TWI600945B - A display module and method of manufacturing the same. - Google Patents

Description

Display module and manufacturing method of display module

The present invention relates to a display module, and more particularly to a display module that utilizes a method of sintering in a wireless road area to increase adhesion.

The process of the liquid crystal display module (LCD Module) is to use two glass substrates, which are respectively connected to the two glass substrates, and then electrically connected to the driving IC and the control circuit board to form a liquid crystal display module. .

The connection between the driver IC and the TFT substrate, including the use of Tape Auto Bonding (TAB) technology to form a Tape Carrier Package (TCP) and the use of Chip On Glass (COG) Technology to connect. When the driver IC is carried on the TCP, an anisotropic conductive film (ACF) is applied to the TCP lead of the glass substrate of the TFT substrate, and then the TCP is placed on the TCP pin and then performed. Hot press process. In this way, the electrical connection between the driver IC and the TFT substrate can be completed. After that, TCP will also be electrically connected to the control circuit board by a thermal compression process.

COG technology refers to the direct placement of the driver IC on the glass substrate of the TFT substrate. The main process steps are: applying an anisotropic conductive film on the COG pin on the glass substrate; and arranging the driver IC on the COG pin. On, and the drive IC is hot pressed. In addition, the glass substrate is electrically connected to a printed circuit board (PCB) by a flexible printed circuit (FPC). This is done by first applying an anisotropic conductive film on the FPC pin on the glass substrate, then placing the FPC on these FPC pins and performing hot pressing.

However, during the thermocompression process, the process temperature will rise to about 250 ° C, ACF will face the risk of softening and viscous failure. If the adhesion of ACF glue alone, it will not provide sufficient adhesion strength, ACF The FPC or COF that is to be bonded to it will partially or completely peel, resulting in a drop in yield and failure to be verified by the reliability of shock or vibration.

In view of the above, the object of the present invention is to provide a display module that utilizes an increased sintered structure in a wireless road area of a circuit component to enhance the bonding ability of the two circuit components without affecting the performance of the original module and increasing the yield. .

According to an object of the present invention, a display module includes: a first circuit member, a second circuit member, and a third circuit member, wherein the third circuit member includes a line region and a wireless road region, and the wireless road region further includes a sintered structure; the anisotropic conductive film, comprising a first anisotropic conductive film and a second anisotropic conductive film, and the first anisotropic conductive film is disposed on the line region of the third circuit member and the first circuit member And the third circuit member and the first circuit member are electrically connected through the first anisotropic conductive film; and the second anisotropic conductive film is disposed between the line region of the third circuit member and the second circuit member The third line member and the second line member are electrically connected through the second anisotropic conductive film; wherein the third circuit member and the first circuit member are connected through the sintered structure of the wireless circuit region of the third circuit member, and the third The circuit member and the second line member are connected by a sintered structure of the wireless road region of the third circuit member.

According to another aspect of the present invention, a method of manufacturing a display module includes: providing a first circuit member, providing a second circuit member, and providing a third circuit member, wherein the third circuit member includes a line region and a wireless road region; The anisotropic conductive film presses the anisotropic conductive film and the third circuit member in a line region of the third circuit member, and electrically connects the third circuit member to the first circuit member and the second circuit member, respectively.

The present invention provides a method of fabricating a display module, including providing a first circuit component, providing a second circuit component, and providing a third circuit component, wherein the third circuit component includes a line region and a wireless road region, and the wireless circuit region further includes a sintered structure is provided; an anisotropic conductive film is provided, and the anisotropic conductive film comprises a first anisotropic conductive film and a second anisotropic conductive film, and the first anisotropic conductive film is disposed on the circuit of the third circuit member Between the region and the first circuit member, pressing the third line member, the first circuit member and the first anisotropic conductive film, so that the third line member and the second line member are electrically connected through the second anisotropic conductive film And providing a second anisotropic conductive film between the line region of the third circuit member and the second circuit member, pressing the third line member, the second line member, and the second anisotropic conductive film to make the third The line member and the second line member are electrically connected through the second anisotropic conductive film; the circuitless region of the third line member and the first circuit member are sintered to form a first sintered structure; and the third line structure is sintered a circuitless region and a second circuit member to form a second sintered structure; the third circuit member and the first circuit member are connected through the first sintered structure of the wireless circuit region of the third circuit member, and the third circuit is constructed and the second The line member is coupled through the second sintered structure of the wireless road region of the third circuit component.

