CN105785673A - Display module and manufacturing method thereof - Google Patents
Display module and manufacturing method thereof Download PDFInfo
- Publication number
- CN105785673A CN105785673A CN201610329211.9A CN201610329211A CN105785673A CN 105785673 A CN105785673 A CN 105785673A CN 201610329211 A CN201610329211 A CN 201610329211A CN 105785673 A CN105785673 A CN 105785673A
- Authority
- CN
- China
- Prior art keywords
- circuit component
- line areas
- conductive film
- anisotropic conductive
- tertiary circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000005245 sintering Methods 0.000 claims description 101
- 238000000034 method Methods 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 7
- 238000004064 recycling Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 12
- 239000004642 Polyimide Substances 0.000 description 10
- 229920001721 polyimide Polymers 0.000 description 10
- -1 PI) Polymers 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 9
- 239000005020 polyethylene terephthalate Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- 238000007731 hot pressing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N EtOH Substances CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Abstract
The invention discloses a display module and a display module manufacturing method. The display module comprises three circuit components, two anisotropic conductive films and two sintered structures. The third circuit member includes a line area and a wireless area. The first anisotropic conductive film is disposed between the circuit region of the third circuit member and the first circuit member, and the third circuit member and the first circuit member are electrically connected through the first anisotropic conductive film. The second anisotropic conductive film is disposed between the circuit region of the third circuit member and the second circuit member, and the third circuit member and the second circuit member are electrically connected through the second anisotropic conductive film. Wherein the third circuit member and the first circuit member are connected at the wireless circuit area of the third circuit member through the first sintered structure, and the third circuit member and the second circuit member are connected at the wireless circuit area of the third circuit member through the second sintered structure.
Description
Technical field
The invention relates to a kind of display apparatus module, and utilize at the display apparatus module utilizing without line areas the mode of sintering to increase attaching power in particular to a kind of.
Background technology
Liquid crystal display device module (LiquidCrystalDisplayModule, LCDModule) processing procedure is to utilize two pieces of glass substrates, after two pieces of glass substrates engage, will be electrically connected with driving IC and control circuit plate again, to form liquid crystal display device module.
Drive the mode of connection of IC and TFT substrate, automatically (TapeAutoBonding is engaged including using winding, TAB) technology forms coiling tape type carrier capsulation piece (TapeCarrierPackage, TCP) link with use glass flip chip (ChipOnGlass, COG) technology.When driving IC to be carried on TCP, need to prior to the TCP pin (lead) of the glass substrate of TFT substrate be coated with anisotropic conductive film (AnisotropicConductiveFilm, ACF), then TCP it is configured on TCP pin and carries out hot pressing manufacture procedure.So, it is possible to complete to drive the IC electric connection with TFT substrate.Afterwards, TCP also by hot pressing manufacture procedure, will be electrically connected with control circuit plate.
COG technology refers to IC to be driven directly to be arranged on the glass substrate of TFT substrate, and its main fabrication steps is: on the COG pin on glass substrate, is coated with anisotropic conductive film；Driving IC is configured on COG pin, and is driven IC hot pressing and.In addition, this glass substrate more must be electrically connected with control circuit plate (PrintedCircuitBoard, PCB) by a flexible circuit board (FlexiblePrintedCircuits, FPC).It is by after being first coated with on anisotropic conductive film FPC pin on glass substrate, then is configured at by FPC on these FPC pins and carries out hot pressing and it.
But, in hot pressing process, process temperatures will rise to about 250 DEG C, ACF can face the risk of softening and adhesion failure, if depending merely on the viscosity of ACF glue, will be unable to provide enough attaching intensity, ACF be intended to above it and FPC or COF of bonding can partly or entirely peel off (peeling), cause yield to decline and cannot pass through to clash into the reliability checking of (shock) or vibrations (vibration).
Summary of the invention
In view of this, the purpose of the present invention is exactly providing a kind of display apparatus module, utilize increase sintering structure in circuit member without line areas, strengthen the laminating ability of two circuit members, and do not affect the performance of script module, and increase yield.
