CN105792513B - A kind of three-in-one function circuit board - Google Patents
A kind of three-in-one function circuit board Download PDFInfo
- Publication number
- CN105792513B CN105792513B CN201610265587.8A CN201610265587A CN105792513B CN 105792513 B CN105792513 B CN 105792513B CN 201610265587 A CN201610265587 A CN 201610265587A CN 105792513 B CN105792513 B CN 105792513B
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit board
- connector
- area
- wireless communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004891 communication Methods 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000004744 fabric Substances 0.000 claims abstract description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides a kind of three-in-one function circuit board, including substrate, it is covered in the cloth layers of copper of the substrate surface, the cloth layers of copper includes pad area and clearance zone, access area is provided on the pad area, the clearance zone surface is covered with insulating layer, and wireless communication pad, microphone pad and earphone base pad are additionally provided on the pad area.Three-in-one function circuit board proposed by the present invention, the circuit board is FPC, it is by concentrating on earphone base pad, the wireless communication pad, the microphone pad on one FPC, then it is connect by connector pad with mainboard, the space of complete machine stacking can be saved and promote the efficiency of assembling.
Description
Technical field
The present invention relates to the technical fields such as LTE, 3G wireless communications products, intelligent terminal more particularly to a kind of three-in-one function
It can circuit board.
Background technique
Flexible circuit board (FPC) has the characteristics that Distribution density is high, light-weight, thickness is thin, is widely used in plate
In computer, display device and other electronic products, mainly the PCB different to electronic product is attached or by other device
It is connected on pcb board.
But with the development of electronic communication product especially tablet computer, machine requirement is more and more thinner, and factory
Packaging efficiency require it is higher and higher, the modularization of corresponding device also require it is higher and higher, this will will lead on pcb board for
The area of FPC welding is smaller and smaller, and with the increase of function, the used pin of FPC welding is more and more, increases weldering
Connect difficulty.
Invention is by a kind of cleverly novel three-in-one function FPC structural design scheme, infrared IR, microphone MIC with
The contact weld pad of earphone base concentrates on a FPC, can save the space of complete machine stacking and promote the efficiency of assembling.
Summary of the invention
In order to solve the deficiencies in the prior art, the present invention provides a kind of three-in-one function circuit board, can save complete machine heap
Folded space, and the efficiency of assembling can be promoted.
It is proposed by the present invention the specific technical proposal is: provide a kind of three-in-one function circuit board, including substrate, be covered in institute
The cloth layers of copper of substrate surface is stated, the cloth layers of copper includes pad area and clearance zone, and access area is provided on the pad area, described
Clearance zone surface is covered with insulating layer, and wireless communication pad, microphone pad and earphone base weldering are additionally provided on the pad area
Disk.
Further, the circuit board is FPC.
Further, the wireless communication pad is infrared communication pad.
Further, the earphone base pad is located at the front of the substrate, the wireless communication pad, microphone weldering
Disk and the access area are located at the back side of the substrate.
Further, the pad area is additionally provided with connector pad, for solder connector and passes through the connector
It is connect with mainboard.
Further, the connector pad is located at the back side of the circuit board.
Further, the earphone base pad, the wireless communication pad, the microphone pad, the connector pad
And the access area is arranged in a staggered manner respectively.
Further, it is welded with the earphone base pad, the wireless communication pad, the microphone pad, the connector
Reinforced structure is respectively arranged on the corresponding clearance zone of disk.
Further, the reinforced structure is steel disc.
Further, the earphone base pad includes 5 dew copper contacts.
Three-in-one function circuit board proposed by the present invention, the circuit board are FPC, by by earphone base pad, described
Wireless communication pad, the microphone pad concentrate on a FPC, are then connect by connector pad with mainboard, Ji Nengjie
The space that complete machine stacks is saved, and the efficiency of assembling can be promoted.
Detailed description of the invention
With reference to the accompanying drawing, by the way that detailed description of specific embodiments of the present invention, technical solution of the present invention will be made
And other beneficial effects are apparent.
