TWI600945B - A display module and method of manufacturing the same. - Google Patents
A display module and method of manufacturing the same. Download PDFInfo
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- TWI600945B TWI600945B TW105110173A TW105110173A TWI600945B TW I600945 B TWI600945 B TW I600945B TW 105110173 A TW105110173 A TW 105110173A TW 105110173 A TW105110173 A TW 105110173A TW I600945 B TWI600945 B TW I600945B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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Description
本發明是有關於一種顯示器模組,且特別是有關於一種利用在無線路區利用燒結的方式增加貼附力之顯示器模組。The present invention relates to a display module, and more particularly to a display module that utilizes a method of sintering in a wireless road area to increase adhesion.
液晶顯示器模組(Liquid Crystal Display Module, LCD Module)之製程是利用兩塊玻璃基板,分別於兩塊玻璃基板接合後,將再與驅動IC以及控制電路板電性連接,以形成液晶顯示器模組。The process of the liquid crystal display module (LCD Module) is to use two glass substrates, which are respectively connected to the two glass substrates, and then electrically connected to the driving IC and the control circuit board to form a liquid crystal display module. .
驅動IC與TFT基板的連結方式,包括使用捲帶自動接合(Tape Auto Bonding, TAB)技術來形成捲帶式載體封裝件(Tape Carrier Package, TCP)和使用玻璃覆晶(Chip On Glass, COG)技術來進行連結。當驅動IC承載於TCP時,需先於TFT基板之玻璃基板之TCP引腳(lead)上塗佈異方性導電膜(Anisotropic Conductive Film, ACF),然後將TCP配置於TCP引腳上並進行熱壓合製程。如此,可以完成驅動IC與TFT基板之電性連接。之後,TCP亦將藉由熱壓合製程,與控制電路板電性連接。The connection between the driver IC and the TFT substrate, including the use of Tape Auto Bonding (TAB) technology to form a Tape Carrier Package (TCP) and the use of Chip On Glass (COG) Technology to connect. When the driver IC is carried on the TCP, an anisotropic conductive film (ACF) is applied to the TCP lead of the glass substrate of the TFT substrate, and then the TCP is placed on the TCP pin and then performed. Hot press process. In this way, the electrical connection between the driver IC and the TFT substrate can be completed. After that, TCP will also be electrically connected to the control circuit board by a thermal compression process.
COG技術係指將驅動IC直接配置在TFT基板之玻璃基板上,其主要的製程步驟為:於玻璃基板上之COG引腳上,塗佈異方性導電膜;將驅動IC配置於COG引腳上,並進行驅動IC熱壓著。除此之外,此玻璃基板上更須藉由一軟性電路板(Flexible Printed Circuits, FPC)與控制電路板(Printed Circuit Board, PCB)電性連接。其係藉由先塗佈異方性導電膜於玻璃基板上之FPC引腳上之後,再將FPC配置於這些FPC引腳上並進行熱壓著以完成之。COG technology refers to the direct placement of the driver IC on the glass substrate of the TFT substrate. The main process steps are: applying an anisotropic conductive film on the COG pin on the glass substrate; and arranging the driver IC on the COG pin. On, and the drive IC is hot pressed. In addition, the glass substrate is electrically connected to a printed circuit board (PCB) by a flexible printed circuit (FPC). This is done by first applying an anisotropic conductive film on the FPC pin on the glass substrate, then placing the FPC on these FPC pins and performing hot pressing.
不過,在熱壓合過程中,製程溫度將升至約250°C,ACF會面臨軟化及黏性失效的風險,若單靠ACF膠的黏性,將無法提供足夠的貼附強度,ACF其上方欲與之黏合的FPC或COF會部分或全部剝落(peeling),導致良率下降及無法通過撞擊(shock)或震動(vibration)的可靠度驗證。However, during the thermocompression process, the process temperature will rise to about 250 ° C, ACF will face the risk of softening and viscous failure. If the adhesion of ACF glue alone, it will not provide sufficient adhesion strength, ACF The FPC or COF that is to be bonded to it will partially or completely peel, resulting in a drop in yield and failure to be verified by the reliability of shock or vibration.
有鑑於此,本發明的目的就是在提供一種顯示器模組,利用增加燒結結構於電路構件之無線路區,強化兩電路構件之貼合能力,且不影響原本模組的性能,並增加良率。In view of the above, the object of the present invention is to provide a display module that utilizes an increased sintered structure in a wireless road area of a circuit component to enhance the bonding ability of the two circuit components without affecting the performance of the original module and increasing the yield. .
根據本發明的目的,提出一種顯示器模組,包含:第一電路構件、第二電路構件、第三電路構件,其中該第三電路構件包含線路區和無線路區,且該無線路區更包含一燒結結構;異方性導電膜,包含第一異方性導電膜以及第二異方性導電膜,且第一異方性導電膜係設置於第三電路構件之線路區和第一電路構件之間,且第三線路構件和第一電路構件透過第一異方性導電膜電性連結;以及第二異方性導電膜係設置於第三電路構件之線路區和第二電路構件之間,第三線路構件和第二線路構件透過第二異方性導電膜電性連結;其中,第三電路構件和第一電路構件透過第三電路構件之無線路區之燒結結構連接,且第三電路構件和第二線路構件透過第三電路構件之無線路區之燒結結構連接。According to an object of the present invention, a display module includes: a first circuit member, a second circuit member, and a third circuit member, wherein the third circuit member includes a line region and a wireless road region, and the wireless road region further includes a sintered structure; the anisotropic conductive film, comprising a first anisotropic conductive film and a second anisotropic conductive film, and the first anisotropic conductive film is disposed on the line region of the third circuit member and the first circuit member And the third circuit member and the first circuit member are electrically connected through the first anisotropic conductive film; and the second anisotropic conductive film is disposed between the line region of the third circuit member and the second circuit member The third line member and the second line member are electrically connected through the second anisotropic conductive film; wherein the third circuit member and the first circuit member are connected through the sintered structure of the wireless circuit region of the third circuit member, and the third The circuit member and the second line member are connected by a sintered structure of the wireless road region of the third circuit member.