According to object of the invention it is proposed a kind of display apparatus module, comprising: the first circuit member, second circuit component, tertiary circuit component, wherein this tertiary circuit component comprises line areas and without line areas, and this more comprises a sintering structure without line areas；Anisotropic conductive film, comprise the first anisotropic conductive film and the second anisotropic conductive film, and first anisotropic conductive film system be arranged between the line areas of tertiary circuit component and the first circuit member, and tertiary circuit component and the first circuit member are through the first anisotropic conductive film electrical connection；And second anisotropic conductive film system be arranged between the line areas of tertiary circuit component and second circuit component, tertiary circuit component and the second routing components are through the second anisotropic conductive film electrical connection；Wherein, tertiary circuit component and the first circuit member connect through the sintering structure without line areas of tertiary circuit component, and tertiary circuit component and the second routing components pass through the sintering structure without line areas of tertiary circuit component and connect.
According to the purpose of the present invention, more providing the manufacture method of a kind of display apparatus module, comprise: provide the first circuit member, it is provided that second circuit component, it is provided that tertiary circuit component, wherein tertiary circuit component comprises line areas and without line areas；Anisotropic conductive film is set in the line areas of tertiary circuit component, this anisotropic conductive film of pressing and tertiary circuit component, make tertiary circuit component respectively with the first circuit member, the second routing components electrical connection.
The present invention proposes the manufacture method of a kind of display apparatus module, comprises offer the first circuit member, it is provided that second circuit component, it is provided that tertiary circuit component, wherein this tertiary circuit component comprises line areas and without line areas, and this more comprises sintering structure without line areas；Anisotropic conductive film is provided, anisotropic conductive film system comprises the first anisotropic conductive film and the second anisotropic conductive film, and the first anisotropic conductive film is set between the line areas of tertiary circuit component and the first circuit member, pressing tertiary circuit component, the first circuit member and the first anisotropic conductive film so that tertiary circuit component and the second routing components are through the second anisotropic conductive film electrical connection；And, second anisotropic conductive film is set between the line areas of tertiary circuit component and second circuit component, pressing tertiary circuit component, the second routing components and the second anisotropic conductive film so that tertiary circuit component and the second routing components are through the second anisotropic conductive film electrical connection；Sintering tertiary circuit component without circuit region and the first circuit member, to form the first sintering structure；Sintering tertiary circuit component without circuit region and the second routing components, to form the second sintering structure；Tertiary circuit component and the first circuit member pass through first sintering structure without line areas of tertiary circuit component and connect, and tertiary circuit structure and the second routing components pass through the second sintering structure connection without line areas of tertiary circuit component.
Accompanying drawing explanation
Figure 1A is the first embodiment schematic diagram of inventive display module.
Figure 1B is the first embodiment explosive view of inventive display module.
Fig. 2 is the second embodiment schematic diagram of inventive display module.
Fig. 3 is the 3rd embodiment schematic diagram of inventive display module.
Fig. 4 is the 4th embodiment schematic diagram of inventive display module.
Fig. 5 is the 5th embodiment schematic diagram of inventive display module.
Fig. 6 is the sixth embodiment schematic diagram of inventive display module.
Wherein, accompanying drawing labelling:
Display apparatus module: 100
First circuit member: 201
Second circuit component: 202
Tertiary circuit component: 203
First sintering structure: 301,303,305
Second sintering structure: 302,304,306
First line district: 401
First without line areas: 501
Second line areas: 402
Second without line areas: 502
3rd without line areas: 503
4th without line areas: 504
First anisotropic conductive film: 601
Second anisotropic conductive film: 602
Minor face: V
Sintering pattern: A, B, C, D
Distance: L, L1, L2
Corner: C1, C2, C3, C4
Sintering structure: 801,802,803,804,701,901,902,903,904
Wireless way region: 701a
Circuit 401a
Sub-sintering structure 902a
Detailed description of the invention
