dissipating portion is an insulating material and has a thermal conductivity higher than a preset threshold for dissipating heat derived from the heat conducting portion.
本发明实施例提供的散热装置、电路板及其设计方法，散热装置包括导热部和散热部，其中，导热部能够将发热器件产生的热量导出；散热部能够将从导热部导出的热量散发，由于散热部的热导率较高，从而能够以较高的效率将热量散发，又由于散热部为绝缘材料，因此散热部的加入不会影响电路的电学性能，与电路板的电学设计具有良好的兼容性。The heat dissipating device, the circuit board and the design method thereof are provided in the embodiment of the present invention. The heat dissipating device includes a heat conducting portion and a heat dissipating portion, wherein the heat conducting portion can derive heat generated by the heat generating device; and the heat dissipating portion can dissipate heat derived from the heat conducting portion. Since the heat conductivity of the heat dissipating portion is high, heat can be dissipated with high efficiency, and since the heat dissipating portion is an insulating material, the addition of the heat dissipating portion does not affect the electrical performance of the circuit, and the electrical design of the circuit board is good. Compatibility.
附图说明DRAWINGS
图1是本发明实施例提供的散热装置的一种结构示意图；1 is a schematic structural view of a heat dissipation device according to an embodiment of the present invention;
图2是本发明实施例提供的散热装置的另一种结构示意图； 2 is another schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
图3是本发明实施例提供的散热装置的又一种结构示意图；3 is a schematic structural diagram of another heat dissipation device according to an embodiment of the present invention;
图4是本发明优选实施例中电路板的一种电路设计示意图；4 is a schematic diagram of a circuit design of a circuit board in a preferred embodiment of the present invention;
图5是图4对应的电路板实物图；Figure 5 is a physical diagram of the circuit board corresponding to Figure 4;
图6是本发明实施例提供的电路板设计方法的一种流程图。FIG. 6 is a flow chart of a circuit board design method according to an embodiment of the present invention.
具体实施方式detailed description
以下结合附图对本发明进行详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不限定本发明。The invention will be described in detail below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
如图1所示，本发明的实施例提供一种散热装置，包括：As shown in FIG. 1 , an embodiment of the present invention provides a heat dissipation device, including:
导热部11，导热部11上设置有发热器件12，配置为将发热器件12产生的热量导出；The heat conducting portion 11 and the heat conducting portion 11 are provided with a heat generating device 12 configured to derive heat generated by the heat generating device 12;
散热部13，散热部13连接于导热部11，散热部13为绝缘材料且热导率高于预设阈值，配置为将从导热部11导出的热量散发。The heat dissipating portion 13 is connected to the heat conducting portion 11 . The heat dissipating portion 13 is made of an insulating material and has a thermal conductivity higher than a predetermined threshold. The heat dissipating portion 13 is disposed to dissipate heat derived from the heat conducting portion 11 .
本发明实施例提供的散热装置，包括导热部11和散热部13，其中，导热部11能够将发热器件12产生的热量导出；散热部13能够将从导热部11导出的热量散发，由于散热部13的热导率较高，从而能够以较高的效率将热量散发，又由于散热部13为绝缘材料，因此散热部13的加入不会影响电路的电学性能，与电路板的电学设计具有良好的兼容性。The heat dissipating device provided by the embodiment of the invention includes a heat conducting portion 11 and a heat dissipating portion 13 , wherein the heat conducting portion 11 can derive the heat generated by the heat generating device 12; the heat dissipating portion 13 can dissipate the heat derived from the heat conducting portion 11 due to the heat dissipating portion The thermal conductivity of 13 is high, so that heat can be dissipated with higher efficiency, and since the heat dissipating portion 13 is an insulating material, the addition of the heat dissipating portion 13 does not affect the electrical performance of the circuit, and the electrical design of the circuit board is good. Compatibility.
本发明实施例中，导热部11可以为任何能够将发热器件12产生的热传导出来的结构或装置，本发明的实施例对此不作限定。例如可以为发热器件与电路板之间的焊盘或者发热器件与电路板之间的微带线等。这种情况下，导热部11同时具备电学功能和导热功能，从而能够充分利用电路原有的设计，无需额外增加电路板设计开销。In the embodiment of the present invention, the heat conducting portion 11 can be any structure or device capable of conducting heat generated by the heat generating device 12, which is not limited by the embodiment of the present invention. For example, it may be a pad between the heat generating device and the circuit board or a microstrip line between the heat generating device and the circuit board. In this case, the heat transfer portion 11 has both an electrical function and a heat transfer function, so that the original design of the circuit can be fully utilized without additional board design overhead.