Fig. 1 is the cross-sectional view of three-in-one function circuit board；
Fig. 2 is three-in-one function circuit board plane structure chart；
Fig. 3 is another plane structure chart of three-in-one function circuit board；
Fig. 4 connect plane structure chart with mainboard for three-in-one function circuit board.
Specific embodiment
Hereinafter, with reference to the accompanying drawings to detailed description of the present invention embodiment.However, it is possible to come in many different forms real
The present invention is applied, and the present invention should not be construed as limited to the specific embodiment illustrated here.On the contrary, providing these implementations
Example is in order to explain the principle of the present invention and its practical application, to make others skilled in the art it will be appreciated that the present invention
Various embodiments and be suitable for the various modifications of specific intended application.In the accompanying drawings, identical label will be used for table always
Show identical element.
Referring to Fig.1, the present embodiment provides a kind of circuit boards of three-in-one function comprising substrate 10, cloth layers of copper 20 and
Insulating layer 30.
Preferably, the circuit board is FPC.Substrate in the present embodiment is dual platen, includes front and back.Substrate
10 be polyimides or polyester film, and front and the back side have been covered each by cloth layers of copper 20.The cloth layers of copper 20 includes pad
Area and clearance zone (not shown), what the pad area of this lining layers of copper 20 indicated is the area Lu Tong for connecting electronic component,
What the clearance zone of cloth layers of copper 20 indicated is the region covered in cloth layers of copper 20 by insulating layer 30.
Referring to Fig. 2, Fig. 3, the pad area of cloth layers of copper 20 is provided with wireless communication pad 11, microphone pad 12, earphone base weldering
Disk 13, access area 14 and connector pad 15.Wherein, wireless communication pad 11 is for welding wireless communication module, it is preferred that
The wireless communication pad 11 is infrared communication pad, and the wireless communication module is infrared communication module.The microphone pad
12 for welding microphone, and the earphone base pad 13 is for connecting earphone base, and earphone base pad 13 includes 5 dew in the present embodiment
Copper contact can realize the conducting of earphone base and circuit board by connecting 5 pins of earphone base with 5 dew copper contacts.
The access area 14 is connect with the access area of mainboard 40, and the connector pad 15 is used for solder connector, connector and circuit
It is connect again with mainboard 40 after plate welding, so that circuit board and mainboard 40 are connected.
In order to enable each component there are enough installation spaces, it is respectively mounted respectively in the front and back of the substrate
There is component.For example, earphone base pad described in the present embodiment 13 is located at the front of substrate 10, the wireless communication pad 11,
Microphone pad 12, access area 14 and connector pad 15 are located at the back side of substrate 10, and wirelessly communicate pad 11, miaow
Head pad 12, earphone base pad 13, access area 14 and connector pad 15 are arranged in a staggered manner respectively, i.e., wireless communication pad 11,
Microphone pad 12, earphone base pad 13, the projection of access area 14 and connector pad 15 on circuit boards are not overlapped.
For the ease of the connection of circuit board, pad 11, microphone pad 12, earphone base pad 13 and connector are wirelessly communicated
Reinforced structure 50 is respectively arranged on the corresponding clearance zone of pad 15, the reinforced structure 50 is steel disc, by conductive two-sided
Glue clearance zone corresponding with wireless communication pad 11, microphone pad 12, earphone base pad 13 and connector pad 15 is bonded in
Together.
Referring to Fig. 4, in order to provide optimal device stack placement scheme, the circuit board in the present embodiment is inverted L shape,
In, wireless communication pad 11, microphone pad 12 and access area 14 are located at one end of inverted L shape circuit board, earphone base pad
13 and connector pad 15 be located at the other end of inverted L shape circuit board, wireless communication pad 11 is connect with microphone pad 12,
Access area 14 and earphone base pad 13 are connect with microphone pad 12 respectively, and connector pad 15 is connect with earphone base pad 13,
Circuit board is connect by the connector on access area 14 and connector pad with mainboard 40.It is assembled by circuit board and mainboard 40
When together, in order to guarantee that contact is reliable, it is additionally provided with the baffle 40a for fixing circuit board on mainboard 40, passes through screw
It is fixed with mainboard 40, it can guarantee that circuit board is contacted with mainboard 40 by access area 40, connector pad 50 and baffle 40a
Reliability.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered
It is considered as the protection scope of the application.