Referring to Figure 1A and Figure 1B, Figure 1A Figure 1B is the first embodiment of the present invention, one display apparatus module 100 comprises the first circuit member 201, second circuit component 202 and tertiary circuit component 203, and wherein the first circuit member 201 and second circuit component 202 are respectively such as: printed circuit board (PCB) (PrintedCircuitBoard；Or display floater PCB).For example, it is PCB that the present invention is preferably the first circuit member 201, and second circuit component 202 is display floater.Wherein, display floater in the embodiment of the present invention, do not limit its kind, comprise the display floater of non-self light emitting display panel (such as: the display floater of display panels, electrophoretic display panel, Electrowetting display panel or other suitable type), light-emitting display panel (such as: the display floater of organic electric-excitation luminescent displaying panel, inorganic electroluminescence display floater or other suitable type) or other suitable type.Wherein, in display floater, two corresponding baseplate materials comprise glass, quartz, polymeric material (such as: polyimides (Polyimide, PI), polyethylene terephthalate (Polyethyleneterephthalate, PET), poly-naphthalenedicarboxylic acid ethanol ester (Polyethylenenaphthalate, PEN) or other suitable material) or other suitable material.Baseplate material in the first circuit member 201 of the embodiment of the present invention comprises polymeric material (such as: polyimides (Polyimide, PI), polyethylene terephthalate (Polyethyleneterephthalate, PET), poly-naphthalenedicarboxylic acid ethanol ester (Polyethylenenaphthalate, PEN) or other suitable material) or other suitable material.It addition, tertiary circuit component 203 is such as: thin membrane flip chip encapsulation is tended to act wafer (IConFilm, COF) or flexible printed wiring board (FlexiblePrintedCircuit, FPC), and the present invention is not limited.In the tertiary circuit component 203 of the embodiment of the present invention baseplate material polymeric material (such as: polyimides (Polyimide, PI), polyethylene terephthalate (Polyethyleneterephthalate, PET), poly-naphthalenedicarboxylic acid ethanol ester (Polyethylenenaphthalate, PEN) or other suitable material) or other suitable material.Tertiary circuit component 203 more comprises line areas (such as: first line district 401) and without line areas (such as: first without line areas 501).Embodiment of the present invention system to be positioned at the side at tertiary circuit component 203 (such as: flexible printed wiring board) edge without line areas (such as: first without line areas 501), and the outside (such as: away from the side at flexible printed wiring board center) being positioned at line areas (such as: first line district 401) is example, but it is not limited to this.It should be noted that, arrange without line areas (such as: without line areas 501) does not have any wire or electronic component (such as: wafer), and line areas with without line areas unrestrictedly relative position relationship, as long as the region arranged without wire or electronic component be the present invention without line areas.
nullIn order to allow tertiary circuit component 203 be electrically connected with the first circuit member 201 and second circuit component 202 respectively，Inventive display module 100 more comprises anisotropic conductive film (AnisotropicConductiveFilm,ACF)，Such as Figure 1A，It comprises the first anisotropic conductive film 601 and the second anisotropic conductive film 602，And first anisotropic conductive film 601 be arranged between first line district 401 and first circuit member 201 of (being located in) tertiary circuit component 203，And tertiary circuit component 203 and the first circuit member 201 are electrically connected through the first anisotropic conductive film 601，And，Second anisotropic conductive film 602 is arranged between second line areas 402 of (being located in) tertiary circuit component 203 and this second circuit component 202，This tertiary circuit component 203 and this second routing components 202 are through this second anisotropic conductive film 602 electrical connection.Specifically, the first line district 401 of tertiary circuit component 203 and tertiary circuit district 403 electrical connection of the first circuit member 201 can be made through the first anisotropic conductive film 601；The second line areas 402 of tertiary circuit component 203 and the 4th line areas 404 electrical connection of second circuit component 202 can be made through the second anisotropic conductive film 602.
In order to allow tertiary circuit component 203 be connected firmly with the first circuit member 201 and second circuit component 202 respectively, inventive display module 100 more comprises sintering structure, and it comprises the first sintering structure 301 and the second sintering structure 302.The sintering structure of the present invention is such as by laser, cover is on the predetermined area of circuit member substrate, such as: utilize laser expose on the first circuit member 201 and/or second circuit component 202 and/or tertiary circuit component 203 without on the material (substrate) on line areas, such as polymeric material is (such as: polyimides (Polyimide, PI) or other suitable material), material is made to present molten because laser produces high temperature, afterwards until the PI film of molten returns to room temperature, making two blocks of PI materials can blow be together, to form sintering structure, but the present invention is not limited, as long as the sintering structure that melting combines by two of which circuit member can be utilized to be scope of the invention.Such as, if second circuit component 202 is display floater, its two corresponding baseplate material is generally glass, then on tertiary circuit component 203 without on the material (substrate) on line areas, such as polyimides (Polyimide, PI) still can by lf, in time returning to room temperature when the PI film of molten afterwards, PI material welding is made to be fixed on glass, to form sintering structure, namely two different materials (such as: PI and glass), still can allow two circuit members combine.