100‧‧‧ display module

201‧‧‧First circuit component

202‧‧‧Second circuit components

203‧‧‧ Third circuit component

301, 303, 305‧‧‧ first sintered structure

302, 304, 306‧‧‧Second sintered structure

401‧‧‧First line area

501‧‧‧First wireless road area

402‧‧‧Second line area

502‧‧‧Second wireless road area

503‧‧‧ Third wireless road area

504‧‧‧fourth wireless road area

601‧‧‧First anisotropic conductive film

602‧‧‧Second anisotropic conductive film

V‧‧‧ Short side

A, B, C, D‧‧‧ sintered patterns

L, L1, L2‧‧‧ distance

C1, C2, C3, C4‧‧‧ corner

801, 802, 803, 804, 701, 901, 902, 903, 904‧‧‧ sintered structure

701a‧‧‧Wireless sub-area

401a‧‧‧ lines

902a‧‧‧Sintered structure

Figure 1A is a schematic view of a first embodiment of a display module of the present invention.

Figure 1B is an exploded view of a first embodiment of the display module of the present invention.

Figure 2 is a schematic view of a second embodiment of the display module of the present invention.

Figure 3 is a schematic view of a third embodiment of the display module of the present invention.

Figure 4 is a schematic view showing a fourth embodiment of the display module of the present invention.

Figure 5 is a schematic view showing a fifth embodiment of the display module of the present invention.

Figure 6 is a schematic view showing a sixth embodiment of the display module of the present invention.

Referring to FIG. 1A and FIG. 1B simultaneously, FIG. 1A is a first embodiment of the present invention. A display module 100 includes a first circuit member 201, a second circuit member 202, and a third circuit member 203. The first circuit member 201 and the second circuit member 202 are respectively, for example, a printed circuit board (PCB) or a display panel. For example, in the present invention, the first circuit member 201 is a PCB, and the second circuit member 202 is a display panel. The display panel of the embodiment of the present invention is not limited to the type, and includes a non-self-luminous display panel (for example, a liquid crystal display panel, an electrophoretic display panel, an electrowetting display panel, or other suitable type of display panel), and self-illumination. Display panel (for example: organic electroluminescent display panel, inorganic electroluminescent display panel, or other suitable type Type of display panel), or other suitable type of display panel. Wherein, the corresponding substrate material in the display panel comprises glass, quartz, and a polymer material (for example, Polyimide (PI), polyethylene terephthalate (PET), polyphthalene Polyethylene naphthalate (PEN), or other suitable material), or other suitable material. The substrate material of the first circuit member 201 in the embodiment of the present invention comprises a polymer material (for example, Polyimide (PI), polyethylene terephthalate (PET), polynaphthalene dicarboxylic acid. Polyethylene naphthalate (PEN), or other suitable material), or other suitable material. In addition, the third circuit member 203 is, for example, a film-on-film (COF) or a flexible printed circuit (FPC), and the invention is not limited thereto. The substrate material polymer material of the third circuit member 203 of the embodiment of the present invention (for example, Polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate ethanol Polyethylene naphthalate (PEN), or other suitable material), or other suitable material. The third circuit component 203 further includes a line area (eg, the first line area 401) and a wireless road area (eg, the first wireless way area 501). In the embodiment of the present invention, the wireless road area (for example, the first wireless road area 501) is located on one side of the edge of the third circuit member 203 (for example, a flexible printed circuit board), and is located in the line area (for example, the first line area 401). The outside side (for example, away from the side of the center of the flexible printed circuit board) is an example, but is not limited thereto. It is worth noting that there are no wires or electronic components (for example, wafers) in the wireless road area (for example, the wireless road area 501), and the line area and the wireless road area do not have a relative positional relationship as long as there is no wire. Or the area where the electronic component is disposed is the wireless road area of the present invention.

In order to electrically connect the third circuit member 203 to the first circuit member 201 and the second circuit member 202, the display module 100 of the present invention further includes an anisotropic conductive film (ACF), as shown in FIG. 1A. The first anisotropic conductive film 601 and the second anisotropic conductive film 602 are included, and the first anisotropic conductive film 601 is disposed (interposed) on the first circuit region 401 of the third circuit member 203 and the first circuit Between the members 201, the third circuit member 203 and the first circuit member 201 are electrically connected through the first anisotropic conductive film 601, and the second anisotropic conductive film 602 is disposed (interposed) on the third circuit. Between the second line region 402 of the member 203 and the second circuit member 202, the first The three-line member 203 and the second line member 202 are electrically connected through the second anisotropic conductive film 602. In detail, the first circuit region 401 of the third circuit member 203 and the third line region 403 of the first circuit member 201 are electrically connected through the first anisotropic conductive film 601; and the second anisotropic conductive film is transmitted through 602 can electrically connect the second line region 402 of the third circuit member 203 and the fourth line region 404 of the second circuit member 202.