导热部11将热量从发热器件导出后，即可通过散热部13散热。本发明实施例中，散热部13可以包括所有热导率高于一定阈值的绝缘材料，例如氮化铝陶瓷、氮化硼、氧化镁等。该阈值可以根据电路对散热要求的不 同而设置，例如可以为热的良导体和不良导体的分界点，大于或等于该阈值的材料为热的良导体，低于该阈值的材料为热的不良导体。那么所有热的良导体都可以作为散热部13的材料。本发明实施例中，散热部13可以由一个或多个独立的散热器件构成，这多个散热器件可以并排放置，也可以叠加放置，本发明的实施例对此不作限定。After the heat transfer portion 11 derives heat from the heat generating device, it can dissipate heat through the heat radiating portion 13. In the embodiment of the present invention, the heat dissipating portion 13 may include all insulating materials having a thermal conductivity higher than a certain threshold, such as aluminum nitride ceramics, boron nitride, magnesium oxide, and the like. The threshold can be based on the circuit's requirements for heat dissipation. Also provided, for example, may be a boundary point between a good conductor of heat and a poor conductor, a material greater than or equal to the threshold is a good conductor of heat, and a material below the threshold is a poor conductor of heat. Then all the good conductors of heat can be used as the material of the heat radiating portion 13. In the embodiment of the present invention, the heat dissipating portion 13 may be formed by one or more independent heat sink members. The plurality of heat dissipating members may be placed side by side or may be stacked, which is not limited by the embodiment of the present invention.
进一步的，如图2所示，为了提高散热部13的散热效率，散热部13一端可连接于导热部11，另一端还可连接于电路板的地14，配置为将从导热部11导出的热量通过电路板上的地14散发。由于电路板上的地14一般为面积较大的金属层，从而大大加快了热量的耗散。Further, as shown in FIG. 2, in order to improve the heat dissipation efficiency of the heat dissipation portion 13, one end of the heat dissipation portion 13 may be connected to the heat conduction portion 11, and the other end may be connected to the ground 14 of the circuit board, and configured to be led out from the heat conduction portion 11. Heat is dissipated through the ground 14 on the board. Since the ground 14 on the circuit board is generally a relatively large metal layer, heat dissipation is greatly accelerated.
本发明实施例中，散热部13可以通过多种途径与电路板上的地14相连，例如，如图3所示，在本发明的一个实施例中，导热部11的周围可以设置有连接部15，连接部15通过电路板内部的导线与地14相连，散热部13一端可以与导热部11相连，另一端可以通过连接部15与电路板的地14相连。本发明实施例中，该连接部15具体可以为焊盘等各种可以与地14相连的结构，其中，该焊盘的个数可以为一个也可以为多个。而散热部13可以通过焊接方式或通过粘贴方式与连接部15以及导热部11相连。由于电路板中的地可能包括多块区域，并分布在电路板的多个层中，而连接部15既可以与电路板中本层的地相连，也可以通过焊盘和通孔与电路板的其他层的地相连，本发明的实施例对此不作限制。In the embodiment of the present invention, the heat dissipating portion 13 can be connected to the ground 14 on the circuit board in various ways. For example, as shown in FIG. 3, in one embodiment of the present invention, the heat conducting portion 11 can be provided with a connecting portion around the portion. 15. The connecting portion 15 is connected to the ground 14 through a wire inside the circuit board. One end of the heat radiating portion 13 may be connected to the heat conducting portion 11, and the other end may be connected to the ground 14 of the circuit board through the connecting portion 15. In the embodiment of the present invention, the connecting portion 15 may be a structure such as a pad that can be connected to the ground 14. The number of the pads may be one or more. The heat dissipating portion 13 can be connected to the connecting portion 15 and the heat conducting portion 11 by soldering or by bonding. Since the ground in the circuit board may include multiple regions and are distributed in multiple layers of the circuit board, the connection portion 15 may be connected to the ground of the current layer in the circuit board, or through the pads and the vias and the circuit board. The other layers are connected to each other, and the embodiment of the present invention does not limit this.