Tertiary circuit component 203 is in order to be connected firmly with the first circuit member 201 and second circuit component 202 respectively, tertiary circuit component 203 can in designing relative to the first circuit member 201 and second circuit component 202 without line areas, namely tertiary circuit component 203 can be described as first without line areas 501 without line areas relative to the first circuit member 201, tertiary circuit component 203 can be described as first without line areas 502 without line areas relative to second circuit component 202.In other words, the first of tertiary circuit component 203 lays respectively at different tertiary circuit component 203 from first without line areas 502 without line areas 501 and does not exist together, and first be all not between first line district 401 and the second line areas 402 without line areas 501 and first without line areas 502, then first lay respectively at the outside (i.e. the side of neighboring edge) of first line district 401 and the second line areas 402 without line areas 501 and first without line areas 502.Therefore, tertiary circuit component 203 and the first circuit member 201 connect without circuit 501 district at the first of tertiary circuit component 203 through the first sintering structure 301, and this tertiary circuit component 203 and this second routing components 202 pass through this second sintering structure 302 and second connect without line areas 502 at this of this tertiary circuit component 203.
The purpose that first circuit member 201 connects for aforementioned jail, first circuit member 201 also can include the 3rd without line areas 503, and second circuit component 202 also can include the 4th without line areas 504, wherein the 3rd arrange without line areas 501 without line areas 503 corresponding first, namely the 3rd overlap in vertical direction upper part without line areas 501 without line areas 503 and first, and the 4th arranged without line areas 502 without line areas 504 corresponding second, namely the 4th without line areas 504 correspondence second without line areas 502 in the overlapping of vertical direction upper part.For example: utilize laser to irradiate without line areas 501 without line areas 503 and/or first the 3rd, make without line areas 501/503 at least one material (substrate) melt, to form the first sintering structure 301, after temperature declines, namely first combine through sintering structure 301 without line areas 503 without line areas 501 and the 3rd.Same, the formation of the second sintering structure 302, it is utilize laser to irradiate without line areas 504 without line areas 502 and/or the 4th second, make without line areas 502/504 at least one material (substrate) melt, to form the first sintering structure 301, after temperature declines, namely first combine through the second sintering structure 302 without line areas 503 without line areas 501 and the 3rd.Furthermore, ACF is except electricity connection function, its ACF itself still has viscosity, and available ACF fits the first circuit member 201 and tertiary circuit component 203, tertiary circuit component 203 and second circuit component 202, then, recycling sintering structure 301/302, make the laminating between circuit member more firm, avoid coming off in processing procedure or use procedure, yield can be increased, and because the sintering structure of the present invention is to utilize forming without line areas is melted of two pre-laminating components, the conducting of other circuit or the performance of circuit member itself can't be had influence on.
Referring again to Figure 1A and Figure 1B, the pattern of the first sintering structure 301 and the second sintering structure 302 respectively may be about ㄇ font, the opening of its two ㄇ fonts is corresponding, and the pattern of the first sintering structure 301 and the second sintering structure 302 is centered around wherein three limit on the first anisotropic conductive film 601 and the second anisotropic conductive film 602 4 limit respectively, and the first sintering structure 301 and the second sintering structure 302 pattern are substantially the same with direction.Therefore, the present embodiment, around three limits of anisotropic conductive film 601/602, can increase fitting area so that two circuit member joints are more firm.But the present invention is not limited, sintering structure can also to be centered around any or polygon of anisotropic conductive film, as long as sintering structure can be utilized to strengthen original stickup strength only engaged by anisotropic conductive film, without departure from scope of the invention,
Refer to Fig. 2, Fig. 2 is the second embodiment of the present invention, first embodiment is similar with the second embodiment, identical place is not repeating, first embodiment and the second embodiment are different in that: the first sintering structure 303 and the second sintering structure 304 are about strip, parallel first anisotropic conductive film 601 and the second anisotropic conductive film 602 respectively, and the length of sintering structure is the strip of continuous way, length is not intended to, second embodiment is at anisotropic conductive film list 601/602 side, lf is utilized to make to elongate the sintering structure of area reinforcement, vertical tension value can be promoted, adhesion is allowed to consolidate.