In order to connect the third circuit member 203 to the first circuit member 201 and the second circuit member 202 respectively, the display module 100 of the present invention further includes a sintered structure including a first sintered structure 301 and a second sintered structure 302. The sintered structure of the present invention is, for example, concentratedly irradiated onto a predetermined area of the circuit member substrate, for example, by laser irradiation to the first circuit member 201 or/and the second circuit member 202 or/and the third circuit member 203. On the material (substrate) on the wireless road area, for example, a polymer material (for example, Polyimide (PI) or other suitable material), the material is molten due to the high temperature generated by the laser, and then waits until When the molten PI film returns to normal temperature, the two PI materials are solidified together to form a sintered structure, but the invention is not limited thereto, as long as the two circuit components can be combined by melting. The sintered structure is the scope of the invention. For example, if the second circuit member 202 is a display panel, the corresponding substrate material is usually glass, and the material (substrate) on the wireless road region on the third circuit member 203, for example, polyimide (Polyimide, PI) can still be melted by the laser, and then wait until the molten PI film returns to normal temperature, the PI material is welded and fixed on the glass to form a sintered structure, that is, two different materials (for example, PI and glass), It is still possible to combine two circuit components together.

The third circuit member 203 is connected to the first circuit member 201 and the second circuit member 202 respectively, and the wireless circuit region of the third circuit member 203 is designed with respect to the first circuit member 201 and the second circuit member 202, that is, The wireless road zone of the three circuit component 203 may be referred to as a first wireless road zone 501 with respect to the first circuit component 201, and the wireless road zone of the third circuit component 203 may be referred to as a first wireless road zone 502 with respect to the second circuit component 202. . In other words, the first wireless road area 501 of the third circuit component 203 and the first wireless road area 502 are respectively located at different positions of the different third circuit components 203, and the first wireless road area 501 and the first wireless road area 502 are not located at the same. Between a line area 401 and a second line area 402, The first wireless road area 501 and the first wireless road area 502 are respectively located on the outer side of the first line area 401 and the second line area 402 (ie, on one side of the adjacent edge). Therefore, the third circuit member 203 and the first circuit member 201 are connected to the first wireless path 501 of the third circuit member 203 through the first sintered structure 301, and the third circuit member 203 and the second line member 202 pass through the The second sintered structure 302 is connected to the second wireless path region 502 of the third circuit member 203.

The first circuit component 201 may also include a third wireless road zone 503 on the first circuit component 201 for the purpose of the foregoing fastening, and the fourth circuit component 202 may also include a fourth wireless road zone 504, of which the third The no-line area 503 is disposed corresponding to the first wireless road area 501, that is, the third wireless road area 503 partially overlaps with the first wireless road area 501 in the vertical direction, and the fourth wireless road area 504 corresponds to the second wireless road area 502. That is, the fourth wireless road area 504 partially overlaps the second wireless road area 502 in the vertical direction. For example, the third wireless road zone 503 and/or the first wireless road zone 501 are irradiated with a laser such that at least one material (substrate) of the wireless road zone 501/503 is melted to form the first sintered structure 301. After the temperature drops, the first wireless road zone 501 and the third wireless road zone 503 are joined together by the sintered structure 301. Similarly, the second sintered structure 302 is formed by irradiating the second wireless road region 502 and/or the fourth wireless road region 504 with a laser such that at least one material (substrate) of the wireless road region 502/504 is melted to The first sintered structure 301 is formed. After the temperature is lowered, the first wireless road region 501 and the third wireless road region 503 are joined together through the second sintered structure 302. Moreover, the ACF itself has adhesiveness in addition to the electrical connection function, and the first circuit member 201 and the third circuit member 203, the third circuit member 203, and the second circuit member 202 can be bonded by the ACF, and then Reusing the sintered structure 301/302 to make the bonding between the circuit members more firm, avoiding falling off during the process or use, increasing the yield, and because the sintered structure of the present invention is a wireless path using the two pre-bonding members The region is melted and does not affect the conduction of other circuits or the performance of the circuit components themselves.