下面通过具体实施例对本发明提供的散热装置进行详细说明。The heat sink provided by the present invention will be described in detail below by way of specific embodiments.
图4为时分双工(TDD，Time Division Duplexing)功放大功率开关所在电路板的电路图，图5为图4对应的实物图。结合图4和图5，本实施例中，TDD功放大功率开关由多个二极管构成，正常工作时，二极管会承受较大功率，成为高热器件。为了对其进行有效的散热，可以在TDD的各个二极管附近设置多个焊盘。氮化铝陶瓷(图中的椭圆圈中所示部分)一端 焊接在微带线上，另一端直接通过焊盘与电路板的地相连。这样，通过在二极管周围加入高导热材料的氮化铝，有效降低了二极管的温升，提高开关所能承受的最大功率等级。同时，由于高导热材料氮化铝陶瓷为绝缘体，其在电路板上的引入，对于射频电路影响可以忽略。4 is a circuit diagram of a circuit board on which a time division duplex (TDD) power amplifier power switch is located, and FIG. 5 is a physical diagram corresponding to FIG. 4 and FIG. 5, in this embodiment, the TDD power amplifier power switch is composed of a plurality of diodes. When working normally, the diode will withstand a large power and become a high-heat device. In order to effectively dissipate heat, a plurality of pads may be disposed in the vicinity of each diode of the TDD. One end of an aluminum nitride ceramic (shown in the elliptical circle in the figure) Solder on the microstrip line and connect the other end directly to the ground of the board through the pad. In this way, by adding aluminum nitride with a high thermal conductivity material around the diode, the temperature rise of the diode is effectively reduced, and the maximum power level that the switch can withstand is increased. At the same time, since the high thermal conductivity material aluminum nitride ceramic is an insulator, its introduction on the circuit board has negligible influence on the radio frequency circuit.
采用上述技术方案后，同等条件下，TDD开关器件温升可以下降到原来的62％，开关功率等级可以提高27％。After adopting the above technical solution, under the same conditions, the temperature rise of the TDD switching device can be reduced to 62%, and the switching power level can be increased by 27%.
相应的，本发明的实施例还提供一种电路板，所述电路板上设置有前述任一实施例中的散热装置，因此也能达到相同的有益技术效果，前文已经进行了详细说明，此处不再赘述。Correspondingly, an embodiment of the present invention further provides a circuit board, which is provided with the heat dissipating device in any of the foregoing embodiments, and thus can achieve the same beneficial technical effects, which have been described in detail above. I won't go into details here.
相应的，如图6所示，本发明的实施例还提供一种电路板的设计方法，包括：Correspondingly, as shown in FIG. 6, an embodiment of the present invention further provides a circuit board design method, including:
S21，根据需求进行电路设计；S21, circuit design according to requirements;
S22，对设计好的电路进行热仿真，以确定发热器件；S22, performing thermal simulation on the designed circuit to determine a heat generating device;
S23，在电路板上为所述发热器件预留散热路径；其中，所述散热路径包括：导热部，所述导热部上设置有发热器件；散热部，所述散热部连接于所述导热部；所述散热部为绝缘材料且热导率高于预设阈值，用于将从所述导热部导出的热量散发。S23, a heat dissipation path is reserved for the heat generating device on the circuit board; wherein the heat dissipation path includes: a heat conducting portion, the heat conducting portion is provided with a heat generating device; and the heat dissipating portion is connected to the heat conducting portion The heat dissipating portion is an insulating material and has a thermal conductivity higher than a preset threshold for dissipating heat derived from the heat conducting portion.
本发明实施例提供的电路板设计方法，在进行整个电路板产品热仿真后，确定高发热器件，后续在优化设计时，在电路板上预留出散热路径，以便为发热器件进行散热，这样兼容了电路功能与器件散热，在不影响电路电学性能的前提下，大大提高了发热器件的散热效率。The circuit board design method provided by the embodiment of the present invention determines a high heat generating device after performing thermal simulation of the entire circuit board product, and then, in the optimized design, a heat dissipation path is reserved on the circuit board to dissipate heat for the heat generating device. Compatible with circuit function and device heat dissipation, greatly improving the heat dissipation efficiency of the heating device without affecting the electrical performance of the circuit.