Refer to Fig. 3, for third embodiment of the invention, 3rd embodiment is similar with first embodiment, same place repeats no more, 3rd embodiment and first embodiment are different in that: the first sintering structure 305 and the second sintering structure 306 are the discontinuity strip pattern with spacing L, wherein L is the distance between adjacent two sintering patterns, and every section of L can have difference or the numerical value being substantially the same.For example, for instance the first sintering structure 305 has adjacent sintering pattern A, B, C and D, and wherein the distance between A and B is L；Distance between B and C is L1；Distance between C and D is L2.In the third embodiment, the distance of adjacent sintering pattern can be L=L1=L2 or L ≠ L1 ≠ L2.In other embodiments, it is also possible to the distance partially sintering pattern adjacent is substantially the same, and part is different, and the present invention is not limited；It addition, the length of sintering pattern A, B, C and D and width also do not limit, length and/or the width of sintering pattern may be about A=B=C=D.In other embodiments, sinter the length of pattern and/or width can be A ≠ B ≠ C ≠ D or partially sinter pattern and be substantially the same width and/or length, part different in width and/or length.3rd embodiment utilizes parallel anisotropic conductive film 601/602 monolateral and repeatedly short-range sintering pattern, improves the pulling force of multiple spot in the way of discontinuous arrangement.
Refer to Fig. 4, Fig. 4 is fourth embodiment of the invention, the present embodiment and first embodiment same place repeat no more, and are different in that: the 4th embodiment only (only has) at anisotropic conductive film 601/602 minor face V, respectively arrange multiple sintering structure 801,802,803 and 804.The present embodiment and the second embodiment and the 3rd embodiment are different in that, multiple sintering structures 801,802,803 and 804 only (only have) side being arranged at anisotropic conductive film 601/602 minor face V, the length of sintering structure can be shortened, and increase the both sides minor face V strength to antistripping, specifically, sintering structure 801 and 802 is respectively arranged at an anisotropic conductive film 601 wherein (outside, minor face V side, i.e. neighboring edge), and sintering structure 803 and 804 is respectively arranged at anisotropic conductive film 602 another minor face V side (outside, i.e. neighboring edge).
Refer to Fig. 5, Fig. 5 is fifth embodiment of the invention, and the 5th embodiment is similar with the 4th embodiment, is different in that: multiple sintering structures 901,902,903 and 904 lay respectively at four corner C1, C2, C3 and C4 of tertiary circuit component 203.Specifically, sintering structure 901 is positioned at corner C1, sintering structure 902 is positioned at corner C2, sintering structure 903 is positioned at corner C3 and sintering structure 904 is positioned at corner C4, the present embodiment utilizes less laser sintered number of times, in the corner of circuit member, sintering structure is set, avoid external force to pull from corner, reduce the risk peeled off.
Refer to Fig. 6, Fig. 6 is sixth embodiment of the invention, sixth embodiment is similar with first to fourth embodiment, it is different in that: overlapping with line areas (such as: first line 401) part without line areas (such as: the first radio zone 701) of tertiary circuit component 203, several wireless way region 701a is comprised without line areas 701, line areas 401 comprises several circuits 401a, between adjacent two-lines road 401a or by circuit, there is at least one in many sub regions 701a, namely at least one sub-sintering structure 902a is just comprised between adjacent two-lines road 401a, and two circuit members 203 with 201 and/or 202 with 203 through sintering structure 902 several sub-sintering structure 902a firmly together with.Therefore, the present embodiment is except the effect (such as: fixing) more improving previous embodiment, and the present embodiment more can reduce the area of tertiary circuit component 203.Must it should be noted that, anisotropic conductive film 601/602 still can arrange (sandwiched) between two circuit members (such as: 203 and 201 and 202 and 203), and namely anisotropic conductive film 601/602 still can overlap with two circuit members 203 and 201 and/or 202 and 203 in vertical direction.
It should be noted that, in other embodiments of the present invention, the sintering structure of embodiment one to embodiment five can be some shapes, strip, polygon, the combination of irregularly shaped or above-mentioned at least two shape, and the sintering structure pattern in each district and position can be different, such as the pattern of the first sintering structure 301 can be differently configured from the pattern of the second sintering structure 302, sintering structure 901 is selected from arbitrary pattern and the position of embodiment one to embodiment 5, sintering structure 902 is also selected from pattern and the position of embodiment one to embodiment 5, and sintering structure 901 and 902 can be selected from pattern that is different or that be substantially the same and position, the present invention differs, and this is limited.