Claims (5)
1. a kind of three-in-one function circuit board, including substrate, it is covered in the cloth layers of copper of the substrate surface, the cloth layers of copper includes
Pad area and clearance zone are provided with access area on the pad area, and the clearance zone surface is covered with insulating layer, and feature exists
In being additionally provided with wireless communication pad, microphone pad and earphone base pad on the pad area, the circuit board is flexible electrical
Road plate, the earphone base pad are located at the front of the substrate, the wireless communication pad, the microphone pad and described connect
Area is located at the back side of the substrate；The pad area is additionally provided with connector pad, for solder connector and passes through
The connector is connect with mainboard, and the connector pad is located at the back side of the substrate；It is the earphone base pad, described wireless
Communication pad, the microphone pad, the connector pad and the access area are arranged in a staggered manner respectively.
2. circuit board according to claim 1, which is characterized in that the wireless communication pad is infrared communication pad.
3. circuit board according to claim 1, which is characterized in that with the earphone base pad, the wireless communication pad,
Reinforced structure is respectively arranged on the microphone pad, the corresponding clearance zone of the connector pad.
4. circuit board according to claim 3, which is characterized in that the reinforced structure is steel disc.
5. circuit board according to any one of claims 1 to 4, which is characterized in that the earphone base pad includes 5 dew copper touchings
Point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610265587.8A CN105792513B (en) | 2016-04-26 | 2016-04-26 | A kind of three-in-one function circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610265587.8A CN105792513B (en) | 2016-04-26 | 2016-04-26 | A kind of three-in-one function circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105792513A CN105792513A (en) | 2016-07-20 |
| CN105792513B true CN105792513B (en) | 2019-05-03 |
Family
ID=56398543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610265587.8A Active CN105792513B (en) | 2016-04-26 | 2016-04-26 | A kind of three-in-one function circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105792513B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1906987A (en) * | 2004-01-16 | 2007-01-31 | 摩托罗拉公司(在特拉华州注册的公司) | Improved populated printed wiring board and method of manufacture |
| CN204759297U (en) * | 2015-07-30 | 2015-11-11 | 深圳市明泰电讯有限公司 | Conversation panel computer mainboard and conversation panel computer with two unification SIM cassettes |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7758353B2 (en) * | 2008-03-14 | 2010-07-20 | Motorola, Inc. | Circuit board connector assembly and method for assembling such an assembly |
-
2016
- 2016-04-26 CN CN201610265587.8A patent/CN105792513B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1906987A (en) * | 2004-01-16 | 2007-01-31 | 摩托罗拉公司(在特拉华州注册的公司) | Improved populated printed wiring board and method of manufacture |
| CN204759297U (en) * | 2015-07-30 | 2015-11-11 | 深圳市明泰电讯有限公司 | Conversation panel computer mainboard and conversation panel computer with two unification SIM cassettes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105792513A (en) | 2016-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220307 Address after: 200000 room 5g11, No. 1, Lane 129, Datian Road, Jing'an District, Shanghai Patentee after: Shanghai Huashi Investment Co.,Ltd. Address before: 516003 No.86, hechangqi Road West, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee before: HUIZHOU TCL MOBILE COMMUNICATION Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240109 Address after: Room 1260, South Building of Film and Television Park, No. 4915 Beisong Road, Songjiang District, Shanghai, 200000 Patentee after: SHANGHAI KANGAO MEDICAL TECHNOLOGY Co.,Ltd. Address before: 200000 room 5g11, No. 1, Lane 129, Datian Road, Jing'an District, Shanghai Patentee before: Shanghai Huashi Investment Co.,Ltd. |
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| TR01 | Transfer of patent right |