根據本發明的目的,更提供一種顯示器模組的製造方法,包含:提供第一電路構件,提供第二電路構件,提供第三電路構件,其中第三電路構件包含線路區和無線路區;設置異方性導電膜於第三電路構件之線路區,壓合該異方性導電膜以及第三電路構件,使第三線路構件分別和第一電路構件、第二線路構件電性連結。According to another aspect of the present invention, a method of manufacturing a display module includes: providing a first circuit member, providing a second circuit member, and providing a third circuit member, wherein the third circuit member includes a line region and a wireless road region; The anisotropic conductive film presses the anisotropic conductive film and the third circuit member in a line region of the third circuit member, and electrically connects the third circuit member to the first circuit member and the second circuit member, respectively.
本發明提出一種顯示器模組的製造方法,包含提供第一電路構件,提供第二電路構件,提供第三電路構件,其中該第三電路構件包含線路區和無線路區,且該無線路區更包含燒結結構;提供異方性導電膜,異方性導電膜係包含第一異方性導電膜以及第二異方性導電膜,且設置第一異方性導電膜於第三電路構件之線路區和第一電路構件之間,壓合第三線路構件、第一電路構件及第一異方性導電膜,使得第三線路構件和第二線路構件透過第二異方性導電膜電性連結;以及,設置第二異方性導電膜於第三電路構件之線路區和第二電路構件之間,壓合第三線路構件、第二線路構件及第二異方性導電膜,使得第三線路構件和第二線路構件透過第二異方性導電膜電性連結;燒結第三線路構件之無電路區以及第一電路構件,以形成第一燒結結構;燒結第三線路構件之無電路區以及第二線路構件,以形成第二燒結結構;第三電路構件和第一電路構件透過第三電路構件之無線路區之第一燒結結構連接,且第三電路構建和第二線路構件透過第三電路構件之無線路區之第二燒結結構連接。 The present invention provides a method of fabricating a display module, including providing a first circuit component, providing a second circuit component, and providing a third circuit component, wherein the third circuit component includes a line region and a wireless road region, and the wireless circuit region further includes a sintered structure is provided; an anisotropic conductive film is provided, and the anisotropic conductive film comprises a first anisotropic conductive film and a second anisotropic conductive film, and the first anisotropic conductive film is disposed on the circuit of the third circuit member Between the region and the first circuit member, pressing the third line member, the first circuit member and the first anisotropic conductive film, so that the third line member and the second line member are electrically connected through the second anisotropic conductive film And providing a second anisotropic conductive film between the line region of the third circuit member and the second circuit member, pressing the third line member, the second line member, and the second anisotropic conductive film to make the third The line member and the second line member are electrically connected through the second anisotropic conductive film; the circuitless region of the third line member and the first circuit member are sintered to form a first sintered structure; and the third line structure is sintered a circuitless region and a second circuit member to form a second sintered structure; the third circuit member and the first circuit member are connected through the first sintered structure of the wireless circuit region of the third circuit member, and the third circuit is constructed and the second The line member is coupled through the second sintered structure of the wireless road region of the third circuit component.
100‧‧‧顯示器模組 100‧‧‧ display module
201‧‧‧第一電路構件 201‧‧‧First circuit component
202‧‧‧第二電路構件 202‧‧‧Second circuit components
203‧‧‧第三電路構件 203‧‧‧ Third circuit component
301、303、305‧‧‧第一燒結結構 301, 303, 305‧‧‧ first sintered structure
302、304、306‧‧‧第二燒結結構 302, 304, 306‧‧‧Second sintered structure
401‧‧‧第一線路區 401‧‧‧First line area
501‧‧‧第一無線路區 501‧‧‧First wireless road area
402‧‧‧第二線路區 402‧‧‧Second line area
502‧‧‧第二無線路區 502‧‧‧Second wireless road area
503‧‧‧第三無線路區 503‧‧‧ Third wireless road area
504‧‧‧第四無線路區 504‧‧‧fourth wireless road area
601‧‧‧第一異方性導電膜 601‧‧‧First anisotropic conductive film
602‧‧‧第二異方性導電膜 602‧‧‧Second anisotropic conductive film
V‧‧‧短邊 V‧‧‧ Short side
A、B、C、D‧‧‧燒結圖案 A, B, C, D‧‧‧ sintered patterns
L、L1、L2‧‧‧距離 L, L1, L2‧‧‧ distance
C1、C2、C3、C4‧‧‧角落 C1, C2, C3, C4‧‧‧ corner
801、802、803、804、701、901、902、903、904‧‧‧燒結結構 801, 802, 803, 804, 701, 901, 902, 903, 904‧‧‧ sintered structure
701a‧‧‧無線路子區域 701a‧‧‧Wireless sub-area
401a‧‧‧線路 401a‧‧‧ lines
902a‧‧‧子燒結結構 902a‧‧‧Sintered structure
第1A圖係本發明顯示器模組之第一實施例示意圖。 Figure 1A is a schematic view of a first embodiment of a display module of the present invention.