According to the object of the invention, please also refer to Fig. 1, the present invention more provides the manufacture method of display apparatus module, comprise: the first circuit member 201 is provided, second circuit component 202 is provided, thering is provided tertiary circuit component 203, wherein this tertiary circuit component 203 comprises first line district 401 and first without line areas 501；Anisotropic conductive film is provided, it comprises the first anisotropy 601 conducting film and the second anisotropic conductive film 602, first anisotropic conductive film 601 is set between the line areas of tertiary circuit component 203 and the first circuit member 201, pressing tertiary circuit component the 203, first circuit member 201 and the first anisotropic conductive film 601 so that tertiary circuit component 203 and second circuit component 202 are through the second anisotropic conductive film 602 electrical connection；And, second anisotropic conductive film 602 is set between the first line district 401 and second circuit component 202 of tertiary circuit component 203, pressing tertiary circuit component the 203, second routing components and 202 second anisotropic conductive films 602 so that tertiary circuit component 203 and the second routing components 202 are through the second anisotropic conductive film 602 electrical connection；The first of sintering tertiary circuit component 203 is without circuit region 501 and the first circuit member 201, to form the first sintering structure 301；The first of sintering tertiary circuit component 203 is without circuit region 501 and the second routing components 202, to form the second sintering structure 302；Tertiary circuit component 203 and the first circuit member 202 connect without the first sintering structure 301 of line areas 501 through the first of tertiary circuit component 203, and tertiary circuit build 203 and second routing components 202 pass through the first of tertiary circuit component 203 and connect without second sintering structure 502 in circuit 501 district.Wherein the mode of the sintering of the present invention is such as laser sintered, and the mode wherein sintered is: after the first radio zone 501 of tertiary circuit component 203 directly contacts this first circuit member 201, recycling laser mode sintering；Or the first radio zone 501 and first circuit member 201 separately distance S of tertiary circuit component 203, recycling laser mode sintering, wherein distance S is not equal to 0.Wherein the energy of this laser is about: 1～50 watt (W), it is preferred that be about 1～10W；And the speed of laser is about: 1～1000 (mm/second, mm/s), it is preferred that be about 1～500mm/s；It addition, the number of times of laser injection is about: 1～100 time, it is preferred that be about 1～50 time.
The purpose of the present invention is exactly providing a kind of display apparatus module, utilize increase sintering structure in circuit member without line areas, strengthen the laminating ability of two circuit members, and because laser sintered structure is arranged at without line areas, do not affect the performance of module originally, and increase yield.
The foregoing is only presently preferred embodiments of the present invention, all equalizations made according to the claims in the present invention protection domain change and amendment, all should belong to the covering scope of the present invention.
Claims (19)
1. a display apparatus module, it is characterised in that comprise:
One first circuit member；
One second circuit component；
One tertiary circuit component, wherein this tertiary circuit component comprises a line areas and without line areas；
One anisotropic conductive film, comprise one first anisotropic conductive film and one second anisotropic conductive film, and first anisotropic conductive film system be arranged between this line areas of this tertiary circuit component and this first circuit member, and this tertiary circuit component and this first circuit member are through this first anisotropic conductive film electrical connection；And this second anisotropic conductive film is arranged between this line areas of this tertiary circuit component and this second circuit component, this tertiary circuit component and this second routing components are through this second anisotropic conductive film electrical connection；
One sintering structure, comprises one first sintering structure and one second sintering structure；
Wherein, this tertiary circuit component and this first circuit member connect without line areas at this of this tertiary circuit component through this first sintering structure, and this tertiary circuit component and this second routing components through this second sintering structure at this of this tertiary circuit component without line areas connection.
2. display apparatus module as claimed in claim 1, it is characterised in that this of this tertiary circuit component comprises the combination of a point-like, strip, polygon, irregularly shaped or above-mentioned at least two shape without this sintering structure of line areas.
3. display apparatus module as claimed in claim 1, it is characterized in that, this of this tertiary circuit component more comprises one first without line areas and one second without line areas without line areas, and this first circuit member also comprises one the 3rd and also comprises one the 4th without line areas without line areas and this second routing components, this tertiary circuit component this first without line areas corresponding to this first circuit member the 3rd without line areas, and this tertiary circuit component this second without line areas to should second circuit component the 4th without line areas.
4. display apparatus module as claimed in claim 1, it is characterized in that, this tertiary circuit component comprises a first line district and one second line areas, wherein its planimetric area part of this first line district and this first anisotropic conductive film overlap, and its planimetric area part of this second line areas and this second anisotropic conductive film overlap.
5. display apparatus module as claimed in claim 5, it is characterised in that this first anisotropic conductive film corresponds to this second line areas corresponding to this first line district and this second anisotropic conductive film.