Referring to FIGS. 1A and 1B, the patterns of the first sintered structure 301 and the second sintered structure 302 are respectively approximately U-shaped, and the openings of the two U-shaped shapes correspond to each other, and the first sintered structure 301 and the first The pattern of the two sintered structures 302 surrounds three sides of the four sides of the first anisotropic conductive film 601 and the second anisotropic conductive film 602, respectively, and the first sintered structure 301 and the second sintered structure The 302 pattern is substantially the same as the direction. Therefore, the present embodiment surrounds the three sides of the anisotropic conductive film 601/602, and the bonding area can be increased, so that the joints of the two circuit members are stronger. However, the present invention is not limited thereto, and the sintered structure may be surrounded by any one side or a plurality of sides of the anisotropic conductive film, as long as the sintered structure can be used to reinforce the adhesive force originally bonded only by the anisotropic conductive film. Leaving the scope of the invention, Please refer to FIG. 2, which is a second embodiment of the present invention. The first embodiment is similar to the second embodiment, and the same places are not described herein. The first embodiment and the second embodiment are different in that: A sintered structure 303 and a second sintered structure 304 are approximately elongated, respectively parallel to the first anisotropic conductive film 601 and the second anisotropic conductive film 602, and the length of the sintered structure is a continuous strip shape, length Without limitation, in the second embodiment, on the side of the anisotropic conductive film 601/602, the sintered structure which is reinforced by the laser melting is used to enhance the vertical tensile force value and stabilize the bonding force.

Please refer to FIG. 3, which is a third embodiment of the present invention. The third embodiment is similar to the first embodiment. The same place is not described again. The third embodiment is different from the first embodiment in that the first sintered structure 305 is different. And the second sintered structure 306 is a discontinuous strip pattern having a pitch L, where L is the distance between adjacent two sintered patterns, and each segment L can have a different or substantially the same value. For example, for example, the first sintered structure 305 has adjacent sintered patterns A, B, C, and D, wherein the distance between A and B is L; the distance between B and C is L1; the distance between C and D is L2. In the third embodiment, the distance between adjacent sintered patterns may be L = L1 = L2 or L ≠ L1 ≠ L2. In other embodiments, the distance between the adjacent portions of the sintered patterns may be substantially the same, and the portions are different, and the present invention is not limited thereto; in addition, the lengths and widths of the sintered patterns A, B, C, and D are not limited. The length or/and width of the sintered pattern may be approximately A=B=C=D. In other embodiments, the length or/and width of the sintered pattern may be A≠B≠C≠D or a partially sintered pattern having substantially the same width and/or length, partially different widths and/or lengths. The third embodiment utilizes the parallel anisotropic conductive film 601/602 to unilaterally and repeatedly a plurality of short-distance sintering patterns to increase the tensile force of multiple points in a discontinuous arrangement.

Referring to FIG. 4, FIG. 4 is a fourth embodiment of the present invention. The same portions of the present embodiment and the first embodiment are not described again, except that the fourth embodiment is only (only) in the anisotropic conductive film. 601/602 short side V, each of which is provided with a plurality of sintered structures 801, 802, 803 and 804. This embodiment and the second The embodiment and the third embodiment are different in that the plurality of sintered structures 801, 802, 803, and 804 are only (only) disposed on one side of the short side V of the anisotropic conductive film 601/602, and the length of the sintered structure can be shortened. And increasing the strength of the short side V on both sides against the peeling. In detail, the sintered structures 801 and 802 are respectively disposed on one side of the short side V of the anisotropic conductive film 601 (outer side, that is, adjacent edge), and the sintered structure 803 And 804 are respectively disposed on the other short side V side (outer side, that is, adjacent edge) of the anisotropic conductive film 602.

Referring to FIG. 5, FIG. 5 is a fifth embodiment of the present invention. The fifth embodiment is similar to the fourth embodiment except that a plurality of sintered structures 901, 902, 903, and 904 are respectively located in the third circuit member. Four corners 203, C1, C2, C3, and C4. In detail, the sintered structure 901 is located at the corner C1, the sintered structure 902 is located at the corner C2, the sintered structure 903 is located at the corner C3, and the sintered structure 904 is located at the corner C4. This embodiment uses fewer laser sintering times to set the corners of the circuit member. The sintered structure avoids the external force pulling from the corner and reduces the risk of peeling.