第1B圖係本發明顯示器模組之第一實施例爆炸圖。 Figure 1B is an exploded view of a first embodiment of the display module of the present invention.
第2圖係本發明顯示器模組之第二實施例示意圖。 Figure 2 is a schematic view of a second embodiment of the display module of the present invention.
第3圖係本發明顯示器模組之第三實施例示意圖。 Figure 3 is a schematic view of a third embodiment of the display module of the present invention.
第4圖係本發明顯示器模組之第四實施例示意圖。 Figure 4 is a schematic view showing a fourth embodiment of the display module of the present invention.
第5圖係本發明顯示器模組之第五實施例示意圖。 Figure 5 is a schematic view showing a fifth embodiment of the display module of the present invention.
第6圖為本發明顯示器模組之第六實施例示意圖。 Figure 6 is a schematic view showing a sixth embodiment of the display module of the present invention.
請同時參照第1A圖和第1B圖,第1A圖第1B圖為本發明之第一實施例,一顯示器模組100包含第一電路構件201、第二電路構件202以及第三電路構件203,其中第一電路構件201以及第二電路構件202分別例如是:印刷電路板(Printed Circuit Board;PCB)或是顯示面板。舉例而言,本發明較佳是第一電路構件201為PCB,第二電路構件202為顯示面板。其中,於本發明實施例之顯示面板,並不限定其種類,包含非自發光顯示面板(例如:液晶顯示面板、電泳顯示面板、電濕潤顯示面板、或其它合適類型的顯示面板)、自發光顯示面板(例如:有機電激發光顯示面板、無機電激發光顯示面板、或其它合適類 型的顯示面板)、或其它合適類型的顯示面板。其中,顯示面板中二相對應的基板材料包含玻璃、石英、聚合物材料(例如:聚醯亞胺(Polyimide,PI)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚萘二甲酸乙醇酯(Polyethylene naphthalate,PEN)、或其它合適的材料)、或其它合適的材料。於本發明實施例之第一電路構件201的基板材料包含聚合物材料(例如:聚醯亞胺(Polyimide,PI)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚萘二甲酸乙醇酯(Polyethylene naphthalate,PEN)、或其它合適的材料)、或其它合適的材料。另外,第三電路構件203例如是:薄膜覆晶封裝趨動晶片(IC on Film,COF)或是軟性印刷電路板(Flexible Printed Circuit,FPC),本發明不以此為限。於本發明實施例之第三電路構件203的基板材料聚合物材料(例如:聚醯亞胺(Polyimide,PI)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚萘二甲酸乙醇酯(Polyethylene naphthalate,PEN)、或其它合適的材料)、或其它合適的材料。第三電路構件203更包含線路區(例如:第一線路區401)和無線路區(例如:第一無線路區501)。本發明實施例係以無線路區(例如:第一無線路區501)位於第三電路構件203(例如:軟性印刷電路板)邊緣之一側,且位於線路區(例如:第一線路區401)之外側(例如:遠離軟性印刷電路板中心之一側)為範例,但不限於此。值得注意的是,無線路區(例如:無線路區501)中並未有任何導線或電子元件(例如:晶片)設置,且線路區和無線路區並無限制相對的位置關係,只要無導線或電子元件設置的區域即為本發明的無線路區。 Referring to FIG. 1A and FIG. 1B simultaneously, FIG. 1A is a first embodiment of the present invention. A display module 100 includes a first circuit member 201, a second circuit member 202, and a third circuit member 203. The first circuit member 201 and the second circuit member 202 are respectively, for example, a printed circuit board (PCB) or a display panel. For example, in the present invention, the first circuit member 201 is a PCB, and the second circuit member 202 is a display panel. The display panel of the embodiment of the present invention is not limited to the type, and includes a non-self-luminous display panel (for example, a liquid crystal display panel, an electrophoretic display panel, an electrowetting display panel, or other suitable type of display panel), and self-illumination. Display panel (for example: organic electroluminescent display panel, inorganic electroluminescent display panel, or other suitable type Type of display panel), or other suitable type of display panel. Wherein, the corresponding substrate material in the display panel comprises glass, quartz, and a polymer material (for example, Polyimide (PI), polyethylene terephthalate (PET), polyphthalene Polyethylene naphthalate (PEN), or other suitable material), or other suitable material. The substrate material of the first circuit member 201 in the embodiment of the present invention comprises a polymer material (for example, Polyimide (PI), polyethylene terephthalate (PET), polynaphthalene dicarboxylic acid. Polyethylene naphthalate (PEN), or other suitable material), or other suitable material. In addition, the third circuit member 203 is, for example, a film-on-film (COF) or a flexible printed circuit (FPC), and the invention is not limited thereto. The substrate material polymer material of the third circuit member 203 of the embodiment of the present invention (for example, Polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate ethanol Polyethylene naphthalate (PEN), or other suitable material), or other suitable material. The third circuit component 203 further includes a line area (eg, the first line area 401) and a wireless road area (eg, the first wireless way area 501). In the embodiment of the present invention, the wireless road area (for example, the first wireless road area 501) is located on one side of the edge of the third circuit member 203 (for example, a flexible printed circuit board), and is located in the line area (for example, the first line area 401). The outside side (for example, away from the side of the center of the flexible printed circuit board) is an example, but is not limited thereto. It is worth noting that there are no wires or electronic components (for example, wafers) in the wireless road area (for example, the wireless road area 501), and the line area and the wireless road area do not have a relative positional relationship as long as there is no wire. Or the area where the electronic component is disposed is the wireless road area of the present invention.