6. display apparatus module as claimed in claim 1, it is characterised in that this second circuit component is a display floater.
7. display apparatus module as claimed in claim 1, it is characterised in that this first circuit member is a printed circuit board (PCB).
8. display apparatus module as claimed in claim 1, it is characterised in that this tertiary circuit component is a thin membrane flip chip encapsulation.
9. display apparatus module as claimed in claim 1, it is characterized in that, this radio zone of this tertiary circuit component overlaps with this line areas part, this radio zone comprises several wireless subregion, this line areas comprises several circuits, has at least one in those wireless subregions between adjacent two-lines road or by a circuit.
10. the manufacture method of a display apparatus module, it is characterised in that comprise:
One first circuit member is provided；
One second circuit component is provided；
Thering is provided a tertiary circuit component, wherein this tertiary circuit component comprises a line areas and without line areas；
One anisotropic conductive film is provided, this anisotropic conductive film comprises one first anisotropic conductive film and one second anisotropic conductive film, this first anisotropic conductive film is set between this line areas of this tertiary circuit component and this first circuit member, this tertiary circuit component of pressing, this first circuit member and this first anisotropic conductive film so that this tertiary circuit component and this second routing components are through this second anisotropic conductive film electrical connection；And,
This second anisotropic conductive film is set between this line areas of this tertiary circuit component and this second circuit component, this tertiary circuit component of pressing, this second routing components and this second anisotropic conductive film so that this tertiary circuit component and this second routing components are through this second anisotropic conductive film electrical connection；
Sinter this of this tertiary circuit component without this of circuit region and this first circuit member and this tertiary circuit component without circuit region and this second routing components, to form one first sintering structure and one second sintering structure respectively；Wherein, this tertiary circuit component and this first circuit member connect without this first sintering structure of line areas through this of this tertiary circuit component, and this tertiary circuit structure and this second routing components pass through this of this tertiary circuit component and connect without this second sintering structure of line areas.
11. the manufacture method of display apparatus module as claimed in claim 1, it is characterised in that the mode of this sintering is laser sintered.
12. the manufacture method of display apparatus module as claimed in claim 1, it is characterised in that the mode of this sintering is: after this radio zone of this tertiary circuit component directly contacts this first circuit member, recycling laser mode sintering.
13. the manufacture method of display apparatus module as claimed in claim 1, it is characterised in that this radio zone and the first circuit member that the mode of this sintering is this tertiary circuit component separate a distance S, and recycling laser mode sintering, wherein distance S is not equal to 0.
14. the manufacture method of display apparatus module as claimed in claim 11, it is characterised in that the energy of this laser is: 1～50W.
15. the manufacture method of display apparatus module as claimed in claim 11, it is characterised in that the energy of this laser is: 1～10W.
16. the manufacture method of display apparatus module as claimed in claim 11, it is characterised in that the speed of this laser is: 1～1000mm/s.
17. the manufacture method of display apparatus module as claimed in claim 11, it is characterised in that the speed of this laser is: 1～500mm/s.
18. the manufacture method of display apparatus module as claimed in claim 11, it is characterised in that the number of times of this laser is: 1～100 time.