Please refer to FIG. 6. FIG. 6 is a sixth embodiment of the present invention. The sixth embodiment is similar to the first to fourth embodiments except that the wireless circuit area of the third circuit component 203 (for example: first) The wireless area 701) partially overlaps the line area (for example, the first line 401), and the wireless road area 701 includes a plurality of wireless path sub-areas 701a. The line area 401 includes a plurality of lines 401a, between adjacent two lines 401a or lines. There are at least one of the plurality of sub-regions 701a, that is, at least one sub-sinter structure 902a is included between the adjacent two lines 401a, and the two circuit members 203 and 201 and/or 202 and 203 are transmitted through the plurality of sub-sinter structures 902. The sintered structure 902a is firmly bonded together. Therefore, in addition to further improving the effects (for example, fixing) of the foregoing embodiment, the present embodiment can further reduce the area of the third circuit member 203. It should be noted that the anisotropic conductive film 601/602 is still disposed (interposed) between two circuit members (for example, 203 and 201 and 202 and 203), that is, the anisotropic conductive film 601/602 will still The two circuit members 203 and 201 and/or 202 and 203 are overlapped in the vertical direction.

It should be noted that, in other embodiments of the present invention, the sintered structures of Embodiments 1 to 5 may be a dot shape, a strip shape, a polygonal shape, an irregular shape, or a combination of at least two shapes, and the sintered structure of each region. The pattern and position may be different. For example, the pattern of the first sintered structure 301 may be different from the pattern of the second sintered structure 302, and the sintered structure 901 may be selected from the first embodiment to the embodiment. The pattern and position of the sintered structure 902 may be selected from any one of the patterns and positions of the first embodiment to the fifth embodiment, and the sintered structures 901 and 902 may be selected from different or substantially the same pattern and position, and the present invention is not limited thereto. Limited.

According to the present invention, please refer to FIG. 1 at the same time. The present invention further provides a method for manufacturing a display module, comprising: providing a first circuit member 201, providing a second circuit member 202, and providing a third circuit member 203, wherein the third The circuit member 203 includes a first line region 401 and a first wireless road region 501; an anisotropic conductive film is provided, including a first anisotropic 601 conductive film and a second anisotropic conductive film 602, and the first anisotropy is set The conductive film 601 is between the line region of the third circuit member 203 and the first circuit member 201, and presses the third circuit member 203, the first circuit member 201, and the first anisotropic conductive film 601 such that the third circuit member 203 And the second circuit member 202 is electrically connected through the second anisotropic conductive film 602; and the second anisotropic conductive film 602 is disposed between the first line region 401 and the second circuit member 202 of the third circuit member 203 And pressing the third line member 203, the second line member, and the second anisotropic conductive film 602 such that the third line member 203 and the second line member 202 are electrically connected through the second anisotropic conductive film 602; sintering Third line member 203 a circuitless region 501 and a first circuit member 201 to form a first sintered structure 301; a first circuitless region 501 of the third circuit member 203 and a second circuit member 202 to form a second sintered structure 302; The circuit member 203 and the first circuit member 202 are connected through the first sintered structure 301 of the first wireless path region 501 of the third circuit member 203, and the third circuit structure 203 and the second circuit member 202 are transmitted through the third circuit member 203. A second sintered structure 502 of a wireless path 501 is connected. The method of sintering according to the present invention is, for example, laser sintering, wherein the first wireless region 501 of the third line member 203 is directly in contact with the first circuit member 201, and then sintered by laser; or The first wireless zone 501 of the three-line component 203 and the first circuit component 201 are separated by a distance S and then sintered by laser, wherein the distance S is not equal to zero. The energy of the laser is about 1 to 50 watts (W), preferably about 1 to 10 W; and the speed of the laser is about 1: 1 to 1000 (mm/s, mm/s), preferably It is about 1~500mm/s; in addition, the number of laser shots is about 1:100~, preferably about 1~50 times.