為了讓第三電路構件203分別與第一電路構件201以及第二電路構件202電性連接,本發明顯示器模組100更包含異方性導電膜(Anisotropic Conductive Film,ACF),如圖1A,其包含第一異方性導電膜601以及第二異方性導電膜602,且第一異方性導電膜601設置於(夾設於)第三電路構件203之第一線路區401和第一電路構件201之間,且第三線路構件203和第一電路構件201透過第一異方性導電膜601電性連接,以及,第二異方性導電膜602設置於(夾設於)第三電路構件203之第二線路區402和該第二電路構件202之間,該第 三線路構件203和該第二線路構件202透過該第二異方性導電膜602電性連結。詳細來說,透過第一異方性導電膜601可使得第三電路構件203之第一線路區401和第一電路構件201之第三線路區403電性連結;透過第二異方性導電膜602可使得第三電路構件203之第二線路區402和第二電路構件202之第四線路區404電性連結。 In order to electrically connect the third circuit member 203 to the first circuit member 201 and the second circuit member 202, the display module 100 of the present invention further includes an anisotropic conductive film (ACF), as shown in FIG. 1A. The first anisotropic conductive film 601 and the second anisotropic conductive film 602 are included, and the first anisotropic conductive film 601 is disposed (interposed) on the first circuit region 401 of the third circuit member 203 and the first circuit Between the members 201, the third circuit member 203 and the first circuit member 201 are electrically connected through the first anisotropic conductive film 601, and the second anisotropic conductive film 602 is disposed (interposed) on the third circuit. Between the second line region 402 of the member 203 and the second circuit member 202, the first The three-line member 203 and the second line member 202 are electrically connected through the second anisotropic conductive film 602. In detail, the first circuit region 401 of the third circuit member 203 and the third line region 403 of the first circuit member 201 are electrically connected through the first anisotropic conductive film 601; and the second anisotropic conductive film is transmitted through 602 can electrically connect the second line region 402 of the third circuit member 203 and the fourth line region 404 of the second circuit member 202.
為了讓第三電路構件203分別與第一電路構件201以及第二電路構件202連接牢固,本發明顯示器模組100更包含燒結結構,其包含第一燒結結構301以及第二燒結結構302。本發明之燒結結構為例如將雷射,集中照射在電路構件基板的預定面積上,例如:利用雷射照射至第一電路構件201或/及第二電路構件202或/及第三電路構件203上的無線路區上之材料(基板)上,例如聚合物材料(例如:聚醯亞胺(Polyimide,PI)或其它合適的材料),因雷射產生高溫而使得材料呈現熔融狀,之後等到熔融狀之PI膜回到常溫時,使兩塊PI材料會熔固為一起,以形成燒結結構,但本發明不以此為限,只要能利用熔融作用讓其中兩個電路構件結合在一起的燒結結構即為本發明之範疇。例如,若第二電路構件202為顯示面板,其二相對應的基板材料通常為玻璃,則第三電路構件203上的無線路區上之材料(基板)上,例如聚醯亞胺(Polyimide,PI)仍可被雷射熔融,於之後等到熔融狀之PI膜回到常溫時,使PI材料熔接而固定於玻璃上,以形成燒結結構,即二個不同材料(例如:PI與玻璃),仍可讓兩個電路構件結合在一起。 In order to connect the third circuit member 203 to the first circuit member 201 and the second circuit member 202 respectively, the display module 100 of the present invention further includes a sintered structure including a first sintered structure 301 and a second sintered structure 302. The sintered structure of the present invention is, for example, concentratedly irradiated onto a predetermined area of the circuit member substrate, for example, by laser irradiation to the first circuit member 201 or/and the second circuit member 202 or/and the third circuit member 203. On the material (substrate) on the wireless road area, for example, a polymer material (for example, Polyimide (PI) or other suitable material), the material is molten due to the high temperature generated by the laser, and then waits until When the molten PI film returns to normal temperature, the two PI materials are solidified together to form a sintered structure, but the invention is not limited thereto, as long as the two circuit components can be combined by melting. The sintered structure is the scope of the invention. For example, if the second circuit member 202 is a display panel, the corresponding substrate material is usually glass, and the material (substrate) on the wireless road region on the third circuit member 203, for example, polyimide (Polyimide, PI) can still be melted by the laser, and then wait until the molten PI film returns to normal temperature, the PI material is welded and fixed on the glass to form a sintered structure, that is, two different materials (for example, PI and glass), It is still possible to combine two circuit components together.