19. the manufacture method of display apparatus module as claimed in claim 11, it is characterised in that the number of times of this laser is: 1～50 time.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105110173 | 2016-03-30 | ||
| TW105110173A TWI600945B (en) | 2016-03-30 | 2016-03-30 | A display module and method of manufacturing the same. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105785673A true CN105785673A (en) | 2016-07-20 |
Family
ID=56380030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610329211.9A Pending CN105785673A (en) | 2016-03-30 | 2016-05-17 | Display module and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105785673A (en) |
| TW (1) | TWI600945B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6795152B2 (en) * | 2000-12-26 | 2004-09-21 | Hannstar Display Corp. | Liquid crystal display apparatus and method for checking the joining accuracy thereof |
| CN1805654A (en) * | 2006-01-09 | 2006-07-19 | 友达光电股份有限公司 | Flexible circuit board and display |
| KR20060126174A (en) * | 2005-06-03 | 2006-12-07 | 삼성전자주식회사 | Tape carrier package |
| CN101336048A (en) * | 2007-06-27 | 2008-12-31 | 英华达(上海)电子有限公司 | Method and apparatus for reinforced locating of flexible circuit board |
| CN103293808A (en) * | 2013-05-28 | 2013-09-11 | 深圳市华星光电技术有限公司 | Display device and manufacturing method thereof |
| CN103811529A (en) * | 2012-11-06 | 2014-05-21 | 三星显示有限公司 | Display panel, chip on film and display device including the same |
| CN204856422U (en) * | 2015-06-10 | 2015-12-09 | 恒颢科技股份有限公司 | Touch panel of softness circuit board containing decoration pattern has |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004066691A1 (en) * | 2003-01-22 | 2004-08-05 | Nec Corporation | Circuit board device and method for interconnecting wiring boards |
| KR100740762B1 (en) * | 2005-02-10 | 2007-07-19 | 오므론 가부시키가이샤 | Connecting method and connecting device |
| US20090044967A1 (en) * | 2006-03-14 | 2009-02-19 | Sharp Kabushiki Kaisha | Circuit board, electronic circuit device, and display device |
| CN103149718B (en) * | 2013-04-02 | 2016-01-20 | 华映视讯（吴江）有限公司 | A kind of consolidation method of anisotropic conductive film |
-
2016
- 2016-03-30 TW TW105110173A patent/TWI600945B/en active
- 2016-05-17 CN CN201610329211.9A patent/CN105785673A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6795152B2 (en) * | 2000-12-26 | 2004-09-21 | Hannstar Display Corp. | Liquid crystal display apparatus and method for checking the joining accuracy thereof |
| KR20060126174A (en) * | 2005-06-03 | 2006-12-07 | 삼성전자주식회사 | Tape carrier package |
| CN1805654A (en) * | 2006-01-09 | 2006-07-19 | 友达光电股份有限公司 | Flexible circuit board and display |
| CN101336048A (en) * | 2007-06-27 | 2008-12-31 | 英华达(上海)电子有限公司 | Method and apparatus for reinforced locating of flexible circuit board |
| CN103811529A (en) * | 2012-11-06 | 2014-05-21 | 三星显示有限公司 | Display panel, chip on film and display device including the same |
| CN103293808A (en) * | 2013-05-28 | 2013-09-11 | 深圳市华星光电技术有限公司 | Display device and manufacturing method thereof |
| CN204856422U (en) * | 2015-06-10 | 2015-12-09 | 恒颢科技股份有限公司 | Touch panel of softness circuit board containing decoration pattern has |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201734587A (en) | 2017-10-01 |
| TWI600945B (en) | 2017-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4938239B2 (en) | Display device | |
| KR102371358B1 (en) | Semiconductor packages and package modules using the same | |
| CN111430406B (en) | Display panel, manufacturing method thereof and display device | |
| CN101408681B (en) | Display panel | |
| KR100481239B1 (en) | Circuit substrate connecting structure, liquid crystal display device having the connecting structure and mounting method of liquid crystal display device | |
| US7109575B2 (en) | Low-cost flexible film package module and method of manufacturing the same | |
| US20160218289A1 (en) | Bonding method and system for flexible display device | |
| WO2021088271A1 (en) | Array substrate, fabrication method therefor, and display device | |
| US10897815B2 (en) | Display device, flexible wiring board, method of manufacturing the display device, and electronic device | |
| CN113570966A (en) | Display device and spliced screen | |
| KR102339969B1 (en) | Chip-On-Film Circuit and Flexible Display Device having the same | |
| CN104364702B (en) | Liquid crystal display device | |
| KR101957670B1 (en) | Method of Fabricating Display Device | |
| KR100945771B1 (en) | Manufacturing method of electronic device | |
| CN205372248U (en) | Display device and back light module thereof | |
| CN105785673A (en) | Display module and manufacturing method thereof | |
| CN114141811B (en) | Preparation method of spliced display screen and spliced display screen | |
| TWI778885B (en) | Optical adhesive film structure, stitching display module and manufacturing method thereof | |
| CN115019677A (en) | Display panel, preparation method thereof and preparation method of display device | |
| CN101236313B (en) | Display device and making method thereof | |
| WO2018193927A1 (en) | Connection structure for connection electrode on flexible substrate and connection electrode of flexible ic, display panel, and connection method | |
| US20210259109A1 (en) | Electronic device | |
| KR102082133B1 (en) | Flexible printed circuit board and display device having thereof | |
| TWI837052B (en) | Splicing display and manufacturing method thereof | |
| CN117199215B (en) | Display panel and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160720 |