尽管为示例目的，已经公开了本发明的优选实施例，本领域的技术人员将意识到各种改进、增加和取代也是可能的，因此，本发明的范围应当不限于上述实施例。 While the preferred embodiments of the present invention have been disclosed for purposes of illustration, those skilled in the art will recognize that various modifications, additions and substitutions are possible, and the scope of the invention should not be limited to the embodiments described above.

Claims (9)

  1. 一种散热装置，包括：A heat sink comprising:
    导热部，所述导热部上设置有发热器件，配置为将所述发热器件产生的热量导出；a heat conducting portion, wherein the heat conducting portion is provided with a heat generating device configured to derive heat generated by the heat generating device;
    散热部，所述散热部连接于所述导热部；所述散热部为绝缘材料且热导率高于预设阈值，配置为将从所述导热部导出的热量散发。The heat dissipating portion is connected to the heat conducting portion; the heat dissipating portion is an insulating material and has a thermal conductivity higher than a predetermined threshold, and is configured to dissipate heat derived from the heat conducting portion.
  2. 根据权利要求1所述的装置，其中，The device according to claim 1, wherein
    所述散热部一端连接于所述导热部，另一端连接于电路板的地，配置为将从所述导热部导出的热量通过电路板上的地散发。One end of the heat dissipating portion is connected to the heat conducting portion, and the other end is connected to the ground of the circuit board, and is configured to dissipate heat extracted from the heat conducting portion through the ground on the circuit board.
  3. 根据权利要求1或2所述的装置，其中，所述导热部包括微带线。The device according to claim 1 or 2, wherein the heat conducting portion comprises a microstrip line.
  4. 根据权利要求2所述的装置，其中，所述导热部的周围设置有连接部，所述散热部一端与所述导热部相连，另一端通过所述连接部与所述电路板的地相连。The apparatus according to claim 2, wherein a periphery of the heat conducting portion is provided with a connecting portion, one end of the heat radiating portion is connected to the heat conducting portion, and the other end is connected to the ground of the circuit board through the connecting portion.
  5. 根据权利要求4所述的装置，其中，所述连接部包括焊盘。The device of claim 4 wherein the connection portion comprises a pad.
  6. 根据权利要求4所述的装置，其中，所述散热部通过焊接或粘贴方式与所述连接部相连。The apparatus according to claim 4, wherein said heat radiating portion is connected to said connecting portion by soldering or pasting.
  7. 根据权利要求1所述的装置，其中，所述散热部包括氮化铝陶瓷。The apparatus of claim 1 wherein said heat sink comprises an aluminum nitride ceramic.
  8. 一种电路板，所述电路板上设置有权利要求1至7中任一项所述的散热装置。A circuit board provided with the heat sink according to any one of claims 1 to 7.
  9. 一种如权利要求8所述的电路板的设计方法，包括：A method of designing a circuit board according to claim 8, comprising:
    根据需求进行电路设计；Circuit design according to requirements;
    对设计好的电路进行热仿真，以确定发热器件；Thermal simulation of the designed circuit to determine the heating device;
    在电路板上为所述发热器件预留散热路径；其中，所述散热路径包括：导热部，所述导热部上设置有发热器件；散热部，所述散热部连接于所述导热部；所述散热部为绝缘材料且热导率高于预设阈值，用于将从所述导 热部导出的热量散发。 Dissipating a heat dissipation path for the heat generating device on the circuit board; wherein the heat dissipation path includes: a heat conducting portion, the heat conducting portion is provided with a heat generating device; and the heat radiating portion is connected to the heat conducting portion; The heat dissipating portion is an insulating material and the thermal conductivity is higher than a preset threshold for The heat derived from the hot part is dissipated.
PCT/CN2015/086621 2014-12-23 2015-08-11 Heat sink apparatus, circuit board and method of designing same WO2016101625A1 (en)

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Citations (3)

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Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
CN202524652U (en) * 2012-04-10 2012-11-07 孙井斌 Combined circuit board with high heat conductivity
CN103974598A (en) * 2013-02-05 2014-08-06 欧司朗有限公司 Circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040226696A1 (en) * 2003-02-28 2004-11-18 Hong Huang Surface mount resistors as heat transfer augmentation devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
CN202524652U (en) * 2012-04-10 2012-11-07 孙井斌 Combined circuit board with high heat conductivity
CN103974598A (en) * 2013-02-05 2014-08-06 欧司朗有限公司 Circuit board

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