第三電路構件203為了分別與第一電路構件201以及第二電路構件202連接牢固,第三電路構件203之無線路區會於相對於第一電路構件201以及第二電路構件202設計,即第三電路構件203之無線路區相對於第一電路構件201可稱為第一無線路區501,第三電路構件203之無線路區相對於第二電路構件202可稱為第一無線路區502。換言之,第三電路構件203之第一無線路區501與第一無線路區502分別位於不同第三電路構件203不同處,且第一無線路區501與第一無線路區502皆不位於第一線路區401與第二線路區402之間,則 第一無線路區501與第一無線路區502分別位於第一線路區401與第二線路區402之外側(即鄰近邊緣之一側)。因此,第三電路構件203和第一電路構件201透過第一燒結結構301在第三電路構件203之第一無線路501區連接,且該第三電路構件203和該第二線路構件202透過該第二燒結結構302在該第三電路構件203之該第二無線路區502連接。 The third circuit member 203 is connected to the first circuit member 201 and the second circuit member 202 respectively, and the wireless circuit region of the third circuit member 203 is designed with respect to the first circuit member 201 and the second circuit member 202, that is, The wireless road zone of the three circuit component 203 may be referred to as a first wireless road zone 501 with respect to the first circuit component 201, and the wireless road zone of the third circuit component 203 may be referred to as a first wireless road zone 502 with respect to the second circuit component 202. . In other words, the first wireless road area 501 of the third circuit component 203 and the first wireless road area 502 are respectively located at different positions of the different third circuit components 203, and the first wireless road area 501 and the first wireless road area 502 are not located at the same. Between a line area 401 and a second line area 402, The first wireless road area 501 and the first wireless road area 502 are respectively located on the outer side of the first line area 401 and the second line area 402 (ie, on one side of the adjacent edge). Therefore, the third circuit member 203 and the first circuit member 201 are connected to the first wireless path 501 of the third circuit member 203 through the first sintered structure 301, and the third circuit member 203 and the second line member 202 pass through the The second sintered structure 302 is connected to the second wireless path region 502 of the third circuit member 203.
第一電路構件201為了前述牢接的目的,第一電路構件201上也可包含有第三無線路區503,且第二電路構件202上也可包含有第四無線路區504,其中第三無線路區503對應第一無線路區501設置,即第三無線路區503與第一無線路區501於垂直方向上部份重疊,且第四無線路區504對應第二無線路區502設置,即第四無線路區504對應第二無線路區502於垂直方向上部份重疊。舉例而言:利用雷射對第三無線路區503以及/或第一無線路區501照射,使得無線路區501/503至少一個的材料(基板)熔融,以形成第一燒結結構301,待溫度下降後,第一無線路區501以及第三無線路區503即透過燒結結構301結合在一起。同樣的,第二燒結結構302的形成,是利用雷射對第二無線路區502以及/或第四無線路區504照射,使得無線路區502/504至少一個的材料(基板)熔融,以形成第一燒結結構301,待溫度下降後,第一無線路區501以及第三無線路區503即透過第二燒結結構302結合在一起。再者,ACF除了電性連接功能之外,其ACF本身仍具有粘性,而可利用ACF貼合第一電路構件201和第三電路構件203、第三電路構件203和第二電路構件202,然後,再利用燒結結構301/302,使得電路構件間的貼合更加牢固,避免在製程或使用過程中脫落,可增加良率,並且因為本發明之燒結結構是利用兩預貼合構件之無線路區熔融而成,並不會影響到其他電路的導通或電路構件本身的性能。 The first circuit component 201 may also include a third wireless road zone 503 on the first circuit component 201 for the purpose of the foregoing fastening, and the fourth circuit component 202 may also include a fourth wireless road zone 504, of which the third The no-line area 503 is disposed corresponding to the first wireless road area 501, that is, the third wireless road area 503 partially overlaps with the first wireless road area 501 in the vertical direction, and the fourth wireless road area 504 corresponds to the second wireless road area 502. That is, the fourth wireless road area 504 partially overlaps the second wireless road area 502 in the vertical direction. For example, the third wireless road zone 503 and/or the first wireless road zone 501 are irradiated with a laser such that at least one material (substrate) of the wireless road zone 501/503 is melted to form the first sintered structure 301. After the temperature drops, the first wireless road zone 501 and the third wireless road zone 503 are joined together by the sintered structure 301. Similarly, the second sintered structure 302 is formed by irradiating the second wireless road region 502 and/or the fourth wireless road region 504 with a laser such that at least one material (substrate) of the wireless road region 502/504 is melted to The first sintered structure 301 is formed. After the temperature is lowered, the first wireless road region 501 and the third wireless road region 503 are joined together through the second sintered structure 302. Moreover, the ACF itself has adhesiveness in addition to the electrical connection function, and the first circuit member 201 and the third circuit member 203, the third circuit member 203, and the second circuit member 202 can be bonded by the ACF, and then Reusing the sintered structure 301/302 to make the bonding between the circuit members more firm, avoiding falling off during the process or use, increasing the yield, and because the sintered structure of the present invention is a wireless path using the two pre-bonding members The region is melted and does not affect the conduction of other circuits or the performance of the circuit components themselves.