The object of the present invention is to provide a display module using an increased sintered structure In the wireless road area of the circuit component, the bonding ability of the two circuit components is strengthened, and the laser sintering structure is disposed in the wireless road area, which does not affect the performance of the original module and increases the yield.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

Display module: 100 first circuit component: 201 second circuit component: 202 third circuit component: 203 first sintered structure: 301 second sintered structure: 302 first line area: 401 first wireless road area: 501 second Line area: 402 Second wireless road area: 502 Third wireless road area: 503 Fourth wireless road area: 504 First anisotropic conductive film: 601 Second anisotropic conductive film: 602

Claims (19)

A display module comprising: a first circuit component; a second circuit component; a third circuit component, wherein the third circuit component comprises a line region and a wireless road zone; and an anisotropic conductive film comprising a first anisotropic conductive film and a second anisotropic conductive film, and the first anisotropic conductive film is disposed between the line region of the third circuit member and the first circuit member, and the first The three-line member and the first circuit member are electrically connected through the first anisotropic conductive film, and the second anisotropic conductive film is disposed between the line region of the third circuit member and the second circuit member And the third line member and the second line member are electrically connected through the second anisotropic conductive film; and a sintered structure comprising a first sintered structure and a second sintered structure; wherein the third circuit The member and the first circuit member are connected to the wireless circuit region of the third circuit member through the first sintered structure, and the third circuit member and the second circuit member are transmitted through the second sintered structure at the third circuit member The wireless Area connection. The display module of claim 1, wherein the sintered structure of the wireless circuit region of the third circuit component comprises a point shape, a strip shape, a polygon shape, an irregular shape or a combination of at least two shapes. The display module of claim 1, wherein the wireless circuit area of the third circuit component further comprises a first wireless road area and a second wireless road area, and the first circuit component further comprises a The third wireless road area and the second line component further include a fourth wireless road area, the first wireless road area of the third circuit component corresponding to the third wireless road area of the first circuit component, and the The second wireless path region of the three circuit component corresponds to the fourth wireless path region of the second circuit component. The display module of claim 1, wherein the third circuit component comprises a first line region and a second line region, wherein the first line region has a vertical projected area portion and the first alien object The conductive films overlap, and a portion of the second wiring region whose vertical projected area overlaps with the second anisotropic conductive film. The display module of claim 4, wherein the first anisotropic conductive film corresponds to the first line region and the second anisotropic conductive film corresponds to the second line region. The display module of claim 1, wherein the second circuit component is a display panel. The display module of claim 1, wherein the first circuit component is a printed circuit board. The display module of claim 1, wherein the third circuit component is a thin film flip chip package. The display module of claim 1, wherein the wireless area of the third circuit component partially overlaps the line area, the wireless area comprising a plurality of wireless sub-areas, the line area comprising a plurality of lines, At least one of the wireless sub-areas is present between adjacent two lines or along a line. A method of manufacturing a display module, comprising: providing a first circuit component; providing a second circuit component; providing a third circuit component, wherein the third circuit component comprises a line region and a wireless road region; providing a different a conductive film comprising a first anisotropic conductive film and a second anisotropic conductive film, the first anisotropic conductive film being disposed in the line region of the third circuit member And the first circuit member, pressing the third line member, the first circuit member and the first anisotropic conductive a film, the third line member and the second line member are electrically connected through the second anisotropic conductive film; the second anisotropic conductive film is disposed on the line region of the third circuit member and the second Between the circuit members, the third line member, the second line member and the second anisotropic conductive film are pressed such that the third line member and the second line member pass through the second anisotropic conductive film And the non-circuit region of the third circuit member and the first circuit member and the circuit-free region of the third circuit member and the second circuit member to form a first sintered structure and a first a sintered structure in which the third circuit member and the first circuit member are connected through the first sintered structure of the wireless circuit region of the third circuit member, and the third circuit structure and the second circuit member pass through the first sintered structure The second sintered structure of the wireless circuit region of the third circuit component is connected. The method of manufacturing a display module according to claim 1, wherein the sintering method is laser sintering. The method for manufacturing a display module according to claim 1, wherein the sintering is performed by directly contacting the wireless component of the third circuit member with the first circuit member and then sintering by laser. The method of manufacturing the display module of claim 1, wherein the sintering is performed by separating the wireless zone of the third circuit component from the first circuit component by a distance S, and then sintering by laser. Wherein the distance S is not equal to zero. The method for manufacturing a display module according to claim 11, wherein the energy of the laser is: 1 to 50 W. The method for manufacturing a display module according to claim 11, wherein the energy of the laser is: 1 to 10 W. The method for manufacturing a display module according to claim 11, wherein the speed of the laser is: 1 to 1000 mm/s. The method for manufacturing a display module according to claim 11, wherein the speed of the laser is: 1 to 500 mm/s. The method for manufacturing a display module according to claim 11, wherein the number of times of the laser is: 1 to 100 times. The method for manufacturing a display module according to claim 11, wherein the number of times of the laser is: 1 to 50 times.