請再參閱第1A圖與第1B圖,第一燒結結構301以及第二燒結結構302之圖案分別約為ㄇ字型,其二個ㄇ字型之開口相對應,並且第一燒結結構301以及第二燒結結構302之圖案分別圍繞在第一異方性導電膜601以及第二異方性導電膜602四邊的其中三邊,且第一燒結結構301以及第二燒結結構 302圖案與方向實質上相同。因此,本實施例圍繞異方性導電膜601/602的三邊,可增加貼合面積,使得兩電路構件接合處更牢固。但本發明不以此為限,燒結結構也可以以圍繞在異方性導電膜的任何一邊或多邊,只要能夠利用燒結結構來加強原先只有靠異方性導電膜來接合的黏貼力量,都不脫離本發明之範疇, 請參考第2圖,第2圖為本發明之第二實施例,第一實施例和第二實施例類似,相同的地方不在贅述,第一實施例和第二實施例不同之處在於:第一燒結結構303以及第二燒結結構304約為長條狀,分別平行第一異方性導電膜601以及第二異方性導電膜602,且燒結結構的長度為連續式的長條狀,長度不限制,第二實施例在異方性導電膜單601/602側邊,利用雷射熔融作拉長面積補強的燒結結構,可提升垂直拉力值,讓結合力穩固。 Referring to FIGS. 1A and 1B, the patterns of the first sintered structure 301 and the second sintered structure 302 are respectively approximately U-shaped, and the openings of the two U-shaped shapes correspond to each other, and the first sintered structure 301 and the first The pattern of the two sintered structures 302 surrounds three sides of the four sides of the first anisotropic conductive film 601 and the second anisotropic conductive film 602, respectively, and the first sintered structure 301 and the second sintered structure The 302 pattern is substantially the same as the direction. Therefore, the present embodiment surrounds the three sides of the anisotropic conductive film 601/602, and the bonding area can be increased, so that the joints of the two circuit members are stronger. However, the present invention is not limited thereto, and the sintered structure may be surrounded by any one side or a plurality of sides of the anisotropic conductive film, as long as the sintered structure can be used to reinforce the adhesive force originally bonded only by the anisotropic conductive film. Leaving the scope of the invention, Please refer to FIG. 2, which is a second embodiment of the present invention. The first embodiment is similar to the second embodiment, and the same places are not described herein. The first embodiment and the second embodiment are different in that: A sintered structure 303 and a second sintered structure 304 are approximately elongated, respectively parallel to the first anisotropic conductive film 601 and the second anisotropic conductive film 602, and the length of the sintered structure is a continuous strip shape, length Without limitation, in the second embodiment, on the side of the anisotropic conductive film 601/602, the sintered structure which is reinforced by the laser melting is used to enhance the vertical tensile force value and stabilize the bonding force.
請參考第3圖,為本發明第三實施例,第三實施例和第一實施例類似,相同地方不再贅述,第三實施例和第一實施例不同之處在於:第一燒結結構305以及第二燒結結構306為具有間距L的不連續性長條圖案,其中L為相鄰兩燒結圖案間的距離,且每段L都可有不同或實質上相同的數值。舉例而言,例如第一燒結結構305具有相鄰的燒結圖案A、B、C和D,其中A和B間的距離為L;B和C間的距離為L1;C和D間的距離為L2。在第三實施例中,相鄰燒結圖案的距離可為L=L1=L2或者L≠L1≠L2。在其他實施例中,也可以部分燒結圖案相鄰的距離實質上相同,而部分不同,本發明不以此為限;另外,燒結圖案A、B、C和D的長度及寬度也不限定,燒結圖案的長度或/及寬度可以約為A=B=C=D。在其他實施例中,燒結圖案的長度或/及寬度可以為A≠B≠C≠D或者部分燒結圖案實質上相同寬度及/或長度,部分不同寬度及/或長度。第三實施例利用平行異方性導電膜601/602單邊且多次短距離的燒結圖案,以不連續排列的方式提高多點的拉力。 Please refer to FIG. 3, which is a third embodiment of the present invention. The third embodiment is similar to the first embodiment. The same place is not described again. The third embodiment is different from the first embodiment in that the first sintered structure 305 is different. And the second sintered structure 306 is a discontinuous strip pattern having a pitch L, where L is the distance between adjacent two sintered patterns, and each segment L can have a different or substantially the same value. For example, for example, the first sintered structure 305 has adjacent sintered patterns A, B, C, and D, wherein the distance between A and B is L; the distance between B and C is L1; the distance between C and D is L2. In the third embodiment, the distance between adjacent sintered patterns may be L = L1 = L2 or L ≠ L1 ≠ L2. In other embodiments, the distance between the adjacent portions of the sintered patterns may be substantially the same, and the portions are different, and the present invention is not limited thereto; in addition, the lengths and widths of the sintered patterns A, B, C, and D are not limited. The length or/and width of the sintered pattern may be approximately A=B=C=D. In other embodiments, the length or/and width of the sintered pattern may be A≠B≠C≠D or a partially sintered pattern having substantially the same width and/or length, partially different widths and/or lengths. The third embodiment utilizes the parallel anisotropic conductive film 601/602 to unilaterally and repeatedly a plurality of short-distance sintering patterns to increase the tensile force of multiple points in a discontinuous arrangement.
請參照第4圖,第4圖為本發明第四實施例,本實施例和第一實施例相同地方不再贅述,不同之處在於:第四實施例僅(只有)在異方性導電膜601/602短邊V,各設置多個燒結結構801、802、803和804。本實施例和第二 實施例以及第三實施例不同之處在於,多個燒結結構801、802、803和804僅(只有)設置於異方性導電膜601/602短邊V的一側,可縮短燒結結構的長度,並增加兩側短邊V對抗剝離的力量,詳細來說,燒結結構801和802分別設置於異方性導電膜601其中一短邊V一側(外側,即鄰近邊緣),且燒結結構803和804分別設置於異方性導電膜602另一短邊V一側(外側,即鄰近邊緣)。 Referring to FIG. 4, FIG. 4 is a fourth embodiment of the present invention. The same portions of the present embodiment and the first embodiment are not described again, except that the fourth embodiment is only (only) in the anisotropic conductive film. 601/602 short side V, each of which is provided with a plurality of sintered structures 801, 802, 803 and 804. This embodiment and the second The embodiment and the third embodiment are different in that the plurality of sintered structures 801, 802, 803, and 804 are only (only) disposed on one side of the short side V of the anisotropic conductive film 601/602, and the length of the sintered structure can be shortened. And increasing the strength of the short side V on both sides against the peeling. In detail, the sintered structures 801 and 802 are respectively disposed on one side of the short side V of the anisotropic conductive film 601 (outer side, that is, adjacent edge), and the sintered structure 803 And 804 are respectively disposed on the other short side V side (outer side, that is, adjacent edge) of the anisotropic conductive film 602.
請參照第5圖,第5圖為本發明第五實施例,第五實施例和第四實施例類似,不同之處在於:多個燒結結構901、902、903和904分別位於第三電路構件203的四個角落C1、C2、C3和C4。詳細而言,燒結結構901位於角落C1、燒結結構902位於角落C2、燒結結構903位於角落C3以及燒結結構904位於角落C4,本實施例利用較少的雷射燒結次數,在電路構件的角落設置燒結結構,避免外力自角落拉扯,降低剝離的風險。 Referring to FIG. 5, FIG. 5 is a fifth embodiment of the present invention. The fifth embodiment is similar to the fourth embodiment except that a plurality of sintered structures 901, 902, 903, and 904 are respectively located in the third circuit member. Four corners 203, C1, C2, C3, and C4. In detail, the sintered structure 901 is located at the corner C1, the sintered structure 902 is located at the corner C2, the sintered structure 903 is located at the corner C3, and the sintered structure 904 is located at the corner C4. This embodiment uses fewer laser sintering times to set the corners of the circuit member. The sintered structure avoids the external force pulling from the corner and reduces the risk of peeling.
請參照第6圖,第6圖為本發明第六實施例,第六實施例和第一至第四實施例類似,不同之處在於:第三電路構件203之無線路區(例如:第一無線區701)與線路區(例如:第一線路401)部份重疊,無線路區701包含數個無線路子區域701a,線路區401包含數條線路401a,相鄰的二條線路401a之間或線路旁具有多個子區域701a中的至少一個,即相鄰的二條線路401a之間就包含至少一個子燒結結構902a,而二個電路構件203與201以及/或202與203透過燒結結構902之數個子燒結結構902a牢固在一起。因此,本實施例除了更改善前述實施例的效果(例如:固定)之外,本實施例更可縮小第三電路構件203的面積。必需說明的是,異方性導電膜601/602仍會設置(夾設)於二個電路構件(例如:203與201及202與203)之間,即異方性導電膜601/602仍會於垂直方向上與二個電路構件203與201以及/或202與203重疊。 Please refer to FIG. 6. FIG. 6 is a sixth embodiment of the present invention. The sixth embodiment is similar to the first to fourth embodiments except that the wireless circuit area of the third circuit component 203 (for example: first) The wireless area 701) partially overlaps the line area (for example, the first line 401), and the wireless road area 701 includes a plurality of wireless path sub-areas 701a. The line area 401 includes a plurality of lines 401a, between adjacent two lines 401a or lines. There are at least one of the plurality of sub-regions 701a, that is, at least one sub-sinter structure 902a is included between the adjacent two lines 401a, and the two circuit members 203 and 201 and/or 202 and 203 are transmitted through the plurality of sub-sinter structures 902. The sintered structure 902a is firmly bonded together. Therefore, in addition to further improving the effects (for example, fixing) of the foregoing embodiment, the present embodiment can further reduce the area of the third circuit member 203. It should be noted that the anisotropic conductive film 601/602 is still disposed (interposed) between two circuit members (for example, 203 and 201 and 202 and 203), that is, the anisotropic conductive film 601/602 will still The two circuit members 203 and 201 and/or 202 and 203 are overlapped in the vertical direction.
值得注意的是,本發明之其他實施例中,實施例一至實施例五的燒結結構可以為一點狀、條狀、多邊形、不規則形狀或上述至少兩種形狀的組合,且各區的燒結結構圖案和位置可以為不同,例如第一燒結結構301的圖案可以不同於第二燒結結構302的圖案,燒結結構901可選自實施例一至實施例 5的任一圖案及位置,燒結結構902亦可選自實施例一至實施例5的圖案及位置,並且燒結結構901及902可以選自不同或實質上相同的圖案及位置,本發明不一此為限。 It should be noted that, in other embodiments of the present invention, the sintered structures of Embodiments 1 to 5 may be a dot shape, a strip shape, a polygonal shape, an irregular shape, or a combination of at least two shapes, and the sintered structure of each region. The pattern and position may be different. For example, the pattern of the first sintered structure 301 may be different from the pattern of the second sintered structure 302, and the sintered structure 901 may be selected from the first embodiment to the embodiment. The pattern and position of the sintered structure 902 may be selected from any one of the patterns and positions of the first embodiment to the fifth embodiment, and the sintered structures 901 and 902 may be selected from different or substantially the same pattern and position, and the present invention is not limited thereto. Limited.
根據本發明目的,請同時參考第1圖,本發明更提供顯示器模組的製造方法,包含:提供第一電路構件201,提供第二電路構件202,提供第三電路構件203,其中該第三電路構件203包含第一線路區401和第一無線路區501;提供異方性導電膜,其包含第一異方性601導電膜以及第二異方性導電膜602,設置第一異方性導電膜601於第三電路構件203之線路區和第一電路構件201之間,壓合第三電路構件203、第一電路構件201及第一異方性導電膜601,使得第三電路構件203和第二電路構件202透過第二異方性導電膜602電性連結;以及,設置第二異方性導電膜602於第三電路構件203之第一線路區401和第二電路構件202之間,壓合第三線路構件203、第二線路構件及202第二異方性導電膜602,使得第三線路構件203和第二線路構件202透過第二異方性導電膜602電性連結;燒結第三線路構件203之第一無電路區501以及第一電路構件201,以形成第一燒結結構301;燒結第三線路構件203之第一無電路區501以及第二線路構件202,以形成第二燒結結構302;第三電路構件203和第一電路構件202透過第三電路構件203之第一無線路區501之第一燒結結構301連接,且第三電路構建203和第二線路構件202透過第三電路構件203之第一無線路501區之第二燒結結構502連接。其中本發明的燒結的方式例如為雷射燒結,其中燒結的方式為:第三線路構件203之第一無線區501直接接觸該第一電路構件201後,再利用雷射方式燒結;或是第三線路構件203之第一無線區501和第一電路構件201分開一距離S,再利用雷射方式燒結,其中距離S不等於0。其中該雷射的能量約為:1~50瓦(W),較佳地約為1~10W;且雷射的速度約為:1~1000(毫米/秒,mm/s),較佳地約為1~500mm/s;另外,雷射射出的次數約為:1~100次,較佳地約為1~50次。 According to the present invention, please refer to FIG. 1 at the same time. The present invention further provides a method for manufacturing a display module, comprising: providing a first circuit member 201, providing a second circuit member 202, and providing a third circuit member 203, wherein the third The circuit member 203 includes a first line region 401 and a first wireless road region 501; an anisotropic conductive film is provided, including a first anisotropic 601 conductive film and a second anisotropic conductive film 602, and the first anisotropy is set The conductive film 601 is between the line region of the third circuit member 203 and the first circuit member 201, and presses the third circuit member 203, the first circuit member 201, and the first anisotropic conductive film 601 such that the third circuit member 203 And the second circuit member 202 is electrically connected through the second anisotropic conductive film 602; and the second anisotropic conductive film 602 is disposed between the first line region 401 and the second circuit member 202 of the third circuit member 203 And pressing the third line member 203, the second line member, and the second anisotropic conductive film 602 such that the third line member 203 and the second line member 202 are electrically connected through the second anisotropic conductive film 602; sintering Third line member 203 a circuitless region 501 and a first circuit member 201 to form a first sintered structure 301; a first circuitless region 501 of the third circuit member 203 and a second circuit member 202 to form a second sintered structure 302; The circuit member 203 and the first circuit member 202 are connected through the first sintered structure 301 of the first wireless path region 501 of the third circuit member 203, and the third circuit structure 203 and the second circuit member 202 are transmitted through the third circuit member 203. A second sintered structure 502 of a wireless path 501 is connected. The method of sintering according to the present invention is, for example, laser sintering, wherein the first wireless region 501 of the third line member 203 is directly in contact with the first circuit member 201, and then sintered by laser; or The first wireless zone 501 of the three-line component 203 and the first circuit component 201 are separated by a distance S and then sintered by laser, wherein the distance S is not equal to zero. The energy of the laser is about 1 to 50 watts (W), preferably about 1 to 10 W; and the speed of the laser is about 1: 1 to 1000 (mm/s, mm/s), preferably It is about 1~500mm/s; in addition, the number of laser shots is about 1:100~, preferably about 1~50 times.
本發明的目的就是在提供一種顯示器模組,利用增加燒結結構 於電路構件之無線路區,強化兩電路構件之貼合能力,且因雷射燒結結構設置於無線路區,不影響原本模組的性能,並增加良率。 The object of the present invention is to provide a display module using an increased sintered structure In the wireless road area of the circuit component, the bonding ability of the two circuit components is strengthened, and the laser sintering structure is disposed in the wireless road area, which does not affect the performance of the original module and increases the yield.
以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.
顯示器模組:100 第一電路構件:201 第二電路構件:202 第三電路構件:203 第一燒結結構:301 第二燒結結構:302 第一線路區:401 第一無線路區:501 第二線路區:402 第二無線路區:502 第三無線路區:503 第四無線路區:504 第一異方性導電膜:601 第二異方性導電膜:602Display module: 100 first circuit component: 201 second circuit component: 202 third circuit component: 203 first sintered structure: 301 second sintered structure: 302 first line area: 401 first wireless road area: 501 second Line area: 402 Second wireless road area: 502 Third wireless road area: 503 Fourth wireless road area: 504 First anisotropic conductive film: 601 Second anisotropic conductive film: 602
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CN1742525A (en) * | 2003-01-22 | 2006-03-01 | 日本电气株式会社 | Method of attachment between circuit board device and circuit board |
TW200634395A (en) * | 2005-02-10 | 2006-10-01 | Omron Tateisi Electronics Co | Binding method and binding device |
CN101401496B (en) * | 2006-03-14 | 2012-10-31 | 夏普株式会社 | Circuit board, electronic circuit device, and display |
CN103149718A (en) * | 2013-04-02 | 2013-06-12 | 华映视讯(吴江)有限公司 | Method for solidifying anisotropic conductive film |
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CN101401496B (en) * | 2006-03-14 | 2012-10-31 | 夏普株式会社 | Circuit board, electronic circuit device, and display |
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